CN103522426A

CN103522426A - Drilling method for high-frequency ceramic circuit boards

Info

Publication number: CN103522426A
Application number: CN201310496909.6A
Authority: CN
Inventors: 朱云霞
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-10-21
Filing date: 2013-10-21
Publication date: 2014-01-22

Abstract

The invention discloses a drilling method for high-frequency ceramic circuit boards. First, a drilling file is made, hole location requirements are converted into a PCB drilling program through CAM software, original hole locations are arranged diagonally, and then a drilling sequence is designed; second, data of the made drilling file are imported into a drilling machine, a drilling rod of the drilling machine is set to zero and parameters of the drilling machine are set according to a job file of the drilling machine, normal drilling is conduced on small-bore high-frequency ceramic boards, and a 3.0mm drilling bit is used for drillinging lead holes and then finished product holes are drilled directly with respect to the high-frequency ceramic circuit boards with bore diameters of more than 4.0mm; third, preparatory work before drilling is completed according to the drilling sequence, wherein the high-frequency ceramic circuit boards are selected first, and then board overlapping, base plate mounting, substrate mounting and aluminum sheet mounting are carried out in sequence; fourth, drilling is conducted according to a start-up program of the drilling machine; fifth, after drilling is completed, the circuit boards are unloaded, and finished products are obtained after flash grinding, hole blowing and inspection. According to the drilling method for the high-frequency ceramic circuit boards, the drilling method is improved, so that drilling quality is improved, and the product percent of pass is increased.

Description

A kind of boring method of high-frequency ceramic circuit board

Technical field

The present invention relates to the preparation method of circuit board, especially a kind of boring method of high-frequency ceramic circuit board.

Background technology

Along with electronic product is day by day to miniaturization, high integrated, high performance trend development, high-frequency ceramic circuit board substrate media density of material is more and more higher, for the mounting process of adaptive circuit plate, circuit printed line hole, locating hole, the fixed installation super 4.0mm in aperture, hole, because high-frequency ceramic circuit board base material is composite dielectric materials, material is hard, frangible characteristic, bit cutting is improper, and large-diameter borehole there will be plate hole mouth blast hole, quick-fried copper, frangible, boring burr is serious, and bore edges pottery powdery phenomenon makes ceramic circuit board processing drilling operating become the bottleneck of circuit board plant, and the method key step of existing boring comprises: to zero-bit, if driller parameters, bore locating hole, upper padding plate, upper substrate, upper aluminium flake, mill peak, blow hole, check, the method that employing is sequentially holed, drill spindle presser feet pad adopts copper presser feet pad, and along with substrate media density of material strengthens, process aperture is strengthened, and the quality problems of boring just come one after another, and hole is inclined to one side, the breaking of rod is chewed, consent, the problems such as hole is thick frequently occur, and because existing boring method exists the problems referred to above, so must seek effective solution, improve product percent of pass.

Summary of the invention

The invention provides a kind of boring method of high-frequency ceramic circuit board, the improvement by boring method, has improved drilling quality, has improved product percent of pass.

The present invention has adopted following technical scheme: a kind of boring method of high-frequency ceramic circuit board, comprise the following steps: step 1, make boring file, position, hole is required to be converted to PCB drilling program by CAM software, to the diagonal angle layout of foramen primum position, then design boring order; Step 2, imports the boring file data of step 1 making to rig, presses rig job file, borer drill rod, to zero-bit, is set to driller parameters, and small-bore is by normal boring, the high-frequency ceramic circuit board that surpasses the above aperture of 4.0mm first bores and chews drill hole with 3.0mm, more directly bores finished hole; Step 3, sequentially carries out the preparation before boring by boring, first chooses high-frequency ceramic circuit board, then carries out successively lamination, upper padding plate, upper substrate, upper aluminium flake; Step 4, presses the boring of rig boot program; Step 5, lower plate after boring, grinds peak, blows hole, inspection, obtains finished product.

While making boring file in described step 1, press the standard design boring order to angular coordinate pitch of holes >=10mm; In described step 3, thickness is 5mm during lamination; While holing by rig boot program in described step 4, select UC type to bore and chew, drill spindle presser feet pad adopts soft plastic screw-type presser feet pad.

The present invention has following beneficial effect: the present invention has mainly changed bore mode, brill is chewed and is adopted the effective UC type brill of chip removal to chew, increased to bore and chewed working edge length and reduce the steps such as the dynamic beat value of drill spindle, to remove, may discharge bad because of powder, brill is chewed working edge length deficiency, reduce the large undesirable element that waits of main shaft trend beat that high rotary speed parameter causes, cause hole partially, the breaking of rod, consent, the thick problem in hole; Large-diameter borehole more than 4.0mm is sequentially set as the leapfrog method with coordinate pitch of holes >=10mm, and diagonal angle boring, reduces the tractive force between Kong Yukong, the little blast hole that causes of pitch of holes while reducing large-diameter borehole, the phenomenon that circuit board apertures is frangible; Drill spindle presser feet pad adopts soft plastic screw-type presser feet pad, and during boring, presser feet pad is depressed on cover plate certain elasticity, reduces spindle presser uneven, and whole presser feet can be flattened at plate face, reduces the space with substrate, reduces the problems such as the breaking of rod, hole be inclined to one side; The high-frequency ceramic circuit board that surpasses the above aperture of 4.0mm first bores and chews boring with 3.0mm, more directly bores finished hole, and the cutter speed feed of waiting a moment, and improves the problems such as ceramic circuit plate hole burr, distortion, improves product percent of pass.

The specific embodiment

The invention provides a kind of boring method of high-frequency ceramic circuit board, comprise the following steps: step 1, make boring file, position, hole is required to be converted to PCB drilling program by CAM software, to the diagonal angle layout of foramen primum position, then by the standard design boring order to angular coordinate pitch of holes >=10mm; Step 2, imports the boring file data of step 1 making to rig, presses rig job file, borer drill rod, to zero-bit, is set to driller parameters, and small-bore is by normal boring, the high-frequency ceramic circuit board that surpasses the above aperture of 4.0mm first bores and chews drill hole with 3.0mm, more directly bores finished hole; Step 3, sequentially carries out the preparation before boring by boring, first chooses high-frequency ceramic circuit board, then carries out successively lamination, upper padding plate, upper substrate, upper aluminium flake, and during lamination, thickness is 5mm; Step 4, presses the boring of rig boot program, selects UC type to bore and chew while holing by rig boot program, and drill spindle presser feet pad adopts soft plastic screw-type presser feet pad; Step 5, lower plate after boring, grinds peak, blows hole, inspection, obtains finished product.

Claims

1. a boring method for high-frequency ceramic circuit board, is characterized in that comprising the following steps:

Step 1, makes boring file, and position, hole is required to be converted to PCB drilling program by CAM software, to the diagonal angle layout of foramen primum position, then designs boring order;

Step 2, imports the boring file data of step 1 making to rig, presses rig job file, borer drill rod, to zero-bit, is set to driller parameters, and small-bore is by normal boring, the high-frequency ceramic circuit board that surpasses the above aperture of 4.0mm first bores and chews drill hole with 3.0mm, more directly bores finished hole;

Step 3, sequentially carries out the preparation before boring by boring, first chooses high-frequency ceramic circuit board, then carries out successively lamination, upper padding plate, upper substrate, upper aluminium flake;

Step 4, presses the boring of rig boot program;

Step 5, lower plate after boring, grinds peak, blows hole, inspection, obtains finished product.

2. the boring method of a kind of high-frequency ceramic circuit board according to claim 1, is characterized in that making while holing file by the standard design boring order to angular coordinate pitch of holes >=10mm in described step 1.

3. the boring method of a kind of high-frequency ceramic circuit board according to claim 1, while it is characterized in that in described step 3 lamination, thickness is 5mm.

4. the boring method of a kind of high-frequency ceramic circuit board according to claim 1, selects UC type to bore while it is characterized in that holing by rig boot program in described step 4 and chews.

5. the boring method of a kind of high-frequency ceramic circuit board according to claim 1, while it is characterized in that holing by rig boot program in described step 4, drill spindle presser feet pad adopts soft plastic screw-type presser feet pad.