CN108697009B - Method for manufacturing printed circuit board and printed circuit board - Google Patents
Method for manufacturing printed circuit board and printed circuit board Download PDFInfo
- Publication number
- CN108697009B CN108697009B CN201710223126.9A CN201710223126A CN108697009B CN 108697009 B CN108697009 B CN 108697009B CN 201710223126 A CN201710223126 A CN 201710223126A CN 108697009 B CN108697009 B CN 108697009B
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- printed circuit
- circuit board
- hole
- copper
- core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a manufacturing method of a printed circuit board and the printed circuit board, the manufacturing method of the printed circuit board provided by the invention comprises the steps of drilling a first hole at a preset position of a first core board after patterning the first core board, filling a decomposable material into the hole, drilling a second hole at the same position after pressing with the rest core boards, wherein the diameter of the first hole is larger than that of the second hole, so that the decomposable material is still left on the hole wall of the first core board after the second hole is drilled, palladium is deposited on the decomposable material after palladium activation treatment is carried out in a PTH flow, and the palladium is removed after the decomposable material is decomposed, so that a copper layer cannot be formed on the hole wall surface of the first core board in the copper deposition and copper electroplating processes.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a printed circuit board and the printed circuit board.
Background
At present, with the development of communication technology, the requirements of communication electronic products on signals are higher and higher. Each product generation update requires technical support from the printed circuit board process and also presents a significant challenge to the printed circuit board industry. In the design of through holes on a printed circuit board, redundant paths which are ineffective for signal transmission often exist, and the loss influence of the paths on signals is very obvious. In the related art, as shown in fig. 1 and 2, in order to solve such problems of the printed circuit board 10 ', a back-drilling method is mainly used to cut off the copper layer 20' on the invalid path in the through hole, so as to reduce the transmission loss of the signal and improve the signal integrity.
However, the back drilling process still has many disadvantages. Such as: the processing difficulty is high due to uneven plate thickness, and the depth is difficult to control accurately; the back drilling is not thorough, and the residual copper sheet still influences the transmission quality of signals; the risk of drilling through the conductive layer exists, and the product yield is greatly influenced by the risk; the back drilling causes a semi-destructive structure to the hole, so that the hole is stressed unevenly under the environment of thermal stress influence such as reflow soldering and the like, and the reliability failure of a local position is easily caused.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
Therefore, the first objective of the invention is to provide a manufacturing method of a printed circuit board.
A second object of the present invention is to provide a printed circuit board.
In view of the above, according to a first object of the present invention, there is provided a method of manufacturing a printed circuit board, comprising: patterning the first core plate, and drilling a first hole at a first preset position; filling a decomposable material into the first hole; pressing the first core board and the second core board according to a second preset position, or pressing the first core board and the prepreg according to a second preset position, or pressing the first core board, the second core board and the prepreg according to a second preset position, so as to obtain a semi-finished printed circuit board; drilling a second hole on the printed circuit board according to a first preset position, wherein the diameter of the second hole is smaller than that of the first hole; carrying out palladium activation treatment on the printed circuit board; decomposing the decomposable material at the first hole; and carrying out chemical copper deposition treatment and electrolytic copper plating treatment on the printed circuit board.
According to the manufacturing method of the printed circuit board, after the first core board is patterned, the first Hole is drilled at the preset position of the first core board, the Hole is filled with the decomposable material, the second Hole is drilled at the same position after the first core board is pressed with the rest core boards, and the diameter of the first Hole is larger than that of the second Hole, so that the decomposable material is still left on the Hole wall of the first core board after the second Hole is drilled, palladium is deposited on the decomposable material after palladium activation treatment is carried out in a PTH (Plating Through Hole metallization) process, and the palladium is removed after the decomposable material is decomposed, so that a copper layer cannot be formed on the Hole wall surface of the first core board in the copper deposition and copper electroplating processes; the process can completely replace a back drilling process, and because the first hole is a through hole drilled before the first core plate is pressed, the problem of depth control does not exist in the process, and because a copper layer cannot be formed on the first hole wall all the time in the processes of copper deposition and copper electroplating, the problem that the residual copper sheet affects the transmission quality of signals is effectively solved, and the process does not need to drill the printed circuit board for many times, thereby effectively reducing the damage to the printed circuit board, improving the reliability of the printed circuit board and prolonging the service life of the printed circuit board.
In addition, the method for manufacturing the printed circuit board in the above technical solution provided by the present invention may further have the following additional technical features:
in the above technical solution, preferably, the first core board is one of the following or a combination thereof: a double-sided copper-clad core board, a single-sided copper-clad core board, a double-sided copper-removed core board or a prepreg.
In any of the above technical solutions, preferably, the intermediate layer of the double-sided copper-clad core board is resin glass fiber, and the two sides are copper sheets; one surface of the single-sided copper-clad core board is resin glass fiber, and the other surface is copper sheet; the double-sided decoppered core board is made of resin glass fiber.
In the technical scheme, the first core board can be a double-sided copper-clad core board, a single-sided copper-clad core board, a double-sided copper-removed core board or a prepreg, so that the manufacturing method of the printed circuit board has a wider application range, and the practicability of the printed circuit board is effectively improved.
In any of the above solutions, preferably, the difference between the diameter of the first hole and the diameter of the second hole is greater than or equal to 2mil (1mil ≈ 0.0254mm) and less than or equal to 4 mil.
In the technical scheme, the diameter difference between the first hole and the second hole is set to be 2-4 mil, so that a layer of decomposable material can be effectively reserved on the inner wall of the first hole after the second hole is drilled, palladium can be removed along with the decomposable material, and palladium cannot be formed on the wall of the first hole.
In any of the above solutions, preferably, after filling the decomposable material into the first hole, the method for manufacturing a printed circuit board further includes: and grinding the surface of the first core plate.
In the technical scheme, the surface of the first core plate is polished, so that the first core plate is filled with the decomposable material, the decomposable material is prevented from protruding out of the surface of the first core plate, and subsequent pressing is prevented from being influenced.
In any of the above technical solutions, preferably, drilling a second hole on the printed circuit board according to the first predetermined position, wherein after the diameter of the second hole is smaller than the diameter of the first hole, the method further includes: and (4) carrying out glue removing treatment on the printed circuit board.
In the technical scheme, the glue removing treatment is carried out on the printed circuit board, so that the surface of the printed circuit board before the palladium activation treatment is clean and tidy without impurities, and the effect of the palladium activation treatment is ensured.
In any of the above technical solutions, preferably, after decomposing the decomposable material at the first hole, the method further includes: the printed circuit board is subjected to accelerated processing.
In the technical scheme, the passivation substance covered on the surface of the palladium is removed by carrying out accelerated treatment on the printed circuit board, so that the activity of the palladium is effectively improved, and the effect of depositing copper is ensured.
In any of the above technical solutions, preferably, after the copper is chemically deposited and electroplated on the printed circuit board, the method further includes: and transferring an outer layer pattern of the printed circuit board, and performing surface treatment.
In the technical scheme, the final finished printed circuit board is obtained by transferring the outer layer pattern of the printed circuit board and carrying out surface treatment, so that the overall performance of the printed circuit board is effectively improved.
In any of the above embodiments, preferably, the decomposable material is one or any combination of a polyester-based high molecular polymer, an acrylic-based high molecular polymer, and a silicone-based high molecular polymer.
In this embodiment, the decomposable material can be a modified acrylic resin with pores plugged or a resin with the same function.
In any of the above technical solutions, preferably, the decomposition of the decomposable material at the first holes is specifically: the decomposable material is dissolved by a high temperature alkaline solution.
In the technical scheme, the high-temperature alkaline solution can be a NaOH solution with the concentration of 3-10% and the temperature of 40-80 ℃.
