KR101275057B1 - Manufacturing apparatus of metal copper clad laminate for voltage test - Google Patents

Abstract

PURPOSE: A manufacturing apparatus of metal copper clad laminates for a withstanding voltage test is provided to shorten the processing time of metal copper clad laminates for a withstanding voltage test by simultaneously removing the copper foil of metal copper clad laminate edge parts and chamfering metal copper clad laminate edge parts. CONSTITUTION: A manufacturing apparatus of metal copper clad laminates for a withstanding voltage test comprises an input unit(21), a first copper foil removing unit(22), a copper clad laminates rotating unit(23), a second copper foil removing unit(24), and a withstand voltage testing unit(25). The copper clad laminate rotating unit rotates the metal copper clad laminates by 90 degrees. The second copper foil removing unit removes both edge parts of copper foil, which is located in a Y direction of the metal copper clad laminates, by a pair of cutting tools(20) or grinding tools. The withstanding voltage testing unit tests the withstanding voltage by a withstanding voltage testing unit(25') after the copper foil of four edge parts of metal copper clad laminates are totally removed.

Description

Manufacturing Apparatus of Metal Copper Clad Laminate for Voltage Test}

The present invention relates to an apparatus for manufacturing a metal copper clad laminate (MCCL) for withstand voltage inspection, and in particular, to prevent the occurrence of electric current jumping at an edge portion of a metal copper clad laminate during a breakdown voltage test, even with a high voltage. The present invention relates to a metal copper-clad laminate manufacturing apparatus which can improve the accuracy of the withstand voltage inspection and the reliability of the copper-clad laminate product and improve the productivity by shortening the withstand voltage inspection time by allowing the withstand voltage inspection to be performed in-line continuously. .

Generally, as shown in FIGS. 1 and 2, the metal copper clad laminate is formed by insulating the copper foil layer 52 on the base metal layer 51 made of a conductive metal such as aluminum (Al) or copper alloy. It is mainly used to manufacture metal printed circuit board (PCB).

Here, the base metal layer 51 is mainly used for electrolytic galvanized iron (EG, Electrolytic Galvanized Iron) or hot-dip galvanized steel (GI, Galvanized Sheet Iron), but in some cases, common cold rolled steel (CR, Cold Rolled Steel).

In such a metal copper clad laminate, the current of the copper foil layer 52 on which the circuit is formed should not be transmitted to the conductive base metal layer 51. For this purpose, an insulating adhesive agent is used to bond the copper foil layer 52 and the base metal layer 51 to each other. I'm using.

Therefore, the insulating adhesive layer 53 should have sufficient insulation so that the current of the copper foil layer 52 is not transmitted to the base metal layer 51.

If there is an insulation failure in the insulation adhesive layer 53, a short may be generated between the circuit after the manufacture of the metal PCB and between the circuit and the base metal layer 51. When the metal copper foil laminate is manufactured, the insulation adhesive layer ( 53, there is a need for a breakdown voltage test for testing the insulation property.

However, in the conventional copper clad laminate, as shown in FIGS. 1 and 2, four surfaces of the copper clad laminate are manufactured in the form of a vertical cross section so that the distance between the base metal layer 51 and the copper foil layer 52 is very close. That is, since the thickness of the insulating adhesive layer 53 is very thin, the base metal layer 51 and the copper foil layer 52 are adjacent to each other at the edge portion.

Accordingly, when the withstand voltage test is performed at a low voltage of 1 kV or less, a large problem does not occur. Since current flows, there is a problem that the accuracy of the withstand voltage test is degraded.

That is, a current jumping phenomenon from the base metal layer 51 to the copper foil layer 52 may occur at the edge portion of the metal copper foil laminated plate, thereby causing a current to flow between the base metal layer 51 and the copper foil layer 52. As a result, the accuracy of the withstand voltage test is degraded.

Therefore, in order to be able to perform the withstand voltage test under a high voltage of 1.5 kV or more, it is necessary to prevent the current jumping phenomenon at the edge portion of the copper clad laminate.

Therefore, at present, the edge portion of the copper foil layer 52 is removed by etching, and the voltage withstand voltage test is performed or the withstand voltage test is performed only at a voltage lower than 1 kV.

However, the method of removing the edge portion of the copper foil layer by etching has a problem in that a lot of labor is required for the etching operation and the operation is cumbersome.

In addition, when the withstand voltage inspection of the copper-clad laminate used in the metal PCB with only a low voltage of 1kV or less, there is a problem that it is difficult to secure the reliability of the short problem that may occur at high voltage.

In addition, since the conventional withstand voltage test is made separately from the copper foil layer removing work, a lot of time is required for the withstand voltage test, thereby reducing the productivity of the product.

In particular, when the entire inspection of the metal copper-clad laminate plate has a problem that the inspection time is very much required.

The present invention is to solve the above problems of the prior art, an object of the present invention to provide a metal copper-clad laminate manufacturing apparatus that does not cause a current jumping phenomenon during the withstand voltage test of the metal copper-clad laminate.

Another object of the present invention is to improve the reliability of the quality of the metal copper clad laminate by enabling the withstand voltage inspection even under high voltage.

Still another object of the present invention is to make it possible to easily remove the copper foil layer from the metal copper clad laminate by mechanical processing.

Another object of the present invention is to reduce the manufacturing time of the metal copper-clad laminate for withstand voltage inspection by simultaneously removing and chamfering the copper foil layer of the edge portion of the metal copper-clad laminate.

It is still another object of the present invention to make it possible to easily inspect the metal copper clad laminate by performing edge part processing and withstand voltage inspection of the copper foil layer continuously on an in-line.

According to a first aspect of the present invention, there is provided an apparatus for manufacturing metal copper-clad laminates for electric voltage inspection, comprising: an input unit continuously feeding horizontally a metal copper-clad laminate; Primary copper foil layer removal unit for removing the edge portion of both copper foil layer in the X axis direction by a pair of cutting or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction; Copper foil laminated plate rotating part for rotating the metal copper foil laminated plate 90 degrees; A secondary copper foil layer removing unit which removes edge portions of both copper foil layers in the Y-axis direction of the metal copper clad laminate by a pair of cutting or grinding tools; After removing all of the copper foil layer of the four-side edge portion of the metal copper clad laminate, the withstand voltage inspection unit for performing a withstand voltage test by the withstand voltage inspection device; characterized in that arranged in series on the inline.

In addition, the apparatus for manufacturing a metal copper clad laminate for withstanding voltage inspection according to a second embodiment of the present invention, an input unit for continuously feeding the metal copper laminated sheet horizontally; A primary copper foil layer removing unit for removing both edge portions of the copper foil layer with a predetermined width by a pair of cutting tools or grinding tools provided on both sides of the metal copper foil laminated plate in a conveying direction; A secondary copper foil layer removing unit disposed in a direction perpendicular to the primary copper foil layer removing unit and removing edge portions of the remaining copper foil layers of the metal copper foil laminate by a pair of cutting or grinding tools at a predetermined width; After removing all of the copper foil layer of the four-side edge portion of the metal copper clad laminate, the withstand voltage inspection unit for performing a withstand voltage test by the withstand voltage inspection device; characterized in that arranged in series on the inline.

In addition, according to the third embodiment of the present invention, the apparatus for manufacturing a voltage-carrying copper clad laminate according to an embodiment of the present invention includes removing a copper foil layer of an edge portion of a copper clad laminate and inspecting a voltage withstand voltage, and then using a chamfering tool to form a chamfer at the corner of the metal copper clad laminate. It further comprises a primary chamfering and secondary chamfering processing.

In addition, a primary chamfering portion for chamfering corners in the X-axis direction is disposed behind the primary copper foil layer removing portion for removing both copper foil layer edge portions in the X-axis direction of the metal copper-clad laminate, and removing both copper foil layer edge portions in the Y-axis direction. After the secondary copper foil layer removing unit is characterized in that the secondary chamfering processing unit is chamfered to the corner in the Y-axis direction.

The chamfering tool is characterized by having an upper chamfering blade and a lower chamfering blade.

In addition, the apparatus for manufacturing a metal copper clad laminate for withstanding voltage inspection according to a fourth embodiment of the present invention includes an input unit for continuously feeding horizontally a metal copper clad laminate; A primary copper foil layer removal and chamfering processing unit which simultaneously removes and chamfers the copper foil layer in the X-axis direction by a pair of copper foil layer removal and chamfering tools installed on both sides of the metal copper foil laminated plate in a transport direction; A copper-clad laminate rotating part for rotating the metal copper-clad laminate 90 degrees or changing the direction in a perpendicular direction; Secondary copper foil layer removal and chamfering processing for simultaneously removing and chamfering the copper foil layer in the Y-axis by a pair of copper foil layer removal and chamfering tools; After the removal of all the copper foil layer of the four-side edge portion of the metal copper clad laminate plate withstand voltage test unit for performing a withstand voltage test by a withstand voltage test device; The product shipment unit for shipping the copper-clad laminate passed the withstand voltage test; characterized in that arranged in a continuous line.

The said copper foil layer removal and chamfering tool are equipped with the copper foil layer removal blade which removes the edge part copper foil layer of a copper foil laminated board, the 1st chamfering edge which chamfers a corner, and a 2nd chamfering edge.

In addition, the apparatus for manufacturing a voltage-resistant metal copper-clad laminate according to a fifth embodiment of the present invention includes an input unit for continuously inputting a metal copper-clad laminate horizontally in a metal-clad laminate production apparatus for a voltage-resistant test; A primary chamfering unit for chamfering both edges of the copper clad laminate in the X-axis direction by a chamfering tool; A copper-clad laminate rotating unit for rotating the metal copper-clad laminate 90 degrees or changing the direction in a right angle direction; A secondary chamfering unit for chamfering both edges of the copper-clad laminate in the Y-axis direction by a chamfering tool; A primary copper foil layer removing unit for removing both edge portions of the copper foil layer with a predetermined width by a pair of cutting tools or grinding tools provided on both sides of the metal copper foil laminated plate in a conveying direction; A secondary copper foil layer removing unit for removing a portion of edge portions of the remaining copper foil layers of the metal copper clad laminate by a pair of cutting or grinding tools to a predetermined width; A withstand voltage inspection unit for inspecting a withstand voltage by a withstand voltage inspection device; Product shipment unit for shipping a product that passed the withstand voltage test; characterized in that arranged in series on the inline.

In addition, a primary copper foil layer removing unit for removing both edges of the copper foil layer in the X axis direction is disposed behind the primary chamfering tool for chamfering both edges of the copper foil laminated plate by the chamfering tool. A secondary copper foil layer removing unit for removing both of the copper foil layer edge portions in the Y-axis direction is disposed behind the secondary chamfering portion chamfering both edges in the axial direction.

In addition, the apparatus for manufacturing a voltage-resistant metal copper-clad laminate according to a sixth embodiment of the present invention includes: an input unit for continuously inputting metal copper-laminated laminates horizontally in the apparatus for manufacturing a voltage-resistant metal copper-clad laminate; Primary copper foil layer removal unit for removing the edge portion of both copper foil layer in the X axis direction by a pair of cutting or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction; A copper-clad laminate rotating unit for rotating the metal copper-clad laminate 90 degrees or changing the direction in a right angle direction; A secondary copper foil layer removing unit which removes edge portions of both copper foil layers in the Y-axis direction of the metal copper clad laminate by a pair of cutting or grinding tools; After the removal of all the copper foil layer of the four-side edge portion of the metal copper clad laminate plate withstand voltage test unit for performing a withstand voltage test by a withstand voltage test device; Cutting and chamfering processing for cutting the edge portion of the operation laminate having passed the withstand voltage test using a cutting tool and chamfering the edge by the chamfering tool; Product shipment unit for shipping the finished product; characterized in that arranged in series on the inline.

According to the present invention, since a jumping phenomenon of the current does not occur during the withstand voltage test of the metal copper clad laminate, there is an effect of ensuring the accuracy of the withstand voltage test.

In addition, it is possible to withstand the voltage withstand under high voltage, thereby improving the quality reliability of the metal copper clad laminate.

In addition, since the copper foil layer can be easily removed by mechanical processing, the copper foil layer removal time can be remarkably shortened compared with the conventional copper foil layer removal method by etching.

In addition, since the copper foil layer removal and the chamfering processing of the edge portion of the metal copper clad laminate plate can be made at the same time, there is an effect that can reduce the manufacturing time of the metal copper clad laminate plate for the voltage resistance test.

In addition, since the edge portion processing and the withstand voltage inspection of the copper foil layer can be continuously performed on the in-line, it is possible to easily perform a full-voltage inspection of the metal copper-clad laminate and to shorten the inspection time, thereby improving productivity.

1 is an exploded perspective view of a typical metal copper clad laminate.
2 is a cross-sectional view of a typical metal copper clad laminate.
3 is a view schematically showing an apparatus for manufacturing a metal copper clad laminate according to a first embodiment of the present invention.
4 is a view schematically showing an apparatus for manufacturing a metal copper clad laminate according to a second embodiment of the present invention.
5 is a cross-sectional view of the metal copper clad laminate prepared by the first embodiment and the second embodiment of the present invention.
6 (a) and 6 (b) schematically show an apparatus for manufacturing a metal copper clad laminate according to a third embodiment of the present invention.
7 is a cross-sectional view of a chamfering tool and a metal copper clad laminate prepared thereby according to a third embodiment of the present invention.
8 is a view schematically showing an apparatus for manufacturing a metal copper clad laminate according to a fourth embodiment of the present invention.
Figure 9 is a cross-sectional view of the copper foil layer manufacturing and chamfering tool according to the fourth embodiment of the present invention and the metal copper foil laminated plate produced thereby.
10 (a) and 10 (b) schematically show an apparatus for manufacturing a metal copper clad laminate according to a fifth embodiment of the present invention.
11 is a cross-sectional view of a chamfering tool according to a fifth embodiment of the present invention and a metal copper-clad laminate prepared thereby.
12 is a view schematically showing an apparatus for manufacturing a metal copper clad laminate according to a sixth embodiment of the present invention.
13 is a cross-sectional view of a metal copper clad laminate prepared in accordance with a sixth embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

≪ Embodiment 1 >

3 shows a first embodiment according to the present invention.

The manufacturing apparatus of the metal copper-clad laminate according to the first embodiment according to the present invention, as shown in Figure 3, the input unit 21 for continuously feeding the metal copper-laminated laminate horizontally; Primary copper foil layer removal unit 22 for removing both edge portions of the copper foil layer 12 to a predetermined width by a pair of cutting tools 20 or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; Secondary copper foil layer removal part 24 which removes the edge part of the remaining both copper foil layers 12 of the said metal copper clad laminated board by a pair of cutting tool 20 or the grinding tool to a predetermined width; After removing all the copper foil layers of the four-side edge portion of the metal copper-clad laminate plate, the withstand voltage inspection unit 25 for performing a withstand voltage inspection by the withstand voltage inspection device 25 ';

First, when the metal copper-clad laminate is introduced into the feeding part 21, the cutting tool 20 or the grinding tool provided on both sides of the conveying direction (hereinafter, referred to as 'X axis direction') of the copper-clad laminate is the copper foil layer 12 of the copper-clad laminate. Both edge portions of the copper foil layer 12 are removed by cutting or grinding a predetermined width.

That is, the insulating adhesive layer 13 is exposed by cutting or grinding the edge portion of the copper foil layer 12 with a predetermined width.

At this time, as the cutting tool 20, it is preferable to use a cutter which is installed vertically and rotates. However, as long as it can remove the copper foil layer 12, a cutter having any structure may be used.

Moreover, the copper foil layer 12 can also be removed manually using a grinding tool, such as a grinder.

When the double-sided edge portion processing in the X-axis direction, which is the copper foil laminated plate transfer direction, is completed, the metal copper foil laminated sheet is rotated 90 degrees to remove the remaining copper foil layer 12 on both edge portions.

When the processing of the edge portion of the Y-axis direction (direction perpendicular to the above-described X-axis direction) is completed by the 90-degree rotation of the copper-clad laminate, all four edge portions of the copper-clad laminate are in a state where the copper foil layer 12 is removed.

That is, as shown in FIG. 5, the base metal layer 11 and the copper foil layer 12 are spaced apart from each other while maintaining a constant distance.

Accordingly, since the current jumping phenomenon does not occur between the base metal layer 11 and the copper foil layer 12 during the withstand voltage test, not only the accuracy of the withstand voltage test can be ensured, but also the withstand voltage test can be performed without errors even in a high voltage state of 1.5 kV or more. .

In the related art, since the withstand voltage test was performed after the copper foil layer 12 was removed by etching, the work man-hours increased and the work was troublesome.

However, according to the present invention, since the copper foil layer can be easily removed by mechanical processing by a cutting tool or a grinding tool, the manufacturing time of the copper-clad laminate for the breakdown voltage inspection can be significantly shortened.

In addition, since the copper foil layer removing operation and the breakdown voltage inspection of the copper foil laminated sheet are continuously performed inline, it is possible to easily perform the full-voltage inspection of the copper foil laminated sheet, thereby securing the reliability of the product and improving the productivity.

≪ Embodiment 2 >

Figure 4 shows a second embodiment according to the present invention.

In the second embodiment, in the first embodiment, the secondary copper foil layer removing portion 24 is disposed in a direction perpendicular to the primary copper foil removing portion 24.

The copper clad laminated board from which the edge part copper foil layer was removed according to 2nd Example has the same structure as 1st Example, as shown in FIG.

According to the second embodiment of the present invention, there is no need to rotate the metal copper-clad laminate 90 degrees after first removing the copper foil layer edge portion.

The other configuration is the same as that of the first embodiment, and thus duplicated description will be omitted.

Third Embodiment

6 and 7 show a third embodiment according to the present invention.

According to the third embodiment of the present invention, after the edge portion of the copper foil layer is removed and the electric strength test is performed, chamfering is performed at the corners of the product that has passed the electric voltage test.

That is, as shown in Fig. 6 (a), the input unit 21 for continuously feeding the metal copper foil laminated plate horizontally; A primary copper foil layer removing unit (22) for removing a predetermined width of both edge portions of the copper foil layer (12) in the X-axis direction by a pair of cutting tools (20) or grinding tools provided on both sides of the metal copper foil laminate in a conveying direction; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; A secondary copper foil layer removing portion 24 for removing the edge portions of both copper foil layers 12 in the Y-axis direction of the metal copper clad laminate by a pair of cutting tools 20 or grinding tools with a predetermined width; A withstand voltage inspecting unit 25 for performing a withstand voltage inspection by the withstand voltage inspecting apparatus 25 'after removing all the copper foil layers of the four surface edge portions of the metal copper clad laminate; A primary chamfering unit 26 and a secondary chamfering unit 28 for chamfering the edges of the copper clad laminate having passed the withstand voltage test by the chamfering tool 50; And the product shipment unit 60 are arranged continuously on the inline.

Moreover, after removing the copper foil layer of an X-axis direction, you may remove a copper foil layer of a Y-axis direction by changing a direction to a perpendicular direction, without rotating a metal copper foil laminated board.

In addition, as shown in Figure 6 (b), the input unit 21 for continuously feeding the metal copper foil laminated plate horizontally; A primary copper foil layer removing unit (22) for removing a predetermined width of both edge portions of the copper foil layer (12) in the X-axis direction by a pair of cutting tools (20) or grinding tools provided on both sides of the metal copper foil laminate in a conveying direction; A primary chamfering section 26 for chamfering both edges of the copper-clad laminate in the X-axis direction by the chamfering tool 50; A copper-clad laminate rotating part 23 for rotating the chamfered metal copper-clad laminate by removing the edge portion copper foil layer by 90 degrees; A secondary copper foil layer removing portion 24 for removing the edge portions of both copper foil layers 12 in the Y-axis direction of the metal copper clad laminate by a pair of cutting tools 20 or grinding tools with a predetermined width; A secondary chamfering unit 28 for chamfering both corners in the Y-axis direction by the chamfering tool 50; The withstand voltage inspecting unit 25 performing the withstand voltage inspection by the withstand voltage inspecting device 25 '; And the product shipping unit 60 for shipping the product that passed the withstand voltage test may be arranged continuously on the inline.

According to the third embodiment of the present invention, as shown in FIG. 6 (a), the copper foil layer edge portion is removed, the electric strength test is performed, and the product is shipped by chamfering, or as shown in FIG. 6 (b). The copper foil layer edge part is removed and chamfered in the X axis direction, and the copper foil layer edge part is removed and chamfered in the Y axis direction.

As shown in FIG. 7, the chamfering tool 50 is provided with an upper chamfering blade 51 and a lower chamfering blade 52 so that the upper and lower edges may be chamfered in one process.

The other configuration is the same as that of the first embodiment described above.

<Fourth Embodiment>

8 and 9 show a fourth embodiment according to the present invention.

In a fourth embodiment according to the present invention, the copper foil layer is removed and chamfered at the same time.

That is, as shown in Figure 8, the input unit 21 for continuously feeding the metal copper-clad laminate plate horizontally; Primary copper foil layer removal and chamfering processing unit 22 'to simultaneously perform copper foil layer removal and chamfering by a pair of copper foil layer removal and chamfering tools 30 installed on both sides of the metal copper foil laminated plate in a conveying direction; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; Secondary copper foil layer removal and chamfering processing part 24 'which simultaneously removes and chamfers the remaining copper foil layer by a pair of copper foil layer removal and chamfering tools 30; A withstand voltage inspecting unit 25 for performing a withstand voltage inspection by the withstand voltage inspecting apparatus 25 'after removing all the copper foil layers of the four surface edge portions of the metal copper clad laminate; The product shipment part 60 which ships the copper-clad laminated board which passed the withstand voltage test is arrange | positioned continuously in an inline.

After the copper foil layer removal and chamfering in the X-axis direction are performed at the same time, the copper foil layer removal and chamfering in the Y-axis direction can be performed simultaneously by changing the direction in the right direction without rotating the metal copper-clad laminate.

The copper foil layer removal and chamfering tool 30 is, as shown in Figure 9, the copper foil layer removal blade 31 for removing the copper foil layer, the first chamfering edge 32 and the second chamfering edge chamfering 33 is provided.

Using the copper foil layer removal and chamfering tool 30 of the structure as shown in Figure 9 can be made at the same time because the copper foil layer removal operation and chamfering processing is made at the same time can be significantly reduced.

<Fifth Embodiment>

10 and 11 show a fifth embodiment according to the present invention.

In a fifth embodiment according to the present invention, edge chamfering is first performed, followed by removing the copper foil layer, and then performing a withstand voltage test.

That is, as shown in Figure 10 (a), the input portion 21 for continuously feeding the metal copper foil laminated plate horizontally; A primary chamfering part 26 for chamfering both edges of one direction of the copper-clad laminate by the chamfering tool 50; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; A secondary chamfering portion 28 for chamfering both edges of the copper clad laminate in different directions by the chamfering tool 50; Primary copper foil layer removal unit 22 for removing both edge portions of the copper foil layer 12 to a predetermined width by a pair of cutting tools 20 or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction; Secondary copper foil layer removal part 24 which removes the edge part of the remaining copper foil layer 12 of the said metal copper foil laminated board by a pair of cutting tool 20 or grinding tools to a predetermined width; A withstand voltage inspection unit 25 for inspecting the withstand voltage by the withstand voltage inspection device 25 '; The product shipment part 60 which ships the product which passed the withstand voltage test is arrange | positioned continuously in an inline.

In addition, after chamfering in the X-axis direction, the chamfering in the Y-axis direction can be performed by changing the direction in a right angle direction without rotating the metal copper clad laminate.

In addition, as shown in Figure 10 (b), the input portion 21 for continuously feeding the metal copper-clad laminate plate horizontally; A primary chamfering section 26 for chamfering both edges of the copper-clad laminate in the X-axis direction by the chamfering tool 50; Primary copper foil layer removal part 22 which removes the edge part of the copper foil layer 12 on both sides of the X-axis direction of the said metal copper clad laminated board by a pair of cutting tool 20 or the grinding tool to a predetermined width; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; A secondary chamfering portion 28 for chamfering both edges of the copper-clad laminate in the Y-axis direction by the chamfering tool 50; Secondary copper foil layer removal part 24 which removes the edge part of the Y-axis direction of the copper foil layer 12 by a pair of cutting tool 20 or the grinding tool to predetermined width | variety; A withstand voltage inspection unit 25 for inspecting the withstand voltage by the withstand voltage inspection device 25 '; The product shipment part 60 which ships the product which passed the withstand voltage test may be arrange | positioned continuously in an inline.

In a fifth embodiment according to the present invention, edge chamfering is performed using the chamfering tool 50 shown in FIG. 11, and the dielectric strength test is performed after removing the copper foil layer using the cutting tool 20.

That is, as shown in FIG. 10 (a), the chamfering process is performed and the edge part copper foil layer is removed, the electric strength test is performed, and the product is shipped, or as shown in FIG. The copper foil layer is removed, the Y-axis chamfering and the edge copper foil layer are removed, the electric strength test is performed and the product is shipped.

<Sixth Embodiment>

12 and 13 show a sixth embodiment according to the present invention.

According to the sixth embodiment of the present invention, after removing the copper foil layer and inspecting the withstand voltage, the exposed insulating adhesive layer 13 is cut and chamfered to ship the product.

That is, as shown in Figure 12, the input unit 21 for continuously feeding the metal copper-clad laminate plate horizontally; Primary copper foil layer removal unit 22 for removing both edge portions of the copper foil layer 12 to a predetermined width by a pair of cutting tools 20 or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction; A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees; Secondary copper foil layer removal part 24 which removes the edge part of the remaining both copper foil layers 12 of the said metal copper clad laminated board by a pair of cutting tool 20 or the grinding tool to a predetermined width; A withstand voltage inspecting unit 25 for performing a withstand voltage inspection by the withstand voltage inspecting apparatus 25 'after removing all the copper foil layers of the four surface edge portions of the metal copper clad laminate; Cutting and chamfering parts 29 for cutting the edges of the copper foil laminate having passed the withstand voltage test using the cutting tool 40 and processing the edges by the chamfering tool 50; And the product shipment unit 60 for shipping the product that has passed the withstand voltage test in series on the inline.

Moreover, after removing the copper foil layer of a X-axis direction primarily, you may remove a copper foil layer of a Y-axis direction secondary by changing a direction to a right angle direction, without rotating a metal copper foil laminated board.

The cutting tool 40 has a shape as shown in FIG. 13 and is disposed in pairs on the upper and lower portions of the copper clad laminate. In addition, the cutting tool 40 may be disposed only at any one of the upper or lower portion of the copper clad laminate.

The chamfering tool 50 has an upper chamfering edge 51 chamfering the upper corner and a lower chamfering edge 52 chamfering the lower edge as shown in FIG.

When the chamfering tool 50 is used, the chamfering work of the upper and lower surfaces can be completed by one machining.

According to the sixth exemplary embodiment, as shown in FIG. 13, the edge portion from which the copper foil layer is removed is cut for the withstand voltage test, and the insulation adhesive layer 13 is not exposed to the outside.

According to the present invention, since the copper foil layer of the four side edge portions of the metal copper clad laminate is removed by machining rather than etching, the copper foil layer can be removed very simply and quickly.

Accordingly, it is possible to improve the accuracy and reliability of the withstand voltage test by preventing the current jumping phenomenon.

In addition, by using a specially shaped tool, copper foil layer removal and chamfering can be carried out very easily and quickly, thus greatly reducing the work time.

In addition, the copper foil laminated sheet can be continuously supplied after the copper foil layer is quickly removed by machining, so that it is possible to perform a full-voltage inspection of the metal copper laminate and to significantly shorten the breakdown voltage inspection time.

Although the preferred embodiments of the present invention have been described above, the scope of the present invention is not limited to the above embodiments, and those skilled in the art may appropriately change within the scope described in the claims of the present invention. This will be possible.

11: base metal layer
12: copper foil layer
13: insulation adhesive layer
15: Chamfer
20: cutting tool
21: copper clad laminate input unit
22: primary copper foil layer removing unit
22 ': Remove primary copper foil layer and chamfer
23: copper foil laminated plate rotating part
24: secondary copper foil layer removing portion
24 ': Remove secondary copper foil layer and chamfer
25: withstand voltage test unit
25 ': Withstand voltage test device
26: Primary Chamfering Process
28: secondary chamfering
29: cutting and chamfering
30: Copper foil layer removal and chamfering tool
40: cutting tool
50: chamfering tool
60: Product shipment

Claims (10)

In the apparatus for producing a metal copper clad laminate for withstanding voltage inspection,
An input unit 21 continuously feeding horizontally the metal copper-clad laminate;
Primary copper foil layer removing portion 22 for removing the edge portions of both copper foil layers 12 in the X-axis direction of the copper foil laminated sheet by a pair of cutting tools 20 or grinding tools provided on both sides of the metal copper foil laminated sheet in the conveying direction. );
A copper clad laminate rotation unit 23 for rotating the metal copper clad laminate 90 degrees;
Secondary copper foil layer removal part 24 which removes the edge part of both copper foil layers 12 in the Y-axis direction of the said metal copper-clad laminated board by a pair of cutting tool 20 or grinding tools in predetermined width | variety;
After the removal of all of the copper foil layer of the four-side edge portion of the metal copper clad laminate plate withstand voltage test section 25 to perform a withstand voltage test by the withstand voltage test device 25 '; Copper Clad Laminate Manufacturing Equipment. In the apparatus for producing a metal copper clad laminate for withstanding voltage inspection,
An input unit 21 continuously feeding horizontally the metal copper-clad laminate;
Primary copper foil layer removal part 22 which removes the edge part of both copper foil layers 12 in a X-axis direction by a pair of cutting tool 20 or grinding tools provided in the conveyance direction both sides of the said metal copper foil laminated board;
Arranged in a direction perpendicular to the primary copper foil layer removing unit 22, by the pair of cutting tools 20 or grinding tools, the edge portions of both copper foil layers 12 in the Y-axis direction of the metal copper clad laminates are removed to a predetermined width. Secondary copper foil layer removal unit 24;
After the removal of all of the copper foil layer of the four-side edge portion of the metal copper clad laminate plate withstand voltage test section 25 to perform a withstand voltage test by the withstand voltage test device 25 '; Copper Clad Laminate Manufacturing Equipment. The method according to claim 1 or 2,
After removing all edge portions of the copper foil layer in the X-axis direction and the Y-axis direction of the metal copper-clad laminate, and inspecting the breakdown voltage, the first chamfer 15 is formed at the corners of the metal copper-clad laminate using the chamfering tool 50. The chamfering processing unit 26 and the secondary chamfering processing unit 28, characterized in that the copper-clad laminate manufacturing apparatus for a high voltage test. The method of claim 3,
A primary chamfering portion 26 for chamfering corners in the X-axis direction is disposed behind the primary copper foil layer removing portion 22 for removing both copper foil layer edge portions in the X-axis direction of the metal copper foil laminated plate,
A secondary copper chamfering portion 28 for chamfering corners in the Y-axis direction is disposed behind the secondary copper foil layer removing portion 24 that removes both copper foil layer edge portions in the Y-axis direction. Device. The method of claim 3,
The chamfering tool 50 is an apparatus for producing a copper-clad laminate for a voltage withstand voltage, characterized in that it comprises an upper chamfering blade 51 and the lower chamfering blade (52). In the apparatus for producing a metal copper clad laminate for withstanding voltage inspection,
An input unit 21 continuously feeding horizontally the metal copper-clad laminate;
Primary copper foil layer removal and chamfering portion 22 ′ simultaneously performing X-axis direction copper foil layer removal and chamfering by a pair of copper foil layer removal and chamfering tools 30 installed on both sides of the metal copper foil laminated plate in the transport direction. ;
A copper-clad laminate rotation part 23 for rotating the metal copper-clad laminate 90 degrees or redirecting in a perpendicular direction;
Secondary copper foil layer removal and chamfering processing part 24 'which simultaneously performs Y-axis direction copper foil layer removal and chamfering by a pair of copper foil layer removal and chamfering tools 30;
A withstand voltage inspecting unit 25 for performing a withstand voltage inspection by the withstand voltage inspecting apparatus 25 'after removing all the copper foil layers of the four surface edge portions of the metal copper clad laminate;
The product shipment part 60 which ships the copper foil laminated board which passed the electric voltage test | inspection; The metal copper foil laminated board manufacturing apparatus for high voltage test characterized by being arrange | positioned continuously in an inline. The method according to claim 6,
The copper foil layer removing and chamfering tool 30 includes a copper foil layer removing blade 31 for removing the edge copper foil layer of the copper foil laminate, a first chamfering blade 32 for chamfering the corners, and a second chamfering blade 33. Metal copper-clad laminate manufacturing apparatus for a voltage withstand voltage characterized in that it comprises a. In the apparatus for producing a metal copper clad laminate for withstanding voltage inspection,
An input unit 21 continuously feeding horizontally the metal copper-clad laminate;
A primary chamfering section 26 for chamfering both edges of the copper-clad laminate in the X-axis direction by the chamfering tool 50;
A copper-clad laminate rotation part 23 for rotating the metal copper-clad laminate 90 degrees or redirecting in a perpendicular direction;
A secondary chamfering portion 28 for chamfering both edges of the copper-clad laminate in the Y-axis direction by the chamfering tool 50;
Primary copper foil layer removal unit 22 for removing both edge portions of the copper foil layer 12 to a predetermined width by a pair of cutting tools 20 or grinding tools provided on both sides of the metal copper foil laminated plate in the conveying direction;
Secondary copper foil layer removal part 24 which removes the edge part of the remaining copper foil layer 12 of the said metal copper foil laminated board by a pair of cutting tool 20 or grinding tools to a predetermined width;
A withstand voltage inspection unit 25 for inspecting the withstand voltage by the withstand voltage inspection device 25 ';
The product shipment part 60 which ships the product which passed the withstand voltage test; The metal-copper laminated board manufacturing apparatus for a withstand voltage test characterized by being arrange | positioned continuously in an inline. 9. The method of claim 8,
Primary copper foil layer removal unit 22 for removing the edge portions of both copper foil layers 12 in the X axis direction after the primary chamfering portion 26 chamfering both edges of the copper foil laminated plate by the chamfering tool 50. ) Is placed,
Secondary copper foil layer removing portion 24 for removing edge portions of both copper foil layers 12 in the Y-axis direction after the secondary chamfering portion 28 chamfering both edges of the Y-axis direction of the copper-clad laminate by the chamfering tool 50. ) Is a metal copper-clad laminate manufacturing apparatus for a voltage test. In the apparatus for producing a metal copper clad laminate for withstand voltage,
An input unit 21 continuously feeding horizontally the metal copper-clad laminate;
Primary copper foil layer removal part 22 which removes the edge part of both copper foil layers 12 in a X-axis direction by a pair of cutting tool 20 or grinding tools provided in the conveyance direction both sides of the said metal copper foil laminated board;
A copper-clad laminate rotation part 23 for rotating the metal copper-clad laminate 90 degrees or redirecting in a perpendicular direction;
Secondary copper foil layer removal part 24 which removes the edge part of both copper foil layers 12 in the Y-axis direction of the said metal copper-clad laminated board by a pair of cutting tool 20 or grinding tools in predetermined width | variety;
A withstand voltage inspecting unit 25 for performing a withstand voltage inspection by the withstand voltage inspecting apparatus 25 'after removing all the copper foil layers of the four surface edge portions of the metal copper clad laminate;
Cutting and chamfering processing unit 29 for cutting the edge portion of the copper foil laminated plate passed the withstand voltage test using a cutting tool 40 and chamfering the edge by the chamfering tool 50;
The product shipment part 60 which ships the manufactured product; The copper-clad laminate manufacturing apparatus for a voltage withstand voltage test, characterized in that arranged in series on an inline.

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