WO2016149902A1 - Pcb board splitting method and related equipment thereof - Google Patents

Pcb board splitting method and related equipment thereof Download PDF

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Publication number
WO2016149902A1
WO2016149902A1 PCT/CN2015/074927 CN2015074927W WO2016149902A1 WO 2016149902 A1 WO2016149902 A1 WO 2016149902A1 CN 2015074927 W CN2015074927 W CN 2015074927W WO 2016149902 A1 WO2016149902 A1 WO 2016149902A1
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Prior art keywords
pcb
beveled
tooling
wall
board
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PCT/CN2015/074927
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French (fr)
Chinese (zh)
Inventor
徐波
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580028598.8A priority Critical patent/CN106465544B/en
Priority to PCT/CN2015/074927 priority patent/WO2016149902A1/en
Publication of WO2016149902A1 publication Critical patent/WO2016149902A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to the field of circuit board technology, and in particular to a PCB board method and related equipment.
  • the module products adopt the printed circuit board (PCB) solid connection design. Since the module products often need secondary assembly, under the premise of fierce competition of electronic products, the customer's space requirements are higher and higher, so The precision of the sub-board precision of the module products is also getting higher and higher. The customer requires that the PCB sub-board precision of the module product be controlled within 0.15mm. Since the thickness of the industrial and consumer module PCB is 0.8mm or 1.0mm, the thickness of the on-board module PCB is 1.2mm. Or 1.6mm, the laser sub-board process can not be applied to the module product, in the module product sub-board operation, it is affected by factors such as the board precision PCB processing precision (0.15mm tolerance) and the tooling wall processing precision (0.08mm tolerance).
  • PCB printed circuit board
  • Module products can not design positioning holes. In this case, we can only rely solely on the limit of tooling wall. At present, our PCB board and sub-board tooling walls are right angle design, and the module product board accuracy is difficult to meet customer requirements of 0.15. Mm, module products often appear in the verification process of the PCB sub-board accuracy does not meet the standards affect the product's assembly and reliability.
  • the existing PCB sub-board technical solution is: affixing adhesive tape on the tooling wall, using the sub-board equipment for the sub-board operation, inspecting the products obtained after the operation, and processing the products that do not meet the specifications by using the boring method. .
  • Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
  • a first aspect of the present invention provides a printed circuit board PCB design method, including:
  • the PCB board is obtained by cutting the beveled PCB board with a PCB board machine.
  • An angle of the first oblique angle formed by the first side surface and the vertical direction is between 5 degrees and 10 degrees;
  • the angle of the second bevel formed by the second side and the vertical direction is between 5 and 10 degrees.
  • the first oblique angle is equal to the second oblique angle.
  • the cross section of the beveled PCB panel is an inverted trapezoid, and the oblique side of the cross section of the beveled PCB panel corresponds to the first side or the second side.
  • the first embodiment of the first aspect of the present invention, the second embodiment of the first aspect of the present invention, or the third embodiment of the first aspect of the present invention, in the fourth embodiment of the first aspect of the present invention is referred to the first aspect of the present invention.
  • the side of the tooling wall for abutting the first side or the second side is a slope, and the angle of the slope formed by the slope with the vertical direction is between 1.5 and 2.5 degrees.
  • the tooling wall has a trapezoidal cross section.
  • the placing the beveled PCB panel between the at least two tooling walls on the PCB sub-tooling comprises:
  • the angled milling cutter is used to cut the edge of the ordinary PCB, and the first side and the second side of the ordinary PCB are processed into a slope to obtain the inclined PCB.
  • the angle cutter has an edge angle of between 5 and 10 degrees.
  • the third side of the beveled PCB panel and the fourth side opposite to the third side are both inclined surfaces, and the inclined PCB board is placed between at least two tooling walls on the PCB boarding machine ,include:
  • the third tooling wall and the fourth tooling wall are two of the at least two tooling walls;
  • the first, second, third and fourth tooling walls enclose a rectangle having the same shape as the beveled PCB panel.
  • the thickness of the beveled PCB panel is between 0.8 mm and 1.6 mm.
  • the beveled PCB panel is placed between the at least two tooling walls on the PCB sub-tool, the first side of the beveled PCB panel and the second side opposite to the first side are beveled, first The side abutting is on the first tooling wall, the second side is abutting on the second tooling wall, and the first tooling wall and the second tooling wall are two of the at least two tooling walls, using the PCB.
  • the board machine cuts the PCB board to obtain the PCB board. Since the side of the slope PCB board is a slope, in the process of cutting the PCB board by the PCB board machine, the error in the cutting process can be effectively eliminated to the accuracy of the PCB board. The impact increases the efficiency of production and improves the reliability of the product.
