CN202702003U - Sapphire wafer chip mounter - Google Patents
Sapphire wafer chip mounter Download PDFInfo
- Publication number
- CN202702003U CN202702003U CN 201220327031 CN201220327031U CN202702003U CN 202702003 U CN202702003 U CN 202702003U CN 201220327031 CN201220327031 CN 201220327031 CN 201220327031 U CN201220327031 U CN 201220327031U CN 202702003 U CN202702003 U CN 202702003U
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- CN
- China
- Prior art keywords
- chip mounter
- cooling
- sapphire wafer
- sheet
- discs
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a sapphire wafer chip mounter which comprises a ceramic disc for containing sapphire wafers. Corresponding heating discs and cooling discs are fitted on the ceramic disc, and the sapphire wafer chip mounter is characterized in that the ceramic disc comprising sheet grooves in at least two specifications and a movable sheet swing device matched with one sheet groove are arranged on the chip mounter, and a vacuum chuck of the movable sheet swing device corresponds to positions of the sheet groove one by one. The movable sheet swing device is adopted on the basis of a traditional chip mounter, the sheet grooves of a swing sheet can be freely installed, paster needs of different products are adapted, and simultaneously pasters of the ceramic disc in different models can be met. Movable location stripes are allocated on the ceramic discs in different sizes on the heating discs and cooling discs, location is accurate, and the sapphire wafer chip mounter is convenient. In addition, the design enables the cooling discs on the traditional chip mounter to be middle screw type cooling form U type cooling, the sapphire wafer chip mounter has the advantages of being rapid in middle cooling block and enabling peripheral cooling to be lower than the middle cooling, and the sapphire wafer chip mounter is favorable for reduction of curing speed of wax during chip pressing.
Description
Technical field
The utility model relates to a kind of sapphire wafer chip mounter.
Technical background
Sapphire hardness is high, fusing point is high, light transmission good, and stable chemical performance is widely used in the high-tech sectors such as machinery, optics, information.The sapphire of Artificial Growth has good wearability, and hardness is only second to diamond and reaches 9 grades of Mohs.Because sapphire hardness height and fragility are large, so it is very difficult that it is carried out machining, the Sapphire Substrate sheet of GaN growth especially, its precision processing technology is complicated especially, is one of problem of current primary study.Such weak point appears in the processing technology of present domestic Sapphire Substrate in batch production: sapphire sheet collapses the limit in the process, the breach ratio is higher, accounts for 5% ~ 8% of sum, so just affects the yield rate of whole Sapphire Substrate process line.
The Sapphire Substrate wafer is the core link of LED industrial chain, the manufacturing technology of this product was all monopolized by offshore company in the past, its key technology and patent rest in U.S., day large factory hand more, for cutting rapidly this field, domestic enterprise mostly can only be with " cooked mode " and foreign capitals cooperation, and tissue is produced behind the technology and equipment that the purchase foreign capitals provide.Existing my company improves chip mounter on original basis.
In the sapphire processing technology, before the sapphire grinding technics, must carry out paster, its objective is the Sapphire Substrate sheet more flatly is attached on the ceramic disk by wax, be conducive to the copper dish and grind the plane control that makes product.
Existing all kinds of copper dish grinds chip mounter can only carry out paster for a kind of product of a kind of ceramic disk.When the product of different size is arranged, have to buy new chip mounter and satisfy the demands, not only taken fund but also increased machine and take up space.
Existing chip mounter has problem;
1. appropriate products is single, and relative machinery utilization rate is lower
2. during compressing tablet, because the ceramic disk cooling is too fast, the punching press effect was undesirable after wax solidified.
Summary of the invention
The utility model adopts movable pendulum device according to the deficiency of existing equipment on traditional chip mounter basis, can freely load and unload the film trap of pendulum, has adapted to the paster demand of different product, has also satisfied the paster of different model ceramic disk simultaneously.The ceramic disk that we are similarly different size on heating plate and cooler pan has disposed movable positioning strip, and the location is accurate and convenient.In addition, the design becomes the cooling of central spiral formula with the cooler pan on traditional chip mounter by U-shaped Cooling Design, and cooling is cooled off the advantage in the middle of being lower than on every side soon in the middle of having, and the curing rate of wax lowers when being conducive to compressing tablet.
Concrete technical scheme of the present utility model is:
A kind of sapphire wafer chip mounter, comprise a ceramic disk that is used for holding sapphire wafer, this ceramic disk is furnished with corresponding heating plate and cooler pan, it is characterized in that this chip mounter is provided with a ceramic disk that comprises at least two kinds of specification film traps, and a movable pendulum device that mates with film trap, the vacuum cup of movable pendulum device is corresponding one by one with the film trap position.
Described heating plate and cooler pan are provided with the activity orientation bar.
Described cooler pan contains spiral cooling pipe.
