CN114916146A - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
- Publication number
- CN114916146A CN114916146A CN202210479327.6A CN202210479327A CN114916146A CN 114916146 A CN114916146 A CN 114916146A CN 202210479327 A CN202210479327 A CN 202210479327A CN 114916146 A CN114916146 A CN 114916146A
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- copper
- carrying
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 20
- 238000003801 milling Methods 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 238000003698 laser cutting Methods 0.000 claims abstract description 8
- 238000011112 process operation Methods 0.000 claims description 19
- 238000005553 drilling Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 70
- 239000004743 Polypropylene Substances 0.000 description 18
- 150000002739 metals Chemical class 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacture Of Motors, Generators (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a PCB manufacturing method and a PCB. The PCB manufacturing method comprises the following steps: arranging a plurality of plates to be operated, and carrying out pressing operation on the plurality of plates to be operated to form a target plate; carrying out depth control milling operation on a surface to be operated of a target plate to form a first cavity; wherein, the surface to be operated is the surface of one side of the target plate; performing laser cutting operation and ultraviolet repairing operation on the first cavity to remove PP glue on the inner surface of the first cavity; performing copper deposition and plate electric operation on the first cavity and the surface to be operated respectively to form a first copper-clad layer on the inner surface of the first cavity and the surface to be operated; and carrying out post-procedure operation on the target board with the first copper-clad layer formed to obtain the PCB. The PCB manufacturing method provided by the embodiment of the invention can ensure that the uniformity of lamination is not influenced by PP glue, thereby improving the yield of products. Meanwhile, the method reduces the process flow and improves the timeliness of PCB production.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB manufacturing method and a PCB.
Background
In the related art, a method of fabricating a PTH (plated hole) stepped groove of a PCB (printed circuit board) includes: firstly, windowing is carried out on the semi-cured sheet and the daughter board at corresponding positions, then the semi-cured sheet and the daughter board are pressed, and finally depth control uncovering is carried out on a finished product.
However, the above method may cause the PP (polypropylene) glue generated after the pressing to overflow in the PTH stepped groove, thereby affecting the uniformity of the pressing and further causing the low yield of the product.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the PCB manufacturing method provided by the invention can ensure that no PP glue exists in the PTH, so that the lamination uniformity is not influenced by the PP glue, and the yield of products is improved.
The invention also provides a PCB with the PCB manufacturing method.
The PCB manufacturing method according to the embodiment of the first aspect of the invention comprises the following steps:
arranging a plurality of plates to be operated, and carrying out pressing operation on the plurality of plates to be operated to form a target plate;
carrying out depth control milling operation on the surface to be operated of the target plate to form a first cavity; wherein the surface to be operated is the surface of one side of the target plate;
performing laser cutting operation and ultraviolet repairing operation on the first cavity to remove PP glue on the inner surface of the first cavity;
performing copper deposition and plate electric operation on the first cavity and the surface to be operated respectively to form a first copper-clad layer on the inner surface of the first cavity and the surface to be operated;
and carrying out post-process operation on the target board after the first copper-clad layer is formed to obtain the PCB.
The PCB manufacturing method provided by the embodiment of the invention at least has the following beneficial effects: and milling a first cavity during depth control milling, cleaning PP glue in the first cavity by means of laser cutting or chemical glue removal and the like, and then performing copper plate deposition electric operation and post-process operation to obtain a finished PCB. According to the PCB manufacturing method, the PP glue overflowing from the first cavity is cleaned in the modes of laser cutting or chemical glue removal and the like, so that the uniformity of pressing is not affected by the PP glue, and the yield of products is improved. Meanwhile, the method reduces the process flow and improves the timeliness of PCB production.
According to some embodiments of the invention, before the providing the plurality of boards to be operated, the PCB fabricating method further comprises:
arranging a core board, and performing cutting operation and inner layer graph manufacturing operation on the core board;
carrying out automatic optical detection on the inner layer graph of the core plate to confirm that the inner layer graph of the core plate is manufactured correctly;
and performing brown oxidation operation on the core plate to form the plate to be operated.
According to some embodiments of the present invention, before the performing the depth-controlled milling operation on the surface to be operated of the target plate to form the first cavity, the method further includes:
drilling the target plate to form at least one through hole;
and carrying out copper deposition and plate electric operation on at least one through hole so as to form a second copper-clad layer in the through hole.
According to some embodiments of the invention, the post-process operation comprises:
drilling the surface of the other side of the target board to form a second cavity at a position corresponding to the second copper-clad layer;
and etching the second cavity to remove residues on the inner surface of the second cavity after the drilling operation.
According to some embodiments of the invention, the post-process operation further comprises:
covering photosensitive ink on the surface to be operated, and carrying out exposure operation on the photosensitive ink so as to solidify the photosensitive ink;
etching the surface to be operated to remove the copper layer uncovered by the photosensitive ink; wherein the photosensitive ink covered copper layer comprises at least one pad;
and removing the photosensitive ink on the surface to be operated.
According to some embodiments of the invention, the post-process operations further comprise:
and performing gold immersion operation on the bonding pad to form a gold-coated layer on the bonding pad.
According to some embodiments of the invention, after the gold-sinking operation of the pad of the target board, the method comprises:
and carrying out molding operation on the target board to obtain the PCB.
According to some embodiments of the invention, the first cavity is formed to have an unlimited depth.
According to the second aspect of the present invention, the PCB is manufactured by the above-mentioned PCB manufacturing method of the first aspect, and the PCB includes:
the device comprises a target plate, a first cavity and a second cavity, wherein one side of the target plate is provided with the first cavity;
a first copper-clad layer disposed on one side of the target board and on an inner surface of the first cavity.
According to some embodiments of the invention, the target plate comprises:
a plurality of dielectric layers;
and one metal layer is arranged between two adjacent dielectric layers.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a block flow diagram of a PCB manufacturing method according to an embodiment of the present invention;
FIG. 2 is a block flow diagram of another embodiment of a PCB fabrication method of the present invention;
FIG. 3 is a block flow diagram of another embodiment of a PCB fabrication method of the present invention;
FIG. 4 is a block flow diagram of a post-process operation embodiment of a PCB fabrication method of the present invention;
fig. 5 is a cross-sectional view of an embodiment of the PCB of the present invention.
Reference numerals:
a target board 100, a first copper-clad layer 200, a metal layer 110, and a dielectric layer 120.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
As shown in fig. 1, an embodiment of the present invention provides a PCB manufacturing method, including but not limited to steps S100 to S500.
S110, arranging a plurality of plates to be operated, and performing pressing operation on the plurality of plates to be operated to form a target plate;
s120, carrying out depth control milling operation on the surface to be operated of the target plate to form a first cavity; wherein, the surface to be operated is the surface of one side of the target plate;
s130, performing laser cutting operation and ultraviolet repairing operation on the first cavity to remove PP glue on the inner surface of the first cavity;
s140, performing copper deposition and plate electric operation on the first cavity and the surface to be operated respectively to form a first copper-clad layer on the inner surface of the first cavity and the surface to be operated;
s150, carrying out post-process operation on the target board with the first copper-clad layer formed, and obtaining the PCB.
Specifically, the method for manufacturing a PCB with a PTH stepped slot of the present embodiment is used for manufacturing a PCB with a PTH stepped slot, and the method includes: the method comprises the process operation steps of pressing, depth control milling, laser cutting operation, ultraviolet ray repairing, copper plate plating, post-process operation and the like. Wherein, the plate to be operated is a core plate which is subjected to a pretreatment process (such as cutting and the like).
After the pressing operation of the plates to be operated is finished, the formed target plate is subjected to depth control washing operation, the depth control milling operation is to mechanically remove the plate layer with a certain depth in the target plate, so that a groove (namely a first cavity) is formed, and the bottom of the milled first cavity is a copper layer. After high-temperature pressing, the PP (polypropylene) layer in the target board is pressed at high temperature to form PP glue, so that the PP glue overflows from the first cavity after the deep-washing control operation is performed, and the glue overflowing position can refer to the position of A, B in fig. 5. And carrying out laser cutting operation and ultraviolet repairing operation on the first cavity so as to remove the overflowing PP glue.
After the PP glue is removed, copper deposition operation is firstly carried out on the first cavity and the surface to be operated so as to deposit a copper layer on the inner surface of the first cavity and the surface to be operated of the target board, and the copper layer is thin and easy to fall off. And secondly, performing plate electric operation on the first cavity and the surface to be operated to thicken the copper layer so as to form a stable first copper-clad layer. The first cavity and the first copper-coated layer form a PTH stepped groove, so that the manufacture of the PTH stepped groove is completed.
And finally, carrying out post-process operation on the target board which is manufactured by the PTH stepped groove, wherein the post-process operation is a manufacturing process flow of a circuit, a slotted hole and the like according to related electric work requirements of the actual PCB, and obtaining the PCB with the PTH stepped groove after the post-process operation is finished.
According to the PCB manufacturing method provided by the embodiment of the invention, after the first cavity is milled in the depth-controlled milling step, the laser and the ultraviolet with certain energy are adopted to irradiate the first cavity, and PP glue overflowing from the first cavity is removed, so that the uniformity of lamination is not influenced by the PP glue, and the yield of products is improved.
As shown in fig. 2, in some embodiments of the present invention, before step S100, the PCB manufacturing method further includes the steps of:
s210, arranging a core plate, and performing cutting operation and inner layer graph manufacturing operation on the core plate;
s220, carrying out automatic optical detection on the inner layer pattern of the core plate to confirm that the inner layer pattern of the core plate is manufactured correctly;
and S230, performing brown oxidation operation on the core plate to form a plate to be operated.
Specifically, steps S010 to S030 are a pretreatment process flow for the core plate to manufacture a plate to be operated. The pretreatment process flow for manufacturing the board to be operated comprises the following steps: cutting, inner layer pattern making, automatic optical detection, browning and the like. And after the core board is cut, manufacturing an inner layer pattern of the core board according to the relevant electrical work requirements of the actual PCB. And then, detecting the inner layer pattern of the core plate by automatic optical detection equipment to determine whether the inner layer pattern of the core plate is manufactured correctly. And finally, brownification is carried out on the core board with the correct inner layer graph to remove grease and sundries on the surface of the core board, and meanwhile, the core board can avoid the problem of layering and board explosion after subsequent pressing operation. It should be noted that after the browning operation is performed on the plurality of core plates to form the plurality of plates to be operated, the plurality of plates to be operated need to be pressed in a short time, so that the plate explosion caused by water absorption of the browning layer is avoided.
As shown in fig. 3, in some embodiments of the present invention, before step S200, the PCB manufacturing method further includes the steps of:
s310, drilling the target plate to form at least one through hole;
s320, performing copper deposition and plate electric operation on at least one through hole to form a second copper-clad layer in the through hole.
Specifically, in the fabrication of a multi-layer PCB, the metals of the layers need to be connected to each other according to the related electrical working requirements of the actual PCB, for example, the metals of the 1 st to 12 th layers need to be connected to each other in a 12-layer PCB. Therefore, in steps S110 and S120, the through hole formed after the drilling operation is completed penetrates through the whole target board, and after the copper deposition and board electrical operation are performed on the through hole, the through hole is completely filled with the second copper clad layer, so that the metals of the respective laminated boards are connected to each other through the second copper clad layer. It will be appreciated that the number of vias specifically drilled is determined by the associated electrical performance requirements of the actual PCB.
As shown in fig. 4, in some embodiments of the invention, the post-process operation includes the steps of:
s410, drilling the surface of the other side of the target board to form a second cavity at a position corresponding to the second copper-clad layer;
and S420, etching the second cavity to remove residues on the inner surface of the second cavity after the drilling operation.
In particular, there are cases in the fabrication of multilayer boards where the metals of some of the boards do not need to be connected, such as in a 12-board PCB, where only the metals of the 1 st to 9 th boards need to be connected. At this time, a drilling operation (i.e., a back drilling operation) needs to be performed on the other side surface of the target board to remove a portion of the second copper-clad layer close to the other side surface, so as to form a second cavity with a certain depth, thereby ensuring that the transmission path of the electrical signal in the PCB and the integrity of the electrical signal are not affected by the redundant second copper-clad layer. It will be appreciated that the depth of the drilled hole (i.e., the number of drilled layers) is determined based on the relevant electrical performance requirements of the actual PCB.
As shown in fig. 4, in some embodiments of the present invention, the post-process operation further comprises the steps of:
s430, covering the surface to be operated with the photosensitive ink, and carrying out exposure operation on the photosensitive ink so as to solidify the photosensitive ink;
s440, etching the surface to be operated to remove the copper layer uncovered by the photosensitive ink; wherein the photosensitive ink covered copper layer comprises at least one pad;
and S450, removing the photosensitive ink on the surface to be operated.
Specifically, when the photosensitive ink is applied, a silk plate printed with a target plate surface circuit pattern needs to be placed on a surface to be operated of the target plate, and at this time, a part of copper layer covered with the photosensitive ink on the surface to be operated is a surface circuit of the target plate. And after etching the surface to be operated, removing the copper layer which is not covered by the photosensitive ink, and after etching the surface to be operated, removing the photosensitive ink on the surface to be operated, wherein the residual copper layer on the surface to be operated is the surface circuit of the target board, and the surface circuit comprises a bonding pad.
As shown in fig. 4, in some embodiments of the present invention, the post-process operation further comprises the steps of:
and S460, performing gold immersion operation on the bonding pad of the target board to form a gold-coated layer on the bonding pad.
Specifically, since the bonding pads of the surface layer circuit of the target board in the above embodiment are copper layers, copper is easily oxidized in the air, resulting in poor tin-plating or poor contact during soldering. Through the gold immersion operation, the gold-coated layer formed on the bonding pad effectively prevents the copper layer from contacting with air, and therefore the anti-oxidation effect is achieved.
As shown in fig. 4, in some embodiments of the invention, after the step of performing the gold immersion operation on the bonding pad of the target board, the post-process operation further includes the steps of:
and S470, carrying out molding operation on the target board to obtain the PCB.
Specifically, the forming operation is to form the target board into an actually required shape by die stamping or a numerical control routing machine, and the PCB can be obtained after the forming operation. After the PCB is obtained through the steps, the PCB is required to be subjected to line testing and final inspection, and the defects that the functions of the PCB are affected by open circuits, short circuits and the like are avoided.
In some embodiments of the present invention, the depth (refer to the depth H in fig. 5) of the first cavity formed in step S120 is not limited.
Specifically, in step S120, the depth of the first cavity milled by the depth-control milling operation is not particularly limited, and a person skilled in the art may determine the depth of the milled first cavity according to the related electrical performance requirement of the actual PCB. Namely, the embodiment of the invention can complete the manufacture of PTH stepped grooves with various actually required depths.
As shown in fig. 5, the embodiment of the present invention also provides a PCB including a target board 100, a first copper clad layer 200. Wherein, one side of the target plate 100 is provided with a first cavity; the first copper-clad layer 200 is disposed on one side of the target board 100 and on an inner surface of the first cavity.
Specifically, the first copper-clad layer 200 covers only the inner surface of the first cavity, i.e. the first copper-clad layer 200 does not completely fill the first cavity. The PTH stepped groove is composed of a first cavity and a first copper-clad layer 200.
As shown in fig. 5, in some embodiments of the invention, the target plate 100 includes a plurality of dielectric layers 120 and a plurality of metal layers 110. One metal layer 110 is disposed between two adjacent dielectric layers 120.
Specifically, the metal layer 110 is made of copper, and the dielectric layer 120 is a PP layer. The metal layer 110 exposed at the bottom of the first cavity is connected to the first copper-clad layer 200.
Therefore, the content in the above-mentioned embodiment of the PCB manufacturing method is all applicable to the embodiment of the PCB, the function specifically realized by the embodiment of the PCB manufacturing method is the same as that of the above-mentioned embodiment of the PCB manufacturing method, and the beneficial effect achieved by the embodiment of the PCB manufacturing method is also the same as that achieved by the above-mentioned embodiment of the PCB manufacturing method.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
- A PCB manufacturing method is characterized by comprising the following steps:arranging a plurality of plates to be operated, and carrying out pressing operation on the plurality of plates to be operated to form a target plate;carrying out depth control milling operation on the surface to be operated of the target plate to form a first cavity; wherein the surface to be operated is the surface of one side of the target plate;carrying out laser cutting operation and ultraviolet repairing operation on the first cavity to remove PP glue on the inner surface of the first cavity;performing copper deposition and plate electric operation on the first cavity and the surface to be operated respectively to form a first copper-clad layer on the inner surface of the first cavity and the surface to be operated;and carrying out post-process operation on the target board after the first copper-clad layer is formed to obtain the PCB.
- 2. The PCB fabrication method of claim 1, wherein before the disposing of the plurality of boards to be operated, the PCB fabrication method further comprises:arranging a core plate, and performing cutting operation and inner layer graph manufacturing operation on the core plate;carrying out automatic optical detection on the inner layer graph of the core plate to confirm that the inner layer graph of the core plate is manufactured correctly;and performing brown oxidation operation on the core plate to form the plate to be operated.
- 3. The PCB manufacturing method according to claim 1, wherein before the performing the depth control milling operation on the surface to be operated of the target board to form the first cavity, the PCB manufacturing method further comprises:drilling the target plate to form at least one through hole;and carrying out copper deposition and plate electric operation on at least one through hole so as to form a second copper-clad layer in the through hole.
- 4. A method of fabricating a PCB according to claim 3, wherein the post-processing operations include:drilling the surface of the other side of the target board to form a second cavity at a position corresponding to the second copper-clad layer;and etching the second cavity to remove residues on the inner surface of the second cavity after the drilling operation.
- 5. The method of claim 4, wherein the post process operations further comprise:covering photosensitive ink on the surface to be operated, and carrying out exposure operation on the photosensitive ink so as to solidify the photosensitive ink;etching the surface to be operated to remove the copper layer uncovered by the photosensitive ink; wherein the photosensitive ink covered copper layer comprises at least one pad;and removing the photosensitive ink on the surface to be operated.
- 6. The method of claim 5, wherein the post process operations further comprise:and carrying out gold immersion operation on the bonding pad so as to form a gold-coated layer on the bonding pad.
- 7. The method of claim 6, wherein after the step of performing the step on the step of performing the step of performing step on the step of performing step on the step of performing step on the step of performing step:and carrying out molding operation on the target board to obtain the PCB.
- 8. The method of fabricating a PCB according to any one of claims 1 to 7, wherein the first cavity is formed with an unlimited depth.
- A PCB manufactured by the PCB manufacturing method of any one of claims 1 to 8, the PCB comprising:the device comprises a target plate, a first cavity and a second cavity, wherein one side of the target plate is provided with the first cavity;a first copper-clad layer disposed on one side of the target board and on an inner surface of the first cavity.
- 10. The PCB of claim 9, wherein the target board comprises:a plurality of dielectric layers;and one metal layer is arranged between two adjacent dielectric layers.
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| CN202210479327.6A CN114916146B (en) | 2022-05-05 | 2022-05-05 | PCB manufacturing method and PCB |
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| CN202210479327.6A CN114916146B (en) | 2022-05-05 | 2022-05-05 | PCB manufacturing method and PCB |
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| CN114916146B CN114916146B (en) | 2024-05-17 |
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| CN102497737A (en) * | 2011-12-23 | 2012-06-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with step-shaped grooves |
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