CN111787688A - Metal-based copper-clad plate, and voltage-resistant test method and manufacturing method thereof - Google Patents
Metal-based copper-clad plate, and voltage-resistant test method and manufacturing method thereof Download PDFInfo
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- CN111787688A CN111787688A CN202010619155.9A CN202010619155A CN111787688A CN 111787688 A CN111787688 A CN 111787688A CN 202010619155 A CN202010619155 A CN 202010619155A CN 111787688 A CN111787688 A CN 111787688A
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- metal
- copper foil
- clad plate
- copper
- based copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/20—Preparation of articles or specimens to facilitate testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
Abstract
The application relates to the technical field of circuit board processing, in particular to a voltage withstanding test method of a metal-based copper-clad plate, a manufacturing method of the metal-based copper-clad plate comprising the test method and the metal-based copper-clad plate manufactured by the manufacturing method. The metal-based copper-clad plate comprises a metal plate, a dielectric layer and a copper foil which are sequentially stacked. The withstand voltage test method comprises the following steps: cutting off the copper foil at the peripheral edge part of the metal-based copper-clad plate, exposing the dielectric layer below, and forming an annular cutting belt to obtain a copper foil cut-off product; and connecting a voltage generator to the copper foil on the top of the copper foil cut-out and the metal plate on the bottom of the copper foil cut-out to perform a voltage withstanding test. The withstand voltage test method of the metal-based copper-clad plate prevents unexpected current flow caused by the end effect, thereby ensuring the accuracy and reliability of withstand voltage test and carrying out complete inspection.
Description
Technical Field
The application relates to the technical field of circuit board processing, in particular to a voltage withstanding test method of a metal-based copper-clad plate, a manufacturing method of the metal-based copper-clad plate comprising the test method and the metal-based copper-clad plate manufactured by the manufacturing method.
Background
In order to prevent the product from being damaged by heat generated by high-frequency or high-power electronic components, a metal-based copper-clad plate is formed by adopting a structure of stacking a dielectric layer and copper foil on a metal plate at the raw material stage for a printed circuit board. Here, the dielectric layer is mainly used in a thickness of about 0.1mm, and when foreign matter or other defects are present in the dielectric layer having such a thin thickness, there seems to be no problem at a low voltage, but if a high voltage is used, there is a problem in that burning or short-circuiting is caused in this portion, and therefore it is necessary to perform a withstand voltage test from the manufacturing stage of parts and materials.
Through the withstand voltage test, the problem that the copper foil on the upper layer and the metal plate on the lower layer in the metal-based copper-clad plate are mutually communicated due to the defect of the dielectric medium or the tiny dust or foreign matters contained can be screened in advance. However, in the withstand voltage test of the metal-based copper-clad plate, due to the existence of the end effect, unexpected current flows out from the end part of the copper foil, so that the accuracy and reliability of the withstand voltage test are reduced. However, it is difficult to check for the above-mentioned end effects, and therefore, if the test is abandoned, there is a risk that a fire will occur or the product cannot be started after the product is shipped after the fittings are assembled in the subsequent processes.
Disclosure of Invention
In order to solve the technical problems, the application provides a voltage withstanding test method of a metal-based copper-clad plate, a manufacturing method of the metal-based copper-clad plate comprising the test method and the metal-based copper-clad plate manufactured by the manufacturing method.
In order to achieve the above object, according to one aspect of the present technical solution, the present technical solution provides a withstand voltage testing method for a metal-based copper-clad plate, where the metal-based copper-clad plate includes a metal plate, a dielectric layer, and a copper foil, which are sequentially stacked, and the method includes:
cutting off the copper foil at the peripheral edge part of the metal-based copper-clad plate, exposing the dielectric layer below, and forming an annular cutting belt to obtain a copper foil cut-off product;
and connecting a voltage generator to the copper foil on the top of the copper foil cut-out and the metal plate on the bottom of the copper foil cut-out to perform a voltage withstanding test.
Further, the width of the removed part of the copper foil is not more than 13 mm.
Furthermore, the width position of the removed part of the copper foil is 1mm-10 mm.
Further, the edge part of the copper foil is removed through a milling tool, a cutter of the milling tool rotates, the metal-based copper-clad plate moves to perform feeding motion, and the diameter of the cutter is matched with the width of the removed part of the copper foil.
Further, the milling tool comprises a fixing part for fixing the cutter and a protective cover arranged at one end of the fixing part, the protective cover is arranged between the copper foil and the fixing part in the milling process, and the hardness of the protective cover is smaller than that of the copper foil.
Furthermore, the material of the protective cover is polytetrafluoroethylene, polyimide, organic silicon plastic, polyester resin, polypropylene, polyethylene or PPS.
Further, the edge part of the copper foil and a part of the dielectric layer are removed through a chamfering tool, a chamfer is formed on the edge of the metal-based copper-clad plate, and the angle of the chamfer is not more than 30 degrees.
Further, the process of obtaining the copper foil cutout product includes:
the first stage, the metal-based copper-clad plate is continuously conveyed in a horizontal mode, and cutters of a milling tool or a chamfering tool are respectively arranged on two sides in the moving direction to remove two opposite sides of the copper foil;
and in the second stage, the metal-based copper-clad plate is rotated by 90 degrees in the horizontal plane and is continuously conveyed, and the two remaining sides of the copper foil are removed by cutters arranged on the two sides in the moving direction.
In order to achieve the above object, according to a second aspect of the present invention, the present invention further discloses a manufacturing method of the metal-based copper-clad plate including the withstand voltage testing method provided by the first aspect of the present application.
In order to achieve the above object, according to a third aspect of the present invention, the present invention further discloses a metal-based copper-clad plate manufactured by the manufacturing method provided in the second aspect of the present application.
The voltage-withstanding test method of the metal-based copper-clad plate provided by the embodiment of the application prevents unexpected current flow caused by the end effect, thereby ensuring the accuracy and reliability of the voltage-withstanding test and further being capable of carrying out complete inspection.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:
FIG. 1 schematically shows a structural reference diagram of a metal-based copper-clad plate in an embodiment of the present application;
FIG. 2 is a schematic structural reference view of a copper foil cut-out provided in an embodiment of the present application;
FIG. 3 is a reference view schematically illustrating a partial structure of a milling tool used in an embodiment of the present application;
FIG. 4 is a reference diagram schematically showing a use state of milling the metal-based copper-clad plate by using the milling tool in the embodiment of the present application;
FIG. 5 is a reference diagram schematically showing a state of use of a chamfering tool used in the embodiment of the present application for chamfering a metal-based copper-clad plate;
FIG. 6 is a flow chart schematically showing a manufacturing method of a metal-based copper-clad plate in the embodiment of the present application; and
fig. 7 schematically shows a flow chart of another method for manufacturing a metal-based copper-clad plate in the embodiment of the present application.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the drawings, the thicknesses of layers and regions are exaggerated for convenience of description, and the sizes shown do not represent actual sizes. Although these figures do not reflect the actual dimensions of the device exactly, they do reflect the mutual positions of the regions and the constituent structures, in particular the upper and lower and adjacent relationships between the constituent structures. The referenced drawings are schematic representations of idealized embodiments of the present invention, which should not be considered limited to the particular shapes of regions shown in the drawings, but are intended to include resulting shapes and manufacturing-induced variations.
The invention relates to a voltage-withstanding test method of a Metal-based Copper Clad laminate (MCCL), aiming at discharging the end effect generated by unexpected current flowing into the end part of a Copper foil due to non-dielectric defect during the voltage-withstanding test, thereby improving the accuracy and reliability of the voltage-withstanding test. The structure of the metal-based copper-clad plate for the withstand voltage test is shown in figure 1, and the metal-based copper-clad plate comprises a metal plate 1, a dielectric layer 2 and a copper foil 3 which are sequentially stacked. Generally, the thickness of the metal plate 1 is 0.2mm to 10.0mm, the thickness of the dielectric layer 2 is 0.05 mm to 0.51mm, and the thickness of the copper foil 3 is 0.009 mm to 0.105 mm.