  • FIG. 1 is a flowchart of a PCB design method according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a beveled PCB panel according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of cutting a beveled PCB panel by using a PCB splitter according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a PCB board obtained by cutting a beveled PCB board using a PCB boarding machine according to an embodiment of the present invention.
  • Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
  • an embodiment of the present invention improves a PCB design method, which may include:
  • a beveled PCB panel that needs to be divided is provided.
  • the beveled PCB panel 201 is obtained by cutting the ordinary PCB panel 20 by the angle milling cutter 202, and the angle of the blade of the angle milling cutter 20 is inclined.
  • the side surface of the beveled PCB panel 201 can be obtained as an oblique angle, the angle of the oblique angle is between 5 and 10 degrees, and the oblique side of the inverted ladder pattern of the beveled PCB panel 201 is 2013 and
  • the oblique side 2014 corresponds to the first side or the second side of the beveled PCB panel 201
  • L is the difference between the length of the lower base 2011 and the length of the upper base 2012 in the inverted trapezoidal figure of the cross section of the beveled PCB panel 201, L
  • the relationship between the thickness of the inclined PCB board and the inclined surface is shown in Table 1.
  • the general PCB processing tolerance is 0.15mm, the angle of the side of the inclined PCB board is 5 degrees to 10 degrees, and the thickness of the inclined PCB board is When 0.8mm, the value of L is 0.07mm ⁇ 0.148mm, which can reduce the influence of PCB processing tolerance on the accuracy of product board. When the thickness of the inclined PCB board is 1.0mm, the value of L is 0.0875mm ⁇ 0.176mm, which can reduce the PCB.
  • the processing tolerance affects the accuracy of the product board; when the thickness of the inclined PCB board is 1.2mm, the value of L is 0.105 ⁇ 0. .211mm can overcome the influence of PCB processing tolerance on the accuracy of product sub-board. When the thickness of the inclined PCB board is 1.6mm, the value of L is 0.14 ⁇ 0.281mm, which can overcome the influence of PCB processing tolerance on the accuracy of product sub-board.
  • the beveled PCB panel 301 is placed between the two tooling walls on the PCB sub-tool 30, and the first side 304 of the beveled PCB panel 301 is abutted on the first tooling wall 302.
  • the second side surface 305 is abutted on the second tooling wall 303, and the upper surface of the inclined PCB board is larger than the small surface, and the first tooling wall 302 and the second tooling wall 303 are used to abut the first side 304 or the first
  • the side surface of the two side faces 305 is a sloped surface.
  • the angle of the oblique angle formed by the inclined surface and the vertical direction is between 1.5 degrees and 2.5 degrees.
  • the cross section of the first tooling wall 302 and the second tooling wall 303 is trapezoidal.
  • the inclined surface PCB The third side of the panel 301 and the fourth side opposite to the third side may be respectively supported by the third tooling wall and the fourth tooling wall, the first tooling wall 302, the second tooling wall 303, and the The three-piece retaining wall and the fourth tooling retaining wall enclose a rectangle having the same shape as the beveled PCB panel.
  • the PCB board machine cuts the inclined PCB board to obtain the PCB board.
  • the blade 306 of the PCB splitter performs a cutting operation on the inclined PCB board 301, and the four mutually independent product areas 401 on the inclined PCB board 301 are cut.
  • the four PCB boards 401 are obtained.
  • the inclined PCB board may have multiple independent product areas, and the shape of the product area is not limited herein.
  • the side surface of the inclined PCB board is a sloped surface, and the angle of the inclined surface is between 5 degrees and 10 degrees.
  • the board thickness of the inclined PCB board is combined.
  • the angle of the bevel the value of the tolerance L of the lower surface of the beveled PCB board can be obtained, according to Relevant experience of the industry, when the value of L is greater than the PCB processing tolerance value, the cutting error of the PCB boarding machine can be effectively eliminated, so that the accuracy of the PCB board is not affected, the production efficiency is improved, and the product is improved. reliability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Milling, Drilling, And Turning Of Wood (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

A PCB board splitting method, comprising: placing inclined surface PCB splicing boards (201, 301) between at least two tool retaining walls on a PCB board splitting tool (30), wherein the first side surfaces (304) and the second side surfaces (305) opposite to the first side surfaces (304) of the inclined surface PCB splicing boards (201, 301) are all inclined surfaces, the first side surfaces (304) are abutted to the first tool retaining wall (302), the second side surfaces (305) are abutted to the second tool retaining wall (303), and the first tool retaining wall (302) and the second tool retaining wall (303) are two of at least two tool retaining walls (303); and cut the inclined surface PCB splicing boards (201, 301) by using a PCB board splitting machine to obtain PCB single boards (401). The method is used for solving the problems in the traditional PCB board splitting technology of low production efficiency and low product reliability caused by using an adhesive tape for sticking and a grater to carry out polishing.

Description

PCB分板方法及其相关设备PCB sub-board method and related equipment 技术领域Technical field
本发明涉及电路板技术领域,具体涉及一种PCB分板方法及其相关设备。The present invention relates to the field of circuit board technology, and in particular to a PCB board method and related equipment.
背景技术Background technique
目前模块产品是采用印制电路板(Printed Circuit Board,PCB)实连接设计,由于模块产品往往需要二次组装,在电子产品激烈竞争的前提下,客户对空间的要求越来越高,因此对模块产品的分板精度要求也越来越高,客户要求模块产品PCB分板精度控制在0.15mm以内,由于工业类和消费类模块PCB厚度为0.8mm或1.0mm,车载模块PCB厚度为1.2mm或1.6mm,激光分板工艺无法应用于模块产品,在模块产品分板作业时,受到分板精度PCB加工精度(0.15mm公差)、工装挡墙加工精度(0.08mm公差)等因素影响,此外模块产品无法设计定位孔,这种情况下只能完全依靠工装挡墙限位,而目前我们的PCB板边、分板工装挡墙都是直角设计,模块产品分板精度难以达到客户要求的0.15mm,模块产品在验证过程中经常出现PCB分板精度不达标影响产品的可组装性、可靠性的案例。At present, the module products adopt the printed circuit board (PCB) solid connection design. Since the module products often need secondary assembly, under the premise of fierce competition of electronic products, the customer's space requirements are higher and higher, so The precision of the sub-board precision of the module products is also getting higher and higher. The customer requires that the PCB sub-board precision of the module product be controlled within 0.15mm. Since the thickness of the industrial and consumer module PCB is 0.8mm or 1.0mm, the thickness of the on-board module PCB is 1.2mm. Or 1.6mm, the laser sub-board process can not be applied to the module product, in the module product sub-board operation, it is affected by factors such as the board precision PCB processing precision (0.15mm tolerance) and the tooling wall processing precision (0.08mm tolerance). Module products can not design positioning holes. In this case, we can only rely solely on the limit of tooling wall. At present, our PCB board and sub-board tooling walls are right angle design, and the module product board accuracy is difficult to meet customer requirements of 0.15. Mm, module products often appear in the verification process of the PCB sub-board accuracy does not meet the standards affect the product's assembly and reliability.
现有的PCB分板技术方案为:在工装挡墙上贴胶纸,使用分板设备进行分板作业,将作业后得到的产品进行检验,对不符合规格的产品使用锉刀打磨的方法进行加工。The existing PCB sub-board technical solution is: affixing adhesive tape on the tooling wall, using the sub-board equipment for the sub-board operation, inspecting the products obtained after the operation, and processing the products that do not meet the specifications by using the boring method. .
但是,在工装挡墙上贴胶纸和对不符合规格的产品使用锉刀打磨的方法进行加工都需要耗时,降低了生产效率,另外,贴胶纸和锉刀打磨的方法在具体实施的过程中涉及到规范和程度的问题,使得产品可靠性低。However, it is time-consuming to reduce the production efficiency by affixing adhesive tape on the work lock wall and using the boring method for products that do not meet the specifications. In addition, the method of affixing paper and boring is in the process of implementation. Issues related to specifications and levels make product reliability low.
发明内容Summary of the invention
本发明实施例提供了一种PCB设计方法,用于解决现有的PCB分板技术中使用贴胶纸和锉刀打磨,导致的生产效率低、产品可靠性低的问题。Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
本发明第一方面提供一种印刷电路板PCB设计方法,包括:A first aspect of the present invention provides a printed circuit board PCB design method, including:
将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间,所述斜面PCB拼板的第一侧面以及与所述第一侧面相对的第二侧面均为斜面,所述第 一侧面抵顶在第一工装挡墙上,所述第二侧面抵顶在第二工装挡墙上,所述第一工装挡墙和所述第二工装挡墙是所述至少两个工装挡墙中的两个;Placing a beveled PCB panel between at least two tooling walls on the PCB sub-tool, the first side of the beveled PCB panel and the second side opposite the first side are both beveled, First One side abuts against the first work load wall, the second side abuts against the second work block wall, and the first work block wall and the second work block wall are the at least two work blocks Two in the wall;
利用PCB分板机切割所述斜面PCB拼板得到PCB单板。The PCB board is obtained by cutting the beveled PCB board with a PCB board machine.
