CN102869195A - Method and device for batch production of printed circuit board - Google Patents
Method and device for batch production of printed circuit board Download PDFInfo
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- CN102869195A CN102869195A CN 201210358479 CN201210358479A CN102869195A CN 102869195 A CN102869195 A CN 102869195A CN 201210358479 CN201210358479 CN 201210358479 CN 201210358479 A CN201210358479 A CN 201210358479A CN 102869195 A CN102869195 A CN 102869195A
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- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000010923 batch production Methods 0.000 title abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims abstract description 68
- 238000012545 processing Methods 0.000 claims abstract description 53
- 238000005476 soldering Methods 0.000 claims description 56
- 238000003780 insertion Methods 0.000 claims description 34
- 230000037431 insertion Effects 0.000 claims description 34
- 238000003466 welding Methods 0.000 claims description 23
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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Abstract
The invention discloses a method and a device for batch production of printed circuit boards. Main printed circuit boards and secondary printed circuit boards which are designed together in advance are produced in a whole board manner, so as to form N batches of whole boards; the secondary printed circuit boards which are carried out fixation processing and board separation processing in the ith batch of whole boards are inserted into the main printed circuit boards of the i+1 batch of whole boards, wherein i is the serial number of the batch, is a natural number and is less than N; the i+1 batch of whole boards into which the ith batch of secondary printed circuit boards are carried out fixation processing and board separation processing, so as to obtain the main printed circuit boards as integrated main printed circuit boards of the i+1 batch of whole boards, and as secondary printed circuit boards of the i+2 batch. Applying the invention, production cost can be reduced, and production efficeitncy can be promoted.
Description
Technical Field
The invention relates to a printed circuit board technology, in particular to a method and a device for producing printed circuit boards in batch.
Background
With the wide application of semiconductor devices, in order to realize the assembly of electronic components in electronic equipment, the electronic components are widely mounted on main and auxiliary Printed Circuit Boards (PCBs), that is, the main and auxiliary printed circuit boards are subjected to processes such as mounting, mechanical insertion, wave soldering, and the like, and then the main and auxiliary printed circuit boards subjected to mounting, mechanical insertion, wave soldering are inserted and fixed, so as to form an integrated printed circuit board, for example, a core board in a television and a main board of a computer are formed by inserting the main and auxiliary printed circuit boards which are independent from each other. Since the circuits and components forming the main and sub printed circuit boards are different, different types of electronic components and different plugging processes are required to be adopted to plug the main and sub printed circuit boards so as to finally form the formed integrated printed circuit board.
In the prior art, when a main printed circuit board and an auxiliary printed circuit board need to be interconnected and spliced by welding, generally, after the main printed circuit board and the auxiliary printed circuit board are produced, required electronic components are respectively arranged on the main printed circuit board and the auxiliary printed circuit board in a patch and machine plugging manner, and then wave soldering is carried out to fix the electronic components arranged on the printed circuit board in the patch and machine plugging manner; and then, inserting the main printed circuit board and the auxiliary printed circuit board together, and then welding the inserted main printed circuit board and the auxiliary printed circuit board, thereby completing the production of the printed circuit boards. From the whole production process, the method comprises two serial production processes.
FIG. 1 is a schematic flow chart of a conventional method for manufacturing a printed circuit board. Referring to fig. 1, taking the example of plugging the main pcb a and the sub pcb B, the process includes:
101, independently producing a main printed circuit board A and an auxiliary printed circuit board B, and carrying out surface mounting, machine plugging and wave soldering processes on the auxiliary printed circuit board B;
in the step, the pre-produced main printed circuit board A and the auxiliary printed circuit board B are two independent printed circuit boards, wherein the main printed circuit board and the auxiliary printed circuit board can be produced in batch, after the printed circuit boards are produced, required electronic components are subjected to surface mounting and machine insertion process treatment on the printed circuit boards through surface mounting, machine insertion, wave soldering and other process treatment according to the requirements of the arrangement of the electronic components on the auxiliary printed circuit boards, and then the electronic components connected to the PCB in a surface mounting and machine insertion mode are welded and fixed on the auxiliary printed circuit boards.
In the embodiment of the invention, the auxiliary printed circuit board B is firstly subjected to the procedures of surface mounting, machine insertion, wave soldering and the like, namely, is subjected to fixing treatment.
102, carrying out surface mounting and machine inserting process treatment on the main printed circuit board A;
in the step, after the main printed circuit board A is subjected to surface mounting and machine plugging procedures according to the requirement of the arrangement of the electronic components on the main printed circuit board, the required electronic components are fixed on the auxiliary main printed circuit board to form a semi-finished product.
And 103, inserting the secondary printed circuit board B subjected to the process treatment onto the main printed circuit board A, and performing wave crest welding process treatment to obtain an inserted printed circuit board.
In the step, the auxiliary printed circuit board B and the main printed circuit board A which are processed by the working procedure are processed by the inserting working procedure, and after the auxiliary printed circuit board B and the main printed circuit board A are inserted together, the auxiliary printed circuit board B and the main printed circuit board A are processed by the wave soldering working procedure to form a finished product, namely the inserted printed circuit board.
Therefore, the conventional method for inserting the printed circuit boards has the advantages that the main printed circuit board and the auxiliary printed circuit boards are independently produced, so that the production cost is high; furthermore, the insertion of the printed circuit board needs to be performed by two independent patches, two machine insertions and two wave soldering, so that the production flow of the main printed circuit board a and the auxiliary printed circuit board B which are inserted into the printed circuit board is a serial production flow, the production process flows are more, and the production efficiency is lower.
Disclosure of Invention
The embodiment of the invention provides a method for producing printed circuit boards in batch, which reduces the production cost and improves the production efficiency.
The embodiment of the invention also provides a device for producing the printed circuit boards in batch, which reduces the production cost and improves the production efficiency.
In order to achieve the above object, an embodiment of the present invention provides a method for mass production of printed circuit boards, including:
carrying out whole-board production on the main printed circuit board and the auxiliary printed circuit board which are designed together in advance to form N batches of whole boards;
inserting a secondary printed circuit board which is obtained by fixing and board dividing processing in the ith batch of whole boards on a main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N;
and fixing and separating the i +1 th batch of whole boards which are inserted with the i-th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the i +1 th batch of whole boards and the i +2 th batch of auxiliary printed circuit boards.
Wherein the method further comprises:
judging whether i is less than or equal to N-1, if not, inserting the (i + 1) th batch of sub-printed circuit boards subjected to board splitting on the first batch of main printed circuit boards, and performing wave-soldering; if so, adding 1 to the serial number of the batch, and returning to execute the step of inserting the auxiliary printed circuit board obtained by fixing processing and board splitting processing in the integral board of the ith batch on the main printed circuit board in the integral board of the (i + 1) th batch.
Wherein, i equals 1, the inserting of the auxiliary printed circuit board which is obtained by fixing and board-dividing processing in the ith batch of whole boards on the main printed circuit board in the (i + 1) th batch of whole boards specifically comprises:
carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards;
dividing the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards, and performing wave soldering process on the auxiliary printed circuit boards of the divided boards;
and inserting the auxiliary printed circuit board of the first batch into the main printed circuit board of the whole second batch after wave soldering process treatment.
Wherein, to the (i + 1) th batch whole board that has the vice printed circuit board of the ith batch of pegging graft, carry out fixed processing and divide the board to handle and include:
carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the plugged (i + 1) th batch of whole boards;
wave soldering is carried out on the main printed circuit board and the auxiliary printed circuit board in the i +1 th batch of whole boards and the auxiliary printed circuit board in the i th batch of main printed circuit boards inserted on the i +1 th batch of main printed circuit boards;
and dividing the (i + 1) th batch of main and auxiliary printed circuit boards subjected to wave soldering to obtain a main printed circuit board serving as an integrated main printed circuit board in the (i + 1) th batch of whole boards and an auxiliary printed circuit board serving as the (i + 2) th batch of auxiliary printed circuit boards.
Wherein the pre-designed main printed circuit board and the sub printed circuit board are rectangular in shape.
The rectangular main printed circuit board and the rectangular auxiliary printed circuit board are directly connected through the connecting support plate.
An apparatus for mass production of printed circuit boards, the apparatus comprising: a whole plate generation module, a first plate dividing module and a second plate dividing module, wherein,
the whole board generation module is used for carrying out whole board production on the main printed circuit board and the auxiliary printed circuit board which are designed together in advance to form N batches of whole boards;
the first board splitting module is used for inserting the auxiliary printed circuit board which is fixedly processed and obtained through board splitting processing in the ith batch of whole boards into the main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N;
and the second board dividing module is used for carrying out fixing treatment and board dividing treatment on the (i + 1) th batch of whole boards which are inserted with the (i) th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board which is used as the (i + 2) th batch of auxiliary printed circuit boards.
The apparatus further comprises:
the judging module is used for judging whether i is smaller than or equal to N-1, if not, the (i + 1) th batch of sub-printed circuit boards subjected to board splitting are inserted on the first batch of main printed circuit boards, and wave soldering is carried out; if so, adding 1 to the batch serial number and outputting the batch serial number to the first board dividing module.
The first splitter module comprises: a patch and machine insertion processing unit, a first board dividing unit, a welding processing unit and an insertion unit, wherein,
the chip mounting and machine inserting processing unit is used for carrying out chip mounting and machine inserting process processing on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards when i is equal to 1;
the first board dividing unit is used for dividing the main and auxiliary printed circuit boards in the first batch of whole boards;
the welding processing unit is used for carrying out wave soldering process on the sub printed circuit board of the sub board;
and the inserting unit is used for inserting the auxiliary printed circuit board of the first batch into the main printed circuit board of the whole second batch after wave soldering process treatment.
The second board dividing module comprises: a patch and plug processing unit, a welding processing unit and a second board dividing unit, wherein,
the patch and machine insertion processing unit is used for performing patch and machine insertion process processing on the main printed circuit board and the auxiliary printed circuit board in the inserted (i + 1) th batch of whole boards;
the welding processing unit is used for carrying out wave soldering on the main printed circuit board and the auxiliary printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board in the (i + 1) th batch of main printed circuit boards;
and the second board dividing unit is used for dividing the (i + 1) th batch of main and auxiliary printed circuit boards subjected to wave soldering to obtain the main printed circuit board serving as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board serving as the (i + 2) th batch of auxiliary printed circuit boards.
According to the technical scheme, the method and the device for producing the printed circuit boards in batches provided by the embodiment of the invention have the advantages that the main printed circuit board and the auxiliary printed circuit board which are designed together in advance are subjected to whole board production to form N batches of whole boards; inserting a secondary printed circuit board which is obtained by fixing and board dividing processing in the ith batch of whole boards on a main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N; and fixing and separating the i +1 th batch of whole boards which are inserted with the i-th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the i +1 th batch of whole boards and the i +2 th batch of auxiliary printed circuit boards. Therefore, the main and auxiliary printed circuit boards are designed into an integrated production process, so that the production cost can be effectively reduced; each integrated printed circuit board is inserted and connected, only one-time insertion, one-time surface mounting and one-time wave peak welding are needed, the production process flow is less, and the production efficiency is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is to be understood that the drawings in the following description are merely exemplary of the invention and that other embodiments and drawings may be devised by those skilled in the art based on the exemplary embodiments shown in the drawings.
FIG. 1 is a schematic flow chart of a conventional method for manufacturing a printed circuit board.
Fig. 2 is a flow chart illustrating a method for mass production of printed circuit boards according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a main pcb and a sub-pcb which are integrally produced according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a main pcb and a sub-pcb formed by dividing a whole board according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram illustrating a first batch of secondary printed circuit boards being plugged onto a second batch of primary printed circuit boards in a complete board according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a printed circuit board obtained by splitting the i +1 th batch of main and auxiliary printed circuit boards according to the embodiment of the present invention.
Fig. 7 is a schematic structural diagram illustrating the insertion of the (i + 1) th batch of secondary pcbs onto the first batch of primary pcbs according to the embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a device for plugging a printed circuit board according to an embodiment of the invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the existing method for producing the printed circuit boards in batches, the main printed circuit board and the auxiliary printed circuit board are produced independently, so that the production cost is higher; and a serial production process flow is adopted, so that more production process flows are required, and the production efficiency is lower.
In the embodiment of the invention, a production process for designing the main and auxiliary printed circuit boards into a whole is considered, and a method for inserting the main and auxiliary printed circuit boards into the integrated printed circuit board through a parallel production process is provided, so that a serial production process is changed into a parallel production process, the production processes are reduced, and the production efficiency is improved. The method is suitable for the design and manufacture of the main and auxiliary printed circuit boards which need to be connected together through welding.
Fig. 2 is a flow chart illustrating a method for mass production of printed circuit boards according to an embodiment of the present invention. Referring to fig. 2, the process includes:
in this step, when designing the printed circuit board, the main printed circuit board a and the sub printed circuit board B are spliced together in advance as a whole board. Different from the existing design that the main printed circuit board A and the auxiliary printed circuit board B are separated, in the embodiment of the invention, the main printed circuit board A and the auxiliary printed circuit board B are only physically connected together, and the structure of the main printed circuit board A and the auxiliary printed circuit board B is not changed. Therefore, the main and auxiliary printed circuit boards are connected together to carry out whole board production, and can be molded and produced by one molding machine without respectively molding and producing by two molding machines, so that the production cost is lower.
Preferably, the shape of the pre-designed main printed circuit board and the pre-designed auxiliary printed circuit board is rectangular, and the rectangular main printed circuit board and the rectangular auxiliary printed circuit board are connected through the connecting support plate.
Fig. 3 is a schematic structural diagram of a main pcb and a sub-pcb which are integrally produced according to an embodiment of the present invention. Referring to fig. 3, the main pcb 301 and the sub pcb 302 are rectangular, and are connected to each other through a connecting strip 303.
In the embodiment of the invention, the main printed circuit board and the auxiliary printed circuit board which are connected through the connecting support plate are called a batch of printed circuit boards. Thus, by automated production, multiple batches of printed circuit boards can be produced.
in this step, the fixing process includes: the method comprises the steps of surface mounting process treatment, machine insertion and wave soldering process treatment and combination process treatment of the surface mounting process treatment and the machine insertion and wave soldering process treatment.
If the ith batch is the first batch of the embodiment of the present invention, that is, the processing of the ith batch is the first step processing flow of the plugged printed circuit board of the embodiment of the present invention, where i is 1, the plugging of the sub-printed circuit board, which is obtained by performing the fixing processing and the board dividing processing on the whole board of the ith batch, on the main printed circuit board in the whole board of the (i + 1) th batch specifically includes:
a11, carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards;
in the step, the whole-board mounting and the machine insertion are carried out on the main printed circuit board and the auxiliary printed circuit board in the whole board of the first batch of production. It should be noted that if the printed circuit board is subjected to the die attach process only, the subsequent wave soldering process is not required to be performed, but in practical applications, the die attach and the machine insertion exist simultaneously in the printed circuit board, and therefore the subsequent wave soldering process is required to be performed. Compared with the prior art that the main printed circuit board and the auxiliary printed circuit board are separated in the processes of surface mounting, machine insertion and welding, the whole-board surface mounting and machine insertion are carried out on the main printed circuit board and the auxiliary printed circuit board which are spliced together, the production efficiency can be improved, and the surface mounting and the machine insertion are prepared for the later-stage welding to form the integrated printed circuit board.
A12, dividing the main and auxiliary printed circuit boards in the first batch of whole boards, and performing wave soldering process on the divided auxiliary printed circuit boards;
in the step, after the processes of surface mounting and machine insertion are carried out, the main printed circuit board and the auxiliary printed circuit board in the whole board of the first batch are manually separated for board separation or automatically separated by a machine for subsequent use. For example, the whole board is separated into a main printed circuit board a and a sub printed circuit board B, which are independent, and the main printed circuit board a is ready for use.
In the embodiment of the invention, because the sub-printed circuit boards of the first batch are required to be inserted into the main printed circuit board of the whole board of the second batch (next batch), in order to ensure that the electronic components processed by the chip mounting and machine inserting process are fixed on the sub-printed circuit boards of the first batch when the sub-printed circuit boards of the first batch are inserted, the sub-printed circuit boards of the first batch are required to be independently soldered, that is, the electronic components on the sub-printed circuit boards B of the first batch are soldered by wave soldering so as to fix the electronic components arranged on the sub-printed circuit boards B.
In the embodiment of the invention, electronic components processed by the patch and plug processes on the auxiliary printed circuit board B of the first batch need to be welded by wave soldering so as to be fixed on the auxiliary printed circuit board B; then, the first batch of the secondary printed circuit board B and the second batch of the primary printed circuit board A are inserted together, the connection form is similar to a memory bank inserted on a computer mainboard, and the difference is that the secondary printed circuit board B is not inserted on the mainboard but welded on the mainboard.
And A13, inserting the first batch of secondary printed circuit boards after wave soldering process treatment into the main printed circuit board in the second batch of whole boards.
In this step, the sub-pcb of the first lot is plugged into the main pcb of the second lot of the whole boards that are not split, that is, the sub-pcb of the first lot is plugged into the main pcb of the second lot of the whole boards.
Fig. 4 is a schematic structural diagram of a main pcb and a sub-pcb formed by dividing a whole board according to an embodiment of the present invention. Referring to fig. 4, after the entire board is separated, a main printed circuit board 401 and a sub printed circuit board 402 independent from each other are formed.
Fig. 5 is a schematic structural diagram illustrating a first batch of secondary printed circuit boards being plugged onto a second batch of primary printed circuit boards in a complete board according to an embodiment of the present invention. Referring to fig. 5, the main pcb 501 of the second batch of boards is directly connected to the sub-pcb 502, and the sub-pcb 503 of the first batch is plugged onto the main pcb 501.
And 203, fixing and separating the i +1 th batch of whole boards inserted with the i-th batch of auxiliary printed circuit boards to obtain the main printed circuit board serving as the integrated main printed circuit board in the i +1 th batch of whole boards and the auxiliary printed circuit board serving as the i +2 th batch of auxiliary printed circuit boards.
The method specifically comprises the following steps:
a21, carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the plugged (i + 1) th batch of whole boards;
a22, wave soldering the main printed circuit board and the auxiliary printed circuit board in the i +1 th batch of whole boards and the auxiliary printed circuit board in the i +1 th batch of main printed circuit boards;
in this step, after the above-mentioned process, the sub-pcb of the ith batch of the sub-pcbs is inserted into the main pcb of the (i + 1) th batch of the whole boards, and the inserted (i + 1) th batch of the whole boards are soldered by wave soldering, so that the three parts of soldering can be completed simultaneously: one is the welding of electronic components processed by the processes of surface mounting and machine insertion on the auxiliary printed circuit board in the whole board of the (i + 1) th batch; secondly, welding electronic components processed by the processes of surface mounting and machine insertion on the main printed circuit board in the whole board of the (i + 1) th batch; and thirdly, welding the main printed circuit board in the whole board of the (i + 1) th batch and the auxiliary printed circuit board in the board of the (i) th batch.
And A23, splitting the main and auxiliary printed circuit boards of the (i + 1) th batch after wave soldering to obtain the main printed circuit board serving as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board serving as the (i + 2) th batch of whole boards.
In this step, wave soldering is performed, the main printed circuit board with the ith batch of auxiliary printed circuit boards is inserted into the (i + 1) th batch of main printed circuit boards, and the auxiliary printed circuit boards in the (i + 1) th batch of whole boards are finished boards, the auxiliary printed circuit boards in the whole boards are separated from the main printed circuit board in the whole boards, the auxiliary printed circuit boards are used for performing the process flow of inserting the auxiliary printed circuit boards on the main printed circuit boards and the auxiliary printed circuit boards in the next batch of whole boards, and the process is repeated. That is, the sub-pcb of the current batch is inserted into the main pcb of the next batch and is soldered and fixed by wave soldering, and then the sub-pcb of the next batch is inserted into the main pcb of the next batch and is soldered and fixed by wave soldering, and the sub-pcb of the previous batch is inserted into the main pcb of each batch, and the above process is repeated.
Fig. 6 is a schematic structural diagram of a printed circuit board obtained by splitting the i +1 th batch of main and auxiliary printed circuit boards according to the embodiment of the present invention. Referring to fig. 6, after the i +1 th batch of whole boards are separated, the i +1 th batch of main printed circuit boards 601 and the i +1 th batch of sub printed circuit boards 602 which are independent from each other are obtained, wherein the i +1 th batch of main printed circuit boards 601 are soldered with the i th batch of sub printed circuit boards 603 by wave soldering.
Preferably, the method may further include:
204, judging whether i is less than or equal to N-1 (i is less than or equal to N-1), if not, inserting the (i + 1) th batch of sub-printed circuit boards subjected to board splitting on the first batch of main printed circuit boards, and performing wave-soldering; if yes, add 1 to the batch serial number (i ═ i + 1), and return to step 202.
In this step, if the batch serial number is equal to the number of batches formed in production, it indicates that the current plugging process has reached the last batch of the whole boards, and the secondary printed circuit board obtained through the board splitting process should be plugged onto the primary printed circuit board of the first batch. If the batch serial number is less than the number of batches formed by production, the steps 202 to 204 are executed in a loop, and the integrated printed circuit boards are inserted until the batch serial number is equal to the number of batches formed by production. Thus, according to the method for mass production of the printed circuit boards in the embodiment of the invention, each integrated printed circuit board formed by splicing only needs to be processed by one-time insertion, one-time patching and one-time wave crest soldering.
Through the process, a new parallel production process is formed: the main printed circuit board A of the current batch is inserted with the auxiliary printed circuit board B of the previous batch, and only one time of insertion, one time of surface mounting and one time of wave peak welding are needed, namely, the parallel production process of the simultaneous production of the main printed circuit board and the auxiliary printed circuit board can save about half of the production time compared with the existing production process, and especially for mass production, the production efficiency of the printed circuit boards can be greatly improved.
Fig. 7 is a schematic structural diagram illustrating the insertion of the (i + 1) th batch of secondary pcbs onto the first batch of primary pcbs according to the embodiment of the present invention. Referring to fig. 7, the (i + 1) th batch of sub printed circuit boards 702 are inserted into the first batch of main printed circuit boards 701, and the (i + 1) th batch of sub printed circuit boards 702 are fixed to the first batch of main printed circuit boards 701 by wave soldering the main printed circuit boards 701 and the sub printed circuit boards 702.
As can be seen from the above, in the method for mass production of printed circuit boards according to the embodiment of the present invention, the main printed circuit board and the sub printed circuit board which are designed in advance are subjected to whole board production to form N batches of whole boards; and inserting the auxiliary printed circuit board which is obtained through fixing treatment and board splitting treatment in the ith batch of whole boards on the main printed circuit board in the (i + 1) th batch of whole boards, and carrying out fixing treatment and board splitting treatment on the (i + 1) th batch of whole boards inserted with the ith batch of auxiliary printed circuit boards to obtain the main printed circuit board which is taken as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board which is taken as the (i + 2) th batch of whole boards. Therefore, the main printed circuit board and the auxiliary printed circuit board are designed into an integrated production process, so that the production cost is effectively reduced; the method comprises the steps of inserting the auxiliary printed circuit board of the previous batch on the main printed circuit board of the current batch, and carrying out surface mounting, mechanical insertion, wave-soldering welding and board splitting treatment to obtain the integrated printed circuit board and the auxiliary printed circuit board for the next batch.
Fig. 8 is a schematic structural diagram of an apparatus for mass production of printed circuit boards according to an embodiment of the present invention. Referring to fig. 8, the apparatus includes: a whole plate generation module, a first plate dividing module and a second plate dividing module, wherein,
the whole board generation module is used for carrying out whole board production on the main printed circuit board and the auxiliary printed circuit board which are designed together in advance to form N batches of whole boards;
in the embodiment of the invention, when the printed circuit board is designed, the main printed circuit board A and the auxiliary printed circuit board B are spliced together in advance to be used as a whole board. Therefore, the main and auxiliary printed circuit boards are connected together to carry out whole board production, and can be molded and produced by one molding machine without respectively molding and producing by two molding machines, so that the production cost is lower.
The first board splitting module is used for inserting the auxiliary printed circuit board which is fixedly processed and obtained through board splitting processing in the ith batch of whole boards into the main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N;
and the second board dividing module is used for carrying out fixing treatment and board dividing treatment on the (i + 1) th batch of whole boards which are inserted with the (i) th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board which is used as the (i + 2) th batch of auxiliary printed circuit boards.
In the embodiment of the invention, the secondary printed circuit board of the current batch (i batch) is inserted and connected on the main printed circuit board of the next batch (i +1 batch) and is welded and fixed through wave soldering, then the secondary printed circuit board of the next batch is inserted and connected on the main printed circuit board of the next batch and is welded and fixed through wave soldering, the secondary printed circuit board of the previous batch is inserted and connected on the main printed circuit board of each batch, and the process is repeated.
Preferably, the apparatus may further comprise:
the judging module is used for judging whether i is smaller than or equal to N-1, if not, the (i + 1) th batch of sub-printed circuit boards subjected to board splitting are inserted on the first batch of main printed circuit boards, and wave soldering is carried out; if so, adding 1 to the batch serial number and outputting the batch serial number to the first board dividing module.
In the embodiment of the invention, the judging module judges the batch serial numbers in the second board dividing module after the second board dividing module finishes processing so as to determine whether to execute the processing flow circularly.
Wherein,
the first board dividing module comprises: a patch and plug processing unit, a first board dividing unit, a welding processing unit, and a plug unit (not shown in the figure), wherein,
the chip mounting and machine inserting processing unit is used for carrying out chip mounting and machine inserting process processing on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards when i is equal to 1;
the first board dividing unit is used for dividing the main and auxiliary printed circuit boards in the first batch of whole boards;
the welding processing unit is used for carrying out wave soldering process on the sub printed circuit board of the sub board;
and the inserting unit is used for inserting the auxiliary printed circuit board of the first batch into the main printed circuit board of the whole second batch after wave soldering process treatment.
In the embodiment of the invention, when i is larger than 1, the first board splitting module directly obtains the auxiliary printed circuit board subjected to board splitting treatment in the ith batch of whole boards, and the auxiliary printed circuit board is treated by a fixing procedure.
The second board dividing module comprises: a patch and plug processing unit, a soldering processing unit, and a second board dividing unit (not shown in the drawings), wherein,
the patch and machine insertion processing unit is used for performing patch and machine insertion process processing on the main printed circuit board and the auxiliary printed circuit board in the inserted (i + 1) th batch of whole boards;
the welding processing unit is used for carrying out wave soldering on the main printed circuit board and the auxiliary printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board in the (i + 1) th batch of main printed circuit boards;
and the second board dividing unit is used for dividing the (i + 1) th batch of main and auxiliary printed circuit boards subjected to wave soldering to obtain the main printed circuit board serving as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board serving as the (i + 2) th batch of auxiliary printed circuit boards.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also encompasses these modifications and variations.
Claims (10)
1. A method of mass producing printed circuit boards, the method comprising:
carrying out whole-board production on the main printed circuit board and the auxiliary printed circuit board which are designed together in advance to form N batches of whole boards;
inserting a secondary printed circuit board which is obtained by fixing and board dividing processing in the ith batch of whole boards on a main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N;
and fixing and separating the i +1 th batch of whole boards which are inserted with the i-th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the i +1 th batch of whole boards and the i +2 th batch of auxiliary printed circuit boards.
2. The method of claim 1, wherein the method further comprises:
judging whether i is less than or equal to N-1, if not, inserting the (i + 1) th batch of sub-printed circuit boards subjected to board splitting on the first batch of main printed circuit boards, and performing wave-soldering; if so, adding 1 to the serial number of the batch, and returning to execute the step of inserting the auxiliary printed circuit board obtained by fixing processing and board splitting processing in the integral board of the ith batch on the main printed circuit board in the integral board of the (i + 1) th batch.
3. The method according to claim 1 or 2, wherein i-1, and the inserting the sub-pcb, which is fixedly processed and obtained through the board dividing process, in the i-th batch of the whole boards onto the main pcb in the i + 1-th batch of the whole boards specifically comprises:
carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards;
dividing the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards, and performing wave soldering process on the auxiliary printed circuit boards of the divided boards;
and inserting the auxiliary printed circuit board of the first batch after wave soldering process treatment on the main printed circuit board of the whole second batch.
4. The method as claimed in claim 3, wherein the fixing process and the board-dividing process of the i +1 th lot of the entire board to which the ith lot of the sub printed circuit boards are inserted comprise:
carrying out surface mounting and machine plugging process treatment on the main printed circuit board and the auxiliary printed circuit board in the plugged (i + 1) th batch of whole boards;
wave soldering is carried out on the main printed circuit board and the auxiliary printed circuit board in the i +1 th batch of whole boards and the auxiliary printed circuit board in the i th batch of main printed circuit boards inserted on the i +1 th batch of main printed circuit boards;
and dividing the (i + 1) th batch of main and auxiliary printed circuit boards subjected to wave soldering to obtain a main printed circuit board serving as an integrated main printed circuit board in the (i + 1) th batch of whole boards and an auxiliary printed circuit board serving as the (i + 2) th batch of auxiliary printed circuit boards.
5. The method of claim 4, wherein the pre-designed together main and sub-printed circuit boards are rectangular in shape.
6. The method of claim 5, wherein the rectangular main printed circuit board and the sub printed circuit board are directly connected by a connecting strip.
7. An apparatus for mass production of printed circuit boards, the apparatus comprising: a whole plate generation module, a first plate dividing module and a second plate dividing module, wherein,
the whole board generation module is used for carrying out whole board production on the main printed circuit board and the auxiliary printed circuit board which are designed together in advance to form N batches of whole boards;
the first board splitting module is used for inserting the auxiliary printed circuit board which is fixedly processed and obtained through board splitting processing in the ith batch of whole boards into the main printed circuit board in the (i + 1) th batch of whole boards, wherein i is a batch serial number, is a natural number and is less than N;
and the second board dividing module is used for carrying out fixing treatment and board dividing treatment on the (i + 1) th batch of whole boards which are inserted with the (i) th batch of auxiliary printed circuit boards to obtain the main printed circuit board which is used as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board which is used as the (i + 2) th batch of auxiliary printed circuit boards.
8. The apparatus of claim 7, further comprising:
the judging module is used for judging whether i is smaller than or equal to N-1, if not, the (i + 1) th batch of sub-printed circuit boards subjected to board splitting are inserted on the first batch of main printed circuit boards, and wave soldering is carried out; if so, adding 1 to the batch serial number and outputting the batch serial number to the first board dividing module.
9. The apparatus of claim 7 or 8, wherein the first splitter module comprises: a patch and machine insertion processing unit, a first board dividing unit, a welding processing unit and an insertion unit, wherein,
the chip mounting and machine inserting processing unit is used for carrying out chip mounting and machine inserting process processing on the main printed circuit board and the auxiliary printed circuit board in the first batch of whole boards when i is equal to 1;
the first board dividing unit is used for dividing the main and auxiliary printed circuit boards in the first batch of whole boards;
the welding processing unit is used for carrying out wave soldering process on the sub printed circuit board of the sub board;
and the inserting unit is used for inserting the auxiliary printed circuit board of the first batch into the main printed circuit board of the whole second batch after wave soldering process treatment.
10. The apparatus of claim 7 or 8, wherein the second panel module comprises: a patch and plug processing unit, a welding processing unit and a second board dividing unit, wherein,
the patch and machine insertion processing unit is used for performing patch and machine insertion process processing on the main printed circuit board and the auxiliary printed circuit board in the inserted (i + 1) th batch of whole boards;
the welding processing unit is used for carrying out wave soldering on the main printed circuit board and the auxiliary printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board in the (i + 1) th batch of main printed circuit boards;
and the second board dividing unit is used for dividing the (i + 1) th batch of main and auxiliary printed circuit boards subjected to wave soldering to obtain the main printed circuit board serving as the integrated main printed circuit board in the (i + 1) th batch of whole boards and the auxiliary printed circuit board serving as the (i + 2) th batch of auxiliary printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210358479.7A CN102869195B (en) | 2012-09-25 | 2012-09-25 | The method of batch production printed circuit board and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210358479.7A CN102869195B (en) | 2012-09-25 | 2012-09-25 | The method of batch production printed circuit board and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102869195A true CN102869195A (en) | 2013-01-09 |
| CN102869195B CN102869195B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210358479.7A Expired - Fee Related CN102869195B (en) | 2012-09-25 | 2012-09-25 | The method of batch production printed circuit board and device |
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| CN (1) | CN102869195B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016149902A1 (en) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | Pcb board splitting method and related equipment thereof |
| CN107172814A (en) * | 2017-05-12 | 2017-09-15 | 深圳市沃特沃德股份有限公司 | Circuit board of mobile phone and its production technology, mobile phone |
-
2012
- 2012-09-25 CN CN201210358479.7A patent/CN102869195B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016149902A1 (en) * | 2015-03-24 | 2016-09-29 | 华为技术有限公司 | Pcb board splitting method and related equipment thereof |
| CN107172814A (en) * | 2017-05-12 | 2017-09-15 | 深圳市沃特沃德股份有限公司 | Circuit board of mobile phone and its production technology, mobile phone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102869195B (en) | 2015-08-19 |
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