CN112969313B - PTH (plated through hole) half-hole manufacturing method - Google Patents
PTH (plated through hole) half-hole manufacturing method Download PDFInfo
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- CN112969313B CN112969313B CN202110133179.8A CN202110133179A CN112969313B CN 112969313 B CN112969313 B CN 112969313B CN 202110133179 A CN202110133179 A CN 202110133179A CN 112969313 B CN112969313 B CN 112969313B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 53
- 238000005553 drilling Methods 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000003513 alkali Substances 0.000 claims abstract description 7
- 239000002699 waste material Substances 0.000 claims description 19
- 239000002585 base Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
技术领域technical field
本发明涉及电路板技术领域,尤其涉及一种PTH半孔制作方法。The invention relates to the technical field of circuit boards, in particular to a method for manufacturing PTH half-holes.
背景技术Background technique
现行业内制作半孔板大多因半孔毛刺及半孔无铜造成品质异常,针对解决半孔毛刺的方法各式各样。半孔板常规做法:钻孔-电镀-线路-二铜-渡锡-成型一锣-退膜-退锡-蚀刻,在成型一锣时,既没有对半孔是否真的需要一锣做出界定,也没有针对半孔毛刺及半孔无铜提出管控方法。这样就使一部份本可以放了成品可以锣出的板也放到了一锣,造成成本的浪费。其次针对半孔毛刺和半孔无铜,也需要一个明确的管控方法。At present, most half-hole plates produced in the industry are of abnormal quality due to half-hole burrs and half-hole copper-free. There are various methods for solving half-hole burrs. Conventional method of semi-hole plate: drilling - electroplating - circuit - two copper - tinning - forming a gong - stripping film - stripping tin - etching, when forming a gong, there is no question whether the half hole really needs to be made in one gong There is no definition, and there is no control method for half-hole burrs and half-hole copper-free. In this way, a part of the boards that could have been put into the finished product can also be put into the same board, resulting in a waste of cost. Secondly, a clear control method is also needed for half-hole burrs and half-hole copper-free.
因此,有必要提供一种新的PTH半孔制作方法解决上述技术问题。Therefore, it is necessary to provide a new PTH semi-hole manufacturing method to solve the above technical problems.
发明内容Contents of the invention
本发明解决的技术问题是提供一种工作效率高、节约成本的PTH半孔制作方法。The technical problem solved by the invention is to provide a PTH semi-hole manufacturing method with high working efficiency and cost saving.
为解决上述技术问题,本发明提供的PTH半孔制作方法包括以下步骤:In order to solve the above-mentioned technical problems, the PTH semi-hole manufacturing method provided by the invention comprises the following steps:
S1:对半孔进行界定:S1: Defining the half hole:
当连续半孔≤3个,且半孔孔径1.75mm<D<8mm,为成品锣;When there are ≤3 consecutive semi-holes, and the diameter of the semi-holes is 1.75mm<D<8mm, it is a finished gong;
当连续半孔>3个,且半孔孔径0.45<D≤1.75mm,为碱蚀前When there are more than 3 consecutive semi-holes, and the diameter of the semi-holes is 0.45<D≤1.75mm, it is before alkali etching
一锣;a gong;
S2:对半孔进行制作:S2: Make the half hole:
针对成品锣:削铜处为弧形时,在半孔削铜处下刀;削铜处为直角时,在半孔削铜处锣刀路径设计45°,并切进直角处3mil,以避免锣外框时产生披锋;For the finished gong: when the copper cutting part is arc-shaped, cut the knife at the half-hole copper cutting part; when the copper cutting part is right-angled, design the path of the gong knife at the half-hole copper cutting part at 45°, and cut 3mil into the right-angle part to avoid When the gong is outside the frame, it produces a front;
针对碱蚀前一锣:根据成品半孔直径不同,进行钻铜皮、拉废料、粗锣和精锣步骤。For the work before alkali etching: according to the diameter of the half hole of the finished product, the steps of drilling copper skin, pulling waste, roughing and finishing are carried out.
优选的,所述步骤S1中,当半孔孔径1.75mm<D<3mm时,采用1.2锣刀正反锣;当半孔孔径3mm≤D<8mm时,采用1.4锣刀正反锣。Preferably, in the step S1, when the diameter of the half hole is 1.75mm<D<3mm, a 1.2 gong knife front and back gong is used; when the half hole diameter is 3mm≤D<8mm, a 1.4 gong knife front and back gong is used.
优选的,所述步骤S2中:Preferably, in the step S2:
当半孔孔径0.45mm<D≤0.8mm,且成品面铜厚度≥70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;When the diameter of the half hole is 0.45mm<D≤0.8mm, and the copper thickness of the finished product surface is ≥70um, and the diameter of the half hole of the finished product is ≥1/2, the sequence of gongs and knives is waste pulling, coarse gongs, and fine gongs, and one gong and a half hole is pre-finished on one side. Leave 4mil, the finished product has a half hole;
当半孔孔径0.45mm<D≤0.8mm,且成品面铜厚度<70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣;When the diameter of the half-hole is 0.45mm<D≤0.8mm, and the copper thickness of the finished product is less than 70um, and the diameter of the half-hole of the finished product is ≥1/2, the order of the belt cutter is scrap, coarse, and fine;
当半孔孔径0.8mm<D≤1.75mm,且成品面铜厚度≥70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;成品半孔直径<1/2,锣带刀序为钻铜皮、拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;When the diameter of the half hole is 0.8mm<D≤1.75mm, and the copper thickness of the finished product surface is ≥70um, and the diameter of the half hole of the finished product is ≥1/2, the sequence of the gong belt knife is scrap pulling, coarse gong, and fine gong, and one gong and a half hole is pre-finished on one side. Leave 4mil, the finished gong has a fine half hole; the diameter of the finished half hole is <1/2, the gong belt knife sequence is to drill copper skin, pull scraps, rough gong, fine gong, reserve 4mil on one side of a gong and a half hole, and the finished gong is fine gong half hole;
当半孔孔径0.8mm<D≤1.75mm,且成品面铜厚度<70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣;成品半孔直径<1/2,锣带刀序为钻铜皮、拉废料、粗锣、精锣。When the diameter of the half hole is 0.8mm<D≤1.75mm, and the copper thickness of the finished product surface is less than 70um, the diameter of the half hole of the finished product is ≥1/2, and the sequence of gongs and knives is scrap, coarse gong, and fine gong; the diameter of the finished half hole is less than 1/2 2. The sequence of gongs with knives is drilling copper skin, pulling waste, rough gongs, and fine gongs.
优选的,所述步骤S2中削铜处为直角时,在半孔削铜处锣刀路径设计45°,且孔内下刀点距离孔铜≥0.2mm。Preferably, when the copper cutting point in the step S2 is at a right angle, the path of the gong knife is designed to be 45° at the half hole copper cutting point, and the distance between the cutting point in the hole and the hole copper is ≥ 0.2mm.
优选的,所述锣刀刀径为1.0 -1.4mm。Preferably, the diameter of the gong knife is 1.0-1.4mm.
优选的,所述拉废料步骤中只拉半孔对侧基材以达到除尘效果,废料使用锣刀清除。Preferably, in the step of pulling waste materials, only the base material on the opposite side of the half hole is pulled to achieve the dust removal effect, and the waste materials are removed with a gong knife.
优选的,所述半孔间距<1.2mm时会接触到半孔,锣刀用1.0mm型号。Preferably, when the distance between the half-holes is less than 1.2mm, the half-holes will be touched, and the gong knife is 1.0mm.
优选的,所述锣刀锣半孔时优先保证不锣破,废料和粗锣刀与半孔边最小间距为0.1mm。Preferably, when the gong knife is half-holed, it is given priority to ensure that the gong is not broken, and the minimum distance between waste and rough gong knife and the edge of the half-hole is 0.1 mm.
优选的,所述钻铜皮步骤中,所述锣刀刀径使用1.0mm型号,角度为45°,切进深度为3mil。Preferably, in the step of drilling the copper skin, the diameter of the gong cutter is 1.0mm, the angle is 45°, and the cutting depth is 3mil.
优选的,所述铜皮步骤中,上下排相邻半孔,上下最小间距<1.2mm时,将半孔以PTH槽方式钻出。Preferably, in the step of copper skin, adjacent half holes are arranged up and down, and when the minimum distance between the upper and lower sides is less than 1.2 mm, the half holes are drilled in the form of PTH grooves.
与相关技术相比较,本发明提供的PTH半孔制作方法具有如下有益效果:Compared with related technologies, the PTH semi-hole manufacturing method provided by the present invention has the following beneficial effects:
本发明提供一种PTH半孔制作方法,可以让一部份可以成品锣出的PTH半孔,不用走一锣流程,大大节省了成本,而且对半孔毛刺和半孔无铜,制定了好的管控方法。The invention provides a method for manufacturing PTH half-holes, which can make a part of PTH half-holes that can be produced as a finished product without going through a single process, which greatly saves costs, and has a good formula for half-hole burrs and half-holes without copper. control method.
附图说明Description of drawings
图1为本发明提供的PTH半孔制作方法的一种较佳实施例的结构示意图;Fig. 1 is the structural representation of a kind of preferred embodiment of PTH semi-hole manufacturing method provided by the present invention;
图2为图1所示的钻头组件的结构示意图;Fig. 2 is a schematic structural view of the drill bit assembly shown in Fig. 1;
图3为图1所示的A部放大示意图;FIG. 3 is an enlarged schematic diagram of part A shown in FIG. 1;
图4为图1所示的钻头安装座的结构示意图;Fig. 4 is a schematic structural view of the drill bit mount shown in Fig. 1;
图5为图1所示的安装块的结构示意图。FIG. 5 is a schematic structural diagram of the mounting block shown in FIG. 1 .
图中标号:1、钻孔设备,2、钻头安装座,3、安装槽,4、钻头组件,5、安装块,6、钻头,7、楔形卡槽,8、通孔,9、滑杆,10、楔形卡块,11、丝杆,12、把手,13、轴承,14、条形限位孔,15、限位块,16、定位槽,17、定位块。Symbols in the figure: 1. Drilling equipment, 2. Drill mounting seat, 3. Installation slot, 4. Drill assembly, 5. Mounting block, 6. Drill, 7. Wedge-shaped slot, 8. Through hole, 9. Slider , 10, wedge-shaped block, 11, screw mandrel, 12, handle, 13, bearing, 14, strip limit hole, 15, limit block, 16, positioning groove, 17, positioning block.
具体实施方式Detailed ways
下面结合附图和实施方式对本发明作进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
第一实施例:First embodiment:
在本发明的实施例中,PTH半孔制作方法包括以下步骤:In an embodiment of the present invention, the PTH semi-hole manufacturing method includes the following steps:
S1:对半孔进行界定:S1: Defining the half hole:
当连续半孔≤3个,且半孔孔径1.75mm<D<8mm,为成品锣;When there are ≤3 consecutive semi-holes, and the diameter of the semi-holes is 1.75mm<D<8mm, it is a finished gong;
当连续半孔>3个,且半孔孔径0.45<D≤1.75mm,为碱蚀前When there are more than 3 consecutive semi-holes, and the diameter of the semi-holes is 0.45<D≤1.75mm, it is before alkali etching
一锣;a gong;
S2:对半孔进行制作:S2: Make the half hole:
针对成品锣:削铜处为弧形时,在半孔削铜处下刀;削铜处为直角时,在半孔削铜处锣刀路径设计45°,并切进直角处3mil,以避免锣外框时产生披锋;For the finished gong: when the copper cutting part is arc-shaped, cut the knife at the half-hole copper cutting part; when the copper cutting part is right-angled, design the path of the gong knife at the half-hole copper cutting part at 45°, and cut 3mil into the right-angle part to avoid When the gong is outside the frame, it produces a front;
针对碱蚀前一锣:根据成品半孔直径不同,进行钻铜皮、拉废料、粗锣和精锣步骤。For the work before alkali etching: according to the diameter of the half hole of the finished product, the steps of drilling copper skin, pulling waste, roughing and finishing are carried out.
所述步骤S1中,当半孔孔径1.75mm<D<3mm时,采用1.2锣刀正反锣;当半孔孔径3mm≤D<8mm时,采用1.4锣刀正反锣。In the step S1, when the diameter of the half hole is 1.75 mm<D<3 mm, use a 1.2 gong knife front and back gong; when the half hole diameter is 3 mm≤D<8 mm, use a 1.4 gong knife front and back gong.
所述步骤S2中:In the step S2:
当半孔孔径0.45mm<D≤0.8mm,且成品面铜厚度≥70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;When the diameter of the half hole is 0.45mm<D≤0.8mm, and the copper thickness of the finished product surface is ≥70um, and the diameter of the half hole of the finished product is ≥1/2, the sequence of gongs and knives is waste pulling, coarse gongs, and fine gongs, and one gong and a half hole is pre-finished on one side. Leave 4mil, the finished product has a half hole;
当半孔孔径0.45mm<D≤0.8mm,且成品面铜厚度<70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣;When the diameter of the half-hole is 0.45mm<D≤0.8mm, and the copper thickness of the finished product is less than 70um, and the diameter of the half-hole of the finished product is ≥1/2, the order of the belt cutter is scrap, coarse, and fine;
当半孔孔径0.8mm<D≤1.75mm,且成品面铜厚度≥70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;When the diameter of the half hole is 0.8mm<D≤1.75mm, and the copper thickness of the finished product surface is ≥70um, and the diameter of the half hole of the finished product is ≥1/2, the sequence of the gong belt knife is scrap pulling, coarse gong, and fine gong, and one gong and a half hole is pre-finished on one side. Leave 4mil, the finished product has a half hole;
成品半孔直径<1/2,锣带刀序为钻铜皮、拉废料、粗锣、精锣,一锣半孔单边预留4mil,成品锣精锣半孔;The diameter of the half hole of the finished product is less than 1/2. The sequence of the gong belt knife is to drill the copper skin, pull the scrap, rough gong, and fine gong. 4mil is reserved on one side of the half hole, and the finished gong is fine and half hole;
当半孔孔径0.8mm<D≤1.75mm,且成品面铜厚度<70um,成品半孔直径≥1/2,锣带刀序为拉废料、粗锣、精锣;When the diameter of the half-hole is 0.8mm<D≤1.75mm, and the copper thickness of the finished product surface is less than 70um, and the diameter of the half-hole of the finished product is ≥1/2, the order of the cutting tool is scrap, coarse and fine;
成品半孔直径<1/2,锣带刀序为钻铜皮、拉废料、粗锣、精锣。The diameter of the half-hole of the finished product is less than 1/2, and the sequence of gongs and knives is to drill copper skin, pull scraps, rough gongs, and fine gongs.
所述步骤S2中削铜处为直角时,在半孔削铜处锣刀路径设计45°,且孔内下刀点距离孔铜≥0.2mm。In the step S2, when the copper cutting point is at a right angle, the path of the gong knife at the copper cutting point of the half hole is designed to be 45°, and the distance between the cutting point in the hole and the hole copper is ≥0.2mm.
所述锣刀刀径为1.0 -1.4mm。The diameter of the gong cutter is 1.0-1.4mm.
所述拉废料步骤中只拉半孔对侧基材以达到除尘效果,废料使用锣刀清除。In the waste pulling step, only the substrate on the opposite side of the half hole is pulled to achieve the dust removal effect, and the waste is removed with a gong knife.
所述半孔间距<1.2mm时会接触到半孔,锣刀用1.0mm型号。When the distance between the half-holes is less than 1.2mm, it will touch the half-holes, and the gong knife uses a 1.0mm model.
所述锣刀锣半孔时优先保证不锣破,废料和粗锣刀与半孔边最小间距为0.1mm。When the gong knife is half-holed, the priority is to ensure that the gong does not break, and the minimum distance between waste and rough gong knife and the half-hole edge is 0.1mm.
所述钻铜皮步骤中,所述锣刀刀径使用1.0mm型号,角度为45°,切进深度为3mil。In the step of drilling the copper skin, the diameter of the gong cutter is 1.0 mm, the angle is 45°, and the cutting depth is 3 mil.
所述铜皮步骤中,上下排相邻半孔,上下最小间距<1.2mm时,将半孔以PTH槽方式钻出。In the copper skin step, the upper and lower rows of adjacent half holes, when the minimum distance between the upper and lower sides is less than 1.2mm, the half holes are drilled in the form of PTH grooves.
一种PTH半孔详细的介定及制作方法如下表:The detailed definition and production method of a PTH semi-pore is as follows:
与相关技术相比较,本发明提供的PTH半孔制作方法具有如下有益效果:Compared with related technologies, the PTH semi-hole manufacturing method provided by the present invention has the following beneficial effects:
本发明提供一种PTH半孔制作方法,可以让一部份可以成品锣出的PTH半孔,不用走一锣流程,大大节省了成本,而且对半孔毛刺和半孔无铜,制定了好的管控方法。The invention provides a method for manufacturing PTH half-holes, which can make a part of PTH half-holes that can be produced as a finished product without going through a single process, which greatly saves costs, and has a good formula for half-hole burrs and half-holes without copper. control method.
第二实施例:Second embodiment:
基于本申请的第一实施例提供的PTH半孔制作方法,本申请的第二实施例提出另一种PTH半孔制作方法。第二实施例仅仅是第一实施例的优选的方式,第二实施例的实施对第一实施例的单独实施不会造成影响。Based on the PTH half-hole manufacturing method provided in the first embodiment of the present application, the second embodiment of the present application proposes another PTH half-hole manufacturing method. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.
下面结合附图和实施方式对本发明的第二实施例作进一步说明。The second embodiment of the present invention will be further described below in conjunction with the drawings and implementation methods.
请结合参阅图1-图5,本实施例与第一实施例的区别在于,使用钻孔设备1进行钻孔,所述钻孔设备1的输出轴上安装有钻头安装座2,所述钻头安装座2的底侧开设有安装槽3,所述安装槽3内安装有钻头组件4,所述钻头组件4的底端延伸至所述安装槽3外。Please refer to Fig. 1-Fig. 5 in combination, the difference between this embodiment and the first embodiment is that the
所述钻头组件4包括安装块5和钻头6,所述安装块5的两侧均开设有楔形卡槽7。The
所述安装槽3的两侧内壁上均开设有通孔8,所述通孔8内滑动安装有滑杆9,所述滑杆9的一端延伸至所述安装槽3内并固定安装有楔形卡块10,所述楔形卡块10与所述楔形卡槽7相适配,所述通孔8内转动安装有丝杆11,所述丝杆11与所述滑杆9螺纹套接,所述丝杆11的一端延伸至所述通孔8外并固定安装有把手12。Both sides of the
所述通孔8内安装有轴承13,所述轴承13的内圈与所述丝杆11固定套接。A
所述通孔8的顶侧内壁上开设有条形限位孔14,所述滑杆9的顶侧固定安装有限位块15,所述限位块15与所述条形限位孔14滑动连接。A bar-shaped limiting
所述安装槽3的两侧内壁上均开设有定位槽16,所述定位槽16的底侧为开口,所述安装块5的两侧均固定安装有定位块17,所述定位块17与所述定位槽16相适配。Both sides inner walls of the mounting
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其它相关的技术领域,均同理包括在本发明的专利保护范围内。The above is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, all of which are equally included in the scope of patent protection of the present invention.
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