CN102946691B - Method for producing printed circuit board (PCB) with locally metalized stepped groove - Google Patents
Method for producing printed circuit board (PCB) with locally metalized stepped groove Download PDFInfo
- Publication number
- CN102946691B CN102946691B CN201210442571.1A CN201210442571A CN102946691B CN 102946691 B CN102946691 B CN 102946691B CN 201210442571 A CN201210442571 A CN 201210442571A CN 102946691 B CN102946691 B CN 102946691B
- Authority
- CN
- China
- Prior art keywords
- hole portion
- layers
- pcb
- copper
- slotted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention provides a method for producing a printed circuit board (PCB) with a locally metalized stepped groove. The method comprises the following steps: step 1, the PCB to be grooved is provided and comprises a plurality of layers of dielectric layers which are attached and a pattern copper layers which are arranged in the way of keeping gaps with the dielectric layers; step 2, a hole is formed in the PCB to be grooved so as to form a first hole part; step 3, the first hole part is metalized; step 4, a milling machine with a mechanical control depth function is used to process a second hole part in the lower surface of the PCB to be grooved in the way of corresponding to the first hole part, the bottom of the second hole part is positioned in the dielectric layers, and the pore diameter of the second hole part is larger than the pore diameter of the first pore part so as to form a step; step 5, laser is used to burn and remove the dielectric layers on the bottom of the second hole part so as to expose the copper layers; and step 6, a plating process is used to thicken the copper layers in the first hole part and the coppers layers of the bottom of the second hole part, and furthermore, the locally metalized stepped groove is formed on the PCB.
Description
Technical field
The present invention relates to the manufacturing technology of printed circuit board (pcb), the PCB plate production method that especially a kind of step containing localized metallic is slotted.
Background technology
Current PC B has in the industry a kind of step fluting design of localized metallic, and its larger groove sidewall has metal level without metal level, bottom land, and less groove sidewall metallization.So both can ensure to realize interconnection by metallization sulculus between designated layer, for installing sunk type device in simultaneously larger groove, effectively can reduce PCBA(Printed Circuit Board Assembly, dress device printed circuit board) highly, and less groove both can be used for installing sunk type device (square groove), also can be used as plug-in mounting device (circular recess).
The Conventional processing methods of the step fluting of localized metallic needs pcb board to be divided into pcb board 1, pcb board 2 two parts, the fluting 1 varied in size and fluting 2 is made respectively on pcb board 1, pcb board 2, and to one of them slotted metal, resistance glue material is imbedded before lamination in fluting, by mechanical press mode, the pressing of two parts pcb board is integrated, finally take out resistance glue material pre-buried in fluting, obtain the required pcb board containing localized metallic step fluting.This technique needs, through repeatedly pressing and fluting, easily to scratch bottom land when taking out resistance glue material pre-buried in fluting, and is difficult to thoroughly to remove clean at the bottom of spew groove, affect Signal transmissions and device installation.
Summary of the invention
The object of the present invention is to provide the PCB plate production method that a kind of step containing localized metallic is slotted, the method only adopts one step press, and without the need to using resistance glue material, Signal transmissions and the device that can not affect pcb board are installed.
For achieving the above object, the invention provides the PCB plate production method that a kind of step containing localized metallic is slotted, comprise the steps:
Step 1, provide pcb board to be slotted, this pcb board of waiting to slot comprises the several layers of dielectric layer that laminating is arranged and the layers of copper of establishing the spaced pattern picture with dielectric layer;
Step 2, upper perforate at pcb board to be slotted, form the first hole portion;
Step 3, metallize this first hole portion;
Step 4, on the lower surface in the corresponding first hole portion of pcb board to be slotted, make the second hole portion by the milling machine with Mechanical course deeper function, the geometric center in this second hole portion overlaps with the geometric center in the first hole portion, the bottom in this second hole portion is positioned at dielectric layer, the aperture in this second hole portion is greater than the aperture in the first hole portion, and then forms step;
Step 5, removed the dielectric layer of the bottom in the second hole portion by laser burn, to expose layers of copper;
Step 6, thicken the layers of copper in the first hole portion and the layers of copper bottom the second hole portion by electroplating technology, and then pcb board is forming the step fluting of localized metallic.
The aperture in described first hole portion is 0.2 ~ 2.0mm.
The medium thickness of the bottom in described second hole portion is less than or equal to 0.1mm.
Described laser ablation is infrared laser ablation.
Described laser ablation is that carbon dioxide excites infrared laser ablation.
Described electroplating technology is wet method graphic plating technique.
Described metallization first hole portion is by chemical-copper-plating process copper facing in the first hole portion.
Beneficial effect of the present invention: the PCB plate production method that the step containing localized metallic of the present invention is slotted, after it adopts a lamination to close, the production method of fluting, avoids repeatedly pressing, does not need to imbed, take out resistance glue material, reduce material and cost of manufacture; The method utilizes same navigation system to make the first hole portion and the second hole portion, and the tolerance of both center superposition degree is ± 0.1mm, and the bore size in this first hole portion and the precision of position are ± 0.05mm; The mode of the method employing laser ablation removes the dielectric layer bottom described step, and efficiency is high, and remaining glue is removed thoroughly, and bottom land is smooth.
In order to further understand feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the flow chart that the present invention contains the PCB plate production method of localized metallic step fluting;
Fig. 2 to Fig. 5 is the schematic flow sheet that the present invention contains the PCB plate production method of localized metallic step fluting.
Embodiment
For further setting forth the technological means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 1 to Fig. 5, the invention provides the PCB plate production method that a kind of step containing localized metallic is slotted, comprise the steps:
Step 1, provide pcb board 20 to be slotted, this pcb board 20 of waiting to slot comprises several layers of dielectric layer 22 that laminating arranges and establishes the layers of copper 24 with the spaced pattern picture of dielectric layer 22.
The present embodiment is for three layers of dielectric layer, four layers of layers of copper, be described in detail, wherein, described dielectric layer 22 is respectively first, second and third dielectric layer 222,224,226 from top to bottom, and described layers of copper 24 is respectively first, second, third and the 4th layers of copper 242,244,246,248 from top to bottom.
Step 2, upper perforate at pcb board 20 to be slotted, form the first hole portion 40.
This first hole portion 40 is for running through the through hole of this first, second and third dielectric layer 222,224,226 and first, second, third and the 4th layers of copper 242,244,246,248.
The present invention locates its position of opening by alignment system program control processing mode on pcb board multi-layer sheet, and the bore size in this first hole portion 40 and the precision of position can be controlled at ± 0.05mm.
Step 3, metallize this first hole portion 40.
In the present embodiment, described metallization first hole portion 40 is by chemical-copper-plating process copper facing in the first hole portion 40, with formed in this first hole portion 40 the 5th layers of copper the 42, five layers of copper 42 and first, second, third and the 4th layers of copper 242,244,246,248 link together.
Step 4, on the lower surface in the corresponding first hole portion 40 of pcb board 20 to be slotted, make the second hole portion 60 by the milling machine with Mechanical course deeper function, the geometric center in this second hole portion 60 overlaps with the geometric center in the first hole portion 40, the bottom in this second hole portion 60 is positioned at dielectric layer 22, the aperture in this second hole portion 60 is greater than the aperture in the first hole portion 40, and then forms step.
The present invention locates its position of opening by alignment system program control processing mode on pcb board multi-layer sheet, makes the spacing between the center in the center in this second hole portion 60 and the first hole portion 40 be less than or equal to 01mm.
In the present embodiment, the aperture in described first hole portion is 0.2 ~ 2.0mm, the aperture in described second hole portion 60 is greater than the aperture in this first hole portion 40, the bottom in this second hole portion 60 is positioned at the second dielectric layer 224, and the second dielectric layer 224 thickness of the bottom in described second hole portion 60 is less than or equal to 0.1mm.
Step 5, removed the dielectric layer 22 of the bottom in the second hole portion 60 by laser burn, to expose layers of copper 24.
In the present embodiment, its concrete operations mode is, excites infrared laser ablation to remove the second dielectric layer 224 of the bottom in the second hole portion 60, to expose the second layers of copper 244 by carbon dioxide.
Due to dielectric layer to the absorptivity of infrared laser much larger than layers of copper, so the method for laser ablation can not damage the second layers of copper 244, and efficiency is high, remaining glue is removed thoroughly, bottom is smooth, and thoroughly remove totally unlike being difficult at the bottom of the spew groove in existing method, and affect Signal transmissions and the device installation of pcb board;
Step 6, thicken the layers of copper in the first hole portion 40 and the layers of copper bottom the second hole portion 60 by electroplating technology, and then pcb board 20 is forming the step fluting of localized metallic.
In the present embodiment, thicken the 5th layers of copper 42 in the first hole portion 40 and the second layers of copper 244 bottom the second hole portion 60 by wet method graphic plating technique, and then pcb board 20 is forming the step fluting of localized metallic.
In sum, the PCB plate production method that the step containing localized metallic of the present invention is slotted, after it adopts a lamination to close, the production method of fluting, avoids repeatedly pressing, does not need to imbed, take out resistance glue material, reduce material and cost of manufacture; The method utilizes same navigation system to make the first hole portion and the second hole portion, and the tolerance of both center superposition degree is ± 0.1mm, and the bore size in this first hole portion and the precision of position are ± 0.05mm; The mode of the method employing laser ablation removes the dielectric layer bottom described step, and efficiency is high, and remaining glue is removed thoroughly, and bottom land is smooth.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection range that all should belong to the claims in the present invention.
Claims (4)
1., containing the PCB plate production method that the step of localized metallic is slotted, it is characterized in that, comprise the steps:
Step 1, provide pcb board to be slotted, this pcb board of waiting to slot comprises the several layers of dielectric layer that laminating is arranged and the layers of copper of establishing the spaced pattern picture with dielectric layer;
Step 2, upper perforate at pcb board to be slotted, form the first hole portion; The aperture in described first hole portion is 0.2 ~ 2.0mm;
Step 3, metallize this first hole portion;
Step 4, on the lower surface in the corresponding first hole portion of pcb board to be slotted, make the second hole portion by the milling machine with Mechanical course deeper function, the geometric center in this second hole portion overlaps with the geometric center in the first hole portion, the bottom in this second hole portion is positioned at dielectric layer, the aperture in this second hole portion is greater than the aperture in the first hole portion, and then forms step; The medium thickness of the bottom in described second hole portion is less than or equal to 0.1mm;
Step 5, removed the dielectric layer of the bottom in the second hole portion by laser burn, to expose layers of copper;
Step 6, thicken the layers of copper in the first hole portion and the layers of copper bottom the second hole portion by electroplating technology, and then pcb board is forming the step fluting of localized metallic; Described electroplating technology is wet method graphic plating technique.
2., as claimed in claim 1 containing the PCB plate production method that the step of localized metallic is slotted, it is characterized in that, described laser ablation is infrared laser ablation.
3., as claimed in claim 2 containing the PCB plate production method that the step of localized metallic is slotted, it is characterized in that, described laser ablation is that carbon dioxide excites infrared laser ablation.
4., as claimed in claim 1 containing the PCB plate production method that the step of localized metallic is slotted, it is characterized in that, described metallization first hole portion is by chemical-copper-plating process copper facing in the first hole portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210442571.1A CN102946691B (en) | 2012-11-07 | 2012-11-07 | Method for producing printed circuit board (PCB) with locally metalized stepped groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210442571.1A CN102946691B (en) | 2012-11-07 | 2012-11-07 | Method for producing printed circuit board (PCB) with locally metalized stepped groove |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102946691A CN102946691A (en) | 2013-02-27 |
| CN102946691B true CN102946691B (en) | 2015-04-29 |
Family
ID=47729580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210442571.1A Active CN102946691B (en) | 2012-11-07 | 2012-11-07 | Method for producing printed circuit board (PCB) with locally metalized stepped groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102946691B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517562B (en) * | 2013-10-10 | 2017-01-04 | 广东生益科技股份有限公司 | The groove-shaped hole forming method of pcb board |
| CN104955276A (en) * | 2014-03-24 | 2015-09-30 | 深南电路有限公司 | Processing method for step holes of circuit board, and circuit board with step holes |
| CN108323002B (en) * | 2017-01-16 | 2022-10-28 | 中兴通讯股份有限公司 | Printed circuit board and method |
| CN108601202A (en) * | 2018-04-25 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB and PCBA |
| CN109219250B (en) * | 2018-08-17 | 2021-05-07 | 昆山沪利微电有限公司 | PCB heat dissipation T-shaped hole machining method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0670668A1 (en) * | 1993-12-22 | 1995-09-06 | Siemens Telecomunicazioni S.P.A. | Process for the provision of metallized holes in dielectric substrates comprising interconnected thin film conductive and/or resistive paths |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101711089A (en) * | 2009-11-12 | 2010-05-19 | 深南电路有限公司 | Preparation method of metallized stepped chute of PCB board |
-
2012
- 2012-11-07 CN CN201210442571.1A patent/CN102946691B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0670668A1 (en) * | 1993-12-22 | 1995-09-06 | Siemens Telecomunicazioni S.P.A. | Process for the provision of metallized holes in dielectric substrates comprising interconnected thin film conductive and/or resistive paths |
| CN101287332A (en) * | 2008-05-27 | 2008-10-15 | 艾默生网络能源有限公司 | Circuit board and method of processing the same |
| CN101711089A (en) * | 2009-11-12 | 2010-05-19 | 深南电路有限公司 | Preparation method of metallized stepped chute of PCB board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102946691A (en) | 2013-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102946691B (en) | Method for producing printed circuit board (PCB) with locally metalized stepped groove | |
| CN105163526B (en) | A kind of preparation method of step trough and the printed circuit board comprising step trough | |
| CN102548225B (en) | Manufacturing method for printed circuit board (PCB) | |
| CN103079350B (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN103327756B (en) | There is multilayer circuit board of local mixing structure and preparation method thereof | |
| CN109413894A (en) | A kind of production method and PCB of stepped groove slot bottom figure | |
| CN102006721B (en) | Printed circuit board base board and preparation method thereof | |
| CN104661436B (en) | Printed circuit board blind slot processing method | |
| CN109068504A (en) | A kind of production method and PCB of the stepped groove that side wall is non-metallic | |
| CN104244597A (en) | Method for manufacturing coreless substrates of symmetrical structure | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN103517581B (en) | A kind of multi-layer PCB board manufacture method and multi-layer PCB board | |
| CN102711395B (en) | Pattern transfer processing method of multilayer printed circuit board | |
| CN105163527A (en) | Manufacturing method of semi-flexible circuit board | |
| CN106163120A (en) | Control processing method and the circuit board of deep stepped hole | |
| CN108112175B (en) | A kind of production method of ladder groove bottom graphical PCB | |
| CN108323040A (en) | A kind of production method and PCB of the PCB with stepped groove | |
| CN103889167A (en) | Method for forming via holes and embedded holes in multilayer circuit board | |
| CN105472909A (en) | Processing method of step groove circuit board | |
| WO2011043537A3 (en) | Printed circuit board and manufacturing method thereof | |
| CN104159392A (en) | Printed circuit board and preparation method thereof | |
| CN108401385A (en) | A kind of production method and PCB of the stepped groove that side wall is non-metallic | |
| CN103140033A (en) | Production method of blind holes for printed circuit board | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof | |
| CN105228346B (en) | The processing method and step groove circuit board of step groove circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |