CN102615318A - Routing method for PCB (printed circuit board) - Google Patents
Routing method for PCB (printed circuit board) Download PDFInfo
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- CN102615318A CN102615318A CN2012101046709A CN201210104670A CN102615318A CN 102615318 A CN102615318 A CN 102615318A CN 2012101046709 A CN2012101046709 A CN 2012101046709A CN 201210104670 A CN201210104670 A CN 201210104670A CN 102615318 A CN102615318 A CN 102615318A
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Abstract
The invention discloses a routing method for a PCB (printed circuit board), which includes steps: using an end-mill to route a routing path in a length of 3 mm at a neighboring position of the peripheral edge of the PCB and the processing edge of the PCB, and making the neighboring routing paths overlap 1 mm. By the method, if a cutter is broken, 1 mm of the processing edge and the peripheral edge is left unrouted, so that a peripheral frame cannot be taken off by an operator, broken message of the cutter can be obtained, unrounting problem caused by broken cutter is solved, and production of defective products can be avoided.
Description
Technical field
The present invention relates to PCB and make the field, relate in particular to a kind of PCB gong plate method.
Background technology
PCB gong plate is an important procedure in the PCB manufacturing process; PCB gong plate is meant through the gong cutter and by the processing formula of engineering design the figure that the client needs is cut; The situation appearance that after cutter wear acquires a certain degree, can breaking occur and cause leaking gong; If when not giving the client by the customer requirement production plate shipment that gong is good, (Printed Circuit Board+Assembly refers to that PCB hollow plate process SMT goes up part can to make PCBA; Pass through the whole process of DIP plug-in unit again) can't be installed on the product smoothly, thus cause PCBA to scrap.Generally adopt following mode operation to leaking gong control in the industry at present: 1, install the breaking checkout gear additional from the device hardware aspect; 2, prevent that through manual method inspection outward appearance problem board from flowing out.And the employing first method can lose efficacy the breaking measuring ability and produce and leak gong along with the aging of equipment, also can produce certain maintenance cost simultaneously; Adopt second method, the testing staff can produce visual fatigue can not guarantee that problem board all is detected, thereby can not thoroughly stop problem board.
Therefore, prior art awaits to improve and development.
Summary of the invention
Deficiency in view of above-mentioned prior art the object of the present invention is to provide a kind of PCB gong plate method, is intended to solve existing PCB gong plate technique and the problem that breaking leakage gong can't in time detect problem board often occurs.
Technical scheme of the present invention is following:
A kind of PCB gong plate method wherein, comprises step: use gong cutter gong to go out the gong journey of length as 3mm in PCB periphery sides and PCB technology limit adjacent, and overlap the 1mm distance between the adjacent gong journey.
Beneficial effect: PCB gong plate method of the present invention through using gong cutter gong to go out the gong journey of length as 3mm in PCB periphery sides and PCB technology limit adjacent, and overlaps the 1mm distance between the adjacent gong journey; If in gong plate process as when breaking occurring; The clout that can make technology limit and peripheral place produce one section 1mm does not have gong empty, and the operator can not take off frame when external surrounding frame down, thereby lets the operator in time obtain breaking information; Breaking is leaked gong has certain foolproof function, has stopped the outflow of defective products.
Description of drawings
Fig. 1 is the structural representation of PCB among the present invention.
Fig. 2 is the gong journey sketch map in the PCB gong plate method of the present invention.
Fig. 3 is preferable technological parameter sketch map during different gong cutter diameter in the embodiment of the invention.
The specific embodiment
The present invention provides PCB gong plate method, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
PCB gong plate method of the present invention through using gong cutter gong to go out the gong journey of length as 3mm in PCB periphery sides and PCB technology limit adjacent, and overlaps the 1mm distance between the adjacent gong journey.The present invention can be not empty by gong in PCB periphery sides and PCB technology limit adjacent when breaking occurring, can make the operator in time obtain breaking information.
When engineering department makes the gong band; After the formula to the intact PCB enclose pattern of gong; Begin gong PCB periphery sides and technology limit immediately, and leave the limit that overlaps of 1mm distance at PCB periphery sides and the adjacent gong journey place on PCB technology limit, remaining place, periphery still adopts the peripheral gong cutter gong of gong intact; This programme is suitable for the gong cutter of gong cutter diameter at 0.5mm ~ 3.2mm; If adopt the gong cutter of other diameter ranges certainly, can do suitable adjustment to the gong journey on PCB periphery sides and PCB technology limit, and adjacent gong journey is overlapped apart from adjust slightly.
