CN106900139A - It is a kind of high-accuracy without technique edges LED circuit board moulding process - Google Patents
It is a kind of high-accuracy without technique edges LED circuit board moulding process Download PDFInfo
- Publication number
- CN106900139A CN106900139A CN201710259697.8A CN201710259697A CN106900139A CN 106900139 A CN106900139 A CN 106900139A CN 201710259697 A CN201710259697 A CN 201710259697A CN 106900139 A CN106900139 A CN 106900139A
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- circuit board
- led circuit
- gong
- auxiliary process
- process side
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The present invention provides a kind of high-accuracy without technique edges LED circuit board moulding process, including step:Product design for LED circuit board carries out gong plate design, and in PNL plates each LED circuit board profile side Design assistant technique edges, location hole and optical point are set on auxiliary process side；Designed according to gong plate, positioned using the location hole on auxiliary process side, thick gong processing is carried out to each LED circuit board, by PNL plates gong into the SET plates for retaining auxiliary process side；Positioned using the optical point on auxiliary process side, the smart gong to LED circuit board, then the auxiliary process side for removing each LED circuit board SET plates Nei are completed using CCD optics gong machine.
Description
Technical field
It is high-accuracy without technique edges LED circuit board moulding process the present invention relates to wiring board manufacture field, more particularly to one kind.
Background technology
In some electronic products, due to small volume itself, inner space is compact, and wiring board requires circuit when making shaping
Without technique edges on plate, to reduce the space shared by wiring board as far as possible, auxiliary positioning is carried out without technique edges, must just used
Special positioning molding method, at present for the molding mode of the wiring board without technique edges to position hole forming in plate, stamping into
Type, edges of boards are molded by pin.The first molding mode by set assist side in location hole effect, in gong sheet metal forming by
Larger in the impact of the force to plate of gong knife, the contour tolerance for causing is larger, and contour tolerance is more than 0.1mm；Second shaping side
Formula relies on punching press mould processing, there is that stamp side is coarse, the quality risk such as metal covering is weighed wounded；The third molding mode relies on plate
Side setting auxiliary pin is processed, and due to only leaning on many PIN needle positioning, also easy stress skew, has locating bias plate angle gong line
Incline uneven, influence client integral product assembly.Three of the above mode cannot meet sharp processing precision requirement
The making demand of LED circuit board higher.
The content of the invention
Regarding to the issue above, the present invention provides a kind of high-accuracy without technique edges LED circuit board moulding process, including step:
Product design for LED circuit board carries out gong plate design, and the profile side of each LED circuit board is designed in PNL plates
Auxiliary process side, sets location hole and optical point on auxiliary process side；
Designed according to gong plate, positioned using the location hole on auxiliary process side, carrying out thick gong to each LED circuit board adds
Work, by PNL plates gong into the SET plates for retaining auxiliary process side；
Positioned using the optical point on auxiliary process side, the smart gong to LED circuit board is completed using CCD optics gong machine, then
The auxiliary process side of each LED circuit board in removal SET plates.
Preferably, when carrying out the design of gong plate, an auxiliary process side is separately designed in the both sides of LED circuit board.
Further, when carrying out the design of gong plate, 4 location holes and 4 optical points, positioning are designed each LED circuit board
Hole and optical point are arranged in pairs in the two ends on the auxiliary process side of LED circuit board.
Further, when carrying out the design of gong plate, it is arranged at location hole and is designed as open circles, optical point is designed as concentric circles.
Preferably, the static pressure ＞ 70KPA in the absorption workbench face of CCD optics gong machine.
The high-accuracy of present invention offer carries out gong sheet metal forming without technique edges LED circuit board moulding process to LED circuit board,
First pass through the positioning support on the auxiliary process side and the thick gong of location hole offer that are pre-designed, it is to avoid because gong knife applies online during thick gong
Power on the plate of road is larger so as to cause appearance and size deviation, then passes through optical point using processing precise degree optics gong machine higher
Positioning carries out smart gong amendment, and finally removal is located at the profile of LED circuit board in upper auxiliary process, because smart gong is in thick gong
On the basis of be modified, LED circuit board is exerted a force smaller, optics is only being coordinated by the absorption workbench face of CCD optics gong machines
It is not easy to cause the locating bias in process in the case of point location, can effectively reduces appearance and size tolerance, improves and add
Work precision, it is ensured that the LED circuit board product quality without technique edges.
Brief description of the drawings
Fig. 1 is PNL plates design signal in the high-accuracy LED circuit board moulding process embodiment without technique edges that invention is provided
Figure.
Fig. 2 is LED circuit board auxiliary in the high-accuracy LED circuit board moulding process embodiment without technique edges that the present invention is provided
Side design diagram.
Specific embodiment
For ease of skilled artisan understands that the present invention, below in conjunction with specific embodiments and the drawings the present invention is made into
One step is described in detail.
First, in PNL plates 1（Production plate）Interior, the product design for each LED circuit board 2 carries out gong plate design, and
The profile side Design assistant technique edges 3 of each LED circuit board 2 in PNL plates 1, as shown in figure 1, LED circuit board 2 is square,
The both sides of LED circuit board 2 separately design an auxiliary process side 3.And location hole 31 and optical point are set on auxiliary process side 3
32, as shown in Fig. 2 designing 4 location holes 31 and 32 one-tenth of 4 optical points 32, location hole 31 and optical point to each LED circuit board
Two ends to being arranged at the auxiliary process side 3 of LED circuit board 2, location hole 31 is designed as open circles, and optical point 32 is designed as with one heart
Circle.
Then designed further according to gong plate, positioned using the location hole 31 on auxiliary process side 3, to each LED line road
Plate 2 carries out thick gong processing, by the gong of PNL plates 1 into the SET plates for retaining auxiliary process side 3（Jigsaw）；
Positioned followed by the optical point 32 on auxiliary process side 3, completed right on the basis of thick gong using CCD optics gong machine
The smart gong of LED circuit board 2, then the auxiliary process side 3 of each LED circuit board 2 SET plates Nei is removed, so as to complete moulding process.For
Avoid producing locating bias during smart gong, need to use
The CCD optics gong machines of the static pressure ＞ 70KPA in absorption workbench face so that what LED circuit board 2 can be stronger is fixed on
On work top.The contour tolerance management and control of LED circuit board can be made in 0.075mm using the method.
Although description of this invention combination embodiments above is carried out, those skilled in the art
Member can carry out many replacements, modifications and variations according to above-mentioned content, be obvious.Therefore, it is all it is such substitute,
Improve and change is included in scope of the appended claims.
Claims (5)
1. a kind of high-accuracy without technique edges LED circuit board moulding process, including step:
Product design for LED circuit board carries out gong plate design, and the profile side of each LED circuit board is designed in PNL plates
Auxiliary process side, sets location hole and optical point on auxiliary process side；
Designed according to gong plate, positioned using the location hole on auxiliary process side, carrying out thick gong to each LED circuit board adds
Work, by PNL plates gong into the SET plates for retaining auxiliary process side；
Positioned using the optical point on auxiliary process side, the smart gong to LED circuit board is completed using CCD optics gong machine, then
The auxiliary process side of each LED circuit board in removal SET plates.
2. according to high-accuracy without technique edges LED circuit board moulding process described in claim 1, it is characterised in that：Gong plate is carried out to set
Timing, an auxiliary process side is separately designed in the both sides of LED circuit board.
3. according to high-accuracy without technique edges LED circuit board moulding process described in claim 2：It is characterized in that：Gong plate is carried out to set
Timing, 4 location holes and 4 optical points are designed to each LED circuit board, and location hole and optical point are arranged in pairs in LED line road
The two ends on the auxiliary process side of plate.
4. according to high-accuracy without technique edges LED circuit board moulding process described in claim 3, it is characterised in that：Gong plate is carried out to set
Timing, is arranged at location hole and is designed as open circles, and optical point is designed as concentric circles.
5. according to high-accuracy without technique edges LED circuit board moulding process described in claim 1, it is characterised in that：CCD optics gong machines
The static pressure ＞ 70KPA in absorption workbench face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259697.8A CN106900139B (en) | 2017-04-20 | 2017-04-20 | A kind of high-accuracy no technique edges LED circuit board moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710259697.8A CN106900139B (en) | 2017-04-20 | 2017-04-20 | A kind of high-accuracy no technique edges LED circuit board moulding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106900139A true CN106900139A (en) | 2017-06-27 |
| CN106900139B CN106900139B (en) | 2019-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710259697.8A Active CN106900139B (en) | 2017-04-20 | 2017-04-20 | A kind of high-accuracy no technique edges LED circuit board moulding process |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN108668447A (en) * | 2018-07-13 | 2018-10-16 | 常州澳弘电子有限公司 | A kind of processing technology of the full-scale wiring board of precision |
| CN109348625A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of LED lamp panel shaping process |
| CN109496059A (en) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | Production method without location structure PCB |
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN110139483A (en) * | 2019-04-16 | 2019-08-16 | 珠海中京电子电路有限公司 | A kind of printed circuit board forming processing method |
| CN110446354A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of pcb board high-precision size forming method applied to LED |
| CN110579846A (en) * | 2019-09-26 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN110896592A (en) * | 2018-09-12 | 2020-03-20 | 胜宏科技（惠州）股份有限公司 | 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof |
| CN111295050A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | Novel LED lamp panel alignment processing method |
| CN111465198A (en) * | 2020-05-26 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN111913072A (en) * | 2020-07-24 | 2020-11-10 | 胜宏科技（惠州）股份有限公司 | Method for identifying waste coil plate reporting |
| CN111954382A (en) * | 2020-09-07 | 2020-11-17 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN112595234A (en) * | 2021-01-04 | 2021-04-02 | 胜宏科技（惠州）股份有限公司 | Method for detecting complex external dimension of circuit board |
| CN112672511A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board without positioning hole and forming method thereof |
| CN113923872A (en) * | 2021-09-29 | 2022-01-11 | 胜宏科技（惠州）股份有限公司 | Process edge removing method of high-precision circuit board |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708305A (en) * | 2017-08-30 | 2018-02-16 | 奥士康精密电路（惠州）有限公司 | Gong plate technique for accurate control base board external form |
| CN107580416A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Circuit board size high-accuracy control method |
| CN107580416B (en) * | 2017-08-30 | 2020-05-19 | 奥士康精密电路（惠州）有限公司 | High-precision control method for circuit board size |
| CN108668447A (en) * | 2018-07-13 | 2018-10-16 | 常州澳弘电子有限公司 | A kind of processing technology of the full-scale wiring board of precision |
| CN110896592A (en) * | 2018-09-12 | 2020-03-20 | 胜宏科技（惠州）股份有限公司 | 3D (three-dimensional) switching type PCB (printed circuit board) and manufacturing method thereof |
| CN109348625A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of LED lamp panel shaping process |
| CN109496059A (en) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | Production method without location structure PCB |
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN110139483B (en) * | 2019-04-16 | 2021-07-02 | 珠海中京电子电路有限公司 | Printed circuit board forming processing method |
| CN110139483A (en) * | 2019-04-16 | 2019-08-16 | 珠海中京电子电路有限公司 | A kind of printed circuit board forming processing method |
| CN110446354A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of pcb board high-precision size forming method applied to LED |
| CN110579846A (en) * | 2019-09-26 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | Bevel edge processing method of high-speed optical module board |
| CN111295050A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | Novel LED lamp panel alignment processing method |
| CN111465198A (en) * | 2020-05-26 | 2020-07-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN111465198B (en) * | 2020-05-26 | 2021-07-02 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving circuit board warping plate |
| CN111913072A (en) * | 2020-07-24 | 2020-11-10 | 胜宏科技（惠州）股份有限公司 | Method for identifying waste coil plate reporting |
| CN111954382A (en) * | 2020-09-07 | 2020-11-17 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN111954382B (en) * | 2020-09-07 | 2021-09-14 | 胜宏科技（惠州）股份有限公司 | Circuit board PAD and hole-to-edge size control method |
| CN112672511A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board without positioning hole and forming method thereof |
| CN112595234A (en) * | 2021-01-04 | 2021-04-02 | 胜宏科技（惠州）股份有限公司 | Method for detecting complex external dimension of circuit board |
| CN113923872A (en) * | 2021-09-29 | 2022-01-11 | 胜宏科技（惠州）股份有限公司 | Process edge removing method of high-precision circuit board |
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