CN101547569A - Technology for processing semi-hole of PCB board - Google Patents
Technology for processing semi-hole of PCB board Download PDFInfo
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- CN101547569A CN101547569A CN200910107109A CN200910107109A CN101547569A CN 101547569 A CN101547569 A CN 101547569A CN 200910107109 A CN200910107109 A CN 200910107109A CN 200910107109 A CN200910107109 A CN 200910107109A CN 101547569 A CN101547569 A CN 101547569A
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Abstract
The invention relates to a process for manufacturing a PCB board, in particular to technology for processing a PCB board provided with a semi-hole. Aiming at avoiding the phenomenon that copper on the hole wall is pulled off or damaged when the semi-hole is formed, the process that the electric milling of the semi-hole is added before etching and after film removal of a line is adopted, and the semi-hole and the external shape are not completed at the same time when the PCB board is formed. By the process that the electric milling of the semi-hole is added before etching and after film removal of the line, the electric milling is performed when the copper is fully connected with the copper on the hole wall in 360 degrees, thereby avoiding the phenomenon that the copper on the hole wall is pulled off or damaged when the semi-hole is formed, improving the yield of products and lowering cost of an enterprise.
Description
Technical field:
The present invention relates to a kind of manufacture craft of pcb board, particularly a kind of pcb board processing technology that is provided with half hole.
Background technology:
PCB is the abbreviation of English (Printed Circuie Board) printed wiring board.Usually on insulating material,, make printed wiring, printed component or conductive pattern that both combine and be called printed circuit by predetermined design.And the conductive pattern that is electrically connected between the components and parts is being provided on the insulating substrate, be called printed wiring.So just the production board of printed circuit or printed wiring is called printed wiring board, also be called printed board or printed circuit board.
Via is meant the hole that only is used as conductive interconnection purposes between layer and the layer on the multilayer circuit board, generally is not used further to the slotting weldering of component pins.This type of hole plates layer of copper by " heavy copper " operation, in order to conduction in the hole.These vias have " all-pass guide hole " (Through Via Hole) of running through full plate, " blind via hole " (Blind Via Hole) of only being switched to the plate face and all not running through arranged, have not with the plate face and connect " burying through hole " (Buried Via Hole) of being imbedded in sheet material inside etc.The local through hole of these complexity, with one by one continuously pressing method (Sequential Lamination) made finish.
Half hole is a kind of as via, has not only kept the conducting function of foramen primum but also has welded fixingly with half hole hole wall, has realized having popularized in a large number in computer, camera, the first-class a large amount of utilizations of shooting by the high strength retaining element more of structure simply and easily.Especially strengthen manyly than tradition by the part pin is fixing, life-span, the degree of stability of product all had largely improve for the fixing of parts such as CCD, CMOS.It is to finish by: figure transfer → graphic plating → move back film → etching → welding resistance graphic making → surface-coated → half hole, external form moulding together that existing conventional method is made half orifice plate.Like this via is become half with the circular hole electric router when the moulding, the hole wall copper that is easy to occur half hole is pulled or damaged phenomenon, causes function imperfect, influences the performance of product, causes manufacturing enterprise's product yield to descend cost up.
Summary of the invention:
A kind of pcb board technology for processing semi-hole that the present invention invents for the defective that solves above-mentioned prior art just.Pulled or damaged phenomenon for fear of the hole wall copper when moulding half hole, adopted the technology that before circuit moves back the film after etching, increases electric router half hole, during no longer with moulding half hole and external form are finished simultaneously.
The present invention realizes by following technological means:
A, at first substrate is holed and heavy copper;
B, carry out line pattern and make;
C, electric router half hole;
D, etching;
E, welding resistance graphic making;
F, carry out surface coating technology;
G, contour substrate electric router.
Before the steps d welding resistance graphic making, substrate is carried out etching behind described step c electric router half hole.After circuit moved back film, at this moment to carrying out electric router half hole technology, the copper of substrate surface is complete like this was connected fully with hole wall copper 360 degree, and it is big to involve adhesion, when electric router, avoided hole wall copper damaged or peel off probability.
Described step b line pattern is made and is comprised line pattern transfer, graphic plating and move back three steps of film.
Move back the technology that increases electric router half hole before the film after etching by circuit, carry out electric router, avoid the hole wall copper when moulding half hole to be pulled or damaged phenomenon, raising product yield, reduction entreprise cost in complete the connection fully of copper with hole wall copper 360 degree.
Specific embodiment:
Further explain the present invention below by the manufacture craft concrete steps that specifically describe half orifice plate.
The pcb board technology for processing semi-hole, implement by the following technical programs:
1, boring: the insert hole that substrate is got out the via and the soldering part of interlayer circuit with drilling machine.See through wad cutter during boring substrate is fixed on the drilling hole machine tool platform, add that simultaneously smooth lower bolster and upper cover plate are to reduce the generation of boring burr.
2, heavy copper: behind interlayer conduction hole drill hole, need on its hole wall, to deposit layer of copper, with the conducting of circuit between complete layer.Earlier clear up burr on the aperture and the break flour in the hole, remove cull on the wall surface of the hole with alkaline permanganate solution again in the mode of mechanical brushing and high pressure washing.On the hole wall of cleaning out, soak the absorption colloid palladium, again it is reduced into Metal Palladium.Circuit board is dipped in the chemical copper solution, the copper ion reduce deposition in the solution is attached on the hole wall, form the through hole turning circuit by the catalytic action of palladium metal.Bathe the mode of electroplating with copper sulphate again and the copper layer in the via is thickeied the thickness of enough opposing following process and environment for use impact.
3, line pattern is made: be divided into three steps: line pattern transfer, graphic plating and move back film.
(1) line pattern shifts:
The circuit that designs is plotted film (film) with optical plotter, then the film is covered on the substrate that scribbles light-sensitive surface and expose, ultraviolet light is blocked at the position of black on the film, light-sensitive surface is not carried out photocuring, transparent position can penetrate ultraviolet light and the light-sensitive surface on the substrate is carried out photocuring on the film.Then the substrate after the exposure is developed with sodium carbonate liquor,, expose copper face not by the dissolving of the light-sensitive surface of photocuring;
(2) carrying out graphic plating, is that copper facing and plating resist layer are carried out in the naked copper position with the light-sensitive surface of no photocuring on the substrate.
(3) move back film, stripping anti-plate film.
4, carry out electric router half hole by the PCB design drawing, because copper does not also have through etching on the substrate, the copper of substrate surface is complete to be connected fully with hole wall copper 360 degree, and it is big to involve adhesion, and in the time of electric router, hole wall copper just is not easy to peel off or is damaged.
The present invention goes out half pore structure by electric router in advance, traditional handicraft as compared with the past, under easy as much as possible situation, with in the tradition half hole manufacture craft the product yield problem of difficult improvement improve greatly, method is simple and practical, the industrial value height.
More than be that manufacture craft to a kind of half orifice plate provided by the present invention is described in detail, used specific case herein structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; For one of ordinary skill in the art, according to thought of the present invention, on execution mode and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (3)
1, a kind of pcb board technology for processing semi-hole is characterized in that: before line pattern moves back the film after etching, substrate is carried out electric router half hole.
2, pcb board technology for processing semi-hole according to claim 1 is characterized in that including following steps:
A, at first substrate is holed and heavy copper;
B, carry out line pattern and make;
C, electric router half hole;
D, etching
E, welding resistance graphic making;
F, carry out surface coating technology;
G, contour substrate electric router.
3, pcb board technology for processing semi-hole according to claim 2 is characterized in that described step b line pattern making comprises line pattern transfer, graphic plating and moves back three steps of film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101071094A CN101547569B (en) | 2009-04-24 | 2009-04-24 | Technology for processing semi-hole of PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101071094A CN101547569B (en) | 2009-04-24 | 2009-04-24 | Technology for processing semi-hole of PCB board |
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| CN101547569A true CN101547569A (en) | 2009-09-30 |
| CN101547569B CN101547569B (en) | 2010-08-18 |
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| CN2009101071094A Active CN101547569B (en) | 2009-04-24 | 2009-04-24 | Technology for processing semi-hole of PCB board |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN102264195A (en) * | 2010-05-25 | 2011-11-30 | 百硕电脑(苏州)有限公司 | Molding method of circuit board with half-bores |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子（深圳）有限公司 | Manufacturing method of metallized semi-hole |
| CN102500682A (en) * | 2011-10-26 | 2012-06-20 | 高德（无锡）电子有限公司 | Punching and processing process of plate edge copper-plated half-hole plate |
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN103068169A (en) * | 2012-12-24 | 2013-04-24 | 广州杰赛科技股份有限公司 | Method of preparing blind groove printed plate |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN106211604A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | The manufacture method that a kind of printed circuit board (PCB) is simple to operate |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
| CN106852010A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of anti-welding making method of half bore printed substrate |
| CN114269070A (en) * | 2021-12-03 | 2022-04-01 | 珠海帝和智能电子科技有限公司 | Production process of gold-electroplated PCB with half holes |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951736B (en) * | 2010-09-17 | 2012-07-04 | 深圳市崇达电路技术股份有限公司 | Process for producing circuit board metallized semi-holes |
| CN105657992A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
-
2009
- 2009-04-24 CN CN2009101071094A patent/CN101547569B/en active Active
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN102264195A (en) * | 2010-05-25 | 2011-11-30 | 百硕电脑(苏州)有限公司 | Molding method of circuit board with half-bores |
| CN102438411B (en) * | 2011-09-30 | 2014-04-16 | 深圳市景旺电子股份有限公司 | Manufacturing method of metallized semi-hole |
| CN102438411A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子（深圳）有限公司 | Manufacturing method of metallized semi-hole |
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN102387668B (en) * | 2011-10-26 | 2013-08-28 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN102500682A (en) * | 2011-10-26 | 2012-06-20 | 高德（无锡）电子有限公司 | Punching and processing process of plate edge copper-plated half-hole plate |
| CN102500682B (en) * | 2011-10-26 | 2014-01-15 | 高德（无锡）电子有限公司 | Punching and processing process of plate edge copper-plated half-hole plate |
| CN102387668A (en) * | 2011-10-26 | 2012-03-21 | 高德（无锡）电子有限公司 | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges |
| CN103068169A (en) * | 2012-12-24 | 2013-04-24 | 广州杰赛科技股份有限公司 | Method of preparing blind groove printed plate |
| CN103068169B (en) * | 2012-12-24 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method of preparing blind groove printed plate |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103079350B (en) * | 2012-12-28 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN106211604A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | The manufacture method that a kind of printed circuit board (PCB) is simple to operate |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
| CN106852010A (en) * | 2017-02-16 | 2017-06-13 | 江苏博敏电子有限公司 | A kind of anti-welding making method of half bore printed substrate |
| CN114269070A (en) * | 2021-12-03 | 2022-04-01 | 珠海帝和智能电子科技有限公司 | Production process of gold-electroplated PCB with half holes |
| CN114269070B (en) * | 2021-12-03 | 2023-10-13 | 珠海帝和智能电子科技有限公司 | Production process of electroplated gold PCB with half holes |
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| CN101547569B (en) | 2010-08-18 |
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