CN106735433A - A kind of processing method of PCB printed circuit board (PCB)s backboard drilling - Google Patents

Abstract

The invention discloses a kind of processing method of PCB printed circuit board (PCB)s backboard drilling, chip area UC types long are used when one bores（Cutting drill pin long）With short chip area ST types（Short cutting drill pin）Two kinds of micro- modes being combined of boring are drilled, first pass through micro- drilling row prebored hole of short chip area ST types, hole depth is the 10~30% of thickness of slab, then chip area long micro- drilling row drilling is recycled, when chip area long drills, by the way of multistep brill, if drilling depth is d, often walk successively according to 1/d：2/d：3/d：The ratio of 4/d is drilled；When back drill drills from the drill point that bit tip angle is 150~170 °, using single-side coated copper plate, copper face downwards with pcb board directly contact.Compared with prior art, the present invention changes the traditional positive back-drilling of use and regards the back drill drill mode of cover plate with traditional aluminium flake, the problems such as not only effectively increasing drilling efficiency and positioning precision is good, and efficiently solve back drill Drilling operation, peak, plug-hole, broken needle.

Description

A kind of processing method of PCB printed circuit board (PCB)s backboard drilling

Technical field

The present invention relates to PCB processing technique field, and in particular to what a kind of PCB printed circuit board (PCB)s backboard drilled adds Work method.

Background technology

During PCB print circuit plates makings, backboard is used than wide, and backboard refers to circuit and numerous sockets Hole, is mainly used in carrying other feature daughter boards and chip, plays the class printing panel products of high speed signal and high current transmission. Backboard has size big as the class high-end print panel products with specialized property, typically, and the number of plies is more, and thickness is big, aperture The features such as aspect ratio is high, quickly grows in recent years, is widely used in communication, space flight, Medical Devices, military base station, supercomputing The fields such as machine.Some requirements that the property that backboard is carried due to it, its design parameter and needs meet and conventional printing Compared to there are greatest differences, technology is related to field wider to panel products, and manufacture difficulty is higher, and the drilling of its dorsulum is that backboard made Important procedure in journey, backboard drilling is, by the through hole after a plating conducting, a part of hole to be removed using control gun drilling method Copper, the hole for only retaining a part of hole copper and being formed, the key effect of backboard drilling is during high speed transmission of signals, to reduce many Yu Kongtong to the reflection interference of signal, to ensure the integrality of signal transmission.At present, backboard drilling is that a kind of cost is relatively low, energy Enough meet high frequency, it is ensured that the production method of high-speed line plate performance.But in actual implementation process, due to back drill in itself the characteristics of and The critical technological points such as its circuit structure requirement, especially in drilling operating, easily there is copper wire in hole, plug-hole, the breaking of rod, peak in back drill hole Etc. quality problem.

The content of the invention

To solve drawbacks described above, it is an object of the invention to provide a kind of processing method of PCB printed circuit board (PCB)s backboard drilling, The quality problem such as the frequent copper wire for occurring, plug-hole, the breaking of rod and batch peak in backboard drilling operating is solved, being that guarantee is whole prints electricity The quality parameter of road plate is provided and ensured.

To reach above-mentioned purpose, the technical solution adopted by the present invention is：A kind of processing of PCB printed circuit board (PCB)s backboard drilling Method, it is characterised in that comprise the following steps：

1）Rough drill holes drilled through：Using chip area UC types long（Cutting drill pin long）With short chip area ST types（Short cutting drill pin）Two kinds of micro- brill phases With reference to mode drilled, first pass through micro- drilling row prebored hole of short chip area ST types, hole depth is the 10~30% of thickness of slab, so After recycle chip area long micro- drilling row drilling, when chip area long drills, by the way of multistep brill, if drilling depth is D, often walks successively according to 1/d：2/d：3/d：The ratio of 4/d is drilled；

2）Upper surface borehole accuracy is better than lower surface borehole accuracy, and being incremented by with drill point mill time, hole position when being drilled because of pcb board Precision is had a declining tendency, and to reduce back drill and rough drill Aligning degree error, back drill is produced with rough drill using the same quadrant of rig, And only use drill point that is brand-new and grinding；

