CN106550543A - A kind of circuit panel forming method without location hole - Google Patents
A kind of circuit panel forming method without location hole Download PDFInfo
- Publication number
- CN106550543A CN106550543A CN201610949417.1A CN201610949417A CN106550543A CN 106550543 A CN106550543 A CN 106550543A CN 201610949417 A CN201610949417 A CN 201610949417A CN 106550543 A CN106550543 A CN 106550543A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- location hole
- processed
- gong
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The present invention provides a kind of circuit panel forming method without location hole, wiring board for being not provided with location hole, the mode for increasing location hole by using technique edges carries out gong plate processing, it is intended to solve inefficiency present in the existing circuit panel forming method without location hole, the problems such as action is cumbersome.
Description
Technical field
The invention belongs to wiring board processing technique field, and in particular to a kind of circuit panel forming method without location hole.
Background technology
During assist side machine-shaping, wiring board gong plate is an important procedure in wiring board manufacturing process,
Wiring board gong plate is referred to and is cut the figure that client needs by the processing formula of engineering design by gong knife.But at this stage
The wiring board plate of some design does not have location hole, positioning of having no idea, it may appear that off-dimension occur during milling cutter conduct
Situation, due to self-inspection and first analyzing it is poor, it is impossible to ensure that problem board is all detected, thus can not thoroughly prevent problem board.Therefore,
Prior art has yet to be improved and developed.
The content of the invention
In view of this, the present invention provides a kind of circuit panel forming method without location hole, for being not provided with location hole
Wiring board, the mode for increasing location hole by using technique edges carry out gong plate processing, it is intended to solve the existing line without location hole
Inefficiency present in the panel forming method of road, the problems such as action is cumbersome.
The technical scheme is that：A kind of circuit panel forming method without location hole, comprises the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.5-1.9mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
The present invention changes traditional gong sheet metal forming technique, using the processing mode of a gong sheet metal forming, greatly optimizes
Circuit panel forming method, positioning are simple, easy to operate so that the edges of boards of wiring board are smooth, smooth, are easy to splicing to use, energy
Enough ensure the quality of wiring board, reduce the production time, improve production efficiency；Enable simultaneously more efficient without location hole gong plate
Production in batch, make wiring board production and processing mode more diversification, lift the production efficiency of this kind of plate.
Specific embodiment
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, this area is common
The every other embodiment obtained under the premise of creative work is not made by technical staff, belongs to the model of present invention protection
Enclose.
Embodiment 1
A kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.5mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
Embodiment 2
A kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.6mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
Embodiment 3
A kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.7mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
Embodiment 4
A kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.8mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
Embodiment 5
A kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
Further, the technique edges of described wiring board to be processed are arranged on any both sides of wiring board to be processed.
Further, in step S4, the gong plate technique is using a processed mode processed by gong knife straight gong.
Further, the gong knife diameter selects 1.9mm.
Further, the periphery holes are with the centrage of wiring board to be processed that is fixed on the backing plate of forming machine table top as axle center
It is symmetrical.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that those skilled in the art should for clarity
Using description as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.The ins and outs of all not detailed descriptions in the present invention, can be appointed by this area
One prior art is realized.
Claims (5)
1. a kind of circuit panel forming method without location hole, it is characterised in that comprise the following steps：
S1, a technique edges are respectively provided with the both sides of wiring board to be processed, each technique edges are provided with two location holes, line
Road plate is being symmetrically arranged on two with two periphery holes except technique edges；
S2., wiring board polylith to be processed is carried out external, overlap successively, will by the location hole on shop bolt insertion process side
Wiring board is fixed on the backing plate of forming machine table top；
S3. shop bolt is inserted into periphery holes, now shop bolt is offseted with wiring board respectively；
S4. a gong plate is carried out to the PCB plates without location hole, technique edges whole gong is fallen, finished product wiring board is made.
2. the circuit panel forming method without location hole according to claim 1, it is characterised in that described circuit to be processed
The technique edges of plate are arranged on any both sides of wiring board to be processed.
3. the circuit panel forming method without location hole according to claim 1, it is characterised in that in step S4, the gong
Plate technique is using a processed mode processed by gong knife straight gong.
4. the circuit panel forming method without location hole according to claim 3, it is characterised in that the gong knife diameter is selected
1.5-1.9mm。
5. the circuit panel forming method without location hole according to claim 1, it is characterised in that the periphery holes are with fixation
The centrage of the wiring board to be processed on the backing plate of forming machine table top is that axle center is symmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610949417.1A CN106550543A (en) | 2016-10-26 | 2016-10-26 | A kind of circuit panel forming method without location hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610949417.1A CN106550543A (en) | 2016-10-26 | 2016-10-26 | A kind of circuit panel forming method without location hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550543A true CN106550543A (en) | 2017-03-29 |
Family
ID=58392465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610949417.1A Pending CN106550543A (en) | 2016-10-26 | 2016-10-26 | A kind of circuit panel forming method without location hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106550543A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN109397370A (en) * | 2017-08-15 | 2019-03-01 | 惠州中京电子科技有限公司 | Splice screen board cutting method |
| CN109496059A (en) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | Production method without location structure PCB |
| CN110430675A (en) * | 2019-07-10 | 2019-11-08 | 奥士康科技股份有限公司 | A kind of wiring board is without positioning hole forming method |
| CN110774351A (en) * | 2019-09-24 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Processing method of thick multimode module connector without internal positioning optical mode |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
| CN112672511A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board without positioning hole and forming method thereof |
| CN113115516A (en) * | 2021-04-06 | 2021-07-13 | 江西旭昇电子有限公司 | Method for processing printed circuit board without positioning hole by adopting numerical control milling machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532067A (en) * | 1978-08-29 | 1980-03-06 | Fujitsu Ltd | Production of photo mask for printed board |
| CN105338746A (en) * | 2015-11-03 | 2016-02-17 | 胜宏科技（惠州）股份有限公司 | Method for forming circuit board without location holes |
-
2016
- 2016-10-26 CN CN201610949417.1A patent/CN106550543A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532067A (en) * | 1978-08-29 | 1980-03-06 | Fujitsu Ltd | Production of photo mask for printed board |
| CN105338746A (en) * | 2015-11-03 | 2016-02-17 | 胜宏科技（惠州）股份有限公司 | Method for forming circuit board without location holes |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN106900139B (en) * | 2017-04-20 | 2019-05-14 | 胜宏科技（惠州）股份有限公司 | A kind of high-accuracy no technique edges LED circuit board moulding process |
| CN109397370A (en) * | 2017-08-15 | 2019-03-01 | 惠州中京电子科技有限公司 | Splice screen board cutting method |
| CN109496059A (en) * | 2018-11-21 | 2019-03-19 | 梅州市志浩电子科技有限公司 | Production method without location structure PCB |
| CN110430675A (en) * | 2019-07-10 | 2019-11-08 | 奥士康科技股份有限公司 | A kind of wiring board is without positioning hole forming method |
| CN110774351A (en) * | 2019-09-24 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Processing method of thick multimode module connector without internal positioning optical mode |
| CN110774351B (en) * | 2019-09-24 | 2021-10-12 | 惠州市金百泽电路科技有限公司 | Processing method of thick multimode module connector without internal positioning optical mode |
| CN111586982A (en) * | 2020-05-28 | 2020-08-25 | 遂宁市广天电子有限公司 | Processing method for reducing PCB (printed Circuit Board) out-of-tolerance phenomenon |
| CN112672511A (en) * | 2020-12-09 | 2021-04-16 | 惠州市特创电子科技股份有限公司 | Circuit board without positioning hole and forming method thereof |
| CN113115516A (en) * | 2021-04-06 | 2021-07-13 | 江西旭昇电子有限公司 | Method for processing printed circuit board without positioning hole by adopting numerical control milling machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106550543A (en) | A kind of circuit panel forming method without location hole | |
| CN103874329B (en) | Pcb board V CUT processing methods | |
| CN105338746A (en) | Method for forming circuit board without location holes | |
| CN102223763B (en) | Manufacturing method of connecting sheet circuit board | |
| CN103533741B (en) | A kind of double-side thick copper plate and preparation method thereof | |
| CN103428999B (en) | A kind of pcb board method for processing forming and superimposed sheet | |
| CN104768338A (en) | PCB edge semi-hole metallization manufacturing process | |
| CN104540335A (en) | Method for routing golden finger area in circuit board | |
| CN105392304A (en) | Circuit board press-fit method | |
| CN108818724A (en) | Route panel forming method without location hole in cell board | |
| CN106376186A (en) | Interconnection PCB and manufacturing method thereof capable of improving alignment degree of blind holes and circuit layers | |
| CN105682363B (en) | A kind of production method of the PCB of edges of boards metallization | |
| CN106332456A (en) | Method for improving groove-making burrs before copper plating | |
| CN205946382U (en) | Circuit board shaping location processing structure | |
| WO2020258446A1 (en) | Circuit board punching structure capable of preventing copper sheet from warping | |
| CN109600922A (en) | A kind of special size PCB forming method | |
| CN104427785A (en) | Manufacturing method of blind holes different in pore diameter, and printed circuit board | |
| CN106170181A (en) | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole | |
| WO2021068400A1 (en) | Method for manufacturing ultra-long multilayer board by drilling and positioning | |
| CN203219618U (en) | Tool for milling mini-sized printed circuit board | |
| CN203352964U (en) | Fixture for producing double-sided board | |
| CN105407646A (en) | Process for improving residual copper of stepped groove | |
| CN103025062B (en) | A kind of circuit board wedge angle region forming method | |
| CN108513444A (en) | A kind of overlength plate pattern-producing method | |
| TW201742520A (en) | Board-separation target-drilling and edging method for circuit boards for performing target drilling and edging after cutting and separating a large-area circuit board into a plurality of small-area circuit boards |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170329 |