CN103934908A - Method for machining sapphire special-shaped hole - Google Patents
Method for machining sapphire special-shaped hole Download PDFInfo
- Publication number
- CN103934908A CN103934908A CN201410185778.4A CN201410185778A CN103934908A CN 103934908 A CN103934908 A CN 103934908A CN 201410185778 A CN201410185778 A CN 201410185778A CN 103934908 A CN103934908 A CN 103934908A
- Authority
- CN
- China
- Prior art keywords
- sapphire
- backing plate
- aluminium flake
- plate aluminium
- trepanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 64
- 239000010980 sapphire Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000003754 machining Methods 0.000 title abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 56
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000725 suspension Substances 0.000 claims abstract description 13
- 230000005484 gravity Effects 0.000 claims abstract description 7
- 238000003672 processing method Methods 0.000 claims description 15
- 238000010079 rubber tapping Methods 0.000 claims description 13
- 229910052580 B4C Inorganic materials 0.000 claims description 10
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 241000218691 Cupressaceae Species 0.000 claims description 2
- 239000013078 crystal Substances 0.000 abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 abstract 6
- 239000011265 semifinished product Substances 0.000 abstract 4
- 229910052796 boron Inorganic materials 0.000 description 4
- -1 boron carbides Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a method for machining a sapphire special-shaped hole. The surface of a sapphire workpiece semi-finished product is firstly washed with absolute ethyl alcohol; the surface of a base plate aluminum sheet is then washed with absolute ethyl alcohol; the base plate aluminum sheet is heated, and the base plate aluminum sheet and the sapphire workpiece semi-finished product are naturally radiated and cooled to be at the indoor temperature; the base plate aluminum sheet is fixed on a trepanning working platform; suspensions are mixed at the indoor temperature; a trepanning mold head is fixed on a trepanning machine head; a circulating pump is then started, and the trepanning process is automatically completed by the trepanning mold head under the gravity effect of the trepanning machine head; then the sapphire workpiece semi-finished product is separated from the base plate aluminum sheet, and the base plate aluminum sheet and the sapphire workpiece semi-finished product are naturally cooled to be at the indoor temperature. The method is high in trepanning efficiency, crystals are not prone to being cracked in the trepanning process, the trepanning surface accuracy is high, the trepanning process is easy to operate, and the device cost is low.
Description
Technical field
The present invention relates to the perforate processing method of sapphire crystal, particularly a kind of processing method of sapphire irregularly-shaped hole, belongs to crystal processing technique field.
Background technology
Sapphire crystal, as a kind of important technology crystal, has been widely used in many fields such as science and technology, national defence, civilian industry and electronic technology.Sapphire crystal is to be combined into covalent bond form by three oxygen atoms and two aluminium atoms, and its crystal structure is hexagonal lattice structure.The hardness of sapphire crystal is very high, for 9 grades of Mohs' hardness, is only second to the hardest diamond.It has good light transmission, heat conductivity and electric insulating quality, mechanics good mechanical property, and there is wear-resisting and weather-proof feature.The fusing point of sapphire crystal is 2050 DEG C, and boiling point is 3500 DEG C, and maximum operating temperature can reach 1900 DEG C.Because sapphire crystal has the features such as high, wear-resistant, the high temperature resistant and acid-alkali-corrosive-resisting of hardness, and there is good optical property, thereby be widely used in substrate base and various optical detecting instrument and the visual instrument window interface of microelectronic.At present sapphire crystal (sheet) perforate mainly adopts laser boring, and its defect is as follows: first can to process thickness range little in laser boring, can process thickness≤0.60mm; The equipment of laser boring is conventionally very expensive on the other hand, makes equipment investment large; And in laser boring perforate process, crystal (sheet) easily ftractures.
Summary of the invention
The object of the invention is to overcome defect of the prior art, a kind of processing method of sapphire irregularly-shaped hole is provided, it is high that described method has perforate efficiency, thickness range can be processed large, hole shape is unrestricted, can output according to actual needs the hole of various shapes, and open surface essence height, perforate process simple operation and other advantages.
The present invention is achieved by the following technical programs.
A processing method for sapphire irregularly-shaped hole, described method step is as follows: (1) cleans sapphire workpiece blank surface with absolute ethyl alcohol; (2) clean backing plate aluminium flake surface with absolute ethyl alcohol; (3) backing plate aluminium flake is heated to 150-180 DEG C, pastes wax with high temperature sapphire workpiece blank is fixed on backing plate aluminium flake; (4) by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature; (5) backing plate aluminium flake is fixed on perforate workbench; (6) under room temperature, boron carbide and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5; (7) perforate die head is fixed on tapping machine head; (8) start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 100-200w, frequency 30-35kHz; (9) perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field; (10) take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 150-180 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
The processing method of above-mentioned a kind of sapphire irregularly-shaped hole, wherein, the order number of described boron carbide is 240 orders.
The processing method of above-mentioned a kind of sapphire irregularly-shaped hole, wherein, the model that described high temperature is pasted wax is WX-02, buys in Dongguan City Song cypress grinding-material Co., Ltd.
The processing method of a kind of sapphire irregularly-shaped hole of the present invention, described method adopts sapphire workpiece blank is fixed on backing plate aluminium flake, again backing plate aluminium flake is fixed on perforate workbench, then by output the hole of various shapes with different perforate die heads on tapping machine, described method perforate efficiency is high, can reach 0.2-0.5mm/min; Can process thickness range large, can process thickness≤70mm; And hole shape is unrestricted, only need can output by changing difform die head the hole of required form, in perforate process, crystal is not easy cracking, open surface essence height, surface roughness Ra≤1.2 μ m, and perforate process is simple to operate, and equipment cost is low.
Detailed description of the invention
By specific embodiment, the specific embodiment of the present invention is described in further detail below.
Embodiment 1
A kind of processing method of sapphire irregularly-shaped hole, described method step is as follows: first clean sapphire workpiece blank surface with absolute ethyl alcohol, clean backing plate aluminium flake surface with absolute ethyl alcohol again, backing plate aluminium flake is heated to 150 DEG C, pasting wax with WX-02 type high temperature is fixed on sapphire workpiece blank on backing plate aluminium flake, by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature, backing plate aluminium flake is fixed on perforate workbench, under room temperature, 240 object boron carbides and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5, perforate die head is fixed on tapping machine head, start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 100w, frequency 30kHz, perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field, take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 150 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
Embodiment 2
A kind of processing method of sapphire irregularly-shaped hole, described method step is as follows: first clean sapphire workpiece blank surface with absolute ethyl alcohol, clean backing plate aluminium flake surface with absolute ethyl alcohol again, backing plate aluminium flake is heated to 160 DEG C, pasting wax with WX-02 type high temperature is fixed on sapphire workpiece blank on backing plate aluminium flake, by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature, backing plate aluminium flake is fixed on perforate workbench, under room temperature, 240 object boron carbides and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5, perforate die head is fixed on tapping machine head, start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 150w, frequency 32kHz, perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field, take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 160 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
Embodiment 3
A kind of processing method of sapphire irregularly-shaped hole, described method step is as follows: first clean sapphire workpiece blank surface with absolute ethyl alcohol, clean backing plate aluminium flake surface with absolute ethyl alcohol again, backing plate aluminium flake is heated to 170 DEG C, pasting wax with WX-02 type high temperature is fixed on sapphire workpiece blank on backing plate aluminium flake, by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature, backing plate aluminium flake is fixed on perforate workbench, under room temperature, 240 object boron carbides and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5, perforate die head is fixed on tapping machine head, start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 180w, frequency 35kHz, perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field, take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 170 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
Embodiment 4
A kind of processing method of sapphire irregularly-shaped hole, described method step is as follows: first clean sapphire workpiece blank surface with absolute ethyl alcohol, clean backing plate aluminium flake surface with absolute ethyl alcohol again, backing plate aluminium flake is heated to 180 DEG C, pasting wax with WX-02 type high temperature is fixed on sapphire workpiece blank on backing plate aluminium flake, by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature, backing plate aluminium flake is fixed on perforate workbench, under room temperature, 240 object boron carbides and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5, perforate die head is fixed on tapping machine head, start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 200w, frequency 30kHz, perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field, take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 180 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
Adopt the method for the invention hole shape unrestricted, can output according to actual needs various difform holes; And perforate efficiency is high, can reach 0.2-0.5mm/min; Can process thickness range large, can process thickness≤70mm; Open surface essence height, surface roughness Ra≤1.2 μ m.
Here description of the invention and application is illustrative, not wants scope of the present invention to limit in the above-described embodiments, and therefore, the present invention is not subject to the restriction of the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.
Claims (3)
1. a processing method for sapphire irregularly-shaped hole, is characterized in that, described method step is as follows:
(1) clean sapphire workpiece blank surface with absolute ethyl alcohol; (2) clean backing plate aluminium flake surface with absolute ethyl alcohol; (3) backing plate aluminium flake is heated to 150-180 DEG C, pastes wax with high temperature sapphire workpiece blank is fixed on backing plate aluminium flake; (4) by backing plate aluminium flake and sapphire workpiece blank natural heat dissipation, be cooled to room temperature; (5) backing plate aluminium flake is fixed on perforate workbench; (6) under room temperature, boron carbide and water are mixed to form to suspension by the mass ratio of 1 ︰ 1.5; (7) perforate die head is fixed on tapping machine head; (8) start circulating pump, by boron carbide suspension outlet alignment apertures position, start supersonic generator, regulate ultrasonic power to 100-200w, frequency 30-35kHz; (9) perforate die head automatically completes perforate process under tapping machine head Action of Gravity Field; (10) take off sapphire workpiece blank and backing plate aluminium flake, sapphire workpiece blank and backing plate aluminium flake are heated to 150-180 DEG C, then sapphire workpiece blank is separated with backing plate aluminium flake, and naturally cool to room temperature.
2. the processing method of a kind of sapphire irregularly-shaped hole as claimed in claim 1, is characterized in that, the order number of described boron carbide is 240 orders.
3. the processing method of a kind of sapphire irregularly-shaped hole as claimed in claim 1, is characterized in that, the model that described high temperature is pasted wax is WX-02, buys in Dongguan City Song cypress grinding-material Co., Ltd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185778.4A CN103934908B (en) | 2014-05-05 | 2014-05-05 | A kind of processing method of sapphire irregularly-shaped hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410185778.4A CN103934908B (en) | 2014-05-05 | 2014-05-05 | A kind of processing method of sapphire irregularly-shaped hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103934908A true CN103934908A (en) | 2014-07-23 |
| CN103934908B CN103934908B (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410185778.4A Active CN103934908B (en) | 2014-05-05 | 2014-05-05 | A kind of processing method of sapphire irregularly-shaped hole |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834840A (en) * | 2015-01-15 | 2016-08-10 | 深圳市网印巨星机电设备有限公司 | Processing method and processing device for sapphire aperture |
| CN107745290A (en) * | 2017-04-18 | 2018-03-02 | 重庆四联特种装备材料有限公司 | Special-shaped plain film polishes adhering method |
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| GB1094115A (en) * | 1965-04-28 | 1967-12-06 | Osoboe K Buro Proektorivaniyu | Method of and apparatus for ultrasonic boring of hard materials |
| CN1546283A (en) * | 2003-12-16 | 2004-11-17 | 汪开庆 | Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use |
| WO2011020775A1 (en) * | 2009-08-21 | 2011-02-24 | Snecma | Tool for machining a cmc by milling and ultrasonic abrasion |
| CN201850220U (en) * | 2010-11-06 | 2011-06-01 | 湖北菲利华石英玻璃股份有限公司 | Precise ultrasonic wave punching mould of quartz glass sheet |
| CN102092099A (en) * | 2009-12-10 | 2011-06-15 | 湖州金科石英有限公司 | Quartz optical fiber rod drilling process |
| CN102166790A (en) * | 2011-01-21 | 2011-08-31 | 苏州辰轩光电科技有限公司 | Processing method for removing rough surface and scars of sapphire substrate |
| CN102700005A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Drilling method for high-frequency ceramic circuit boards |
| CN103029226A (en) * | 2012-12-06 | 2013-04-10 | 江苏吉星新材料有限公司 | Forming method of sapphire pipe |
| CN103522426A (en) * | 2013-10-21 | 2014-01-22 | 朱云霞 | Drilling method for high-frequency ceramic circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD265820A1 (en) * | 1987-11-12 | 1989-03-15 | Nachrichten Elektronik Zft | ARRANGEMENT FOR ULTRASOUND DRILLING |
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2014
- 2014-05-05 CN CN201410185778.4A patent/CN103934908B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1094115A (en) * | 1965-04-28 | 1967-12-06 | Osoboe K Buro Proektorivaniyu | Method of and apparatus for ultrasonic boring of hard materials |
| CN1546283A (en) * | 2003-12-16 | 2004-11-17 | 汪开庆 | Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use |
| WO2011020775A1 (en) * | 2009-08-21 | 2011-02-24 | Snecma | Tool for machining a cmc by milling and ultrasonic abrasion |
| CN102092099A (en) * | 2009-12-10 | 2011-06-15 | 湖州金科石英有限公司 | Quartz optical fiber rod drilling process |
| CN201850220U (en) * | 2010-11-06 | 2011-06-01 | 湖北菲利华石英玻璃股份有限公司 | Precise ultrasonic wave punching mould of quartz glass sheet |
| CN102166790A (en) * | 2011-01-21 | 2011-08-31 | 苏州辰轩光电科技有限公司 | Processing method for removing rough surface and scars of sapphire substrate |
| CN102700005A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Drilling method for high-frequency ceramic circuit boards |
| CN103029226A (en) * | 2012-12-06 | 2013-04-10 | 江苏吉星新材料有限公司 | Forming method of sapphire pipe |
| CN103522426A (en) * | 2013-10-21 | 2014-01-22 | 朱云霞 | Drilling method for high-frequency ceramic circuit boards |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105834840A (en) * | 2015-01-15 | 2016-08-10 | 深圳市网印巨星机电设备有限公司 | Processing method and processing device for sapphire aperture |
| CN107745290A (en) * | 2017-04-18 | 2018-03-02 | 重庆四联特种装备材料有限公司 | Special-shaped plain film polishes adhering method |
| CN107745290B (en) * | 2017-04-18 | 2019-06-11 | 重庆四联特种装备材料有限公司 | Special-shaped plain film polishes adhering method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103934908B (en) | 2015-12-30 |
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Effective date of registration: 20230105 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
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Effective date of registration: 20230609 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A processing method for sapphire irregular holes Granted publication date: 20151230 Pledgee: Hengshui Bank Co.,Ltd. Pledgor: TUNGHSU GROUP Co.,Ltd. Registration number: Y2024980031994 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |