CN110972396A - Forming and processing method for printed circuit board with semi-copper hole - Google Patents
Forming and processing method for printed circuit board with semi-copper hole Download PDFInfo
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- CN110972396A CN110972396A CN201911155109.1A CN201911155109A CN110972396A CN 110972396 A CN110972396 A CN 110972396A CN 201911155109 A CN201911155109 A CN 201911155109A CN 110972396 A CN110972396 A CN 110972396A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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Abstract
The invention provides a method for forming and processing a printed circuit board with semi-copper holes, which relates to the technical field of printed circuit board processing and comprises the following specific steps: s1, routing the inner groove roughly; s2, cutting by a face milling cutter; s3, lifting the milling cutter with the positive edge; s4, cutting by a positive edge milling cutter; s5, repeating the steps S2-S4 until the forward cutting of all hole walls is completed; s6, cutting by a reverse-edge milling cutter; s7, lifting the milling cutter with the reverse edge; s8, cutting by a reverse-edge milling cutter; s9, repeating the steps S6-S8 until the reverse cutting of all hole walls is completed. Compared with the conventional semi-copper hole processing method, the method can save , one-step forming, acid washing, alkali washing and other four procedures, thereby greatly saving the processing cost; and the problem of semi-copper hole burrs can be avoided by one-step forming, compared with the conventional burr removing process, the one-step processing is realized, the surface quality is better, and the processing reliability of working procedures such as characters, solder resist ink and the like in the printed circuit board manufacturing process is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a forming processing method of a printed circuit board with a semi-copper hole.
Background
The mode of reserving the semi-copper hole is widely applied to the design of the printed circuit board, and the design can bring great processing difficulty to the subsequent forming process. The conventional semi-copper hole processing mode at present is as follows: firstly, a tinning process is carried out, then the diameter of a milling cutter is directly confirmed according to the size of a half-hole groove pitch, the milling cutter is formed once, then copper wire drawing is removed through acid washing, and finally protective tin on the surface of copper is removed through alkali washing. Due to the imperfection of the printed circuit board, a hollow hole groove exists, and certain unreliability of characters and solder resist ink in the subsequent process is caused.
Because copper has better ductility, when the glass fiber and the copper wire are processed according to a conventional mode, the glass fiber and the copper wire lack force points at the semi-copper hole, and the glass fiber and the copper wire are easy to avoid to form drawn wires; and the wire drawing at the half hole can cause the problems of electroplating plug holes and the like in the subsequent process. The existing processing mode can not better avoid the problem of wire drawing basically, the wire drawing can be removed only by increasing manual overhaul and cleaning, the processing cost is increased while the processing efficiency is reduced.
Disclosure of Invention
In order to solve the problems mentioned in the prior art, the invention provides a method for forming and processing a printed circuit board with a semi-copper hole.
The invention is realized by adopting the following technical scheme:
the invention relates to a method for forming and processing a printed circuit board with semi-copper holes, which comprises the following steps:
the method comprises the following steps:
s1, carrying out inner groove rough routing, namely firstly, carrying out rough routing and slotting on the printed circuit board by using a rough milling cutter so as to reduce the loss of the alignment milling cutter and the counter milling cutter in the subsequent procedures;
s2, cutting by a positive edge milling cutter, wherein the positive edge milling cutter feeds clockwise to cut the hole walls of two adjacent half holes;
s3, lifting the positive edge milling cutter, wherein when the distance L3 between the center of the positive edge milling cutter and the next hole wall in the step S2 is more than or equal to 0.10mm, the positive edge milling cutter is lifted obliquely, and part of the hole wall is reserved for further cutting by the reverse edge milling cutter;
s4, cutting the next hole wall by the front edge milling cutter obliquely according to the same lifting angle in the step S3;
s5, repeating the steps S2-S4 until the forward cutting of all hole walls is completed;
s6, cutting by a reverse-edge milling cutter, and further feeding the printed circuit board subjected to cutting in the step 5 in a counterclockwise direction by the reverse-edge milling cutter to cut residual hole walls of two adjacent half holes, wherein the cutting mode is the same as that of the positive-edge milling cutter in the step S2;
s7, lifting the milling cutter with the reverse edge in the same way as the lifting way of the milling cutter with the positive edge in the step S3;
s8, turning down the reverse-edge milling cutter in the same way as the turning down of the positive-edge milling cutter in the step S4;
s9, repeating the steps S6-S8 until the reverse cutting of all hole walls is completed.
Preferably, in step S1, the relationship between the groove width H2 of the rough routing and the diameter D1 of the rough milling cutter is as follows: h2 ═ D1, the size relation of finished product slot width H1 and rough gong fluting slot width H2 that the printed wiring board needs is: (H1-H2)/2 is more than or equal to 0.200mm and is used for ensuring the finishing allowance of the face milling cutter and the back milling cutter.
Preferably, in step S2, after the face mill has finished cutting one hole wall, the center point a of the face mill needs to exceed the centerline of the hole wall.
Preferably, in the step S3, the positive edge milling cutter has a diameter d, a height H of elevation H is H ≦ (H1+ H2)/2-d, and the angle β of oblique elevation of the positive edge milling cutter is 45 ≦ β ≦ 90 °.
Preferably, in step S4, after the positive edge milling cutter is turned down, the maximum convolution outer diameter does not touch the hole wall reserved in step S3, and the distance L5 between the center point of the positive edge milling cutter and the hole wall is not less than 0.100 mm.
The invention provides a method for forming and processing a printed circuit board with semi-copper holes, which has the beneficial effects that: compared with the conventional semi-copper hole processing method, the method can save , one-step forming, acid washing, alkali washing and other four procedures, thereby greatly saving the processing cost; and the problem of semi-copper hole burrs can be avoided by one-step forming, compared with the conventional burr removing process, the one-step processing is realized, the surface quality is better, and the processing reliability of working procedures such as characters, solder resist ink and the like in the printed circuit board manufacturing process is improved.
Drawings
FIG. 1 is a schematic cutting diagram of the groove routing in step S1 according to the present invention;
FIG. 2 is a schematic cutting view of the positive cutter of step S2 in the present invention;
FIG. 3 is a schematic view of the overlap of the front and back edges;
FIG. 4 is a schematic diagram of the tool lifting path of the positive edge milling cutter of step S3 according to the present invention;
FIG. 5 is a schematic view of the tool lifting position of the positive edge milling cutter of step S3 in the present invention;
FIG. 6 is a schematic view of the lower cutting position of the positive-edge milling cutter of step S4 in the present invention;
FIG. 7 is a schematic view of the back-edge milling cutter cutting of step S6 according to the present invention; .
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
The embodiment provides a method for forming and processing a printed circuit board with a semi-copper hole, which comprises the following steps:
the method comprises the following steps:
s1, carrying out inner groove rough routing, namely firstly, carrying out rough routing and slotting on the printed circuit board by using a rough milling cutter so as to reduce the loss of the alignment milling cutter and the counter milling cutter in the subsequent procedures;
s2, cutting by a positive edge milling cutter, wherein the positive edge milling cutter feeds clockwise to cut the hole walls of two adjacent half holes;
s3, lifting the positive edge milling cutter, and when the distance L3 between the center of the positive edge milling cutter and the next hole wall in the step S2 is not less than 0.10mm, obliquely lifting the positive edge milling cutter, and reserving part of the hole wall for further cutting by the reverse edge milling cutter;
s4, cutting the next hole wall by the front edge milling cutter obliquely according to the same lifting angle in the step S3;
s5, repeating the steps S2-S4 until the forward cutting of all hole walls is completed;
s6, cutting by a reverse-edge milling cutter, and further feeding the printed circuit board subjected to cutting in the step 5 in a counterclockwise direction by the reverse-edge milling cutter to cut residual hole walls of two adjacent half holes, wherein the cutting mode is the same as that of the positive-edge milling cutter in the step S2;
s7, lifting the milling cutter with the reverse edge in the same way as the lifting way of the milling cutter with the positive edge in the step S3;
s8, turning down the reverse-edge milling cutter in the same way as the turning down of the positive-edge milling cutter in the step S4;
s9, repeating the steps S6-S8 until the reverse cutting of all hole walls is completed.
In step S1 of this embodiment, as shown in fig. 1, the relationship between the groove width H2 of the rough routing and the diameter D1 of the rough milling cutter is: h2 ═ D1, the size relation of finished product slot width H1 and rough gong fluting slot width H2 that the printed wiring board needs is: (H1-H2)/2 is more than or equal to 0.200mm, so that the sufficient finishing allowance of the face milling cutter and the back milling cutter is ensured.
In step S2 of this embodiment, after the face milling cutter finishes cutting a hole wall, the center point a of the face milling cutter needs to exceed the center line of the hole wall, that is, as shown in fig. 2, the center distance between two adjacent half holes is L, the hole wall distance between two adjacent half holes is L1, the distance from the center point a of the face milling cutter to the center line of the hole wall is L2, and the distance from the center point a of the face milling cutter to the edge of the hole wall is L3, which is required to satisfy L2 not less than 0 regardless of whether forward cutting or reverse cutting is performed, to ensure that the front and back edges overlap and prevent incomplete cutting, otherwise, a B-portion area shown in fig. 3 occurs and a black incomplete cutting portion exists.
In step S3 of this embodiment, the cutter lifting path is as shown in fig. 4 and 5, wherein the diameter of the positive-edge milling cutter is d, the lifting height H is H ≦ H (H1+ H2)/2-d, the angle β for obliquely lifting the positive-edge milling cutter is 45 ≦ β ≦ 90 °, and the lifting position of the positive-edge milling cutter is at L3 ≥ 0.10mm, and the value of L3 is as large as possible on the premise that L2 ≥ 0 is satisfied, in order to keep a certain residual amount for the cutting of the counter-edge milling cutter, and the remaining portion is as shown in the region C in fig. 5.
In step S4 of this embodiment, after the positive-edge milling cutter is turned down, on the premise that the maximum convolution outer diameter does not touch the hole wall reserved in step S3, i.e., in the region D in fig. 6, the distance L5 between the center point of the positive-edge milling cutter and the hole wall is not less than or equal to 0.100mm, i.e., the maximum convolution outer diameter does not touch the region E in fig. 6, so as to prevent the half hole from being cut.
In step S6 of this embodiment, the cutting direction of the milling cutter with reversed edge is as shown in fig. 7, and according to the cutting mode of the milling cutter with reversed edge, the compensation amount of the tool is the same as that of the milling cutter with reversed edge, and the remaining part of the milling cutter with reversed edge is further cut, and the lifting and lowering modes with reversed edge are completely the same as those of the lifting and lowering with reversed edge, so the description is not repeated.
Through the cutting process of the positive edge and the cutting process of the reverse edge, the problem of semi-copper hole burrs can be avoided, and the surface quality is better.
It should be further noted that, if the product with the smaller half-hole pitch is used, the inner groove rough routing in step S1 can be omitted.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A method for forming and processing a printed circuit board with a semi-copper hole is characterized by comprising the following steps:
s1, carrying out inner groove rough routing, namely firstly, carrying out rough routing and slotting on the printed circuit board by using a rough milling cutter so as to reduce the loss of the alignment milling cutter and the counter milling cutter in the subsequent procedures;
s2, cutting by a positive edge milling cutter, wherein the positive edge milling cutter feeds clockwise to cut the hole walls of two adjacent half holes;
s3, lifting the positive edge milling cutter, and when the distance L3 between the center of the positive edge milling cutter and the next hole wall in the step S2 is not less than 0.10mm, obliquely lifting the positive edge milling cutter, and reserving part of the hole wall for further cutting by the reverse edge milling cutter;
s4, cutting the next hole wall by the front edge milling cutter obliquely according to the same lifting angle in the step S3;
s5, repeating the steps S2-S4 until the forward cutting of all hole walls is completed;
s6, cutting by a reverse-edge milling cutter, and further feeding the printed circuit board subjected to cutting in the step 5 in a counterclockwise direction by the reverse-edge milling cutter to cut residual hole walls of two adjacent half holes, wherein the cutting mode is the same as that of the positive-edge milling cutter in the step S2;
s7, lifting the milling cutter with the reverse edge in the same way as the lifting way of the milling cutter with the positive edge in the step S3;
s8, turning down the reverse-edge milling cutter in the same way as the turning down of the positive-edge milling cutter in the step S4;
s9, repeating the steps S6-S8 until the reverse cutting of all hole walls is completed.
2. The method for forming a printed wiring board with a half copper hole according to claim 1, wherein in step S1, the relationship between the groove width H2 of the rough routing and the diameter D1 of the rough milling cutter is as follows: h2 ═ D1, the size relation of finished product slot width H1 and rough gong fluting slot width H2 that the printed wiring board needs is: (H1-H2)/2 is more than or equal to 0.200mm and is used for ensuring the finishing allowance of the face milling cutter and the back milling cutter.
3. The method for forming a printed wiring board with a half copper hole according to claim 2, wherein in step S2, after the face milling cutter finishes cutting a hole wall, the center point a of the face milling cutter needs to exceed the center line of the hole wall.
4. The method for forming a printed wiring board with half copper holes as claimed in claim 3, wherein in step S3, the diameter of the face milling cutter is d, the height H of the face milling cutter is H ≦ (H1+ H2)/2-d, and the angle β of the face milling cutter is 45 ° ≦ β ≦ 90 °.
5. The method for forming a printed wiring board with a semi-copper hole according to claim 1, wherein in step S4, after the positive edge milling cutter is turned down, the maximum convolution outer diameter does not touch the hole wall reserved in step S3, and the distance L5 between the center point of the positive edge milling cutter and the hole wall is greater than or equal to 0.100 mm.
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| CN201911155109.1A CN110972396B (en) | 2019-11-22 | 2019-11-22 | Forming and processing method for printed circuit board with semi-copper hole |
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| CN201911155109.1A CN110972396B (en) | 2019-11-22 | 2019-11-22 | Forming and processing method for printed circuit board with semi-copper hole |
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| CN110972396A true CN110972396A (en) | 2020-04-07 |
| CN110972396B CN110972396B (en) | 2020-11-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
| CN112969313A (en) * | 2021-02-03 | 2021-06-15 | 湖南好易佳电路板有限公司 | PTH (plated through hole) half-hole manufacturing method |
| CN114641152A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Method for half-hole fabrication |
| CN114679848A (en) * | 2022-04-19 | 2022-06-28 | 科惠白井(佛冈)电路有限公司 | Forming method of incomplete electroplating bath of PCB and PCB preparation method |
| CN114713889A (en) * | 2022-04-15 | 2022-07-08 | 宜昌永鑫精工科技股份有限公司 | Method for forming PCB (printed circuit board) with metal half-holes |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
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| CN112969313B (en) * | 2021-02-03 | 2023-02-17 | 湖南好易佳电路板股份有限公司 | PTH (plated through hole) half-hole manufacturing method |
| CN114641152A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Method for half-hole fabrication |
| CN114713889A (en) * | 2022-04-15 | 2022-07-08 | 宜昌永鑫精工科技股份有限公司 | Method for forming PCB (printed circuit board) with metal half-holes |
| CN114713889B (en) * | 2022-04-15 | 2024-02-06 | 宜昌永鑫精工科技股份有限公司 | PCB (printed circuit board) forming method containing metal half holes |
| CN114679848A (en) * | 2022-04-19 | 2022-06-28 | 科惠白井(佛冈)电路有限公司 | Forming method of incomplete electroplating bath of PCB and PCB preparation method |
| CN114679848B (en) * | 2022-04-19 | 2023-07-11 | 科惠白井(佛冈)电路有限公司 | Forming method of PCB incomplete electroplating bath and PCB preparation method |
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