According to a second object of the present invention, there is provided a printed circuit board manufactured by the method for manufacturing a printed circuit board according to any one of the above-mentioned aspects, thereby having all the advantageous effects of the method for manufacturing a printed circuit board according to any one of the above-mentioned aspects.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view showing a structure of a printed circuit board in the related art;
FIG. 2 is a schematic view showing a structure of a printed circuit board after back drilling in the related art;
FIG. 3 shows a flow chart of a method of manufacturing a printed circuit board according to one embodiment of the invention;
FIG. 4 shows a flow chart of a method of manufacturing a printed circuit board according to another embodiment of the invention;
FIG. 5 shows a schematic view of a first core plate according to an embodiment of the invention;
FIG. 6 illustrates a schematic view of a first core plate after drilling a first hole in accordance with one embodiment of the present invention;
FIG. 7 shows a schematic view of a first core plate after filling with decomposable material according to one embodiment of the invention;
FIG. 8 shows a schematic view of a printed circuit board after stitching according to one embodiment of the invention;
FIG. 9 shows a schematic view of a printed circuit board after drilling a second hole in accordance with one embodiment of the present invention;
FIG. 10 shows a schematic view of a printed circuit board after a palladium activation process according to one embodiment of the invention;
FIG. 11 shows a schematic view of a printed circuit board after removal of decomposable material according to one embodiment of the invention;
FIG. 12 shows a schematic view of a printed circuit board after deposition of copper according to one embodiment of the invention;
FIG. 13 shows a schematic view of a printed circuit board after electroplating of copper according to one embodiment of the present invention;
wherein, the correspondence between the reference numbers and the component names in fig. 1 to 13 is:
10 'printed circuit board, 20' copper sheet, 302 first core board, 3022 first hole, 304 decomposable material, 306 second core board, 308 prepreg, 310 second hole, 312 palladium, 314 deposited copper layer, 316 electroplated copper layer.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
A method of manufacturing a printed circuit board and a printed circuit board according to some embodiments of the present invention are described below with reference to fig. 3 and 13.
In an embodiment of the first aspect of the present invention, as shown in fig. 3, the present invention provides a method of manufacturing a printed circuit board, including: 102, patterning the first core plate, and drilling a first hole at a first preset position; 104, filling decomposable material into the first hole; step 106, pressing the first core board and the second core board according to a second preset position, or pressing the first core board and the prepreg according to a second preset position, or pressing the first core board, the second core board and the prepreg according to a second preset position, so as to obtain a semi-finished printed circuit board; step 108, drilling a second hole on the printed circuit board according to the first preset position, wherein the diameter of the second hole is smaller than that of the first hole; step 110, performing palladium activation treatment on the printed circuit board; step 112, decomposing the decomposable material at the first hole; step 114, the printed circuit board is subjected to chemical copper deposition and electrolytic copper plating.
In the embodiment, after the first core plate is patterned, a first hole is drilled at a preset position of the first core plate, a decomposable material is filled in the hole, a second hole is drilled at the same position after the first core plate is pressed with the rest core plates, and the diameter of the first hole is larger than that of the second hole, so that the decomposable material is still left on the hole wall of the first core plate after the second hole is drilled, palladium is deposited on the decomposable material after palladium activation treatment is carried out in a PTH flow, and palladium is removed after the decomposable material is decomposed, so that a copper layer cannot be formed on the surface of the hole wall of the first core plate in the processes of copper deposition and copper electroplating; the process can completely replace a back drilling process, and because the first hole is a through hole drilled before the first core plate is pressed, the problem of depth control does not exist in the process, and because a copper layer cannot be formed on the first hole wall all the time in the processes of copper deposition and copper electroplating, the problem that the residual copper sheet affects the transmission quality of signals is effectively solved, and the process does not need to drill the printed circuit board for many times, thereby effectively reducing the damage to the printed circuit board, improving the reliability of the printed circuit board and prolonging the service life of the printed circuit board.
In one embodiment of the present invention, preferably, the first core plate is one or a combination of the following: a double-sided copper-clad core board, a single-sided copper-clad core board, a double-sided copper-removed core board or a prepreg.
In one embodiment of the present invention, preferably, the intermediate layer of the double-sided copper-clad core board is resin glass fiber, and the two sides are copper sheets; one surface of the single-sided copper-clad core board is resin glass fiber, and the other surface is copper sheet; the double-sided decoppered core board is made of resin glass fiber.
In this embodiment, the first core board may be a double-sided copper-clad core board, a single-sided copper-clad core board, a double-sided copper-removed core board or a prepreg, so that the manufacturing method of the printed circuit board has a wider application range, and the practicability of the printed circuit board is effectively improved.
In one embodiment of the present invention, preferably, the difference between the diameter of the first hole and the diameter of the second hole is greater than or equal to 2mil (1mil ≈ 0.0254mm) and less than or equal to 4 mil.
In this embodiment, by setting the difference between the diameters of the first hole and the second hole to be 2mil to 4mil, it is effectively ensured that a layer of decomposable material remains on the inner wall of the first hole after the second hole is drilled, and it is ensured that palladium is removed along with the decomposable material, and palladium cannot be formed on the wall of the first hole.
In one embodiment of the present invention, preferably, as shown in fig. 4, after filling the decomposable material into the first hole at step 202, the method for manufacturing a printed circuit board further includes: step 204, grinding the surface of the first core plate.
In this embodiment, by polishing the surface of the first core plate, after the first core plate is filled with the decomposable material, the decomposable material is ensured not to protrude out of the surface of the first core plate, thereby avoiding influencing subsequent pressing.
In an embodiment of the present invention, preferably, as shown in fig. 4, step 210 is to drill a second hole on the printed circuit board at a first predetermined position, wherein after the diameter of the second hole is smaller than the diameter of the first hole, the method further includes: step 212, a glue removing process is performed on the printed circuit board.
In the embodiment, the glue removing treatment is carried out on the printed circuit board, so that the surface of the printed circuit board before the palladium activating treatment is clean and tidy without impurities, and the effect of the palladium activating treatment is ensured.
In one embodiment of the present invention, as shown in fig. 4, step 216, after decomposing the decomposable material at the first hole, further includes: step 218, the printed circuit board is subjected to accelerated processing.
In the embodiment, the passivation substance covered on the surface of the palladium is removed by carrying out accelerated treatment on the printed circuit board, so that the activity of the palladium is effectively improved, and the effect of depositing copper is ensured.
In one embodiment of the present invention, as shown in fig. 4, step 220, after the step of chemically depositing copper and electroplating copper on the printed circuit board, further includes: step 222, transferring an outer layer pattern of the printed circuit board and performing surface treatment.
In the embodiment, the final finished printed circuit board is obtained by transferring the outer layer pattern of the printed circuit board and performing surface treatment, so that the overall performance of the printed circuit board is effectively improved.
In one embodiment of the present invention, preferably, the decomposable material is one or any combination of a polyester-based high molecular polymer, an acrylic-based high molecular polymer and a silicone-based high molecular polymer.
In this embodiment, the decomposable material can be a modified acrylic resin or a resin of similar function.
In one embodiment of the invention, the decomposable material at the first pores is preferably decomposed specifically as: the decomposable material is dissolved by a high temperature alkaline solution.
In this embodiment, the high temperature alkaline solution may be a NaOH solution with a concentration of 3% to 10% and a temperature of 40 ℃ to 80 ℃.
In an embodiment of the second aspect of the present invention, the present invention provides a printed circuit board manufactured by the method for manufacturing a printed circuit board according to any one of the above-described embodiments, and therefore, the printed circuit board has all the advantageous effects of the method for manufacturing a printed circuit board according to any one of the above-described embodiments.
In one embodiment of the present invention, as shown in fig. 4, step 202, as shown in fig. 5 and 6, the first core plate 302 is patterned and a first hole 3022 is drilled at a first predetermined location; step 204, grinding the surface of the first core plate 302; step 206, as shown in fig. 7, filling decomposable material 304 into the first hole 3022; step 208, as shown in fig. 8, pressing the first core board 302 and the second core board 306 according to a second predetermined position, or pressing the first core board 302 and the prepreg 308 according to a second predetermined position, or pressing the first core board 302, the second core board 306 and the prepreg 308 according to a second predetermined position, so as to obtain a semi-finished printed circuit board; step 210, as shown in fig. 9, drilling a second hole 310 on the printed circuit board according to a first predetermined position, wherein the diameter of the second hole 310 is smaller than the diameter of the first hole 3022; step 212, performing glue removal treatment on the printed circuit board; step 214, as shown in fig. 10, performing palladium activation treatment on the printed circuit board to form a layer of palladium 312 on the surface of the printed circuit board and on the wall of the second hole 310; step 216, as shown in fig. 11, the decomposable material 304 at the first hole 3022 is decomposed, and the decomposable material 304 is removed together with the palladium 312 attached thereto; step 218, performing accelerated processing on the printed circuit board; step 220, as shown in fig. 12 and 13, performing a chemical copper deposition process and an electroplating copper process on the pcb to form a copper deposition layer 314 and a copper electroplating layer 316 on the surface of the pcb and the wall of the second hole 310; step 222, transferring an outer layer pattern of the printed circuit board and performing surface treatment.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A method of manufacturing a printed circuit board, comprising:
patterning the first core plate, and drilling a first hole at a first preset position;
filling a decomposable material into the first hole;
pressing the first core board and the second core board according to a second preset position, or pressing the first core board and the prepreg according to a second preset position, or pressing the first core board, the second core board and the prepreg according to a second preset position, so as to obtain a semi-finished printed circuit board;
drilling a second hole on the printed circuit board according to a first preset position, wherein the diameter of the second hole is smaller than that of the first hole;
wherein the first hole is concentric with the second hole;
carrying out palladium activation treatment on the printed circuit board;
decomposing the decomposable material at the first pores;
and carrying out chemical deposition copper treatment and electrolytic copper treatment on the printed circuit board.
