CN110774351A - Processing method of thick multimode module connector without internal positioning optical mode - Google Patents
Processing method of thick multimode module connector without internal positioning optical mode Download PDFInfo
- Publication number
- CN110774351A CN110774351A CN201910904738.3A CN201910904738A CN110774351A CN 110774351 A CN110774351 A CN 110774351A CN 201910904738 A CN201910904738 A CN 201910904738A CN 110774351 A CN110774351 A CN 110774351A
- Authority
- CN
- China
- Prior art keywords
- routing
- board
- processing
- tolerance
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
- B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Abstract
The invention provides a processing method of a thick multimode module connector without an internal positioning optical mode, which comprises the following steps: s1, designing a thick multilayer primary and secondary board project without an internal positioning optical module connector; s2, designing thick multilayer primary and secondary board routing tapes of the connector of the non-internal positioning optical module; s3, processing the thick multilayer primary and secondary board without the internal positioning optical module connector; and S4, detecting the quality of the thick multilayer connector mother-son board without the inner positioning optical module. According to the technical characteristics of the forming machine, the special process for improving the processing precision and the product quality by using the machine to drive the routing cutters and the groove cutters to replace a die stamping machine and die processing is designed, so that the products can be produced in batch, quickly and safely, the product quality is improved, and the product quality and potential safety hazards caused by die stamping are solved.
Description
Technical Field
The invention particularly relates to a processing method of a thick type multimode module connector without an internal positioning optical mode.
Background
The devices such as digital medical systems, intelligent photoelectric modules, security integrated systems and the like increasingly adopt a modular three-dimensional installation mode. The board has a mother board without inner positioning and various small inner grooves as a substrate, and during welding, the daughter board is inserted into the inner grooves of the mother board, then corresponding bonding pads are welded, and the daughter board is inserted into a socket to connect signals or power lines to form a passage.
Because the product size specification is very little, and conventional size all is below 50mm, and need process the inside groove in the mother board and hold the inserting of daughter board, the inside groove side has the metal pad to be connected through the welding with the daughter board and has strict requirements for product size common customs, and the size exceedes the tolerance range can form the dislocation of pad or leak the solder when welding, and the same region has different tolerance requirements, has further increased the degree of difficulty of processing.
The product is a double-sided board product with a thin thickness in the early stage, the conventional thickness is below 1.6mm, no inner layer circuit pattern exists, the requirements of a user on the appearance size and quality are not high, a die stamping mode is adopted in appearance processing, burrs of the operation mode are large, and the size is within +/-0.15 mm conventionally. With the continuous expansion of the application field of the product density and the function, more and more products are designed to be thicker multilayer boards, special materials or composite materials, the quality requirements of customers on the products are more and more strict, the appearance quality is affected by the irregular edge cutting in a die stamping mode, certain damage is caused to an inner layer circuit, particularly, the customers of the products with impedance lines do not accept the die stamping mode for processing, and part of special material product mother boards can be finished through a counter bore or sink process.
Disclosure of Invention
In view of this, the present invention provides a method for processing a thick type multi-layer connector without an internal positioning optical mode, and particularly provides a method for processing a thick type multi-layer connector without an internal positioning optical mode. The invention starts from the technological capability of the equipment, carries out deeper technical development on the technological capability of the numerical control machine tool equipment, designs a special primary and secondary board processing flow without an inner positioning connector, ensures that products can be produced in batch, quickly and safely, improves the product quality, and solves the product quality and potential safety hazard brought by stamping dies.
The technical scheme of the invention is as follows:
a processing method of a thick multimode module connector without an internal positioning optical mode is characterized by comprising the following steps:
s1, designing a thick multilayer primary and secondary board project without an internal positioning optical module connector;
s2, designing thick multilayer primary and secondary board routing tapes of the connector of the non-internal positioning optical module;
s3, processing the thick multilayer primary and secondary board without the internal positioning optical module connector;
and S4, detecting the quality of the thick multilayer connector mother-son board without the inner positioning optical module.
Further, the specific method of step S1 includes:
s11, engineering design of the daughter board: the width of the clamping groove (the thickness of the PCB daughter board) is designed according to the thickness of the mother board, which is-0.1 mm;
s12, engineering design of a motherboard: the width of the inner groove (the thickness of the PCB daughter board) is designed according to +/-0.1 mm, the length of the inner groove (the length of a clamping groove of the PCB daughter board) is designed according to +0.15mm, a secondary drilling process is added, a pre-counter bore with the diameter of 0.5mm is added at each corner, the short edge of the pre-drilling hole is inwards contracted by 0.2mm, and the outer edge of the pre-drilling hole is ensured to be basically tangent to the groove line;
and S13, designing a sinking groove uncovering gong belt.
Further, the specific method of step S2 includes:
s21, designing a gong and a belt of a daughter board: the routing belts of the daughter boards are designed according to the negative tolerance of engineering data, 2 routing belts are required to be designed for the outer frame due to no internal positioning, the starting point and the end point are both designed on the short edge, 5mm is reserved for the starting point and the end point of the first routing belt to be not broken, and the second routing belt is designed to break the reserved 5 mm;
s22, designing a routing belt of the mother board, wherein A and the length of the inner groove are designed according to a positive tolerance; B. the width of the inner groove is designed according to the conventional tolerance; C. increasing a secondary drilling flow along the length direction of the inner groove, increasing 4 secondary drilling holes with the diameter of 0.5mm at 4 angles according to the length plus a positive tolerance value as a standard point, and performing unilateral retraction of 0.2mm according to requirements to ensure that the outer edge of the pre-drilling hole is basically tangent to the groove line; D. and (3) processing an outer frame: and processing according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
Further, the specific method of step S3 includes:
s31, processing the daughter board: selecting a high-precision routing machine, selecting routing knives according to routing tapes of the daughter boards, installing the routing knives on a main shaft, stopping the machine after completing the first routing tape manufacturing according to engineering data according to negative tolerance setting parameters, milling the remaining 5mm of each unit according to a second routing tape produced after no internal positioning product is glued, and then tearing the glue, thereby completing the whole board manufacturing;
s32, processing of the mother board: a. selecting a high-precision drilling machine, and drilling according to the two drilling files; b. selecting a high-precision routing machine, selecting routing knives according to routing belts of a mother board, installing the routing knives on a main shaft, stopping the machine after finishing manufacturing a first routing belt according to engineering data and positive tolerance setting parameters, and producing a second routing belt according to a conventional tolerance until the whole board is manufactured; c. and milling the outer frame, and processing the outer frame according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
Further, the specific method of step S4 is to draw the sizes of the daughter board and the mother board with calipers and check whether the sizes meet the design requirements.
The invention has the beneficial effects that:
1. the punching die provided by the invention mainly cuts the plate by the impact force of the die, and the rough edge of the side surface is not flat and large. The CNC forming machine is used for processing, namely the circuit board is cut by using the transverse cutting force of the milling cutter, so that the quality of the edge of the circuit board is smoother and more exquisite, and the requirement of the appearance quality of a customer is met.
2. The processing overall dimension of the stamping die is +/-0.15 mm, the processing overall dimension of the stamping die can be controlled to be less than or equal to +/-0.10 mm by adopting a CNC forming machine, the dimension is more accurate, the daughter board can be rapidly inserted into the mother board without the risk of loosening and falling, the risk of solder resist leakage during insertion can be improved, the welding precision of the daughter board and the mother board can be improved, and the welding reliability of products can be improved.
3. Effectively improving the processing capacity: the punching die processing is only suitable for processing double-sided boards with the board thickness of less than 2.0mm, the inner layer circuit patterns of the multilayer boards are not influenced by the milling cutter processed by the CNC forming machine, and PCB products with all thicknesses can be processed.
4. The new process adopts CNC forming machine processing to replace die punching process, and has strong operability. The multi-layer board with different thicknesses can be produced, and the requirements of printed board manufacturers on batch production and safety production are comprehensively met. On the premise that the technology is not limited by people, enterprises must use the high, fine and sharp technology as the latest profit increasing point to obtain more orders and higher profit return.
5. The invention provides a manufacturing method for processing a thick multilayer connector mother-son board without an internal positioning optical module by using a forming machine instead of a stamping die. The new technology designs a special flow for improving the processing precision and the product quality by utilizing a machine to drive a routing tool and a slot tool to replace a die stamping machine and a die for processing according to the technical characteristics of a forming machine.
6. The special process comprises the data design of the secondary member and the primary member, the design of the gong and the sunken groove file and the processing technology of the primary member and the secondary member, is an important factor for ensuring that the primary plate and the secondary plate of the thick multilayer connector of the module without the inner positioning optical module meet the size requirement and the quality standard, and simultaneously ensures the production safety of operators. The requirement of large-scale automatic production of enterprises is met.
7. The invention adopts a new technology to break through the limitations that the original die technology can not produce multi-layer plate products, needs sink products and ultra-thick products, improves the appearance quality and the whole dimension precision of the daughter board and the mother board, and avoids the risk of huge claims when unqualified products are lost to client enterprises.
In particular, the present application relates to technical features of software and circuit programs, and the implementation of functions thereof belongs to the prior art, and the essence of the technical solution of the present application is to improve the composition and connection relationship of hardware parts, and does not relate to the improvement of the software program or the circuit structure itself.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
A processing method of a thick multimode module connector without an internal positioning optical mode is characterized by comprising the following steps:
s1, designing a thick multilayer primary and secondary board project without an internal positioning optical module connector;
s2, designing thick multilayer primary and secondary board routing tapes of the connector of the non-internal positioning optical module;
s3, processing the thick multilayer primary and secondary board without the internal positioning optical module connector;
and S4, detecting the quality of the thick multilayer connector mother-son board without the inner positioning optical module.
Further, the specific method of step S1 includes:
s11, engineering design of the daughter board: the width of the clamping groove (the thickness of the PCB daughter board) is designed according to the thickness of the mother board, which is-0.1 mm;
s12, engineering design of a motherboard: the width of the inner groove (the thickness of the PCB daughter board) is designed according to +/-0.1 mm, the length of the inner groove (the length of a clamping groove of the PCB daughter board) is designed according to +0.15mm, a secondary drilling process is added, a pre-counter bore with the diameter of 0.5mm is added at each corner, the short edge of the pre-drilling hole is inwards contracted by 0.2mm, and the outer edge of the pre-drilling hole is ensured to be basically tangent to the groove line;
and S13, designing a sinking groove uncovering gong belt.
Further, the specific method of step S2 includes:
s21, designing a gong and a belt of a daughter board: the routing belts of the daughter boards are designed according to the negative tolerance of engineering data, 2 routing belts are required to be designed for the outer frame due to no internal positioning, the starting point and the end point are both designed on the short edge, 5mm is reserved for the starting point and the end point of the first routing belt to be not broken, and the second routing belt is designed to break the reserved 5 mm;
s22, designing a routing belt of the mother board, wherein A and the length of the inner groove are designed according to a positive tolerance; B. the width of the inner groove is designed according to the conventional tolerance; C. increasing a secondary drilling flow along the length direction of the inner groove, increasing 4 secondary drilling holes with the diameter of 0.5mm at 4 angles according to the length plus a positive tolerance value as a standard point, and performing unilateral retraction of 0.2mm according to requirements to ensure that the outer edge of the pre-drilling hole is basically tangent to the groove line; D. and (3) processing an outer frame: and processing according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
Further, the specific method of step S3 includes:
s31, processing the daughter board: selecting a high-precision routing machine, selecting routing knives according to routing tapes of the daughter boards, installing the routing knives on a main shaft, stopping the machine after completing the first routing tape manufacturing according to engineering data according to negative tolerance setting parameters, milling the remaining 5mm of each unit according to a second routing tape produced after no internal positioning product is glued, and then tearing the glue, thereby completing the whole board manufacturing;
s32, processing of the mother board: a. selecting a high-precision drilling machine, and drilling according to the two drilling files; b. selecting a high-precision routing machine, selecting routing knives according to routing belts of a mother board, installing the routing knives on a main shaft, stopping the machine after finishing manufacturing a first routing belt according to engineering data and positive tolerance setting parameters, and producing a second routing belt according to a conventional tolerance until the whole board is manufactured; c. and milling the outer frame, and processing the outer frame according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
Further, the specific method of step S4 is to draw the sizes of the daughter board and the mother board with calipers and check whether the sizes meet the design requirements.
Specific processing parameters and detection results of the embodiments 1 to 3 are given for the technical solution of the present application, as shown in the following table.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (5)
1. A processing method of a thick multimode module connector without an internal positioning optical mode is characterized by comprising the following steps:
s1, designing a thick multilayer primary and secondary board project without an internal positioning optical module connector;
s2, designing thick multilayer primary and secondary board routing tapes of the connector of the non-internal positioning optical module;
s3, processing the thick multilayer primary and secondary board without the internal positioning optical module connector;
and S4, detecting the quality of the thick multilayer connector mother-son board without the inner positioning optical module.
2. The method for processing the thick type multimode module connector without the inner positioning light mode according to claim 1, wherein the specific method of the step S1 comprises the following steps:
s11, engineering design of the daughter board: the width of the clamping groove is designed according to the thickness of the mother board, which is-0.1 mm;
s12, engineering design of a motherboard: the width of the inner groove is designed according to +/-0.1 mm, the length of the inner groove is designed according to +0.15mm, a secondary drilling process is added, a pre-counter bore with the diameter of 0.5mm is added at each corner, the short side of the pre-drilling hole is retracted by 0.2mm, and the outer edge of the pre-drilling hole is ensured to be basically tangent to the groove line;
and S13, designing a sinking groove uncovering gong belt.
3. The method for processing the thick type multimode module connector without the inner positioning light mode according to claim 1, wherein the specific method of the step S2 comprises the following steps:
s21, designing a gong and a belt of a daughter board: the routing belts of the daughter boards are designed according to the negative tolerance of engineering data, 2 routing belts are required to be designed for the outer frame due to no internal positioning, the starting point and the end point are both designed on the short edge, 5mm is reserved for the starting point and the end point of the first routing belt to be not broken, and the second routing belt is designed to break the reserved 5 mm;
s22, designing a routing belt of the mother board, wherein A and the length of the inner groove are designed according to a positive tolerance; B. the width of the inner groove is designed according to the conventional tolerance; C. increasing a secondary drilling flow along the length direction of the inner groove, increasing 4 secondary drilling holes with the diameter of 0.5mm at 4 angles according to the length plus a positive tolerance value as a standard point, and performing unilateral retraction of 0.2mm according to requirements to ensure that the outer edge of the pre-drilling hole is basically tangent to the groove line; D. and (3) processing an outer frame: and processing according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
4. The method for processing the thick type multimode module connector without the inner positioning light mode according to claim 1, wherein the specific method of the step S3 comprises the following steps:
s31, processing the daughter board: selecting a high-precision routing machine, selecting routing knives according to routing tapes of the daughter boards, installing the routing knives on a main shaft, stopping the machine after completing the first routing tape manufacturing according to engineering data according to negative tolerance setting parameters, milling the remaining 5mm of each unit according to a second routing tape produced after no internal positioning product is glued, and then tearing the glue, thereby completing the whole board manufacturing;
s32, processing of the mother board: a. selecting a high-precision drilling machine, and drilling according to the two drilling files; b. selecting a high-precision routing machine, selecting routing knives according to routing belts of a mother board, installing the routing knives on a main shaft, stopping the machine after finishing manufacturing a first routing belt according to engineering data and positive tolerance setting parameters, and producing a second routing belt according to a conventional tolerance until the whole board is manufactured; c. and milling the outer frame, and processing the outer frame according to the processing scheme of the daughter board, wherein the tolerance is controlled according to the conventional tolerance of +/-0.1 mm.
5. The method for manufacturing the thick type multimode module connector without the inner positioning optical module according to claim 1, wherein the step S4 is specifically performed by measuring the sizes of the daughter board and the mother board with calipers and checking whether the sizes meet design requirements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904738.3A CN110774351B (en) | 2019-09-24 | 2019-09-24 | Processing method of thick multimode module connector without internal positioning optical mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910904738.3A CN110774351B (en) | 2019-09-24 | 2019-09-24 | Processing method of thick multimode module connector without internal positioning optical mode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110774351A true CN110774351A (en) | 2020-02-11 |
| CN110774351B CN110774351B (en) | 2021-10-12 |
Family
ID=69383790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910904738.3A Active CN110774351B (en) | 2019-09-24 | 2019-09-24 | Processing method of thick multimode module connector without internal positioning optical mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110774351B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4833913A (en) * | 1986-12-05 | 1989-05-30 | Hyprez S.A. | Sample having coated perforations intended to be examined under the microscope and its preparation process, particularly for printed circuit boards |
| CN103200779A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Method for stretching interval of printed circuit boards |
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN106550543A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of circuit panel forming method without location hole |
| CN107907816A (en) * | 2017-10-10 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of LED lamp product of high density without interior location hole opens the quick determination method of short circuit |
-
2019
- 2019-09-24 CN CN201910904738.3A patent/CN110774351B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4833913A (en) * | 1986-12-05 | 1989-05-30 | Hyprez S.A. | Sample having coated perforations intended to be examined under the microscope and its preparation process, particularly for printed circuit boards |
| CN103200779A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Method for stretching interval of printed circuit boards |
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN106550543A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of circuit panel forming method without location hole |
| CN107907816A (en) * | 2017-10-10 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of LED lamp product of high density without interior location hole opens the quick determination method of short circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110774351B (en) | 2021-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103179790B (en) | Mixed pressing printed circuit board and preparation method thereof | |
| CN111148351B (en) | Processing method of 5G small-sized base station power amplifier module PCB with step groove | |
| CN111031682B (en) | Manufacturing method of 5G signal shielding PCB module with latch | |
| CN109168265A (en) | A kind of high-frequency microwave plate high density interconnection board manufacturing method | |
| CN110785011B (en) | Forming processing method of PCB with ultra-long clamping groove | |
| CN102387668A (en) | Cutting machining technology for semi-hole plate provided with copper plating holes at plate edges | |
| CN110418505B (en) | Precise PCB blank plate and processing and forming method thereof | |
| CN106961795B (en) | A kind of PCB forming method | |
| CN107820365B (en) | PCB processing method and PCB | |
| CN110774351B (en) | Processing method of thick multimode module connector without internal positioning optical mode | |
| WO2016149902A1 (en) | Pcb board splitting method and related equipment thereof | |
| CN112867269B (en) | Method for cladding metal on side wall of PCB | |
| US6105246A (en) | Method of making a circuit board having burr free castellated plated through holes | |
| CN109246927B (en) | V-cutting method of finished PCB | |
| CN111093329B (en) | Small-size stepped PCB forming method | |
| JP2006281323A (en) | Burr preventive punch | |
| CN111356305B (en) | Processing technology for forming V-CUT | |
| CN204545651U (en) | A kind of wiring board welding localization tool | |
| CN114211564A (en) | Machining method of square slotted hole and drilling machine | |
| CN112654153A (en) | Processing method of high-precision light wave scale PCB of measurement and control equipment | |
| CN213426554U (en) | PCB board with flange connection structure | |
| CN111615265A (en) | Blind hole processing method of LCP multilayer board | |
| CN203518882U (en) | Jig for testing printed circuit board forming fishing missing | |
| CN113286451B (en) | Manufacturing method of laminated blind guiding hole of HDI multilayer circuit board | |
| CN215898108U (en) | Overlong microwave printed board with welding holes at bottom of blind groove |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |