WO2016149902A1 - Procédé de séparation de carte pcb et équipement associé correspondant - Google Patents

Procédé de séparation de carte pcb et équipement associé correspondant Download PDF

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Publication number
WO2016149902A1
WO2016149902A1 PCT/CN2015/074927 CN2015074927W WO2016149902A1 WO 2016149902 A1 WO2016149902 A1 WO 2016149902A1 CN 2015074927 W CN2015074927 W CN 2015074927W WO 2016149902 A1 WO2016149902 A1 WO 2016149902A1
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WO
WIPO (PCT)
Prior art keywords
pcb
beveled
tooling
wall
board
Prior art date
Application number
PCT/CN2015/074927
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English (en)
Chinese (zh)
Inventor
徐波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580028598.8A priority Critical patent/CN106465544B/zh
Priority to PCT/CN2015/074927 priority patent/WO2016149902A1/fr
Publication of WO2016149902A1 publication Critical patent/WO2016149902A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to the field of circuit board technology, and in particular to a PCB board method and related equipment.
  • the module products adopt the printed circuit board (PCB) solid connection design. Since the module products often need secondary assembly, under the premise of fierce competition of electronic products, the customer's space requirements are higher and higher, so The precision of the sub-board precision of the module products is also getting higher and higher. The customer requires that the PCB sub-board precision of the module product be controlled within 0.15mm. Since the thickness of the industrial and consumer module PCB is 0.8mm or 1.0mm, the thickness of the on-board module PCB is 1.2mm. Or 1.6mm, the laser sub-board process can not be applied to the module product, in the module product sub-board operation, it is affected by factors such as the board precision PCB processing precision (0.15mm tolerance) and the tooling wall processing precision (0.08mm tolerance).
  • PCB printed circuit board
  • Module products can not design positioning holes. In this case, we can only rely solely on the limit of tooling wall. At present, our PCB board and sub-board tooling walls are right angle design, and the module product board accuracy is difficult to meet customer requirements of 0.15. Mm, module products often appear in the verification process of the PCB sub-board accuracy does not meet the standards affect the product's assembly and reliability.
  • the existing PCB sub-board technical solution is: affixing adhesive tape on the tooling wall, using the sub-board equipment for the sub-board operation, inspecting the products obtained after the operation, and processing the products that do not meet the specifications by using the boring method. .
  • Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
  • a first aspect of the present invention provides a printed circuit board PCB design method, including:
  • the PCB board is obtained by cutting the beveled PCB board with a PCB board machine.
  • An angle of the first oblique angle formed by the first side surface and the vertical direction is between 5 degrees and 10 degrees;
  • the angle of the second bevel formed by the second side and the vertical direction is between 5 and 10 degrees.
  • the first oblique angle is equal to the second oblique angle.
  • the cross section of the beveled PCB panel is an inverted trapezoid, and the oblique side of the cross section of the beveled PCB panel corresponds to the first side or the second side.
  • the first embodiment of the first aspect of the present invention, the second embodiment of the first aspect of the present invention, or the third embodiment of the first aspect of the present invention, in the fourth embodiment of the first aspect of the present invention is referred to the first aspect of the present invention.
  • the side of the tooling wall for abutting the first side or the second side is a slope, and the angle of the slope formed by the slope with the vertical direction is between 1.5 and 2.5 degrees.
  • the tooling wall has a trapezoidal cross section.
  • the placing the beveled PCB panel between the at least two tooling walls on the PCB sub-tooling comprises:
  • the angled milling cutter is used to cut the edge of the ordinary PCB, and the first side and the second side of the ordinary PCB are processed into a slope to obtain the inclined PCB.
  • the angle cutter has an edge angle of between 5 and 10 degrees.
  • the third side of the beveled PCB panel and the fourth side opposite to the third side are both inclined surfaces, and the inclined PCB board is placed between at least two tooling walls on the PCB boarding machine ,include:
  • the third tooling wall and the fourth tooling wall are two of the at least two tooling walls;
  • the first, second, third and fourth tooling walls enclose a rectangle having the same shape as the beveled PCB panel.
  • the thickness of the beveled PCB panel is between 0.8 mm and 1.6 mm.
  • the beveled PCB panel is placed between the at least two tooling walls on the PCB sub-tool, the first side of the beveled PCB panel and the second side opposite to the first side are beveled, first The side abutting is on the first tooling wall, the second side is abutting on the second tooling wall, and the first tooling wall and the second tooling wall are two of the at least two tooling walls, using the PCB.
  • the board machine cuts the PCB board to obtain the PCB board. Since the side of the slope PCB board is a slope, in the process of cutting the PCB board by the PCB board machine, the error in the cutting process can be effectively eliminated to the accuracy of the PCB board. The impact increases the efficiency of production and improves the reliability of the product.
  • FIG. 1 is a flowchart of a PCB design method according to an embodiment of the present invention
  • FIG. 2 is a schematic view of a beveled PCB panel according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of cutting a beveled PCB panel by using a PCB splitter according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a PCB board obtained by cutting a beveled PCB board using a PCB boarding machine according to an embodiment of the present invention.
  • Embodiments of the present invention provide a PCB design method for solving the problem of low production efficiency and low product reliability caused by the use of adhesive tape and boring in the existing PCB sub-board technology.
  • an embodiment of the present invention improves a PCB design method, which may include:
  • a beveled PCB panel that needs to be divided is provided.
  • the beveled PCB panel 201 is obtained by cutting the ordinary PCB panel 20 by the angle milling cutter 202, and the angle of the blade of the angle milling cutter 20 is inclined.
  • the side surface of the beveled PCB panel 201 can be obtained as an oblique angle, the angle of the oblique angle is between 5 and 10 degrees, and the oblique side of the inverted ladder pattern of the beveled PCB panel 201 is 2013 and
  • the oblique side 2014 corresponds to the first side or the second side of the beveled PCB panel 201
  • L is the difference between the length of the lower base 2011 and the length of the upper base 2012 in the inverted trapezoidal figure of the cross section of the beveled PCB panel 201, L
  • the relationship between the thickness of the inclined PCB board and the inclined surface is shown in Table 1.
  • the general PCB processing tolerance is 0.15mm, the angle of the side of the inclined PCB board is 5 degrees to 10 degrees, and the thickness of the inclined PCB board is When 0.8mm, the value of L is 0.07mm ⁇ 0.148mm, which can reduce the influence of PCB processing tolerance on the accuracy of product board. When the thickness of the inclined PCB board is 1.0mm, the value of L is 0.0875mm ⁇ 0.176mm, which can reduce the PCB.
  • the processing tolerance affects the accuracy of the product board; when the thickness of the inclined PCB board is 1.2mm, the value of L is 0.105 ⁇ 0. .211mm can overcome the influence of PCB processing tolerance on the accuracy of product sub-board. When the thickness of the inclined PCB board is 1.6mm, the value of L is 0.14 ⁇ 0.281mm, which can overcome the influence of PCB processing tolerance on the accuracy of product sub-board.
  • the beveled PCB panel 301 is placed between the two tooling walls on the PCB sub-tool 30, and the first side 304 of the beveled PCB panel 301 is abutted on the first tooling wall 302.
  • the second side surface 305 is abutted on the second tooling wall 303, and the upper surface of the inclined PCB board is larger than the small surface, and the first tooling wall 302 and the second tooling wall 303 are used to abut the first side 304 or the first
  • the side surface of the two side faces 305 is a sloped surface.
  • the angle of the oblique angle formed by the inclined surface and the vertical direction is between 1.5 degrees and 2.5 degrees.
  • the cross section of the first tooling wall 302 and the second tooling wall 303 is trapezoidal.
  • the inclined surface PCB The third side of the panel 301 and the fourth side opposite to the third side may be respectively supported by the third tooling wall and the fourth tooling wall, the first tooling wall 302, the second tooling wall 303, and the The three-piece retaining wall and the fourth tooling retaining wall enclose a rectangle having the same shape as the beveled PCB panel.
  • the PCB board machine cuts the inclined PCB board to obtain the PCB board.
  • the blade 306 of the PCB splitter performs a cutting operation on the inclined PCB board 301, and the four mutually independent product areas 401 on the inclined PCB board 301 are cut.
  • the four PCB boards 401 are obtained.
  • the inclined PCB board may have multiple independent product areas, and the shape of the product area is not limited herein.
  • the side surface of the inclined PCB board is a sloped surface, and the angle of the inclined surface is between 5 degrees and 10 degrees.
  • the board thickness of the inclined PCB board is combined.
  • the angle of the bevel the value of the tolerance L of the lower surface of the beveled PCB board can be obtained, according to Relevant experience of the industry, when the value of L is greater than the PCB processing tolerance value, the cutting error of the PCB boarding machine can be effectively eliminated, so that the accuracy of the PCB board is not affected, the production efficiency is improved, and the product is improved. reliability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Structure Of Printed Boards (AREA)
  • Milling, Drilling, And Turning Of Wood (AREA)

Abstract

L'invention concerne un procédé de séparation de carte PCB, comprenant les étapes suivantes : placer des cartes (201, 301) de séparation de PCB à surface inclinée entre au moins deux parois de retenue d'outil sur un outil (30) de séparation de carte PCB, les premières surfaces latérales (304) et les secondes surfaces latérales (305) face aux premières surfaces latérales (304) des cartes (201, 301) de séparation de PCB à surface inclinée étant toutes des surfaces inclinées, les premières surfaces latérales (304) venant en butée contre la première paroi de retenue d'outil (302), les secondes surfaces latérales (305) venant en butée contre la seconde paroi de retenue d'outil (303) et la première paroi de retenue d'outil (302) et la seconde paroi de retenue d'outil (303) étant deux parois parmi au moins deux parois de retenue d'outil (303) ; et découper les cartes (201, 301) de séparation de PCB à surface inclinée à l'aide d'une machine de séparation de carte PCB afin d'obtenir des cartes PCB uniques (401). Le procédé est utilisé pour résoudre les problèmes posés par la technologie de séparation de carte PCB classique en matière de faible efficacité de production et de mauvaise fiabilité du produit en raison de l'utilisation d'un ruban adhésif pour le collage et d'un racloir pour réaliser le polissage.
PCT/CN2015/074927 2015-03-24 2015-03-24 Procédé de séparation de carte pcb et équipement associé correspondant WO2016149902A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580028598.8A CN106465544B (zh) 2015-03-24 2015-03-24 Pcb分板方法及其相关设备
PCT/CN2015/074927 WO2016149902A1 (fr) 2015-03-24 2015-03-24 Procédé de séparation de carte pcb et équipement associé correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/074927 WO2016149902A1 (fr) 2015-03-24 2015-03-24 Procédé de séparation de carte pcb et équipement associé correspondant

Publications (1)

Publication Number Publication Date
WO2016149902A1 true WO2016149902A1 (fr) 2016-09-29

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PCT/CN2015/074927 WO2016149902A1 (fr) 2015-03-24 2015-03-24 Procédé de séparation de carte pcb et équipement associé correspondant

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CN (1) CN106465544B (fr)
WO (1) WO2016149902A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107660071A (zh) * 2017-10-30 2018-02-02 广东智科电子股份有限公司 一种pcb拼板
CN108601213A (zh) * 2018-06-13 2018-09-28 深圳市诚志电路有限公司 一种pcb拼板及锣板方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109561593A (zh) * 2018-12-26 2019-04-02 苏州光韵达自动化设备有限公司 一种自动分板机

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JP2003324253A (ja) * 2002-04-30 2003-11-14 Elna Co Ltd プリント配線板およびその製造方法
CN102036493A (zh) * 2010-12-29 2011-04-27 上海华勤通讯技术有限公司 一种有效利用pcb拼板边角料的方法
CN102438399A (zh) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
CN102869195A (zh) * 2012-09-25 2013-01-09 青岛海信电器股份有限公司 批量生产印制电路板的方法及装置
CN203523148U (zh) * 2013-10-18 2014-04-02 北大方正集团有限公司 一种印刷电路板拼板
CN103547077A (zh) * 2013-10-25 2014-01-29 深圳雷柏科技股份有限公司 具有多个夹头的夹持机构和pcb板测试及分板生产线
CN204157166U (zh) * 2014-08-13 2015-02-11 中国船舶重工集团公司第七〇九研究所 一种拼装电路板分板装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107660071A (zh) * 2017-10-30 2018-02-02 广东智科电子股份有限公司 一种pcb拼板
CN108601213A (zh) * 2018-06-13 2018-09-28 深圳市诚志电路有限公司 一种pcb拼板及锣板方法

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CN106465544B (zh) 2019-05-03

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