2. The method of manufacturing a printed circuit board according to claim 1, wherein the first core board is one or a combination of: a double-sided copper-clad core board, a single-sided copper-clad core board, a double-sided copper-removed core board or a prepreg.
3. The method of manufacturing a printed circuit board according to claim 2,
the middle layer of the double-sided copper-clad core board is made of resin glass fiber, and the two sides of the double-sided copper-clad core board are made of copper sheets;
one surface of the single-sided copper-clad core board is made of resin glass fiber, and the other surface of the single-sided copper-clad core board is made of copper sheets;
the double-sided copper-removed core board is made of resin glass fiber.
4. The method of claim 1, wherein a difference between a diameter of the first hole and a diameter of the second hole is greater than or equal to 2 mils and less than or equal to 4 mils.
5. The method of manufacturing a printed circuit board according to claim 1, wherein after the filling of the decomposable material into the first hole, the method of manufacturing a printed circuit board further comprises: and grinding the surface of the first core plate.
6. The method for manufacturing a printed circuit board according to claim 1, wherein drilling a second hole on the printed circuit board at a first predetermined position, wherein the diameter of the second hole is smaller than the diameter of the first hole, further comprising: and carrying out glue removing treatment on the printed circuit board.
7. The method of manufacturing a printed circuit board according to claim 1, further comprising, after the decomposing the decomposable material at the first hole: performing accelerated processing on the printed circuit board, wherein the accelerated processing comprises the following steps: and removing the passivation substance covered on the palladium surface.
8. The method of claim 1, further comprising, after the electroless copper deposition and the electroplating of copper on the printed circuit board: and transferring an outer layer pattern of the printed circuit board, and performing surface treatment.
9. The method of claim 1, wherein the decomposable material is one or any combination of a polyester-based high molecular polymer, an acrylic-based high molecular polymer and a silicone-based high molecular polymer.
10. The method of manufacturing a printed circuit board according to claim 9, wherein the decomposing the decomposable material at the first hole is specifically: the decomposable material is dissolved by a high-temperature alkaline solution, wherein the high-temperature alkaline solution is a NaOH solution with the concentration of 3% -10% and the temperature of 40-80 ℃.
11. A printed circuit board manufactured by the method for manufacturing a printed circuit board according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710223126.9A CN108697009B (en) | 2017-04-07 | 2017-04-07 | Method for manufacturing printed circuit board and printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710223126.9A CN108697009B (en) | 2017-04-07 | 2017-04-07 | Method for manufacturing printed circuit board and printed circuit board |
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| CN108697009A CN108697009A (en) | 2018-10-23 |
| CN108697009B true CN108697009B (en) | 2020-08-07 |
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| CN201710223126.9A Active CN108697009B (en) | 2017-04-07 | 2017-04-07 | Method for manufacturing printed circuit board and printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111954395B (en) * | 2020-07-30 | 2024-06-18 | 生益电子股份有限公司 | Printed circuit board with partial hole wall thick conductive layer and preparation method thereof |
| CN112752399B (en) * | 2020-11-26 | 2022-06-14 | 苏州浪潮智能科技有限公司 | Printed circuit board and method for processing through hole thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6541712B1 (en) * | 2001-12-04 | 2003-04-01 | Teradyhe, Inc. | High speed multi-layer printed circuit board via |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
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|---|---|---|---|---|
| KR102300288B1 (en) * | 2014-01-22 | 2021-09-10 | 산미나 코포레이션 | Methods of forming high aspect ration plated through holes and high precision stub removal in a printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6541712B1 (en) * | 2001-12-04 | 2003-04-01 | Teradyhe, Inc. | High speed multi-layer printed circuit board via |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
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Effective date of registration: 20220621 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |