CN109413894A - A kind of production method and PCB of stepped groove slot bottom figure - Google Patents
A kind of production method and PCB of stepped groove slot bottom figure Download PDFInfo
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- CN109413894A CN109413894A CN201811278387.1A CN201811278387A CN109413894A CN 109413894 A CN109413894 A CN 109413894A CN 201811278387 A CN201811278387 A CN 201811278387A CN 109413894 A CN109413894 A CN 109413894A
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- slot bottom
- slot
- stepped groove
- copper
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The embodiment of the invention discloses the production methods and PCB of a kind of stepped groove slot bottom figure, this method comprises: providing the multi-layer board with initial step slot；By multi-layer board electroless copper plating, make the thin copper of side wall deposition of multiple-plate initial step slot；To multi-layer board outside the slot bottom and slot of initial step slot holes drilled through；Multi-layer board is subjected to deposition reaction, so that the hole wall of multiple-plate side wall and through-hole forms conductive layer；Remove the thin copper of side wall and the conductive layer of Bao Tongshang；Multi-layer board is electroplated, so that multiple-plate hole wall plates a thickness copper；Inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, makes slot bottom figure.Technical solution provided in an embodiment of the present invention, compared with the existing technology, process is simpler, is not necessarily to special installation or special process, both reduces operation difficulty, also raising working efficiency, and high-volume is suitble to make.
Description
Technical field
The present embodiments relate to printed circuit board technology field more particularly to a kind of production sides of stepped groove slot bottom figure
Method and PCB.
Background technique
With the development of science and technology electronic product has become indispensable articles for daily use in for people's lives, and PCB
(Printed Circuit Board, printed circuit board) is the important component of electronic product, and people produce electronics in recent years
The functional requirement of product is more and more, and thus to PCB, higher requirements are also raised.In general, special for the ease of being installed on PCB
The device that the device or needs of function sink, it is often necessary to which stepped groove is set on PCB, and stepped groove is also to realize the big function of product
The pith of rate heat dissipation, is in industry widely used.
The side wall of stepped groove can metallize, can also be non-metallic；And the PCB non-metallic for ladder groove sidewall,
There are mainly two types of production methods general at present:
One kind is controlled depth milling production method.It is bigger that this production method not only controls deep difficulty, is difficult controlled depth milling to specified line
Road floor leads to not meet design requirement；And figure can not be made in slot bottom.
Another kind is the via hole and figure of pre-production slot bottom, after filling or embedding gasket, successively carries out pressing plate, uncaps
And take out gasket.This production method, on the one hand must be in production ladder since pre-production slot bottom figure makes stepped groove again
Protection processing, complex process and operating difficulties are carried out to slot bottom figure during slot；On the other hand, it is needing to make different graphic
Production requirement under do not have versatility, constrain the popularization and application of stepped groove PCB.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the deficiencies of the prior art, providing a kind of stepped groove slot bottom figure
Production method and PCB, to overcome complex manufacturing technology of the existing technology, operating difficulties and the defect of poor universality.
To achieve this purpose, the present invention adopts the following technical scheme:
In a first aspect, the embodiment of the present invention provides a kind of production method of stepped groove slot bottom figure, which comprises
The multi-layer board for having initial step slot is provided；
The multi-layer board is placed into heavy copper liquid medicine and carries out electroless copper plating, makes the side of multiple-plate initial step slot
One layer of thin copper is deposited on wall；
Multi-layer board after electroless copper plating is drilled through respectively in the slot bottom position of the initial step slot and slot external position
Hole；
Multi-layer board after holes drilled through is placed into specific liquid medicine and carries out deposition reaction so that multiple-plate side wall with
And one layer of conductive material is deposited on the hole wall of through-hole, form conductive layer；
The conductive layer of the thin copper and Bao Tongshang on the side wall is removed by chemical microetch；
Multi-layer board after chemical microetch is electroplated, so that plating a thickness copper on multiple-plate hole wall；
Inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, makes slot bottom figure.
Further, in the production method, the layers of copper to the non-graphic region of initial step slot slot bottom is carried out
Inkjet process, make slot bottom figure the step of include:
Inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, forms ink-jet region；
Layers of copper in addition to the ink-jet region is carried out tin plating；
The ink on the ink-jet region is removed by laser ablation, then is etched, is gone unless slot bottom graph area
The layers of copper in domain；
The tin layers for removing slot bottom graphics field, so that the layers of copper of slot bottom graphics field is exposed to be formed as slot bottom figure.
Further, in the production method, the multiple-plate step of the offer with initial step slot includes:
Prepreg and outer layer core plate and core material are provided, outer layer core plate, prepreg and core material are being intended to
The corresponding position for forming stepped groove completely or partially opens up through slot；The outer layer core plate includes top layer core plate and bottom core plate；
The outer layer core plate, prepreg and core material are stacked together according to scheduled laminated layer sequence, by filling out
The mode for filling gasket or embedding gasket makes the stepped groove, obtains the multi-layer board with initial step slot.
Further, in the production method, the step of stepped groove is made by way of joint sheet, includes:
The joint sheet in the through slot of the top layer core plate, prepreg and core material；
Buffer board is placed respectively in the outside of the outer layer core plate of lamination two sides, carries out melting lamination at high temperature under high pressure；
It removes buffer board after the completion of lamination and directly takes out the gasket of filling, form the stepped groove.
Further, in the production method, the step of making the stepped groove by way of embedding gasket, includes:
The embedding gasket in the through slot of the prepreg and core material；
It is laminated at high temperature under high pressure, forms the internal embedding multi-layer board for having gasket；
Controlled depth milling plate is carried out to the multi-layer board after lamination, is milled from the top layer core plate to gasket；
Embedding gasket is taken out, stepped groove is formed.
Further, in the production method, the material of the gasket is polytetrafluoroethylene (PTFE).
Further, in the production method, the gasket is process by milling machine.
Further, in the production method, the slot bottom figure includes route and/or pad.
Further, in the production method, the conductive material is carbon dust.
Second aspect, the embodiment of the present invention also provide a kind of PCB, the stepped groove including slot bottom tool figure, which is characterized in that
The stepped groove slot bottom figure is made according to any production method of first aspect.
Compared with prior art, the invention has the following advantages:
Using the embodiment of the present invention, a PCB with stepped groove can be made into, and its ladder groove sidewall is non-metallic, slot bottom
It is formed with figure；In the production process, thin copper is plated by normally heavy copper in multiple-plate side wall substrate area before this, then passed through
Plating mode deposits one layer of conductive layer, and falls the copper plate of sidewall region by microetch, and final realization side wall is subsequent to pass through again without copper
Slot bottom ink-jet blocking is tin plating to produce slot bottom figure, and process is simple, is not necessarily to special installation or special process, both reduced
Operation difficulty, also raising working efficiency, are suitble to high-volume to make.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the production method flow chart for the stepped groove slot bottom figure that the embodiment of the present invention one provides；
Fig. 2 is the multiple-plate topology view for forming initial step slot that the embodiment of the present invention one provides；
Fig. 3 is topology view of the multi-layer board after electroless copper plating shown in Fig. 2；
Fig. 4 is topology view of the multi-layer board after holes drilled through shown in Fig. 3；
Fig. 5 is topology view of the multi-layer board after deposition reaction shown in Fig. 4；
Fig. 6 is multi-layer board shown in Fig. 5 after the conductive layer that microetch removes thin copper and Bao Tongshang on the side wall
Topology view；
Fig. 7 is the topology view of multi-layer board after plating shown in Fig. 6；
Fig. 8 is topology view of the multi-layer board after the ink-jet of non-slot bottom graphics field shown in Fig. 7；
Fig. 9 be Fig. 8 shown in multi-layer board the layers of copper in addition to ink-jet region carry out it is tin plating after topology view；
Figure 10 is topology view of the multi-layer board after laser ablation ink shown in Fig. 9；
Figure 11 removes the topology view unless after the layers of copper of slot bottom graphics field in etching for multi-layer board shown in Figure 10；
Figure 12 is topology view of the multi-layer board shown in Figure 11 after the tin layers of removal slot bottom graphics field.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Referring to Fig. 1, the present embodiment one provides a kind of production method of stepped groove slot bottom figure, comprising steps of
S101, the multi-layer board with initial step slot is provided, as shown in Figure 2.
Specifically, S101 further comprises:
(1) prepreg and outer layer core plate and core material are provided, to outer layer core plate, prepreg and core material
Through slot is completely or partially opened up in the corresponding position of stepped groove to be formed；The outer layer core plate includes top layer core plate and bottom core
Plate；
(2) outer layer core plate, prepreg and core material are stacked together according to scheduled laminated layer sequence, pass through filling
The mode of gasket or embedding gasket makes the stepped groove, obtains the multi-layer board with stepped groove.
Wherein, the method for stepped groove being made using joint sheet mode are as follows: in top layer core plate, prepreg and core material
Through slot in joint sheet；Buffer board is placed respectively in the outside of the outer layer core plate of lamination two sides, is melted at high temperature under high pressure
Melting layer pressure；It removes buffer board after the completion of lamination and directly takes out the gasket of filling, form the stepped groove.
The method that stepped groove is made using embedding gasket mode are as follows: the embedding pad in the through slot of prepreg and core material
Piece；It is laminated at high temperature under high pressure, forms the internal embedding multi-layer board for having gasket；Controlled depth milling is carried out to the multi-layer board after lamination
Plate is milled from the top layer core plate to gasket；Embedding gasket is taken out, stepped groove is formed.
The material of the gasket and buffer board is polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene, PTFE), institute
PTFE gasket is stated to be process by milling machine.
In the present embodiment, glue is buffered and is hindered by using filling or embedding PTFE gasket, relative to silica gel piece, by
It is harder in the hardness of PTFE gasket, therefore filling placement operation is simple, operating efficiency is high.Meanwhile the outer layer core in lamination two sides
PTFE buffer board is placed respectively to be buffered in the outside of plate, can be realized the stability contorting of stepped groove edge gummosis, therefore half
Cured sheets can be selected common FR-4 prepreg and carry out pressing plate, and cost is lower.
The PTFE buffer board with a thickness of 0.2mm~1.0mm.
S102, it the multi-layer board is placed into heavy copper liquid medicine carries out electroless copper plating, make multiple-plate initial step
One layer of thin copper of deposited on sidewalls of slot, as shown in Figure 3.
During electroless copper plating, one layer of thin copper in the side wall deposition of multiple-plate initial step slot, 0.1 μm~2.0 μ of copper thickness
m。
S130, the multi-layer board after electroless copper plating is carried out respectively in the slot bottom position of the initial step slot and slot external position
Holes drilled through, as shown in Figure 4.
At this point, substrate is exposed in the hole of the through-hole.
S104, it the multi-layer board after holes drilled through is placed into specific liquid medicine carries out deposition reaction, so that described multiple-plate
One layer of conductive material is deposited on the hole wall of side wall and through-hole, forms conductive layer, as shown in Figure 5.
In the present embodiment, the conductive material is carbon dust or other conducting polymer substances.
S105, the conductive layer that thin copper and Bao Tongshang on the side wall are removed by chemical microetch, as shown in Figure 6.
The effect of microetch is to form the surface of micro-rough on layers of copper surface, to enhance the binding force with copper plate；Microetch
Depth shallowly will lead to very much copper plate binding force deficiency, is layered or falls off in rear process.This step is removed by chemical microetch mode
Thin copper layer on side wall, while the conductive materials deposited on thin copper layer being removed together.It is to be understood that sinking on substrate in hole
Long-pending conductive materials may be implemented subsequent plating step middle hole wall and plate layers of copper.
At present there are two types of the common microetch systems of PCB: hydrogen peroxide system and sodium peroxydisulfate system, since hydrogen peroxide easily divides
Solution, and the price of stabilizer is costly, therefore the application of sodium peroxydisulfate system is wider.
S106, the multi-layer board after chemical microetch is electroplated, so that a thickness copper is plated on multiple-plate hole wall,
As shown in Figure 7.
The layers of copper of adequate thickness is electroplated on multiple-plate hole wall, and side wall is formed because of no conductive materials without Copper base material area.
S107, inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, makes slot bottom figure.
Wherein, slot bottom figure includes route and/or pad.
Specifically, S107 further comprises:
(1) inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, forms ink-jet region, such as schemes
Shown in 8.
(2) tin plating to the layers of copper progress in addition to the ink-jet region, as shown in Figure 9.
Wherein, non-slot bottom graphics field is due to being sprayed with ink, thus cannot achieve tin plating.
(3) ink on the ink-jet region is removed by laser ablation, then be etched, gone unless slot bottom figure
The layers of copper in region, as shown in figs. 10-11.
Specifically, laser ablation gets rid of slot bottom ink, expose the layers of copper under ink, which exactly needs
Etch the layers of copper of removal.
(4) tin layers for removing slot bottom graphics field, so that the layers of copper of slot bottom graphics field is exposed to be formed as slot bottom figure, such as
Shown in Figure 12.
Specifically, the tin layers of the slot bottom graphics field of the slot bottom are removed, so that slot bottom figure in such a way that laser burns tin
The layers of copper in shape region is exposed, forms slot bottom figure.
A kind of production method of stepped groove slot bottom figure provided in an embodiment of the present invention, can be made into one has stepped groove slot bottom
The PCB of figure, and its ladder groove sidewall is non-metallic, slot bottom is formed with figure；In the production process, before this in multiple-plate side
Wall substrate area plates thin copper by normally heavy copper, then deposits one layer of conductive layer by plating mode, and fall side wall by microetch
The copper plate in area, final realization side wall are subsequent to produce slot bottom figure, process by the way that slot bottom ink-jet blocking is tin plating again without copper
Simply, it is not necessarily to special installation or special process, both reduces operation difficulty, also raising working efficiency, high-volume is suitble to make.
Embodiment two
The present embodiment two provides a kind of PCB comprising slot bottom has the stepped groove of figure, and the slot bottom figure is according to embodiment
One production method provided is made.
The side wall of the stepped groove is non-metallic.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although referring to before
Stating embodiment, invention is explained in detail, those skilled in the art should understand that: it still can be to preceding
Technical solution documented by each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
It modifies or replaces, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of production method of stepped groove slot bottom figure characterized by comprising
The multi-layer board for having initial step slot is provided；
The multi-layer board is placed into heavy copper liquid medicine and carries out electroless copper plating, on the side wall for making multiple-plate initial step slot
Deposit one layer of thin copper；
Holes drilled through is carried out respectively in the slot bottom position of the initial step slot and slot external position to the multi-layer board after electroless copper plating；
Multi-layer board after holes drilled through is placed into specific liquid medicine and carries out deposition reaction, so that multiple-plate side wall and logical
One layer of conductive material is deposited on the hole wall in hole, forms conductive layer；
The conductive layer of the thin copper and Bao Tongshang on the side wall is removed by chemical microetch；
Multi-layer board after chemical microetch is electroplated, so that the conductive layer on multiple-plate hole wall plates a thickness copper；
Inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, makes slot bottom figure.
2. the production method of stepped groove slot bottom figure according to claim 1, which is characterized in that described to the initial rank
The step of layers of copper in the terraced non-graphic region of slot slot bottom carries out inkjet process, makes slot bottom figure include:
Inkjet process is carried out to the layers of copper in the non-graphic region of initial step slot slot bottom, forms ink-jet region；
Layers of copper in addition to the ink-jet region is carried out tin plating；
It the ink on the ink-jet region is removed by laser ablation, then is etched, go unless slot bottom graphics field
Layers of copper；
The tin layers for removing slot bottom graphics field, so that the layers of copper of slot bottom graphics field is exposed to be formed as slot bottom figure.
3. the production method of stepped groove slot bottom figure according to claim 1, which is characterized in that described provide has initially
Multiple-plate step of stepped groove includes:
Prepreg and outer layer core plate and core material are provided, outer layer core plate, prepreg and core material are being intended to be formed
The corresponding position of stepped groove completely or partially opens up through slot；The outer layer core plate includes top layer core plate and bottom core plate；
The outer layer core plate, prepreg and core material are stacked together according to scheduled laminated layer sequence, pass through fill-in pad
The mode of piece or embedding gasket makes the stepped groove, obtains the multi-layer board with initial step slot.
4. the production method of stepped groove slot bottom figure according to claim 3, which is characterized in that pass through the side of joint sheet
Formula make the stepped groove the step of include:
The joint sheet in the through slot of the top layer core plate, prepreg and core material；
Buffer board is placed respectively in the outside of the outer layer core plate of lamination two sides, carries out melting lamination at high temperature under high pressure；
It removes buffer board after the completion of lamination and directly takes out the gasket of filling, form the stepped groove.
5. the production method of stepped groove slot bottom figure according to claim 3, which is characterized in that pass through the side of embedding gasket
Formula make the stepped groove the step of include:
The embedding gasket in the through slot of the prepreg and core material；
It is laminated at high temperature under high pressure, forms the internal embedding multi-layer board for having gasket；
Controlled depth milling plate is carried out to the multi-layer board after lamination, is milled from the top layer core plate to gasket；
Embedding gasket is taken out, stepped groove is formed.
6. the production method of stepped groove slot bottom figure according to claim 3, which is characterized in that the material of the gasket is
Polytetrafluoroethylene (PTFE).
7. the production method of stepped groove slot bottom figure according to claim 3, which is characterized in that the gasket passes through milling machine
It is process.
8. the production method of stepped groove slot bottom figure according to claim 2, which is characterized in that the slot bottom figure includes
Route and/or pad.
9. the production method of stepped groove slot bottom figure according to claim 1, which is characterized in that the conductive material is
Carbon dust.
10. a kind of PCB, the stepped groove including slot bottom tool figure, which is characterized in that the stepped groove slot bottom figure is wanted according to right
1 to 9 any production method is asked to be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811278387.1A CN109413894B (en) | 2018-10-30 | 2018-10-30 | Manufacturing method of bottom graph of stepped groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811278387.1A CN109413894B (en) | 2018-10-30 | 2018-10-30 | Manufacturing method of bottom graph of stepped groove |
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| CN109413894A true CN109413894A (en) | 2019-03-01 |
| CN109413894B CN109413894B (en) | 2022-02-08 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110461085A (en) * | 2019-07-24 | 2019-11-15 | 沪士电子股份有限公司 | A kind of wiring board and preparation method thereof may be implemented in crimping component in stepped groove |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN111885857A (en) * | 2020-08-25 | 2020-11-03 | 景旺电子科技(珠海)有限公司 | Printed circuit board and manufacturing method thereof |
| CN112040672A (en) * | 2020-07-30 | 2020-12-04 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
| CN113194638A (en) * | 2021-03-22 | 2021-07-30 | 山东英信计算机技术有限公司 | Manufacturing method and system of PCB with efficient heat dissipation and PCB |
| CN114340224A (en) * | 2021-12-14 | 2022-04-12 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280641B1 (en) * | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
| CN201608969U (en) * | 2009-10-28 | 2010-10-13 | 深南电路有限公司 | Figured circuit board at the bottom of stepped groove |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN104080278A (en) * | 2014-06-24 | 2014-10-01 | 柏承科技(昆山)股份有限公司 | Circuit board polymer conducting film hole processing process and matching pattern electroplating manufacturing process thereof |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
| CN109068504B (en) * | 2018-10-30 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of stepped groove with non-metalized side wall and PCB |
-
2018
- 2018-10-30 CN CN201811278387.1A patent/CN109413894B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280641B1 (en) * | 1998-06-02 | 2001-08-28 | Mitsubishi Gas Chemical Company, Inc. | Printed wiring board having highly reliably via hole and process for forming via hole |
| CN201608969U (en) * | 2009-10-28 | 2010-10-13 | 深南电路有限公司 | Figured circuit board at the bottom of stepped groove |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN104080278A (en) * | 2014-06-24 | 2014-10-01 | 柏承科技(昆山)股份有限公司 | Circuit board polymer conducting film hole processing process and matching pattern electroplating manufacturing process thereof |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
| CN109068504B (en) * | 2018-10-30 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of stepped groove with non-metalized side wall and PCB |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110461085A (en) * | 2019-07-24 | 2019-11-15 | 沪士电子股份有限公司 | A kind of wiring board and preparation method thereof may be implemented in crimping component in stepped groove |
| CN110461085B (en) * | 2019-07-24 | 2021-05-11 | 沪士电子股份有限公司 | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof |
| CN112040672A (en) * | 2020-07-30 | 2020-12-04 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
| CN112040672B (en) * | 2020-07-30 | 2024-05-07 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
| CN111836485A (en) * | 2020-08-24 | 2020-10-27 | 大连崇达电子有限公司 | Manufacturing process of twice stepped plate |
| CN111885857A (en) * | 2020-08-25 | 2020-11-03 | 景旺电子科技(珠海)有限公司 | Printed circuit board and manufacturing method thereof |
| CN113194638A (en) * | 2021-03-22 | 2021-07-30 | 山东英信计算机技术有限公司 | Manufacturing method and system of PCB with efficient heat dissipation and PCB |
| CN114340224A (en) * | 2021-12-14 | 2022-04-12 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN114916146A (en) * | 2022-05-05 | 2022-08-16 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
| CN114916146B (en) * | 2022-05-05 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | PCB manufacturing method and PCB |
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| CN109413894B (en) | 2022-02-08 |
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