CN102398065A - Profile processing method for metal-based circuit board - Google Patents
Profile processing method for metal-based circuit board Download PDFInfo
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- CN102398065A CN102398065A CN2011103565429A CN201110356542A CN102398065A CN 102398065 A CN102398065 A CN 102398065A CN 2011103565429 A CN2011103565429 A CN 2011103565429A CN 201110356542 A CN201110356542 A CN 201110356542A CN 102398065 A CN102398065 A CN 102398065A
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Abstract
The invention belongs the field of processing of electronic devices, particularly relates to profile processing of a circuit board for an LED (Light-Emitting Diode) flat television or a 3D (three-dimensional) television display, and aims to provide a profile processing method for a metal-based circuit board, which has relatively low cost and can meet the requirement of batch processing. In the processing method, a 1-shaped feeding way is designed innovatively, the conventional S-shaped feeding way is avoided for reducing burrs, and the feeding workload is reduced by about 50 percent, so that the heat output is reduced, and the service life of a cutter is prolonged; more importantly, the profile processing process of a product is performed in a heat conducting liquid, so that heat generated in the processing process is taken away in time by the heat conducting liquid, and high temperature is effectively prevented; and once high temperature is generated, equipment is damaged severely, the service life of the cutter is shortened, batch production cannot be realized any more, the thermal expansion coefficient of a metal-based material is large, the material is deformed due to the high temperature, and the physical dimension of a processed product does not reach the standard.
Description
Technical field
The invention belongs to the electronic device manufacture field, particularly a kind of sharp processing that is used for LED flat panel TV or 3D television indicator circuit board.
Background technology
LCD TV begins to popularize rapidly in each big and medium-sized cities at home at present, and original traditional C RT kinescope TV is on the verge of being replaced, and is especially also in the ascendant at vast rural market LCD TV.And along with the decline year by year of the LCD TV market price, a lot of high-end types also will progress into ordinary family.LED flat panel TV and 3D flat panel TV display screen are all used high-power LED lamp, so as the core support device of LED lamp, metal base circuit board is also used and given birth to.
All wiring boards all need carry out sharp processing, all be that product (PCS of unit) with finally delivery is spliced into suit (SET) in order to improve its production efficiency in the wiring board enterprise production process, and then suit is spliced into the active gage (PNL) of actual production processing., wiring board just need active gage be processed into the profile appearance (SET) of client's actual needs (when delivering goods) when being worked near finished product with contour processing method.Wiring board is divided by the base material kind, is broadly divided into five types, CEM-1, CEM-3, FR-4, pottery, Metal Substrate etc., and it is ripe that the wiring board of preceding four kinds of base materials all has been tending towards on contour processing method at present, and ripe corollary equipment, instrument and method are arranged.But metal base circuit board is the product that belongs to emerging in recent years, and the high speed development of mainly complying with market LED requires and a kind of product of deriving out.The LED lamp in use can produce more heat, if these heats can not in time dissipate the lasting service time and the life-span thereof that badly influence LED, metal base circuit board just is being based on this demand and the product that produces.The heat that can rapidly the LED lamp be produced disseminates away.Metal base circuit board uses the different of metal can be divided into aluminum-based circuit board, iron-based wiring board etc. according to it again.
The more common wiring board maximum difficult point in the wiring board process of metal base circuit board is the processing method of its profile; The wiring board of common material is because its base material material is softer relatively; So it is very ripe to this processing method to be convenient to cut industry; Use common carbide drill to get final product, process equipment is common milling machine (being the gong machine again).But the sharp processing of metal base circuit board is a difficult problem always, mainly contains two kinds of processing modes at present in the world.A kind of is that professional mould is die-cut, and a kind of is to lean on Digit Control Machine Tool (gong machine) to mill the processing profile.The former advantage: be fit to produce in enormous quantities, the normal relatively CNC milling machine processing of wiring board sharp processing production cost is lower during production in enormous quantities.Shortcoming: mould is required high, and mould costs an arm and a leg, and price is very high during small lot batch manufacture.And opening period is unfavorable for Products Development and delivery fast generally more than 7 days.Latter's advantage: need not make special-purpose punch die, promptly need not to spend the plenty of time to remove to develop the processing resource and the processing charges of special-purpose punch die, cost reaches 5-7 days punch die time of delivery.Be particularly suitable for quantity and be not the making of huge order and sample.Shortcoming: processing cost is high, and difficulty of processing is big, and general enterprise does not possess process technology strength.Because Metal Substrate cause owing to metal base in milling process needs bigger cutting strength and fricative heat obviously to increase than the common line plate, if adopt the processing mode of common line plate.So very easily causing the damage of milling cutter owing to heat is too high is " burning cutter ", the wiring board profile also obtains destroying simultaneously.At present industry has to design and is exclusively used in the milling cutter that mills metal base circuit board, on milling cutter, has adjusted cutting face and chip removal, and certain improvement effect has been played in sharp processing, solves the difficult problem of sharp processing but fail essence ground.Therefore we can say that up to the present the sharp processing technology of metal base circuit board is still a difficult problem of not capturing; Domestic a lot of enterprise does not possess production capacity; The efficient and the qualification rate of its production of the fertile producer of minority are generally on the low side; Indivedual outstanding overseas-funded enterprises could realize producing in batches by dropping into a large amount of high-end devices, and cost is very expensive.To mill the processing technology difficulty big if can solve well, and the problem that cost is high will obtain important breakthrough to the processing of metal base circuit board.
The more traditional base material wiring board of aluminum-based circuit board (especially LED flat panel TV lamp batten) has very big difficulty aspect sharp processing: 1. the narrow length of aluminium base profile (general width be 5-6mm, length 300-600mm does not wait) 2. metallic aluminium when sharp processing, be prone to produce a large amount of thermal conductances and cause the 3. traditional S shape feed meeting of the thermal expansion distortion of base material owing to the monolateral stressed base material resilient bias of fillet shape that causes influences machining accuracy.
Summary of the invention
The difficulty of processing that the present invention is directed to above metal substrate improves on existing process technology, provides a kind of cost lower, and can satisfy the metal base circuit board contour processing method of batch machining.Processing method innovative design of the present invention " 1 " shape tool path pattern is avoided traditional serpentine and is walked the skill in using a kitchen knife in cookery reducing burr, and reduced by about 50% feed workload, thereby has also reduced caloric value and prolonged service life of cutter; Secondly more crucial is with the sharp processing process of product is placed in the heat-conducting liquid and carries out; Heat in the process is just in time taken away by heat-conducting liquid like this; In a single day prevented the generation of high temperature very effectively,, can't form batch process at all because produce the life-span of high temperature with grievous injury equipment and minimizing cutter; And the metal_based material thermal coefficient of expansion is bigger, thereby high temperature can cause material deformation to cause the appearance and size of processed finished products not up to standard.
Concrete technical scheme is following:
A kind of metal base circuit board contour processing method has following steps:
1) adopts " 1 " shape tool path pattern, vertically carry out unidirectional straight cuts at metal base circuit board;
2) accomplish a cutting groove after, mobile tool position is carried out next bar and is vertically cut, up to accomplishing all cuttings;
3) shift cutter and carry out laterally " V " shape groove processing in the upper and lower both sides of wiring board.
Above-mentioned steps 1) and 2) cutting operation process be provided with conductive fluid circulation cooling device, the heat that cutter produces in the cutting process is taken away by conductive fluid.
Above-mentioned steps 3) cutter that carries out the processing of " V " shape groove in is the diamond dedicated tool, and row cutter speed is 1m/min, and the residual thickness that adds the metal base circuit board in man-hour is 0.2-0.3mm.
Above-mentioned conductive fluid circulation cooling device comprises conductive fluid, heat conduction liquid bath, Rose Box and the water pump that cutter is soaked into, and above-mentioned conductive fluid circulates between heat conduction liquid bath, Rose Box through water pump, is provided with in the above-mentioned Rose Box to be used for the screen pack of impurity screening.
The metal base circuit board that this patent method processes (is example with the aluminium base) the key technical indexes is reached advanced world standards, and comprises with the technical indicator of external like product following:
And after adopting water conservancy diversion liquid cooling but, prolong the service life of cutter greatly, can use 15 meters from cutting 5 meters originally, extending to, and saved production cost.
Description of drawings
Fig. 1 is original serpentine feed processing sketch map.
Fig. 2 is the present invention " 1 " shape feed processing sketch map.
Fig. 3 is that process of the present invention is to cutter cooling water conservancy diversion sketch map.
The specific embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention, operation principle are further explained.
See Fig. 3, the present invention is employed in and carries out sharp processing in the heat-conducting liquid, and is example with the aluminium base sharp processing.The present invention designs heat conduction return-flow system; On the material platform, install one and contain thermal trough; Change the tracheae on original sharp processing milling machine spindle into circulating heat conduction liquid pipe; At the Rose Box of a band of equipment next door configuration grid sedimentation and filtration net, the Sheng heat-conducting liquid groove on the material platform, main shaft water pipe, sedimentation and filtration case are formed the heat-conducting system that liquid can circulate through water pump in addition.Metal base circuit board is fixed in the Sheng heat conduction liquid bath of material platform and is processed by the milling cutter on the milling machine, and heat-conducting liquid did not have PCB surface to process.On processing mode, design different tool path patterns through computer programming; The sharp processing equipment of supporting independent research carries out sampling test; The result of the test of contrast various combination confirms that " 1 " shape tool path pattern is a best design, avoids the consistent burr that reduced of machining direction that original tool path pattern makes milling cutter; And reduced by about 50% feed workload at least, thereby also reduced caloric value and prolonged service life of cutter.
Above-mentioned wiring board contour processing method has following steps:
1) adopt " 1 " shape tool path pattern, metal base circuit board vertically carry out unidirectional straight cuts, cutting operation process is provided with conductive fluid circulation cooling device, the heat that cutter produces in the cutting process is taken away by conductive fluid;
2) accomplish a cutting groove after, mobile tool position is carried out next bar and is vertically cut, up to accomplishing all cuttings, the heat that same cutting operation process cutter produces is taken away by conductive fluid;
3) shift cutter and carry out laterally " V " shape groove processing (being v-cut processing) in the upper and lower both sides of wiring board, the cutter of " V " shape groove processing is the diamond dedicated tool, and row cutter speed is 1m/min, and the residual thickness that adds the metal base circuit board in man-hour is 0.2-0.3mm.
Milling cutter originally adopts the serpentine feed, and is as shown in Figure 1, promptly from the starting position; Detour along the direction of arrow and to accomplish the cutting operation of a circulation week; And then the cutting that next time circulates, inevitable milling cutter is because there is machining accuracy and cutter damage phenomenon in feed circuit unbalance stress; Use straight shape feed shown in Figure 2 instead, the milling cutter life-span is elongated, and cutting accuracy is also higher, adds the conductive fluid cooling effect, the leading world level of the metal base circuit board profile technical indicator that processing method of the present invention obtains.
Obviously, above-mentioned embodiment of the present invention only be for explanation the present invention did for example, and be not to be qualification to embodiment of the present invention.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also be easy to make other pro forma variation or substitute, and these change or substitute and also will be included within the protection domain that the present invention confirms.
Claims (4)
1. metal base circuit board contour processing method has following steps:
1) adopts " 1 " shape tool path pattern, vertically carry out unidirectional straight cuts at metal base circuit board;
2) accomplish a cutting groove after, mobile tool position is carried out next bar and is vertically cut, up to accomplishing all cuttings;
3) shift cutter and carry out laterally " V " shape groove processing in the upper and lower both sides of wiring board.
2. metal base circuit board contour processing method according to claim 1 is characterized in that: above-mentioned steps 1) and 2) cutting operation process be provided with conductive fluid circulation cooling device, the heat that cutter produces in the cutting process is taken away by conductive fluid.
3. metal base circuit board contour processing method according to claim 1; It is characterized in that: the cutter that carries out the processing of " V " shape groove above-mentioned steps 3) is the diamond dedicated tool; Row cutter speed is 1m/min, and the residual thickness that adds the metal base circuit board in man-hour is 0.2-0.3mm.
4. metal base circuit board contour processing method according to claim 2; It is characterized in that: above-mentioned conductive fluid circulation cooling device comprises conductive fluid, heat conduction liquid bath, Rose Box and the water pump that cutter is soaked into; Above-mentioned conductive fluid circulates between heat conduction liquid bath, Rose Box through water pump, is provided with in the above-mentioned Rose Box to be used for the screen pack of impurity screening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110356542.9A CN102398065B (en) | 2011-11-11 | 2011-11-11 | Profile processing method for metal-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110356542.9A CN102398065B (en) | 2011-11-11 | 2011-11-11 | Profile processing method for metal-based circuit board |
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| CN102398065A true CN102398065A (en) | 2012-04-04 |
| CN102398065B CN102398065B (en) | 2014-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110356542.9A Active CN102398065B (en) | 2011-11-11 | 2011-11-11 | Profile processing method for metal-based circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104985271A (en) * | 2015-06-26 | 2015-10-21 | 苏州市宝玛数控设备有限公司 | Novel wire cutting water tank |
| CN106851993A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of new lamp bar sheet metal forming processing method |
| CN108746790A (en) * | 2018-08-30 | 2018-11-06 | 惠州市正耀科技有限公司 | Multistation slotter |
Citations (5)
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| JPH03255633A (en) * | 1990-03-05 | 1991-11-14 | Ngk Spark Plug Co Ltd | Bump formation of ic package |
| JPH06275924A (en) * | 1993-03-22 | 1994-09-30 | Ngk Spark Plug Co Ltd | Ceramic substrate |
| CN2242749Y (en) * | 1995-08-07 | 1996-12-18 | 新疆工学院 | General spring grip-hold automatic tool-changing system special for numerical control machine tool |
| JPH0966493A (en) * | 1995-08-31 | 1997-03-11 | Fujitsu Ltd | Machine for dividing and cutting off in a lump |
| CN102036483A (en) * | 2010-09-30 | 2011-04-27 | 北大方正集团有限公司 | Method and system for forming blind gongs on printed circuit board (PCB) and circuit board |
-
2011
- 2011-11-11 CN CN201110356542.9A patent/CN102398065B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03255633A (en) * | 1990-03-05 | 1991-11-14 | Ngk Spark Plug Co Ltd | Bump formation of ic package |
| JPH06275924A (en) * | 1993-03-22 | 1994-09-30 | Ngk Spark Plug Co Ltd | Ceramic substrate |
| CN2242749Y (en) * | 1995-08-07 | 1996-12-18 | 新疆工学院 | General spring grip-hold automatic tool-changing system special for numerical control machine tool |
| JPH0966493A (en) * | 1995-08-31 | 1997-03-11 | Fujitsu Ltd | Machine for dividing and cutting off in a lump |
| CN102036483A (en) * | 2010-09-30 | 2011-04-27 | 北大方正集团有限公司 | Method and system for forming blind gongs on printed circuit board (PCB) and circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104985271A (en) * | 2015-06-26 | 2015-10-21 | 苏州市宝玛数控设备有限公司 | Novel wire cutting water tank |
| CN106851993A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of new lamp bar sheet metal forming processing method |
| CN106851993B (en) * | 2017-04-08 | 2019-04-12 | 吉安满坤科技股份有限公司 | A kind of novel lamp bar sheet metal forming processing method |
| CN108746790A (en) * | 2018-08-30 | 2018-11-06 | 惠州市正耀科技有限公司 | Multistation slotter |
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| Publication number | Publication date |
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| CN102398065B (en) | 2014-07-02 |
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Address after: 213031 No. 15 Xinke Road, Changzhou Electronic Science and Technology Industrial Park, Jiangsu Province Patentee after: Changzhou Aohong Electronics Co., Ltd. Address before: 213031 No. 15 Xinke Road, Changzhou Electronic Science and Technology Industrial Park, Jiangsu Province Patentee before: Changzhou Aohong Electronics Co., Ltd. |
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