As shown in Figure 1, the position on PCB periphery sides 120 and PCB technology limit 110 has been shown, among Fig. 1 when concrete gong plate; Can the gong journey be set to 3mm; As shown in Figure 2, this PCB goes up with gong cutter gong and has gone out the first gong journey 210, the second gong journey 220 and the 3rd gong journey 230, and above-mentioned gong journey is 3mm; And the first gong journey 210 overlaps distance for 1mm with the second gong journey 220, and the second gong journey 220 overlaps with the 3rd gong journey apart from being 1mm.If the second gong journey of having leaked gong like this, then should the place empty by gong, this moment, the operator can't take off frame, and like this, where the operator limit can be known and in time to have detected problem board by breaking.
A concrete embodiment is to carry out the gong cutter according to following program successively: the input navigation data, bore locating hole, input gong plate data, upper plate (setting the folded number of processing by technological requirement), machined parameters be set (according to different gong cutter diameters by the technological requirement input), examination gong initial workpiece (list of a plate of examination props up during the examination gong), initial workpiece inspection, batch gong plate, lower plate according to gong cutter diameter and thickness of slab, check, go out under operation.Gong plate operation lower plate flow process wherein is, successively through getting periphery sides, mend gong, get periphery sides, getting operation such as forming board.
PCB gong plate method of the present invention is suitable for the gong cutter of diameter range at 0.5mm ~ 3.2mm.Specific as follows stating:
When the diameter of said gong cutter was 0.8mm, gong swivel speed was 38krpm, and feed velocity is 0.8 ~ 1.2m/min, and returning cutter speed is 10m/min, and gait of march is 2 ~ 3mm/s, and the lamination gross thickness is smaller or equal to 3.6mm, and lamination piece number is smaller or equal to 5.
When the diameter of said gong cutter was 1mm, gong swivel speed was 38krpm, and feed velocity is 0.8 ~ 1.2m/min, and returning cutter speed is 10m/min, and gait of march is 3 ~ 4mm/s, and the lamination gross thickness is smaller or equal to 4.8mm, and lamination piece number is smaller or equal to 7.
When the diameter of said gong cutter was 1.2mm, gong swivel speed was 35krpm, and feed velocity is 1.0 ~ 1.4m/min, and returning cutter speed is 10m/min, and gait of march is 5 ~ 8mm/s, and the lamination gross thickness is smaller or equal to 5.5mm, and lamination piece number is smaller or equal to 9.
When the diameter of said gong cutter was 1.6mm, gong swivel speed was 32krpm, and feed velocity is 1.3 ~ 1.7m/min, and returning cutter speed is 10m/min, and gait of march is 10 ~ 14mm/s, and the lamination gross thickness is smaller or equal to 6.4mm, and lamination piece number is smaller or equal to 9.
When the diameter of said gong cutter was 1.9mm, gong swivel speed was 30krpm, and feed velocity is 1.3 ~ 1.7m/min, and returning cutter speed is 10m/min, and gait of march is 14 ~ 16mm/s, and the lamination gross thickness is smaller or equal to 6.4mm, and lamination piece number is smaller or equal to 10.
Specifically of Fig. 3, the preferable technological parameter when Fig. 3 shows gong cutter diameter and is above-mentioned value and other values.
PCB gong plate method of the present invention through using gong cutter gong to go out the gong journey of length as 3mm in PCB periphery sides and PCB technology limit adjacent, and overlaps the 1mm distance between the adjacent gong journey; If in gong plate process as when breaking occurring; The clout that can make technology limit and peripheral place produce one section 1mm does not have gong empty, and the operator can not take off frame when external surrounding frame down, thereby lets the operator in time obtain breaking information; Breaking is leaked gong has certain foolproof function, has stopped the outflow of defective products.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection domain of accompanying claims of the present invention according to above-mentioned explanation.
Claims (7)
1. a PCB gong plate method is characterized in that, comprises step: use gong cutter gong to go out the gong journey of length as 3mm in PCB periphery sides and PCB technology limit adjacent, and overlap the 1mm distance between the adjacent gong journey.
2. PCB gong plate method according to claim 1 is characterized in that the diameter range of said gong cutter is 0.5mm ~ 3.2mm.
3. PCB gong plate method according to claim 2 is characterized in that, when the diameter of said gong cutter is 0.8mm; Gong swivel speed is 38krpm; Feed velocity is 0.8 ~ 1.2m/min, and returning cutter speed is 10m/min, and gait of march is 2 ~ 3mm/s; The lamination gross thickness is smaller or equal to 3.6mm, and lamination piece number is smaller or equal to 5.
4. PCB gong plate method according to claim 2 is characterized in that, when the diameter of said gong cutter is 1mm; Gong swivel speed is 38krpm; Feed velocity is 0.8 ~ 1.2m/min, and returning cutter speed is 10m/min, and gait of march is 3 ~ 4mm/s; The lamination gross thickness is smaller or equal to 4.8mm, and lamination piece number is smaller or equal to 7.
5. PCB gong plate method according to claim 2 is characterized in that, when the diameter of said gong cutter is 1.2mm; Gong swivel speed is 35krpm; Feed velocity is 1.0 ~ 1.4m/min, and returning cutter speed is 10m/min, and gait of march is 5 ~ 8mm/s; The lamination gross thickness is smaller or equal to 5.5mm, and lamination piece number is smaller or equal to 9.
6. PCB gong plate method according to claim 2 is characterized in that, when the diameter of said gong cutter is 1.6mm; Gong swivel speed is 32krpm; Feed velocity is 1.3 ~ 1.7m/min, and returning cutter speed is 10m/min, and gait of march is 10 ~ 14mm/s; The lamination gross thickness is smaller or equal to 6.4mm, and lamination piece number is smaller or equal to 9.
7. PCB gong plate method according to claim 2 is characterized in that, when the diameter of said gong cutter is 1.9mm; Gong swivel speed is 30krpm; Feed velocity is 1.3 ~ 1.7m/min, and returning cutter speed is 10m/min, and gait of march is 14 ~ 16mm/s; The lamination gross thickness is smaller or equal to 6.4mm, and lamination piece number is smaller or equal to 10.
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| CN201210104670.9A CN102615318B (en) | 2012-04-11 | 2012-04-11 | Routing method for PCB (printed circuit board) |
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|---|---|---|---|
| CN201210104670.9A CN102615318B (en) | 2012-04-11 | 2012-04-11 | Routing method for PCB (printed circuit board) |
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| CN102615318A true CN102615318A (en) | 2012-08-01 |
| CN102615318B CN102615318B (en) | 2014-11-05 |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168713A (en) * | 2013-05-20 | 2014-11-26 | 北大方正集团有限公司 | Printed circuit board routing method |
| CN104841969A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | PCB (printed circuit board) numerical-control drilling method |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105376928A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | Easily-assembled-and-fixed PCB and manufacturing method thereof |
| CN106098633A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of base plate for packaging and preparation method thereof |
| CN106231800A (en) * | 2016-08-15 | 2016-12-14 | 梅州市志浩电子科技有限公司 | Printed circuit board method for processing forming |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106825763A (en) * | 2017-01-11 | 2017-06-13 | 雪龙数控设备(深圳)有限公司 | Without wiring board cutting processing technology, numerical control gong machine that pin on the table is followed closely |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN108495462A (en) * | 2018-03-08 | 2018-09-04 | 景旺电子科技(龙川)有限公司 | A kind of leakproof gong method |
| CN108637333A (en) * | 2018-05-22 | 2018-10-12 | 东莞市中泰精创精密科技有限公司 | A kind of CNC feed methods of ultra-thin hole structure |
| CN112969313A (en) * | 2021-02-03 | 2021-06-15 | 湖南好易佳电路板有限公司 | PTH (plated through hole) half-hole manufacturing method |
| CN113312872A (en) * | 2021-05-19 | 2021-08-27 | 深圳市百能信息技术有限公司 | Gong band manufacturing method and device, gong band manufacturing equipment and storage medium |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
| CN114544665A (en) * | 2022-04-27 | 2022-05-27 | 惠州威尔高电子有限公司 | PCB forming groove gong missing rapid detection method, electronic equipment and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464709A (en) * | 1987-09-01 | 1989-03-10 | Fujitsu Ltd | Drilling method for printed board |
| JPH1064709A (en) * | 1996-08-12 | 1998-03-06 | Hitachi Maxell Ltd | Method of manufacturing manganese-bismuth magnetic powder and magnetic sheet using the powder |
| TW200622532A (en) * | 2004-12-28 | 2006-07-01 | Ind Tech Res Inst | Methods of the machining of metals tool control machining for a pcb router/driller machine |
| CN101284351A (en) * | 2008-05-30 | 2008-10-15 | 汕头超声印制板公司 | Printed circuit board contour processing method |
| CN201805623U (en) * | 2010-08-30 | 2011-04-20 | 昆山元茂电子科技有限公司 | Forming processing hole on printed circuit board |
| KR20110045567A (en) * | 2009-10-27 | 2011-05-04 | 주식회사 에스아이 플렉스 | Method of manufacturing printed circuit board |
-
2012
- 2012-04-11 CN CN201210104670.9A patent/CN102615318B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464709A (en) * | 1987-09-01 | 1989-03-10 | Fujitsu Ltd | Drilling method for printed board |
| JPH1064709A (en) * | 1996-08-12 | 1998-03-06 | Hitachi Maxell Ltd | Method of manufacturing manganese-bismuth magnetic powder and magnetic sheet using the powder |
| TW200622532A (en) * | 2004-12-28 | 2006-07-01 | Ind Tech Res Inst | Methods of the machining of metals tool control machining for a pcb router/driller machine |
| CN101284351A (en) * | 2008-05-30 | 2008-10-15 | 汕头超声印制板公司 | Printed circuit board contour processing method |
| KR20110045567A (en) * | 2009-10-27 | 2011-05-04 | 주식회사 에스아이 플렉스 | Method of manufacturing printed circuit board |
| CN201805623U (en) * | 2010-08-30 | 2011-04-20 | 昆山元茂电子科技有限公司 | Forming processing hole on printed circuit board |
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168713A (en) * | 2013-05-20 | 2014-11-26 | 北大方正集团有限公司 | Printed circuit board routing method |
| CN104168713B (en) * | 2013-05-20 | 2017-02-08 | 北大方正集团有限公司 | Printed circuit board routing method |
| CN104841969A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | PCB (printed circuit board) numerical-control drilling method |
| CN104968151A (en) * | 2015-07-03 | 2015-10-07 | 景旺电子科技(龙川)有限公司 | Manufacturing method of carved copper substrate |
| CN104968151B (en) * | 2015-07-03 | 2017-12-15 | 景旺电子科技(龙川)有限公司 | A kind of preparation method for carving cup copper base |
| CN105228347A (en) * | 2015-08-14 | 2016-01-06 | 景旺电子科技(龙川)有限公司 | A kind of PCB jigsaw gong plate method |
| CN105376928A (en) * | 2015-11-03 | 2016-03-02 | 江门崇达电路技术有限公司 | Easily-assembled-and-fixed PCB and manufacturing method thereof |
| CN106098633A (en) * | 2016-06-30 | 2016-11-09 | 广州兴森快捷电路科技有限公司 | A kind of base plate for packaging and preparation method thereof |
| CN106098633B (en) * | 2016-06-30 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | A kind of package substrate and preparation method thereof |
| CN106255321A (en) * | 2016-08-10 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106255321B (en) * | 2016-08-10 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A kind of gong plate edges of boards are without dust technique |
| CN106231800A (en) * | 2016-08-15 | 2016-12-14 | 梅州市志浩电子科技有限公司 | Printed circuit board method for processing forming |
| CN106231800B (en) * | 2016-08-15 | 2019-02-05 | 梅州市志浩电子科技有限公司 | Printed circuit board method for processing forming |
| CN106825763A (en) * | 2017-01-11 | 2017-06-13 | 雪龙数控设备(深圳)有限公司 | Without wiring board cutting processing technology, numerical control gong machine that pin on the table is followed closely |
| CN106825763B (en) * | 2017-01-11 | 2019-05-17 | 雪龙数控设备(深圳)有限公司 | Without the wiring board cutting processing technology of the nail of pin on the table, numerical control gong machine |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN106900139B (en) * | 2017-04-20 | 2019-05-14 | 胜宏科技（惠州）股份有限公司 | A kind of high-accuracy no technique edges LED circuit board moulding process |
| CN107708305B (en) * | 2017-08-30 | 2020-05-19 | 奥士康精密电路（惠州）有限公司 | Routing process for precisely controlling appearance of substrate |
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107580416B (en) * | 2017-08-30 | 2020-05-19 | 奥士康精密电路（惠州）有限公司 | High-precision control method for circuit board size |
| CN108495462A (en) * | 2018-03-08 | 2018-09-04 | 景旺电子科技(龙川)有限公司 | A kind of leakproof gong method |
| CN108637333A (en) * | 2018-05-22 | 2018-10-12 | 东莞市中泰精创精密科技有限公司 | A kind of CNC feed methods of ultra-thin hole structure |
| CN112969313A (en) * | 2021-02-03 | 2021-06-15 | 湖南好易佳电路板有限公司 | PTH (plated through hole) half-hole manufacturing method |
| CN112969313B (en) * | 2021-02-03 | 2023-02-17 | 湖南好易佳电路板股份有限公司 | PTH (plated through hole) half-hole manufacturing method |
| CN113312872A (en) * | 2021-05-19 | 2021-08-27 | 深圳市百能信息技术有限公司 | Gong band manufacturing method and device, gong band manufacturing equipment and storage medium |
| CN113312872B (en) * | 2021-05-19 | 2024-02-23 | 深圳市百能信息技术有限公司 | Gong belt manufacturing method and device, gong belt manufacturing equipment and storage medium |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
| CN114544665A (en) * | 2022-04-27 | 2022-05-27 | 惠州威尔高电子有限公司 | PCB forming groove gong missing rapid detection method, electronic equipment and storage medium |
| CN114544665B (en) * | 2022-04-27 | 2022-07-08 | 惠州威尔高电子有限公司 | PCB forming groove milling missing rapid detection method, electronic equipment and storage medium |
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