CN109152224A - A kind of manufacture craft of metallized semi-pore wiring board - Google Patents
A kind of manufacture craft of metallized semi-pore wiring board Download PDFInfo
- Publication number
- CN109152224A CN109152224A CN201811211526.9A CN201811211526A CN109152224A CN 109152224 A CN109152224 A CN 109152224A CN 201811211526 A CN201811211526 A CN 201811211526A CN 109152224 A CN109152224 A CN 109152224A
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- Prior art keywords
- point
- plate
- sideline
- milling cutter
- wiring board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of manufacture crafts of metallized semi-pore wiring board, including half-edge hole making step, half-edge hole making step includes: electric router time processing: the sideline of default plate, sideline and the intersection of via hole are intersection point A and intersection points B, according to default route, milling cutter cuts the plate along sideline, and the milling cutter A point that is staggered when being cut at the A point cuts plate, and milling cutter is moved to along sideline from B point when being cut at B point and cuts to plate；Electric router secondary operation: according to default route, milling cutter reversely carries out second of cutting processing to plate, removes the miscellaneous side at A point along sideline cutting.By changing electric router cutter path, to change cutter to the cutting direction of hole wall, the generation of burr when overcoming Tool in Cutting hole wall metal achievees the purpose that hole wall processing of metallizing.
Description
Technical field
The present invention relates to a kind of manufacture crafts of metallized semi-pore wiring board.
Background technique
This kind of edges of boards have the PCB in entire row semi-metal hole, its main feature is that individual is smaller, are mostly used on support plate, as
The daughter board of one motherboard is welded together by these semi-metal holes and the pin of motherboard and component.So if this
Remain copper thorn in a little semi-metal holes, when plug-in unit producer is welded, will lead to leg loosely, rosin joint, it is serious
It will cause and bridge short circuit between two pins.
In the prior art, for CNC milling machine during milling, plank side can generate a cutting force, act in cutting force
Under, milling cutter is by under extra plate milling, and the copper on copper plated through holes is successional crystalline solid, there is very good extension
Property, layers of copper can extend along the direction of travel of milling cutter, to form burr.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of production works of metallized semi-pore wiring board
Skill.
The scheme of the invention is be achieved:
A kind of manufacture craft of metallized semi-pore wiring board, including half-edge hole making step, the half-edge hole making step
Include:
Electric router time processing: presetting the sideline of the plate, the intersection of the sideline and the via hole be intersection point A and
Intersection points B, according to default route, milling cutter cuts the plate along sideline, when the milling cutter is cut at the A point
The A point that is staggered cuts the plate, and the milling cutter is moved to along the sideline when being cut at B point from institute
It states and the plate is cut at B point；
Electric router secondary operation: according to default route, the milling cutter reversely carries out second of cutting processing, edge to the plate
The sideline cutting removes the miscellaneous side at the A point.
It further, further include welding resistance step, after the half-edge hole making step is set to the welding resistance step.
Further, include the following steps:
Drill process: the via hole of route connection between layers is drilled out on plate；
PTH step: it by PTH technique, deposits to form layers of copper in the hole wall surface of the via hole；
Line layer step: line layer is made on the surface of the plate；
Welding resistance step: by welding resistance technique, be staggered preset welding portion, forms solder mask on the surface of the plate；
Half-edge hole making step:
Electric router time processing: presetting the sideline of the plate, the intersection of the sideline and the via hole be intersection point A and
Intersection points B, according to default route, milling cutter cuts the plate along sideline, when the milling cutter is cut at the A point
The A point that is staggered cuts the plate, and the milling cutter is moved to along the sideline when being cut at B point from institute
It states and the plate is cut at B point；
Electric router secondary operation: according to default route, the milling cutter reversely carries out second of cutting processing, edge to the plate
The sideline cutting removes the miscellaneous side at the A point.
Further, the line layer step includes:
Dry film is attached to the surface of the layers of copper, preset line pattern is transferred to by outer graphics shifting process
On the dry film, so that the dry film forms preset line pattern on the layers of copper surface；
Using etch process, the partial corrosion that route figure layer is removed in the layers of copper is fallen, so that the layers of copper forms route
Figure；
The dry film is removed, the line layer is obtained.
Further, the etch process is acid etching technique.
It further, further include surface treatment step, the surface treatment step is set to the welding resistance step and described
Between half-edge hole making step, the surface treatment step includes: to be formed on its surface anti-oxidant according to preset welding portion
Protective layer.
Further, the material of the oxidation resistant protective layer is nickel billon.
The beneficial effects of the present invention are:
By changing electric router cutter path, to change cutter to the cutting direction of hole wall, overcome Tool in Cutting hole wall golden
The generation of burr when category achievees the purpose that hole wall processing of metallizing.
Detailed description of the invention
The invention will be further described with embodiment with reference to the accompanying drawing.
Fig. 1 is the flow diagram of the manufacture craft of metallized semi-pore wiring board in one embodiment of the invention；
Fig. 2 is the machining sketch chart of the manufacture craft of metallized semi-pore wiring board in one embodiment of the invention.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.Below with reference to the attached drawing of the embodiment of the present invention, technical solution of the present invention is described further, the present invention is not only
It is limited to following specific embodiments.
It is to be appreciated that in the attached drawing of embodiment, the same or similar label correspond to the same or similar components.At this
In the description of invention, it is to be understood that if there is the finger such as term " on ", "lower", "front", "rear", "left", "right", "top", "bottom"
The orientation or positional relationship shown is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and simplifies
Description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, constructed and grasped with specific orientation
Make, therefore the terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent, for
For those skilled in the art, the concrete meaning of above-mentioned term can be understood as the case may be.
The manufacture craft of metallized semi-pore wiring board provided by the invention has metal for solving edges of boards in the prior art
The existing copper that remains of PCB (Printed Circuit Board, printed wiring board) for changing half bore pierces, holds in welding resistance step
Consent difficulty, the problem of silk-screen difficulty are easily caused, in order to solve this problem, the present invention provides a kind of production works of half-edge hole
Skill, wherein the production of half-edge hole designs in PCB overall processing process, processing cutting is carried out by electric router, to complete scheme.
Further, in order to solve, the consent that metallized semi-pore wiring board is easy to appear in welding resistance step is difficult, silk-screen
Difficult problem after half-edge hole making step is set to welding resistance step, first carries out welding resistance plug to PCB in one embodiment
Hole, then the production of metallized semi-pore is carried out, to reduce the difficulty of processing of welding resistance process, be conducive to the yield for promoting product.
Specifically, it as shown in Figure 1, it is the manufacture craft of the metallized semi-pore wiring board of an embodiment, including walks as follows
It is rapid:
Drill process 100:
The via hole of route connection between layers is drilled out on plate；
Wherein, the plate is the multi-layered board through pressing multilayer internal layer circuit sheet metal forming for needing to process, and the plate
Two surfaces on pressing have copper foil, in this step, process by drilling machine, drilled out on plate between layers route connection
Via hole, and by subsequent PTH each inner plating route of plate is connected to.In a specific embodiment, described
Drill process includes: the via hole that route connection between layers is drilled out on plate, and is carried out to the side wall of the via hole
Polishing removes deburring.So that the hole better quality processed, guarantee subsequent PTH step be made good plated through-hole with
It is connected to each sandwich circuit.
PTH (Plated Through Hole, plated-through-hole) step 200:
By PTH technique, deposit to form layers of copper in the hole wall surface of the via hole；
Wherein, PTH be on nonconducting hole wall that plate has drilled, with the method for chemistry deposit upper one layer of chemical copper,
To be connected to the technique of each sandwich circuit, the processes such as pre-treatment (oil removing), microetch, activation, electroless copper plating are specifically included.
Pretreatment procedure is used to remove the greasy dirt etc. on the hole wall of via hole, according to the type of greasy dirt, using organic solvent
With chemistry and electrochemical alkaline oil removing.
Microetch process using chemical liquid roughening remove plate plate face oxide, roughening plate face, guarantee the coat of metal with
Good bond strength between plate, that is, by increasing its contact surface area, it is made to form mechanical button with heavy layers of copper
In conjunction with obtaining higher bond strength.Newborn copper face has very strong activity, can adsorb colloid palladium, chemical liquid very well
It can be with ammonium sulfate, sodium peroxydisulfate, copper chloride solution, hydrogen peroxide/sulfuric acid etc..
Activation procedure is by depositing one layer of uniform active centre core particle in plated plate surface, and formation " is drawn
" center " is sent out, makes copper deposition uniformity, guarantees evenness, continuity and the compactness of subsequent heavy copper, in specific embodiment:
First by plate in SnCl2·2H2Presoaked in the mixed liquor of O and HCl, preimpregnation can effective wetting via hole hole wall, be convenient for subsequent work
Changing liquid can be carried out activation effective enough, protects palladium slot from the pollution of Pretreatment Bath, extends the service life of palladium slot, will be through
It crosses preimpregnated plate and is put into activating solution and activate, deposit one layer of uniform active centre core matter in plated plate surface
Point, the activating solution are colloid palladium, and colloid palladium can be any one of acidoid palladium, alkali palladium, basoid palladium.
Electroless copper plating process induces electroless copper plating self-catalyzed reaction by the activation of palladium core, and newborn chemical copper and reaction are secondary
Hydrogen product all can serve as catalysts catalysis reaction, makes heavy copper reaction is constant to carry out, sinks in plate face or hole wall
One layer of chemical copper of product.
Line layer step 300:
Line layer is made on the surface of the plate；
Line layer is made on surface described in this step in plate, can be pcb board material outer-layer circuit in the prior art
Any preparation process will be pre- for example, specifically, the line layer step includes: that dry film is attached to the surface of the layers of copper
If line pattern be transferred on the dry film by outer graphics shifting process so that the dry film is in layers of copper surface shape
At preset line pattern, wherein outer graphics shifting process includes the processes such as exposure development, and line pattern is transferred to dry film
On；Using etch process, the partial corrosion that route figure layer is removed in the layers of copper is fallen, so that the layers of copper forms line pattern,
Specifically, plate surface to be corroded by chemical liquid, the part for being covered with dry film shields to prevent from being corroded,
The part for not being covered with dry film is then etched, so that line pattern is transferred in layers of copper, in one embodiment, the etching work
Skill is acid etching technique；The dry film is removed, the line layer is obtained.
Welding resistance step 400:
By welding resistance technique, be staggered preset welding portion, forms solder mask on the surface of the plate；
Specifically, it is coated with one layer of solder mask at the surface of the plate (including line layer and logicalnot circuit layer), passes through exposure
The disk to be welded and hole are exposed in photodevelopment, and other parts cover upper solder mask layer, for preventing solder shorts, preventing steam
Insulation between the injury and realization route of electrolyte etc., and can print character on solder mask, play mark action.This step
It further include consent process, plate face welding resistance is completed at the same time with consent.
Before welding resistance technique is set to half-edge hole making step, the difficulty of processing of consent in welding resistance process is reduced,
Be conducive to the promotion of process yields.
Half-edge hole making step 500:
Electric router time processing: presetting the sideline of the plate, the intersection of the sideline and the via hole be intersection point A and
Intersection points B, according to default route, milling cutter cuts the plate along sideline, when the milling cutter is cut at the A point
The A point that is staggered cuts the plate, and the milling cutter is moved to along the sideline when being cut at B point from institute
It states and the plate is cut at B point；
Electric router secondary operation: according to default route, the milling cutter reversely carries out second of cutting processing, edge to the plate
The sideline cutting removes the miscellaneous side at the A point.
Specifically, as shown in Fig. 2, in electric router time processing process: presetting the sideline of the plate, the sideline and institute
The sideline intersection for stating via hole, forms intersection point A and intersection points B, according to default route, to the direction at B from A, milling cutter is along sideline
Plate is cut, when milling cutter cutting is moved at the A point, around the A point, to the direction close to sheet edge
Mobile cutting, when milling cutter is cut at B point, milling cutter is moved again to along the sideline, carries out from B point to plate
Cutting.At this point, sheet edge all cuts and finishes except the place A outer peripheral portion, progress electric router secondary operation: according to default route, from B
Place reversely carries out second of cutting processing to plate to the direction at A, milling cutter, removes the miscellaneous side at A point along sideline cutting, complete
At half of hole machined.
Wherein, route C is electric router time processing route in Fig. 2, in figure 101 be half-edge hole to be made copper facing via hole, it is left
It is the displaying of milling cutter time processing that side mill and mark, which turn to, and it is that milling cutter secondary operation is shown that right side milling cutter and mark, which turn to,.
The principle of this technique are as follows:
Milling cutter is set from A point to when the movement of B point, milling cutter rotates clockwise feed.In the conventional technology, milling cutter is traveling across
Cheng Zhong, when being cut to A point and B point, A point and B point are by a shearing force to the right, and at A point, milling cutter first switches to plate
Layer continues to cut layers of copper after cutting off sheet metal layer, and the copper on copper plated through holes is successional crystalline solid, there is very good prolong
Malleability, layers of copper have an extension space (via hole) again in A point just, and then the layers of copper at A point is just along the traveling side of milling cutter
To extension, burr is formed, and when at B point, milling cutter first switches to layers of copper, continues cutting plate material layer after layers of copper is cut off, and is acting on
It is lower that layers of copper is pressed into the substrate layer at B, so that it is lost the space of extension, to effectively prevent the extension of layers of copper, not shape
At burr.
Therefore, it in half-edge hole making step of the invention, sets in milling cutter time processing, milling cutter is mobile from A point to B point
When, milling cutter rotates clockwise feed, around not cutting to the layers of copper at A point at A point, and the layers of copper at B point is cut, by layers of copper
The substrate layer at B is pressed to, is set in milling cutter secondary operation, when milling cutter is mobile to A point from B point, milling cutter rotates feed to A counterclockwise
Point is cut, and layers of copper is pressed to the substrate layer at A, to prevent the extension of layers of copper, has effectively checked the formation of burr.
The characteristics of present invention is by analyzing product edges of boards one side of something plated through-hole and hole metallization process metal burr
Producing cause, in conjunction with electric router machining feature, design adaptable electric router program, by change electric router cutter path,
To change cutter to the cutting direction of hole wall, the generation of burr, solves semi-metal when overcoming Tool in Cutting hole wall metal
The problem of hole burr, achievees the purpose that hole wall processing of metallizing.
The process of the manufacture craft of metallized semi-pore wiring board of the invention, except the concrete technology of half-edge hole making step,
Process sequence between half-edge hole making step and welding resistance step is different with traditional handicraft outer, remaining and the general production process of PCB
It is roughly the same.
Also, traditional positive requirements of process figure electricity and alkali etching process, not only cause the increase of cost of manufacture, and work
The danger wastes that sequence generates are more, not friendly enough to environment, and the preparation of wiring board saves the two processes in the present invention, make
75 yuan/square metre can be reduced by obtaining cost of manufacture, and the technique that can do acid etching, process yields can promote 5-10%.
Wherein, in one embodiment, the manufacture craft of metallized semi-pore wiring board of the invention further includes surface treatment
Step 600, the surface treatment step is set between the welding resistance step and the half-edge hole making step, at the surface
Reason step includes: to be formed on its surface oxidation resistant protective layer, the oxidation resistant protective layer is for protecting according to preset welding portion
Copper surface is protected, in one embodiment, the material of the oxidation resistant protective layer is nickel billon.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of manufacture craft of metallized semi-pore wiring board, which is characterized in that including half-edge hole making step, the half-edge hole
Making step includes:
Electric router time processing: presetting the sideline of the plate, and the intersection of the sideline and the via hole is intersection point A and intersection point
B, according to default route, milling cutter cuts the plate along sideline, and the milling cutter is staggered when being cut at the A point
The A point cuts the plate, and the milling cutter is moved to along the sideline when being cut at B point from the B
The plate is cut at point；
Electric router secondary operation: according to default route, the milling cutter reversely carries out second of cutting processing to the plate, along described
Sideline cutting removes the miscellaneous side at the A point.
2. the manufacture craft of metallized semi-pore wiring board according to claim 1, which is characterized in that further include welding resistance step
Suddenly, after the half-edge hole making step is set to the welding resistance step.
3. the manufacture craft of metallized semi-pore wiring board according to claim 1, which comprises the steps of:
Drill process: the via hole of route connection between layers is drilled out on plate；
PTH step: it by PTH technique, deposits to form layers of copper in the hole wall surface of the via hole；
Line layer step: line layer is made on the surface of the plate；
Welding resistance step: by welding resistance technique, be staggered preset welding portion, forms solder mask on the surface of the plate；
Half-edge hole making step:
Electric router time processing: presetting the sideline of the plate, and the intersection of the sideline and the via hole is intersection point A and intersection point
B, according to default route, milling cutter cuts the plate along sideline, and the milling cutter is staggered when being cut at the A point
The A point cuts the plate, and the milling cutter is moved to along the sideline when being cut at B point from the B
The plate is cut at point；
Electric router secondary operation: according to default route, the milling cutter reversely carries out second of cutting processing to the plate, along described
Sideline cutting removes the miscellaneous side at the A point.
4. the manufacture craft of metallized semi-pore wiring board according to claim 3, which is characterized in that the line layer step
Include:
Dry film is attached to the surface of the layers of copper, preset line pattern is transferred to by outer graphics shifting process described
On dry film, so that the dry film forms preset line pattern on the layers of copper surface；
Using etch process, the partial corrosion that route figure layer is removed in the layers of copper is fallen, so that the layers of copper forms line pattern；
The dry film is removed, the line layer is obtained.
5. the manufacture craft of metallized semi-pore wiring board according to claim 4, which is characterized in that the etch process is
Acid etching technique.
6. the manufacture craft of metallized semi-pore wiring board according to claim 3, which is characterized in that further include surface treatment
Step, the surface treatment step are set between the welding resistance step and the half-edge hole making step, the surface treatment
Step includes: to be formed on its surface oxidation resistant protective layer according to preset welding portion.
7. the manufacture craft of metallized semi-pore wiring board according to claim 6, which is characterized in that the anti-oxidation protection
The material of layer is nickel billon.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811211526.9A CN109152224A (en) | 2018-10-17 | 2018-10-17 | A kind of manufacture craft of metallized semi-pore wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811211526.9A CN109152224A (en) | 2018-10-17 | 2018-10-17 | A kind of manufacture craft of metallized semi-pore wiring board |
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| CN109152224A true CN109152224A (en) | 2019-01-04 |
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| CN201811211526.9A Pending CN109152224A (en) | 2018-10-17 | 2018-10-17 | A kind of manufacture craft of metallized semi-pore wiring board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
| CN112739000A (en) * | 2020-11-04 | 2021-04-30 | 智恩电子(大亚湾)有限公司 | PCB (printed circuit board) half-hole plate processing method |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112969312A (en) * | 2021-01-27 | 2021-06-15 | 红板（江西）有限公司 | PCB metallized half-hole processing technology |
| CN113163598A (en) * | 2020-01-07 | 2021-07-23 | 北大方正集团有限公司 | Processing method of circuit board with half hole and half hole circuit board |
| CN114370458A (en) * | 2021-12-08 | 2022-04-19 | 安徽中润航空科技有限公司 | Aviation spline coupling and machining process thereof |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN110972396A (en) * | 2019-11-22 | 2020-04-07 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
| CN110972396B (en) * | 2019-11-22 | 2020-11-06 | 厦门鸿鹭联创工具有限公司 | Forming and processing method for printed circuit board with semi-copper hole |
| CN113163598A (en) * | 2020-01-07 | 2021-07-23 | 北大方正集团有限公司 | Processing method of circuit board with half hole and half hole circuit board |
| CN112739000A (en) * | 2020-11-04 | 2021-04-30 | 智恩电子(大亚湾)有限公司 | PCB (printed circuit board) half-hole plate processing method |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112969312A (en) * | 2021-01-27 | 2021-06-15 | 红板（江西）有限公司 | PCB metallized half-hole processing technology |
| CN114370458A (en) * | 2021-12-08 | 2022-04-19 | 安徽中润航空科技有限公司 | Aviation spline coupling and machining process thereof |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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