Description of drawings
Fig. 1 is the utility model chip mounter paster platform structure schematic diagram.
Fig. 2 is the utility model ceramic disk structural representation.
Fig. 3 is the utility model cooler pan pipe structure for cooling schematic diagram.
Wherein, ceramic disk 1, heating plate 2, cooler pan 3, film trap 4, film trap 5.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further described.
Sapphire surface mounting machine as shown in Figure 1 mainly comprises the ceramic disk 1 for pendulum, is used for the heating plate 2 of waxing heating, is used for the cooler pan 3 of cooling.Wherein, the film trap (such as the film trap 4 among the figure and film trap 5) of plurality of specifications can be set on the ceramic disk 1, ceramic disk 1 is provided with movable pendulum device accordingly, and the pendulum device is provided with the position vacuum cup corresponding with film trap, is used for drawing the sapphire wafer in the film trap.
The operation of this chip mounter mainly is divided into three parts: pendulum, waxing, compressing tablet.
Pendulum: substrate slice is placed on the sheet position of lower wall (replaceable), presses the button rear machine sucker during paster and automatically slice, thin piece is picked up by suction nozzle, move on to the heating plate top.This machine is transformed into original fixed sucker and lower wall detachable, and lower price fixing can be processed needs, makes two cun into, the substrate slice of four cun or other sizes.
Waxing: just can wax and slice, thin piece is placed on ceramic disk after ceramic disk position on heating plate is fixing and locate.Two adjustable locating pieces are arranged on this machine heating plate, ceramic disk that can the flexible positioning different size, the time that sucker presses down is automatic, need not manually-operated.This chip mounter contains the dish pattern: ceramic disk contacts with locating piece, aligns with two locating pieces, and the position is just fixing can not to be changed.
Compressing tablet: ceramic disk is shifted onto on the cooler pan, and upper dish decline punching press is attached on the ceramic disk substrate slice level simultaneously, and this machine compressing tablet partly is divided into dish punch-out and lower wall cooling segment.
This programme cooler pan inside is used central spiral formula refrigeration instead as shown in Figure 2, refrigeration is fast in the middle of can making cooler pan, tradition U-shaped type of cooling edge cooling slow (product mainly is placed on the edge by wax with product), and the spiral type of cooling of this programme can with the wax extrusion of product central authorities before wax solidifies, have been guaranteed the quality of compressing tablet.
Claims (3)
1. sapphire wafer chip mounter, comprise a ceramic disk that is used for holding sapphire wafer, this ceramic disk is furnished with corresponding heating plate and cooler pan, it is characterized in that this chip mounter is provided with a ceramic disk that comprises at least two kinds of specification film traps, and a movable pendulum device that mates with film trap, the vacuum cup of movable pendulum device is corresponding one by one with the film trap position.
2. sapphire wafer chip mounter according to claim 1 is characterized in that described heating plate and cooler pan are provided with the activity orientation bar.
3. sapphire wafer chip mounter according to claim 1 is characterized in that described cooler pan contains spiral cooling pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220327031 CN202702003U (en) | 2012-07-06 | 2012-07-06 | Sapphire wafer chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220327031 CN202702003U (en) | 2012-07-06 | 2012-07-06 | Sapphire wafer chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202702003U true CN202702003U (en) | 2013-01-30 |
Family
ID=47582342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220327031 Expired - Fee Related CN202702003U (en) | 2012-07-06 | 2012-07-06 | Sapphire wafer chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202702003U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639877A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Polishing processing method for ultrathin sapphire wafer |
| CN104759974A (en) * | 2015-04-16 | 2015-07-08 | 常州市科沛达超声工程设备有限公司 | Full-automatic sheet mounter |
| CN105881527A (en) * | 2016-05-16 | 2016-08-24 | 苏州辰轩光电科技有限公司 | Full-automatic vertical manipulator |
| CN109986459A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of heat dissipation tool and its application for chip ceramic disk in LED chip substrate reduction process |
-
2012
- 2012-07-06 CN CN 201220327031 patent/CN202702003U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639877A (en) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | Polishing processing method for ultrathin sapphire wafer |
| CN104759974A (en) * | 2015-04-16 | 2015-07-08 | 常州市科沛达超声工程设备有限公司 | Full-automatic sheet mounter |
| CN105881527A (en) * | 2016-05-16 | 2016-08-24 | 苏州辰轩光电科技有限公司 | Full-automatic vertical manipulator |
| CN109986459A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of heat dissipation tool and its application for chip ceramic disk in LED chip substrate reduction process |
| CN109986459B (en) * | 2017-12-29 | 2021-04-06 | 山东浪潮华光光电子股份有限公司 | Heat dissipation tool for surface-mounted ceramic disc in LED chip substrate thinning process and application of heat dissipation tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130130 Termination date: 20150706 |
|
| EXPY | Termination of patent right or utility model |