3）, from the drill point that bit tip angle is 150~170 ° when drilling, using single-side coated copper plate, copper face is downwards and pcb board for back drill Directly contact；

4）Back drill bores the selection in footpath according to Aligning degree tolerance and hole tolerance, and suitable backboard bore cutter footpath and rough drill is obtained accordingly Most pocket knife footpath disparity range needed for through hole knife footpath, specifically when back drill drills, the hole wall copper after just holes drilled through, drilling tool are fallen in subdrilling Using the cutter of 0.18MM more than bigger than rough drill through-hole diameter.

The present invention is by above-mentioned technical proposal, step 1）It is middle to use chip area UC types long（Cutting drill pin long）With short chip area ST Type（Short cutting drill pin）Two kinds of micro- brills are combined mode and drill, and the hole position characteristic for not only drilling is readily obtained guarantee, and micro- brill is not The easy breaking of rod, after being drilled hole every time, will more effectively can bore outside dirty evacuation aperture, it is to avoid bore dirty excessive buildup and produce plug-hole phenomenon, And the radiating efficiency of inner-layer thick copper drilling can be improved, it is to avoid roughness is excessive etc. in the hole of the excessive generation of heat bad asks Topic, while reducing breaking of rod rate；

Step 3）Conventional drilling, general to use aluminium flake as cover plate, aluminium flake general tolerance is 0.15 ± 0.02MM, because it compares Thin, the dust suction of easy drilled machine is sucked away from plate face, causes high-frequency electronic inductor actual range deviation occur, sometimes dust Ensconce under aluminium flake, cause back drill hole hole position lack accuracy, the single-side coated copper plate used in the present invention, because it has larger thickness and hard Degree, when drilling, it is not easy to pick up, and the copper thickness tolerance of single-side coated copper plate is small, can reduce high-frequency electronic inductor to depth Influence error, so as to effectively improve the precision of back drill.

Step 4) in subdrilling fall hole wall copper first after holes drilled through, drilling tool is using 0.18MM's more than bigger than rough drill through-hole diameter Cutter, the hole for so getting out not only meets electrical property, and with good ladder back drill effect.

The beneficial effects of the invention are as follows：The present invention changes the traditional positive back-drilling of use and regards the back of the body of cover plate with traditional aluminium flake Drill mode is bored, drilling efficiency is not only effectively increased and positioning precision is good, and efficiently solve back drill Drilling operation, draped over one's shoulders The problems such as peak, plug-hole, broken needle.

Brief description of the drawings

Below according to drawings and Examples, structure and features of the invention is further described.

Fig. 1 is process schematic diagram of the invention.

Fig. 2 be the present invention when back drill drills using the machining sketch chart of single-side coated copper plate.

Fig. 3 be the present invention when back drill drills from the structural representation of drill point.

In accompanying drawing 2, Fig. 3,1. aluminium flake, 2. copper coin, 3. angle is 150~170 ° of apex point.

Specific embodiment

The present invention is further elaborated on below in conjunction with the drawings and specific embodiments.

A kind of processing method of PCB printed circuit board (PCB)s backboard drilling, its step includes：

1）According to sheet metal thickness and pore size, when first holes drilled through, suitable diameter and sword drill point long are selected.Consider Backboard typically processes that thickness is high, and aperture is small, radius-thickness ratio than larger, using chip area UC types long（Cutting drill pin long）With short chip area ST Type（Short cutting drill pin）Two kinds of micro- modes being combined of boring are drilled, using micro- drilling row prebored hole of short chip area ST types, hole Then deep control recycle the micro- drilling for being drilled into whole micropore of chip area long in 10~30% thicknesss of slab, and the hole position for not only drilling is special Property be readily obtained guarantee, and micro- brill is difficult the breaking of rod, wherein when chip area long drills, by the way of multistep brill, if boring Hole depth is d, is often walked successively according to 1/d：2/d：3/d：The ratio of 4/d is drilled；After being drilled hole every time, can be more effective To bore outside dirty evacuation aperture, it is to avoid bore dirty excessive buildup and produce plug-hole phenomenon, and the radiating effect of inner-layer thick copper drilling can be improved Rate, it is to avoid the bad problem such as roughness is excessive in the hole of the excessive generation of heat, while reducing breaking of rod rate.

2）To reduce back drill and rough drill Aligning degree error, back drill is produced with rough drill using the same quadrant of rig, and is only used Drill point that is brand-new and grinding one, because upper surface borehole accuracy is better than lower surface borehole accuracy when pcb board drills, and as drill point grinds Secondary is incremented by, and hole position precision has a declining tendency；

3）Conventional drilling, it is general using aluminium flake 1 as cover plate, the general tolerance of aluminium flake 1 is 0.15 ± 0.02MM, because it is than relatively thin, The dust suction of easy drilled machine is sucked away from plate face, causes high-frequency electronic inductor actual range deviation occur, and sometimes dust is also hidden Under aluminium flake 1, cause back drill hole hole position lack accuracy.When back drill drills, using single-side coated copper plate 2, copper face is downwards and PCB Plate directly contact, because it has larger thickness and hardness, when drilling, it is not easy to pick up, and single-side coated copper plate copper thickness tolerance It is small, influence error of the high-frequency electronic inductor to depth can be reduced, so as to effectively improve the precision of back drill, back drill drilling is from brill 150~170 ° of drill point drillings of wedge angle degree, the slope of drill point is small, and severity control is easy；

4）Good ladder back drill effect is obtained, and meets electrical property, also to bore the hole wall copper after rough drill, so back drill is bored The selection in footpath is needed according to Aligning degree tolerance and hole tolerance, so as to obtain suitable backboard bore cutter footpath with first holes drilled through hole knife Most pocket knife footpath disparity range needed for footpath, back drill tool diameter bores big more than the 0.18MM of tool diameter than one.

The present invention solves the copper wire often occurred in backboard drilling operating, plug-hole, the breaking of rod and criticizes by above-mentioned steps The quality problems such as peak, for the quality parameter for ensureing whole printed circuit board (PCB) provides guarantee.

Described above is only presently preferred embodiments of the present invention, and above-mentioned specific embodiment is not limitation of the present invention, Retouching, modification or equivalent that all one of ordinary skill in the art are made as described above, belong to guarantor of the invention Shield scope.

Claims (1)

1. the processing method that a kind of PCB printed circuit board (PCB)s backboard drills, it is characterised in that comprise the following steps：

1）Rough drill holes drilled through：Using chip area UC types long（Cutting drill pin long）With short chip area ST types（Short cutting drill pin）Two kinds of micro- brill phases With reference to mode drilled, first pass through micro- drilling row prebored hole of short chip area ST types, hole depth is the 10~30% of thickness of slab, so After recycle chip area long micro- drilling row drilling, when chip area long drills, by the way of multistep brill, if drilling depth is D, often walks successively according to 1/d：2/d：3/d：The ratio of 4/d is drilled；

2）Upper surface borehole accuracy is better than lower surface borehole accuracy, and being incremented by with drill point mill time, hole position when being drilled because of pcb board Precision is had a declining tendency, and to reduce back drill and rough drill Aligning degree error, back drill is produced with rough drill using the same quadrant of rig, And only use drill point that is brand-new and grinding；

3）, from the drill point that bit tip angle is 150~170 ° when drilling, using single-side coated copper plate, copper face is downwards and pcb board for back drill Directly contact；

4）Back drill bores the selection in footpath according to Aligning degree tolerance and hole tolerance, and suitable backboard bore cutter footpath and rough drill is obtained accordingly Most pocket knife footpath disparity range needed for through hole knife footpath, specifically when back drill drills, the hole wall copper after just holes drilled through, drilling tool are fallen in subdrilling Using the cutter of 0.18MM more than bigger than rough drill through-hole diameter.