The voltage resistance test method of the metal-based copper-clad plate in the embodiment of the application comprises the following steps: as shown in fig. 2, firstly, cutting off the copper foil 3 at the peripheral edge part of the metal-based copper-clad plate, exposing the dielectric layer 2 below, and forming an annular cutting belt 4 to obtain a copper foil cut-off product; then, a voltage generator was connected to the copper foil 3 on the top and the metal plate 1 on the bottom of the copper foil cut-out to perform a withstand voltage test. In the embodiment, the edge part of the copper foil 3 is cut off, and the metal-based copper-clad plate forms the annular cutting belt 4, so that accidental current flow caused by the end effect is prevented, and the accuracy and reliability of the voltage resistance test are ensured.
The part of the edge of the metal-based copper-clad plate within the range of 13mm is not actually used as a circuit in the processing process of the printed circuit board, the part is usually used for the purpose of fixing a substrate or keeping a reference point in the processing process, and the part is usually discarded when the copper-clad laminated plate is manufactured, so that in order to enable the withstand voltage test to be used in the manufacturing process of the metal-based copper-clad plate, the normal use of a subsequent product as a circuit substrate is not influenced, and the width of the removed part of the copper foil is not more than 13 mm. Preferably, the width of the removed part of the copper foil is 1mm-10mm, and generally, the higher the voltage tested in the withstand voltage test process, the more obvious the end effect is, and the larger the width of the part to be removed should be. For example, the width of the removed portion of the copper foil may be 3mm when the test is performed using a voltage of 1kV, 2mm or more when the test is performed using 0.5kV or less, and 5mm or more when the test is performed using 3kV or more.
In the above embodiment, the removal of the edge portion of the copper foil in the metal-based copper-clad plate needs to be achieved by means of auxiliary tools, which can be used, including but not limited to, a milling tool 5 and a chamfering tool 6.
In some embodiments, the edge portion of the copper foil is removed by a milling tool 5 shown in fig. 3, a cutter of the milling tool rotates, the metal-based copper-clad plate moves linearly to perform a feeding motion, and the diameter of the cutter is matched with the width of the removed portion of the copper foil. In the operation process, as shown in fig. 4, a cutter 501 of the milling tool 5 is perpendicular to the metal-based copper-clad plate, the moving direction of the metal-based copper-clad plate is parallel to one side of the metal-based copper-clad plate to be cut, the height of the cutter is adjusted by referring to the thickness of the part of the metal-based copper-clad plate to be cut, the diameter of the cutter of the milling tool is matched with the width of the part to be removed, preferably 1mm-10mm, and the copper foil on one side can be cut by one-time milling. Preferably, as shown in fig. 3, the milling tool 5 includes a fixing portion 502 for fixing the cutter 501 and a protective cover 503 disposed at one end of the fixing portion 502, the protective cover 503 is interposed between the copper foil 3 and the fixing portion 502 during the milling process, the hardness of the protective cover 503 is less than that of the copper foil 3, and the protective cover 503 is made of a material having a hardness less than that of the copper foil to prevent scratching and damaging the surface of the copper foil. Materials that may be used for the protective cover 503 include, but are not limited to, polytetrafluoroethylene, polyimide, silicone plastic, polyester resin, polypropylene, polyethylene, and PPS.
In some embodiments, the edge part of the copper foil 3 and a part of the dielectric layer 2 are removed by a chamfering tool 6 shown in fig. 5, and a chamfer is formed on the edge of the metal-based copper-clad plate, wherein the chamfer angle is not more than 30 degrees, so that the width of the chamfer of the cut part on the metal-based copper-clad plate is more than twice of the thickness of the cut dielectric material, and the electrical short circuit can be effectively prevented. The chamfering tool 6 includes, but is not limited to, a chamfering machine and a beveling machine. If the metal-based copper-clad plate has sharp corners, people can be injured, the copper foil part at the edge is removed in a chamfering mode, the sharp corners cannot exist, and operators can be prevented from being injured.
In order to realize continuous testing and processing, the process of obtaining the copper foil cut-out in the withstand voltage testing method in the implementation at least comprises a first stage and a second stage. In the first stage, the metal-based copper-clad plate is continuously conveyed in a horizontal mode, and cutters of a tool or a chamfering tool are respectively milled on two sides in the moving direction to remove two opposite sides of the copper foil; and in the second stage, the metal-based copper-clad plate is rotated by 90 degrees in the horizontal plane and conveyed continuously, and the remaining two sides of the copper foil are removed by the cutters arranged on the two sides in the moving direction, so that the copper foils on the four sides of the metal-based copper-clad plate are removed, and a copper foil cut-off product is obtained. The first stage and the second stage can automatically and continuously carry out treatment and voltage resistance test on the edge part of the metal-based copper-clad plate.
The embodiment of the invention also provides a manufacturing method of the metal-based copper-clad plate, which comprises the voltage resistance test method of the metal-based copper-clad plate provided by the embodiment of the application. Specifically, a metal-based copper-clad plate is obtained after a metal plate, a dielectric layer and a copper foil are molded through a hot-pressing process, and then the metal-based copper-clad plate is subjected to a voltage resistance test. In the embodiment, the withstand voltage test is used as a necessary step for manufacturing the metal-based copper-clad plate, and the metal-based copper-clad plate can be subjected to total number detection.
The local defect of the dielectric medium or the inclusion of the fine foreign matters is considered to be one of inevitable factors in the manufacturing process of the copper-clad plate, and the problem occurs irregularly, so that the voltage resistance of the copper-clad plate needs to be subjected to nondestructive detection. According to the manufacturing method provided by the embodiment of the invention, the withstand voltage testing method is introduced, copper foil is removed from the edge part which is usually discarded and does not need to be used as a circuit, the end effect is eliminated, nondestructive testing and full-scale testing can be carried out on the processed copper-clad plate, and the accuracy and reliability of the testing can be provided.
In addition, in the withstand voltage test process, the end effect of the copper-clad plate is shown as that the higher the test voltage is, the stronger the end effect is, the difficulty is caused when the copper-clad plate is detected in the voltage of more than 1KV in a normal state, in order to reduce the end effect, foreign matters at the end part are often removed by manual work in the prior art, and the test is repeated, so that the danger of electric shock can be caused to operators in the process. The method for removing the copper foil part in the embodiment can effectively avoid the electric shock risk of workers, and can expand the withstand voltage test which cannot be executed at more than 1KV due to the end effect to 3 KV.
In the prior art, an attempt to remove the end copper foil by etching technique has been proposed, but the process time is long, which not only pollutes the environment, but also pollutes the surface of the product, and the method provided by the embodiment of the present application does not have the above-mentioned defects.
Example 1
As shown in fig. 6, a manufacturing flow chart of a metal-based copper-clad plate is provided, which specifically comprises the following steps:
step 1: and continuously putting the metal-based copper-clad plate subjected to hot press molding in a horizontal mode, wherein the moving direction of the metal-based copper-clad plate is parallel to one side edge of the metal-based copper-clad plate.
Step 2: a pair of cutters of a milling tool is provided on both sides in the moving direction, and the edge portion of the copper foil is milled by the cutters of the milling tool.
And step 3: and rotating the metal-based copper-clad plate by 90 degrees in the horizontal plane for direction conversion.
And 4, step 4: a pair of cutters of a milling tool is provided on both sides in the moving direction, and the edge portion of the copper foil is milled.
And 5: after the copper foils at the edge parts of 4 sides of the metal-based copper-clad plate are removed, the metal-based copper-clad plate is subjected to voltage resistance test.
Example 2
As shown in fig. 7, a manufacturing flow chart of a metal-based copper-clad plate is provided, which specifically comprises the following steps:
step 1: and continuously putting the metal-based copper-clad plate subjected to hot press molding in a horizontal mode, wherein the moving direction of the metal-based copper-clad plate is parallel to one side edge of the metal-based copper-clad plate.
Step 2: a pair of cutters of a chamfering tool is provided on both sides in the moving direction, and the edge portion of the copper foil is chamfered by the cutters of the chamfering tool.
And step 3: and rotating the metal-based copper-clad plate by 90 degrees in the horizontal plane for direction conversion.
And 4, step 4: a pair of cutters of a chamfering tool is provided on both sides in the moving direction, and the edge portion of the copper foil is chamfered.
And 5: and after chamfering the edge parts of 4 edges of the metal-based copper-clad plate, carrying out voltage resistance test on the metal-based copper-clad plate.
In the embodiment, a milling tool is not used, but a chamfering process is adopted, so that the method has the advantages of high speed and capability of preventing the copper-clad plate from being damaged after touching the edges and corners of the metal-based copper-clad plate. But has a disadvantage that a withstand voltage test cannot be performed at a high voltage.
The embodiment of the invention also discloses a metal-based copper-clad plate which is prepared by the manufacturing method in the embodiment of the invention. Since the copper-clad plate is prepared by the process method of the specific scheme disclosed in the above embodiment, the obtained metal-based copper-clad plate also has all the technical effects of the above embodiment, and details are not repeated here. The metal-based copper-clad plate and the method related thereto according to the above embodiments may further include other necessary components, structures or steps, and the corresponding arrangement position, connection relationship and preparation process can refer to related structures and processes in the prior art, and the connection relationship, operation, process steps and operation principle of each un-mentioned structure are known to those skilled in the art and will not be described in detail herein.
Some embodiments in this specification are described in a progressive or parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A voltage resistance test method of a metal-based copper-clad plate comprises a metal plate, a dielectric layer and a copper foil which are sequentially stacked, and is characterized by comprising the following steps:
cutting off the copper foil at the peripheral edge part of the metal-based copper-clad plate, exposing the dielectric layer below, and forming an annular cutting belt to obtain a copper foil cut-off product;
and connecting a voltage generator to the copper foil on the top of the copper foil cut-out and the metal plate on the bottom of the copper foil cut-out to perform a voltage withstanding test.
2. The withstand voltage testing method according to claim 1, wherein the width of the removed portion of the copper foil does not exceed 13 mm.
3. The withstand voltage testing method according to claim 1, wherein the width of the removed portion of the copper foil is 1mm to 10 mm.
4. The withstand voltage testing method according to claim 1, wherein the edge portion of the copper foil is removed by a milling tool, a cutter of the milling tool rotates, the metal-based copper-clad plate moves in a feeding motion, and the diameter of the cutter matches with the width of the removed portion of the copper foil.
5. The withstand voltage testing method according to claim 4, wherein the milling tool includes a fixing portion for fixing the cutter and a protective cover provided at one end of the fixing portion, the protective cover being interposed between the copper foil and the fixing portion during milling, the protective cover having a hardness less than that of the copper foil.
6. The withstand voltage testing method according to claim 5, wherein the protective cover is made of polytetrafluoroethylene, polyimide, silicone plastic, polyester resin, polypropylene, polyethylene or PPS.
7. The withstand voltage testing method according to claim 1, wherein a chamfer is formed at the edge of the metal-based copper-clad plate by removing the edge portion of the copper foil and a portion of the dielectric layer by a chamfer tool, and the chamfer angle is not more than 30 °.
8. The withstand voltage testing method according to claim 1, wherein the process of obtaining the copper foil cut-out includes:
the first stage, the metal-based copper-clad plate is continuously conveyed in a horizontal mode, and cutters of a milling tool or a chamfering tool are respectively arranged on two sides in the moving direction to remove two opposite sides of the copper foil;
and in the second stage, the metal-based copper-clad plate is rotated by 90 degrees in the horizontal plane and is continuously conveyed, and the two remaining sides of the copper foil are removed by cutters arranged on the two sides in the moving direction.
9. A manufacturing method of a metal-based copper-clad plate is characterized by comprising the withstand voltage test method of the metal-based copper-clad plate of any one of claims 1 to 8.
10. A metal-based copper clad laminate made by the method of any one of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010619155.9A CN111787688A (en) | 2020-06-30 | 2020-06-30 | Metal-based copper-clad plate, and voltage-resistant test method and manufacturing method thereof |
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| CN202010619155.9A CN111787688A (en) | 2020-06-30 | 2020-06-30 | Metal-based copper-clad plate, and voltage-resistant test method and manufacturing method thereof |
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Application publication date: 20201016 |