CN110430669A - Circuit board and production technology based on laser drill tungsten carbide/conductive substrate surfaces hole - Google Patents
Circuit board and production technology based on laser drill tungsten carbide/conductive substrate surfaces hole Download PDFInfo
- Publication number
- CN110430669A CN110430669A CN201910742714.2A CN201910742714A CN110430669A CN 110430669 A CN110430669 A CN 110430669A CN 201910742714 A CN201910742714 A CN 201910742714A CN 110430669 A CN110430669 A CN 110430669A
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- Prior art keywords
- hole
- copper
- layer
- circuit board
- tungsten carbide
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 32
- 238000003763 carbonization Methods 0.000 claims abstract description 10
- 239000004576 sand Substances 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 19
- 238000003698 laser cutting Methods 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000004642 Polyimide Substances 0.000 claims description 13
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 238000005488 sandblasting Methods 0.000 claims description 9
- 241001232787 Epiphragma Species 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 239000002893 slag Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 33
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The present invention provides a kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterized by: the copper-clad plate with substrate, copper foil offers hole, the hole wall position in the corresponding hole of substrate has one layer of carburization zone, and copper foil surface and carbonization layer surface have one layer of copper plate.The production technology of circuit board of the present invention also based on laser drill tungsten carbide/conductive substrate surfaces hole.The present invention improves board production efficiency, reduces production cost.
Description
Technical field
The present invention relates to a kind of board structure of circuit, the especially structure of the through-hole of circuit board or blind hole.
Background technique
For the circuit board that some need through-hole or blind buried via hole to be connected, traditional technique is all by electroless copper plating or graphite
The method of black holes forms one layer of very thin conductive layer in the insulating layer of hole wall surrounding, this conductive layer is recycled to be electroplated one layer more
Thick copper forms hole metallization, plays the role of wiring board upper and lower level line conduction.Obviously this is a kind of necessary technique.
Such as the traditional metallization of wiring board laser drill shown in Fig. 1 hole technique is:
Polyimide copper clad lamination or FR4 copper-clad plate, after UV ultraviolet laser holes drilled through or blind hole, using plasma de-smear or
The methods such as sodium hydroxide chemical cleaning processing remove carburization zone, then with electroless copper plating or carbon dust black holes technique, in hole wall surrounding shape
At one layer of very thin conductive layer, then electro-coppering is carried out, then route production re-plating or chemical nickel plating gold, then carries out sharp processing
The process Deng after.
The electroless copper plating or graphite black holes of the prior art form the process costs of one layer of very thin conductive layer in hole wall surrounding
Height, low efficiency.
Summary of the invention
The present invention provides a kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, existing the purpose is to solve
There is the shortcomings that technology, improve board production efficiency, reduces production cost.
The present invention also provides a kind of production technologies of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: there is substrate, copper foil
Copper-clad plate offer hole, the hole wall position in the corresponding hole of substrate has one layer of carburization zone, copper foil surface and carbonization layer surface tool
There is one layer of copper plate.
The copper foil includes upper copper, lower copper foil, and the copper-clad plate is double face copper.
The hole is through-hole or blind hole.
A kind of production technology of the circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: packet
Include following steps:
Step 1: the copper-clad plate with substrate, copper foil is cut into the size of needs, and it is substrate that copper-clad plate, which is by polyimides,
Flexible copper-clad plate, or using epoxy glass fiber cloth as the rigid copper-clad plate of substrate；
Step 2: by designed hole location coordinate and aperture size file, UV ultraviolet laser cutting machine tool is imported, according to substrate
Material and thickness, copper thickness, the type in hole, pore size, set drilling parameter, then carry out test drilling, be cut into needs
Aperture and depth hole；Carburization zone 6 after laser cutting in the hole wall surrounding adherency of substrate is with a thickness of 1-2 μm；
Step 3: by the copper-clad plate after laser drill, carrying out high-pressure sand blast processing with sand grains, remove after being cut by laser in hole
The black oxide layer of remaining plush copper carbon slag and copper foil surface；
Step 4: the plate after sandblasting being subjected to electro-coppering, forms copper plate in carburization zone, upper copper foil, lower copper foil surface.
The sand grains of step 3 is 300-400# sand grains.
Or
A kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: there is substrate, route
Copper-clad plate offer hole, the hole wall position in the corresponding hole of substrate has one layer of carburization zone, has on route and pastes epiphragma or print
The coating that ink is formed, carbonization layer surface are coated with one layer of nickel-gold layer, and the circuit surface for being not covered with layer is also coated with one layer of nickel gold
Layer.
The route includes upper layer circuit, lower sandwich circuit, and the copper-clad plate is double face copper.
The hole is through-hole or blind hole.
A kind of production technology of the circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: packet
Include following steps:
Step 1: unwanted copper foil is etched away by design requirement when copper-clad plate route is made, obtains line spacing and hole,
Form route；
Step 2: by designed hole location coordinate and aperture size file, UV ultraviolet laser cutting machine tool is imported, according to substrate
Material and thickness, copper thickness, the type in hole, pore size, set drilling parameter, then carry out test drilling, be cut into needs
Aperture and depth hole；Carburization zone 6 after laser cutting in the hole wall surrounding adherency of substrate is with a thickness of 1-2 μm；
Step 3: by the copper-clad plate after laser drill, carrying out high-pressure sand blast processing with sand grains, remove after being cut by laser in hole
The black oxide layer of remaining plush copper carbon slag and copper foil surface；
Step 4: carrying out the plate after sandblasting to paste epiphragma or printing ink forms coating；Then chemical nickel plating gold, in carbon
Change layer and is not covered with circuit surface one layer of nickel-gold layer of plating of layer.
The sand grains of step 3 is 300-400# sand grains.
The invention has the beneficial effects that:
All can after laser holes drilled through or blind hole using polyimides or epoxy glass fiber cloth as the wiring board of substrate
In the surface of insulating layer of hole wall surrounding, one layer of uniform carburization zone is formed, this carburization zone is conductive, passes through sandblasting process
Remove some exoncomas that carbonisation is formed, so that it may electro-coppering or electronickelling gold or chemistry are directly carried out using this electric conductivity
Plating nickel gold eliminates electroless copper plating or black holes technical process to reduce costs and improves production efficiency.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is prior art processes flow chart；
Fig. 2 is the first technology process flow chart of the invention；
Fig. 3 is sectional view after the first technique copper-clad plate laser cutting of the invention；
Fig. 4 is sectional view after the first technique copper-clad plate copper facing of the invention；
Fig. 5 is second of technology process flow chart of the invention；
Fig. 6 is sectional view after being cut by laser after second of technique copper-clad plate route of the present invention makes；
Fig. 7 is sectional view after second of technique copper-clad plate chemical nickel plating gold of the present invention.
Specific embodiment
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in description will be made below simple
Ground introduction, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ordinary skill
For personnel, without creative efforts, it can also be obtained according to these attached drawings other embodiments.
The principle of the present invention is:
It take polyimides (PI) or epoxy glass fiber cloth (FR-4) as the wiring board of substrate, using laser holes drilled through or blind
Kong Hou can form one layer of uniform carburization zone, this carburization zone in the surface of insulating layer of hole wall surrounding, and traditional technique is
It is removed using methods such as plasma or sodium hydroxides, then uses heavy copper or black holes technique, one layer very thin led in the formation of hole wall surrounding
Electric layer, then carry out electro-coppering.Actually this carburization zone is conductive, is that laser burning cuts process, under the action of high temperature moment
Polyimides or epoxy glass fiber cloth are carbonized, the carburization zone for being adhered to hole wall surrounding, and this carburization zone and hole wall are formed
The polyimides of script or epoxy glass fiber cloth combination are more firm.Certainly, some exoncomas also be will form sometimes in carbonisation, this
A little exoncomas can be removed by subsequent sandblasting process.Therefore utilize this carburization zone electric conductivity, directly carry out electro-coppering or
Electronickelling gold, chemical nickel plating gold directly carry out electronickelling gold, chemical plating for certain to save heavy copper or black holes process
The product of nickel gold, also saves plating copper process.It is used using the product that this mode produces through detection and client, performance and biography
The product that system technique generates does not have difference.
The first technique of the invention as shown in Figure 2, Figure 3, Figure 4: the technique is suitble to first laser drill, then makes route
Mode.I.e. with the above copper-clad plate through-hole 4 or blind hole 5 for having copper foil of UV ultraviolet laser cutting one side.UV ultraviolet laser is suitble to cut
Metal material and nonmetallic materials.
Step 1: there is substrate 1, upper copper 2, the double face copper of lower copper foil 3 to be cut into the size of needs, it is two-sided
It is base that copper-clad plate, which can be flexible double-sided copper-clad plate that polyimides (PI) is substrate 1 or epoxy glass fiber cloth (FR-4),
The rigid double-face copper-clad plate of material 1；
Step 2: by designed hole location coordinate and aperture size file, UV ultraviolet laser cutting machine tool is imported, according to substrate
Material and thickness, copper thickness, the type (through-hole, blind hole) in hole, pore size etc., set drilling parameter, are then tried
It bores, is cut into the aperture of needs and the through-hole 4 of depth or blind hole 5.The carbonization adhered to after laser cutting in the hole wall surrounding of substrate 1
About 1-2 μm of 6 thickness of layer.
Step 3: by the copper-clad plate after laser drill, carrying out high-pressure sand blast processing with 300-400# sand grains, remove in hole and swash
Remaining plush copper carbon slag after light cutting.Since the carburization zone 6 that hole wall surrounding adheres to after laser cutting is more firm in conjunction with former base material, spray
Hole wall surrounding can only be had the part carbon slag of plush copper by sand process, be got rid of under the impacting with high pressure of sand grains, while by copper foil surface
Black oxide layer removal.
Step 4: the plate after sandblasting being subjected to electro-coppering, due to polyimides or epoxy after through-hole 4 or the laser cutting of blind hole 5
The carburization zone 6 of the hole wall surrounding of glass fibre cloth base material 1 can be conductive, upper copper foil 2 and lower copper foil 3, Dou Nengjun with hole wall surrounding
Even one layer of copper of plating forms copper plate 61, and according to copper facing thickness requirement, sets the parameters such as copper facing current density, time, speed.
The half-finished product plate of formation is to offer through-hole 4 with substrate 1, upper copper 2, the double face copper of lower copper foil 3
Or blind hole 5, the hole wall position of the corresponding through-hole 4 of substrate 1 or blind hole 5 have one layer of carburization zone, copper foil surface and carbonization layer surface
With one layer of copper plate.
Step 5: half-finished product plate being subjected to route production, pastes epiphragma or printing ink, electronickelling gold or change nickel gold, progress electricity
The rear process production such as survey, sharp processing.
Such as Fig. 5, Fig. 6, second of technique of the invention shown in Fig. 7: being suitble to first make route, then laser drill mode.
I.e. while circuit etching needing the position copper foil of holes drilled through 4 or blind hole 5 to etch away, then use CO2Laser to the position into
Row cutting.CO2Laser is suitble to cut the nonmetallic materials such as polyimides, epoxy glass fiber cloth.
Step 1: double face copper being etched away into unwanted copper foil by design requirement when route makes, obtains line spacing
7 and through-hole 4 or blind hole 5 size, form upper layer circuit 21 and lower sandwich circuit 31.
Step 2: by designed hole location coordinate and aperture size file, importing CO2Laser cutting machine, according to 1 material of substrate
Material, thickness, the type (through-hole 4, blind hole 5) in hole, pore size size etc., set drilling parameter, test drilling are then carried out, in through-hole
4 or blind hole 5 be cut into aperture and the depth of needs.After laser cutting substrate 1 hole wall surrounding adhere to 6 thickness of carburization zone about
1-2μm。
Step 3: by the copper-clad plate after laser drill, carry out high-pressure sand blast processing with 300-400# sand grains, remove through-hole 4 or
Remaining plush copper carbon slag after laser cutting in blind hole 5.Due to the carburization zone 6 and former base material knot that hole wall surrounding adheres to after laser cutting
Conjunction is more firm, and hole wall surrounding can only be had the part carbon slag of plush copper by sandblasting procedures, gets rid of under the impacting with high pressure of sand grains, simultaneously will
The black oxide layer of copper foil surface removes.
Step 4: carrying out the plate after sandblasting to paste epiphragma or printing ink forms coating 8.Then chemical nickel plating gold, due to
The carburization zone of 1 hole wall surrounding of polyimides or epoxy glass fiber cloth substrate can be conductive after through-hole 4 or blind hole 5 are cut by laser, with
The upper layer circuit 21 of hole wall surrounding and lower sandwich circuit 31, can in the position for not pasting epiphragma or printing ink formation coating 8
Uniformly one layer of nickel-gold layer 61 of plating, and according to plating nickel gold thickness requirement, set chemical nickel plating gold parameter.
The half-finished product plate of formation is to offer logical with substrate 1, upper layer circuit 21, the double face copper of lower sandwich circuit 31
The hole wall position of hole 4 or blind hole 5, the corresponding through-hole 4 of substrate 1 or blind hole 5 has one layer of carburization zone, upper layer circuit 21 and lower layer line
The coating 8 for pasting that epiphragma or printing ink are formed is respectively provided on road 31, carbonization layer surface is coated with one layer of nickel-gold layer 61, does not cover
The upper layer circuit 21 of cap rock 8 and lower 31 surface of sandwich circuit are also coated with one layer of nickel-gold layer 61.
(5) by the half-finished product plate after chemical nickel plating gold, the rear process production such as electrical measurement, sharp processing is carried out.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.To the upper of the disclosed embodiments
It states bright, enables those skilled in the art to implement or use the present invention.Various modifications to these embodiments are to ability
Will be apparent for the professional technician in domain, the general principles defined herein can not depart from it is of the invention
In the case where spirit or scope, realize in other embodiments.Therefore, the present invention be not intended to be limited to it is shown in this article these
Embodiment, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. a kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: with substrate, copper foil
Copper-clad plate offers hole, and the hole wall position in the corresponding hole of substrate has one layer of carburization zone, and copper foil surface and carbonization layer surface have
One layer of copper plate.
2. the circuit board as described in claim 1 based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: institute
Stating copper foil includes upper copper, lower copper foil, and the copper-clad plate is double face copper.
3. the circuit board as described in claim 1 based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: institute
The hole stated is through-hole or blind hole.
4. the production technology of the circuit board as described in claim 1 based on laser drill tungsten carbide/conductive substrate surfaces hole,
It is characterized in that: including the following steps:
Step 1: the copper-clad plate with substrate, copper foil is cut into the sizes of needs, copper-clad plate be the soft of substrate by polyimides
Property copper-clad plate, or using epoxy glass fiber cloth as the rigid copper-clad plate of substrate；
Step 2: by designed hole location coordinate and aperture size file, UV ultraviolet laser cutting machine tool is imported, according to substrate material
With thickness, copper thickness, the type in hole, pore size, drilling parameter is set, then carries out test drilling, is cut into the hole of needs
The hole of diameter and depth；Carburization zone 6 after laser cutting in the hole wall surrounding adherency of substrate is with a thickness of 1-2 μm；
Step 3: by the copper-clad plate after laser drill, carrying out high-pressure sand blast processing with sand grains, remove and remained after being cut by laser in hole
Plush copper carbon slag and copper foil surface black oxide layer；
Step 4: the plate after sandblasting being subjected to electro-coppering, forms copper plate in carburization zone, upper copper foil, lower copper foil surface.
5. the production technology of the circuit board as claimed in claim 4 based on laser drill tungsten carbide/conductive substrate surfaces hole,
Be characterized in that: the sand grains of step 3 is 300-400# sand grains.
6. a kind of circuit board based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: with substrate, route
Copper-clad plate offers hole, and the hole wall position in the corresponding hole of substrate has one layer of carburization zone, has on route and paste epiphragma or stamp-pad ink
The coating that ink is formed, carbonization layer surface are coated with one layer of nickel-gold layer, and the circuit surface for being not covered with layer is also coated with one layer of nickel-gold layer.
7. the circuit board as claimed in claim 6 based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: institute
Stating route includes upper layer circuit, lower sandwich circuit, and the copper-clad plate is double face copper.
8. the circuit board as claimed in claim 6 based on laser drill tungsten carbide/conductive substrate surfaces hole, it is characterised in that: institute
The hole stated is through-hole or blind hole.
9. the production technology of the circuit board as claimed in claim 6 based on laser drill tungsten carbide/conductive substrate surfaces hole,
It is characterized in that: including the following steps:
Step 1: etching away unwanted copper foil by design requirement when copper-clad plate route is made, obtain line spacing and hole, formed
Route；
Step 2: by designed hole location coordinate and aperture size file, UV ultraviolet laser cutting machine tool is imported, according to substrate material
With thickness, copper thickness, the type in hole, pore size, drilling parameter is set, then carries out test drilling, is cut into the hole of needs
The hole of diameter and depth；Carburization zone 6 after laser cutting in the hole wall surrounding adherency of substrate is with a thickness of 1-2 μm；
Step 3: by the copper-clad plate after laser drill, carrying out high-pressure sand blast processing with sand grains, remove and remained after being cut by laser in hole
Plush copper carbon slag and copper foil surface black oxide layer；
Step 4: carrying out the plate after sandblasting to paste epiphragma or printing ink forms coating；Then chemical nickel plating gold, in carburization zone
One layer of nickel-gold layer is plated with the circuit surface for being not covered with layer.
10. the production technology of the circuit board as claimed in claim 9 based on laser drill tungsten carbide/conductive substrate surfaces hole,
Be characterized in that: the sand grains of step 3 is 300-400# sand grains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910742714.2A CN110430669A (en) | 2019-08-13 | 2019-08-13 | Circuit board and production technology based on laser drill tungsten carbide/conductive substrate surfaces hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910742714.2A CN110430669A (en) | 2019-08-13 | 2019-08-13 | Circuit board and production technology based on laser drill tungsten carbide/conductive substrate surfaces hole |
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| Publication Number | Publication Date |
|---|---|
| CN110430669A true CN110430669A (en) | 2019-11-08 |
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| CN201910742714.2A Pending CN110430669A (en) | 2019-08-13 | 2019-08-13 | Circuit board and production technology based on laser drill tungsten carbide/conductive substrate surfaces hole |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315146A (en) * | 2020-02-27 | 2020-06-19 | 清华大学 | Method for manufacturing flexible composite circuit |
| CN112570385A (en) * | 2020-12-01 | 2021-03-30 | 珠海杰赛科技有限公司 | Carbon black-free laser edge milling process for PCB |
| CN113766738A (en) * | 2020-06-02 | 2021-12-07 | 深南电路股份有限公司 | Drilling method and drilling device for circuit board and computer readable storage device |
| CN114229790A (en) * | 2021-11-11 | 2022-03-25 | 江苏普诺威电子股份有限公司 | Composite treatment process based on MEMS (micro-electromechanical systems) groove hole wall |
| CN115190697A (en) * | 2022-07-19 | 2022-10-14 | 常州海弘电子有限公司 | Rapid metallization process for through hole and blind hole of printed circuit board |
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