结合本发明第一方面,本发明第一方面第一实施方式中,With reference to the first aspect of the present invention, in the first embodiment of the first aspect of the present invention,
所述第一侧面与垂直方向形成的第一斜角的角度在5度至10度之间;An angle of the first oblique angle formed by the first side surface and the vertical direction is between 5 degrees and 10 degrees;
所述第二侧面与垂直方向形成的第二斜角的角度在5度至10度之间。The angle of the second bevel formed by the second side and the vertical direction is between 5 and 10 degrees.
结合本发明第一方面第一实施方式,本发明第一方面第二实施方式中,With reference to the first embodiment of the first aspect of the present invention, in the second embodiment of the first aspect of the present invention,
所述第一斜角与所述第二斜角相等。The first oblique angle is equal to the second oblique angle.
结合本发明第一方面第二实施方式,本发明第一方面第三实施方式中,With reference to the second embodiment of the first aspect of the present invention, in the third embodiment of the first aspect of the present invention,
所述斜面PCB拼板的横截面为倒置梯形,所述斜面PCB拼板的横截面的斜边对应于所述第一侧面或所述第二侧面。The cross section of the beveled PCB panel is an inverted trapezoid, and the oblique side of the cross section of the beveled PCB panel corresponds to the first side or the second side.
结合本发明第一方面、本发明第一方面第一实施方式、本发明第一方面第二实施方式或本发明第一方面第三实施方式,本发明第一方面第四实施方式中,With reference to the first aspect of the present invention, the first embodiment of the first aspect of the present invention, the second embodiment of the first aspect of the present invention, or the third embodiment of the first aspect of the present invention, in the fourth embodiment of the first aspect of the present invention,
所述工装挡墙的用于抵顶所述第一侧面或者第二侧面的侧面是斜面,所述斜面与垂直方向形成的斜角的角度在1.5至2.5度之间。The side of the tooling wall for abutting the first side or the second side is a slope, and the angle of the slope formed by the slope with the vertical direction is between 1.5 and 2.5 degrees.
结合本发明第一方面第四实施方式,本发明第一方面第五实施方式中,With reference to the fourth embodiment of the first aspect of the present invention, in the fifth embodiment of the first aspect of the present invention,
所述工装挡墙的横截面为梯形。The tooling wall has a trapezoidal cross section.
结合本发明第一方面,本发明第一方面第六实施方式中,所述将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间之前包括:In conjunction with the first aspect of the present invention, in the sixth embodiment of the first aspect of the present invention, the placing the beveled PCB panel between the at least two tooling walls on the PCB sub-tooling comprises:
利用角度铣刀对普通PCB拼板切割板边,将所述普通PCB拼板的第一侧面以及第二侧面加工为斜面,得到所述斜面PCB拼板。The angled milling cutter is used to cut the edge of the ordinary PCB, and the first side and the second side of the ordinary PCB are processed into a slope to obtain the inclined PCB.
结合本发明第一方面第六实施方式,本发明第一方面第七实施方式中,With reference to the sixth embodiment of the first aspect of the present invention, in the seventh embodiment of the first aspect of the present invention,
所述角度铣刀的刀刃倾斜角度在5度至10度之间。The angle cutter has an edge angle of between 5 and 10 degrees.
结合本发明第一方面,本发明第一方面第八实施方式中,With reference to the first aspect of the present invention, in the eighth embodiment of the first aspect of the present invention,
所述斜面PCB拼板的第三侧面以及与所述第三侧面相对的第四侧面均为斜面,所述将所述斜面PCB拼板放置在PCB分板机上的至少两个工装挡墙之间,包括:The third side of the beveled PCB panel and the fourth side opposite to the third side are both inclined surfaces, and the inclined PCB board is placed between at least two tooling walls on the PCB boarding machine ,include:
将所述第三侧面抵顶在第三工装挡墙上,将所述第四侧面抵顶在第四工装 挡墙上,所述第三工装挡墙和所述第四工装挡墙是所述至少两个工装挡墙中的两个;Abutting the third side on the third working block wall, and the fourth side is abutting in the fourth tooling Retaining wall, the third tooling wall and the fourth tooling wall are two of the at least two tooling walls;
所述第一、第二、第三和第四工装挡墙围成与所述斜面PCB拼板形状相同的矩形。The first, second, third and fourth tooling walls enclose a rectangle having the same shape as the beveled PCB panel.
结合本发明第一方面,本发明第一方面第九实施方式中,With reference to the first aspect of the present invention, in a ninth embodiment of the first aspect of the present invention,
所述斜面PCB拼板的厚度在0.8毫米到1.6毫米之间。The thickness of the beveled PCB panel is between 0.8 mm and 1.6 mm.
由上可见,将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间,斜面PCB拼板的第一侧面以及与第一侧面相对的第二侧面均为斜面,第一侧面抵顶在第一工装挡墙上,第二侧面抵顶在第二工装挡墙上,第一工装挡墙和第二工装挡墙是至少两个工装挡墙中的两个,利用PCB分板机切割PCB拼板得到PCB单板,由于斜面PCB拼板的侧面是斜面,在PCB分板机切割得到PCB单板的过程中,可以有效的消除切割过程中的误差对PCB单板精度的影响,提高了生产的效率,提高了产品的可靠性。As can be seen from the above, the beveled PCB panel is placed between the at least two tooling walls on the PCB sub-tool, the first side of the beveled PCB panel and the second side opposite to the first side are beveled, first The side abutting is on the first tooling wall, the second side is abutting on the second tooling wall, and the first tooling wall and the second tooling wall are two of the at least two tooling walls, using the PCB. The board machine cuts the PCB board to obtain the PCB board. Since the side of the slope PCB board is a slope, in the process of cutting the PCB board by the PCB board machine, the error in the cutting process can be effectively eliminated to the accuracy of the PCB board. The impact increases the efficiency of production and improves the reliability of the product.
附图说明DRAWINGS
为了更清楚地说明本发明实施例技术方案,下面将对实施例和现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments and the prior art description will be briefly described below. Obviously, the drawings in the following description are only some implementations of the present invention. For example, other drawings may be obtained from those skilled in the art without any inventive effort.
图1为本发明实施例提供一种PCB设计方法的流程图;FIG. 1 is a flowchart of a PCB design method according to an embodiment of the present invention;
图2为本发明实施例斜面PCB拼板的示意图;2 is a schematic view of a beveled PCB panel according to an embodiment of the present invention;
图3为本发明实施例利用PCB分板机切割斜面PCB拼板的示意图;3 is a schematic diagram of cutting a beveled PCB panel by using a PCB splitter according to an embodiment of the present invention;
图4为本发明实施例利用PCB分板机切割斜面PCB拼板得到PCB单板的示意图。FIG. 4 is a schematic diagram of a PCB board obtained by cutting a beveled PCB board using a PCB boarding machine according to an embodiment of the present invention.
具体实施方式detailed description
本发明实施例提供了一种PCB设计方法,用于解决现有的PCB分板技术中使用贴胶纸和锉刀打磨,导致的生产效率低、产品可靠性低的问题。 Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
为了使本技术领域的人员更好地理解本发明方案,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is an embodiment of the invention, but not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of the present invention.
下面通过具体实施例,分别进行详细说明。The detailed description will be respectively made below through specific embodiments.
请参阅图1,本发明实施例提高一种PCB设计方法,可包括:Referring to FIG. 1 , an embodiment of the present invention improves a PCB design method, which may include:
101、将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间;101. Place a beveled PCB panel between at least two tooling retaining walls on the PCB sub-tooling tool;
本发明实施例中,提供需要进行分割的斜面PCB拼板,如图2所示,该斜面PCB拼板201由角度铣刀202切割普通PCB拼板20得到,角度铣刀20的刀刃倾斜的角度在5度至10度之间,可以得到斜面PCB拼板201的侧面为斜角,斜角的角度在5度至10度之间,斜面PCB拼板201的倒置梯形图形中的斜边2013和斜边2014对应于斜面PCB拼板201的第一侧面或第二侧面,L为斜面PCB拼板201的横截面的倒置梯形图形中下底2011的长度与上底2012的长度的差值,L、斜面PCB拼板板厚和斜面之间的关系如表1所示,一般PCB加工公差的要求是0.15mm,斜面PCB拼板侧面的角度为5度~10度,斜面PCB拼板板厚为0.8mm时,L的值为0.07mm~0.148mm,可以减少PCB加工公差对产品分板精度影响;斜面PCB拼板板厚为1.0mm时,L的值为0.0875mm~0.176mm,可以减少PCB加工公差对产品分板精度影响;斜面PCB拼板板厚为1.2mm时,L的值为0.105~0.211mm,可以克服PCB加工公差对产品分板精度影响,斜面PCB拼板板厚为1.6mm时,L的值为0.14~0.281mm,可以克服PCB加工公差对产品分板精度影响。In the embodiment of the present invention, a beveled PCB panel that needs to be divided is provided. As shown in FIG. 2, the beveled PCB panel 201 is obtained by cutting the ordinary PCB panel 20 by the angle milling cutter 202, and the angle of the blade of the angle milling cutter 20 is inclined. Between 5 degrees and 10 degrees, the side surface of the beveled PCB panel 201 can be obtained as an oblique angle, the angle of the oblique angle is between 5 and 10 degrees, and the oblique side of the inverted ladder pattern of the beveled PCB panel 201 is 2013 and The oblique side 2014 corresponds to the first side or the second side of the beveled PCB panel 201, and L is the difference between the length of the lower base 2011 and the length of the upper base 2012 in the inverted trapezoidal figure of the cross section of the beveled PCB panel 201, L The relationship between the thickness of the inclined PCB board and the inclined surface is shown in Table 1. The general PCB processing tolerance is 0.15mm, the angle of the side of the inclined PCB board is 5 degrees to 10 degrees, and the thickness of the inclined PCB board is When 0.8mm, the value of L is 0.07mm~0.148mm, which can reduce the influence of PCB processing tolerance on the accuracy of product board. When the thickness of the inclined PCB board is 1.0mm, the value of L is 0.0875mm~0.176mm, which can reduce the PCB. The processing tolerance affects the accuracy of the product board; when the thickness of the inclined PCB board is 1.2mm, the value of L is 0.105~0. .211mm can overcome the influence of PCB processing tolerance on the accuracy of product sub-board. When the thickness of the inclined PCB board is 1.6mm, the value of L is 0.14~0.281mm, which can overcome the influence of PCB processing tolerance on the accuracy of product sub-board.
表1 Table 1
Figure PCTCN2015074927-appb-000001
Figure PCTCN2015074927-appb-000001
如图3所示,将斜面PCB拼板301放置在PCB分板工装30上的两个工装挡墙之间,斜面PCB拼板301的第一侧面304抵顶在第一工装挡墙302上,第二侧面305抵顶在第二工装挡墙303上,斜面PCB拼板的上表面大于小表面,第一工装挡墙302和第二工装挡墙303的用于抵顶第一侧面304或第二侧面305的侧面是斜面,斜面与垂直方向形成的斜角的角度在1.5度~2.5度之间,第一工装挡墙302和第二工装挡墙303的横截面为梯形,另外,斜面PCB拼板301的第三侧面和与第三侧面相对的第四侧面可以分别被第三工装挡墙和第四工装挡墙抵顶住,第一工装挡墙302、第二工装挡墙303、第三工装挡墙和第四工装挡墙围成与斜面PCB拼板形状相同的矩形。As shown in FIG. 3, the beveled PCB panel 301 is placed between the two tooling walls on the PCB sub-tool 30, and the first side 304 of the beveled PCB panel 301 is abutted on the first tooling wall 302. The second side surface 305 is abutted on the second tooling wall 303, and the upper surface of the inclined PCB board is larger than the small surface, and the first tooling wall 302 and the second tooling wall 303 are used to abut the first side 304 or the first The side surface of the two side faces 305 is a sloped surface. The angle of the oblique angle formed by the inclined surface and the vertical direction is between 1.5 degrees and 2.5 degrees. The cross section of the first tooling wall 302 and the second tooling wall 303 is trapezoidal. In addition, the inclined surface PCB The third side of the panel 301 and the fourth side opposite to the third side may be respectively supported by the third tooling wall and the fourth tooling wall, the first tooling wall 302, the second tooling wall 303, and the The three-piece retaining wall and the fourth tooling retaining wall enclose a rectangle having the same shape as the beveled PCB panel.
102、PCB分板机切割斜面PCB拼板得到PCB单板。102. The PCB board machine cuts the inclined PCB board to obtain the PCB board.
本发明实施例中,如图3和图4所示,PCB分板机的刀片306对斜面PCB拼板301进行切割操作,将斜面PCB拼板301上的四个相互独立的产品区域401切割下来,得到四块PCB单板401,需要说明的是,斜面PCB拼板上可以有多块相互独立的产品区域,产品区域的形状此处不做限定。In the embodiment of the present invention, as shown in FIG. 3 and FIG. 4, the blade 306 of the PCB splitter performs a cutting operation on the inclined PCB board 301, and the four mutually independent product areas 401 on the inclined PCB board 301 are cut. The four PCB boards 401 are obtained. It should be noted that the inclined PCB board may have multiple independent product areas, and the shape of the product area is not limited herein.
由上可见,斜面PCB拼板的侧面为斜面,斜面的角度在5度~10度之间,在PCB分板机切割斜面PCB拼板得到PCB单板的过程中,结合斜面PCB板的板厚和斜面的角度,可以得到斜面PCB拼板上下表面的公差L的值,根据 业内人员的相关经验,L的值大于PCB加工公差值时,PCB分板机的切割误差可以有效的消除,从而使得PCB单板的精度不受影响,提高了生产的效率,提高了产品的可靠性。It can be seen from the above that the side surface of the inclined PCB board is a sloped surface, and the angle of the inclined surface is between 5 degrees and 10 degrees. In the process of cutting the inclined surface PCB board to obtain the PCB single board, the board thickness of the inclined PCB board is combined. And the angle of the bevel, the value of the tolerance L of the lower surface of the beveled PCB board can be obtained, according to Relevant experience of the industry, when the value of L is greater than the PCB processing tolerance value, the cutting error of the PCB boarding machine can be effectively eliminated, so that the accuracy of the PCB board is not affected, the production efficiency is improved, and the product is improved. reliability.
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详细描述的部分,可以参见其它实施例的相关描述。In the above embodiments, the descriptions of the various embodiments are different, and the parts that are not described in detail in a certain embodiment can be referred to the related description of other embodiments.
以上对本发明实施例所提供的电路板的曝光显影方法进行了详细介绍,但以上实施例的说明只是用于帮助理解本发明的方法及其核心思想,不应理解为对本发明的限制。本技术领域的技术人员,依据本发明的思想,在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。 The method of the exposure and development of the circuit board provided by the embodiment of the present invention has been described in detail above, but the description of the above embodiments is only for helping to understand the method and the core idea of the present invention, and should not be construed as limiting the present invention. Those skilled in the art, in light of the spirit of the present invention, are susceptible to variations and substitutions within the scope of the present invention.

Claims (10)

  1. 一种印刷电路板PCB设计方法,其特征在于,包括:A printed circuit board PCB design method, comprising:
    将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间,所述斜面PCB拼板的第一侧面以及与所述第一侧面相对的第二侧面均为斜面,所述第一侧面抵顶在第一工装挡墙上,所述第二侧面抵顶在第二工装挡墙上,所述第一工装挡墙和所述第二工装挡墙是所述至少两个工装挡墙中的两个;Placing a beveled PCB panel between at least two tooling walls on the PCB sub-tool, the first side of the beveled PCB panel and the second side opposite the first side are both beveled, The first side abuts against the first work load wall, the second side abuts against the second work block wall, and the first work block wall and the second work block wall are the at least two tool sets Two of the retaining walls;
    利用PCB分板机切割所述斜面PCB拼板得到PCB单板。The PCB board is obtained by cutting the beveled PCB board with a PCB board machine.
  2. 根据权利要求1所述的方法,其特征在于,The method of claim 1 wherein
    所述第一侧面与垂直方向形成的第一斜角的角度在5度至10度之间;An angle of the first oblique angle formed by the first side surface and the vertical direction is between 5 degrees and 10 degrees;
    所述第二侧面与垂直方向形成的第二斜角的角度在5度至10度之间。The angle of the second bevel formed by the second side and the vertical direction is between 5 and 10 degrees.
  3. 根据权利要求2所述的方法,其特征在于,The method of claim 2 wherein:
    所述第一斜角与所述第二斜角相等。The first oblique angle is equal to the second oblique angle.
  4. 根据权利要求3所述的方法,其特征在于,The method of claim 3 wherein:
    所述斜面PCB拼板的横截面为倒置梯形,所述斜面PCB拼板的横截面的斜边对应于所述第一侧面或所述第二侧面。The cross section of the beveled PCB panel is an inverted trapezoid, and the oblique side of the cross section of the beveled PCB panel corresponds to the first side or the second side.
  5. 根据权利要求1至4中任一所述的方法,其特征在于,A method according to any one of claims 1 to 4, characterized in that
    所述工装挡墙的用于抵顶所述第一侧面或者第二侧面的侧面是斜面,所述斜面与垂直方向形成的斜角的角度在1.5至2.5度之间。The side of the tooling wall for abutting the first side or the second side is a slope, and the angle of the slope formed by the slope with the vertical direction is between 1.5 and 2.5 degrees.
  6. 根据权利要求5所述的方法,其特征在于,The method of claim 5 wherein:
    所述工装挡墙的横截面为梯形。The tooling wall has a trapezoidal cross section.
  7. 根据权利要求1所述的方法,其特征在于,所述将斜面PCB拼板放置在PCB分板工装上的至少两个工装挡墙之间之前包括:The method of claim 1 wherein said placing the beveled PCB panel between at least two tooling walls on the PCB sub-tooling comprises:
    利用角度铣刀对普通PCB拼板切割板边,将所述普通PCB拼板的第一侧面以及第二侧面加工为斜面,得到所述斜面PCB拼板。The angled milling cutter is used to cut the edge of the ordinary PCB, and the first side and the second side of the ordinary PCB are processed into a slope to obtain the inclined PCB.
  8. 根据权利要求7所述的方法,其特征在于,The method of claim 7 wherein:
    所述角度铣刀的刀刃倾斜角度在5度至10度之间。The angle cutter has an edge angle of between 5 and 10 degrees.
  9. 根据权利要求1所述的方法,其特征在于,The method of claim 1 wherein
    所述斜面PCB拼板的第三侧面以及与所述第三侧面相对的第四侧面均为斜面,所述将所述斜面PCB拼板放置在PCB分板机上的至少两个工装挡墙之 间,包括:The third side of the beveled PCB panel and the fourth side opposite to the third side are both inclined surfaces, and the inclined PCB board is placed on at least two tooling walls on the PCB boarding machine Between, including:
    将所述第三侧面抵顶在第三工装挡墙上,将所述第四侧面抵顶在第四工装挡墙上,所述第三工装挡墙和所述第四工装挡墙是所述至少两个工装挡墙中的两个;Abutting the third side on the third working block wall, and the fourth side is abutting on the fourth working block wall, wherein the third working block wall and the fourth tooling retaining wall are Two of at least two tooling walls;
    所述第一、第二、第三和第四工装挡墙围成与所述斜面PCB拼板形状相同的矩形。The first, second, third and fourth tooling walls enclose a rectangle having the same shape as the beveled PCB panel.
  10. 根据权利要求1所述的方法,其特征在于,The method of claim 1 wherein
    所述斜面PCB拼板的厚度在0.8毫米到1.6毫米之间。 The thickness of the beveled PCB panel is between 0.8 mm and 1.6 mm.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107660071A (en) * 2017-10-30 2018-02-02 广东智科电子股份有限公司 A kind of PCB jigsaw
CN108601213A (en) * 2018-06-13 2018-09-28 深圳市诚志电路有限公司 A kind of PCB jigsaw and gong plate method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109561593A (en) * 2018-12-26 2019-04-02 苏州光韵达自动化设备有限公司 A kind of automatic board separator

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324253A (en) * 2002-04-30 2003-11-14 Elna Co Ltd Printed board and its manufacturing method
CN102036493A (en) * 2010-12-29 2011-04-27 上海华勤通讯技术有限公司 Method for effectively utilizing leftover materials of jointing PCB board
CN102438399A (en) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
CN102869195A (en) * 2012-09-25 2013-01-09 青岛海信电器股份有限公司 Method and device for batch production of printed circuit board
CN103547077A (en) * 2013-10-25 2014-01-29 深圳雷柏科技股份有限公司 Clamping mechanism with multiple chucks and PCB testing and distributing production line
CN203523148U (en) * 2013-10-18 2014-04-02 北大方正集团有限公司 PCB (printed circuit board) jointed plate
CN204157166U (en) * 2014-08-13 2015-02-11 中国船舶重工集团公司第七〇九研究所 A kind of assembled circuit board dividing device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117290A (en) * 1997-06-27 1999-01-22 Fuji Photo Film Co Ltd Multi-layer substrate and manufacture of the same
JP2002216872A (en) * 2001-01-16 2002-08-02 Seiko Instruments Inc Print head for ink jet
CN1258957C (en) * 2003-09-17 2006-06-07 建汉科技股份有限公司 V type slot circuit board
JP2005223266A (en) * 2004-02-09 2005-08-18 Sharp Corp Manufacturing method of through-hole in end face of board
JP2008034636A (en) * 2006-07-28 2008-02-14 Orion Denki Kk Printed circuit board base material, and method for manufacturing the same
CN102528840B (en) * 2010-12-16 2014-11-05 百硕电脑(苏州)有限公司 Semi-solidified sheet cutting method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324253A (en) * 2002-04-30 2003-11-14 Elna Co Ltd Printed board and its manufacturing method
CN102036493A (en) * 2010-12-29 2011-04-27 上海华勤通讯技术有限公司 Method for effectively utilizing leftover materials of jointing PCB board
CN102438399A (en) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
CN102869195A (en) * 2012-09-25 2013-01-09 青岛海信电器股份有限公司 Method and device for batch production of printed circuit board
CN203523148U (en) * 2013-10-18 2014-04-02 北大方正集团有限公司 PCB (printed circuit board) jointed plate
CN103547077A (en) * 2013-10-25 2014-01-29 深圳雷柏科技股份有限公司 Clamping mechanism with multiple chucks and PCB testing and distributing production line
CN204157166U (en) * 2014-08-13 2015-02-11 中国船舶重工集团公司第七〇九研究所 A kind of assembled circuit board dividing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107660071A (en) * 2017-10-30 2018-02-02 广东智科电子股份有限公司 A kind of PCB jigsaw
CN108601213A (en) * 2018-06-13 2018-09-28 深圳市诚志电路有限公司 A kind of PCB jigsaw and gong plate method

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