CN204545651U - A kind of wiring board welding localization tool - Google Patents

A kind of wiring board welding localization tool Download PDF

Info

Publication number
CN204545651U
CN204545651U CN201520118438.XU CN201520118438U CN204545651U CN 204545651 U CN204545651 U CN 204545651U CN 201520118438 U CN201520118438 U CN 201520118438U CN 204545651 U CN204545651 U CN 204545651U
Authority
CN
China
Prior art keywords
wiring board
alignment layers
hole
chassis
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520118438.XU
Other languages
Chinese (zh)
Inventor
陈丽荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN KENI ELECTRONIC EQUIPMENT Co Ltd
Original Assignee
KUNSHAN KENI ELECTRONIC EQUIPMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN KENI ELECTRONIC EQUIPMENT Co Ltd filed Critical KUNSHAN KENI ELECTRONIC EQUIPMENT Co Ltd
Priority to CN201520118438.XU priority Critical patent/CN204545651U/en
Application granted granted Critical
Publication of CN204545651U publication Critical patent/CN204545651U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of wiring board welding localization tool, comprise chassis, chassis is rectangle, and chassis comprises alignment layers fixed with each other and backplane level; Alignment layers is above backplane level, and alignment layers has default one-tenth-value thickness 1/10; Alignment layers is provided with multiple locating hole group, and locating hole group comprises multiple positioning through hole; The profile of the electronic devices and components in positioning through hole and wiring board matches, and electronic devices and components can be fixed in positioning through hole, and the pin of electronic devices and components is upward, and perpendicular to the upper surface on chassis; The positioning through hole of multiple locating hole group can be identical, also can not be identical.A kind of wiring board welding localization tool of this utility model, handled easily personnel can weld this small electronic devices and components, welding position is stable, solder joint is good.

Description

A kind of wiring board welding localization tool
Technical field
The utility model relates to wiring board manufacturing technology field, is specifically related to a kind of wiring board welding localization tool.
Background technology
Wiring board, is generally referred to as pcb board (English is Printed Circuit Board), is widely used at electronic enterprises.Along with electronic product is towards miniaturized, digitlization future development, wiring board is also towards high density, high accuracy future development.
Also this reason just, present wiring board manufacture is all adopt automatic placement machine automatically to mount, and such efficiency is high, quality is also stablized.
But sometimes, some special products, there are some very small electronic devices and components, automatic placement machine cannot be used to mount, can only manual welding, but because this electronic devices and components are very small, hand held, not too convenient, also easy changing position in welding process, cause that welding position is not good, solder joint is undesirable, and then have influence on the quality of wiring board.
Therefore, design a kind of tool or device, handled easily personnel can weld this small electronic devices and components, welding position is stable, solder joint is good, is this area technical issues that need to address.
Utility model content
The technical problems to be solved in the utility model: design a kind of tool or device, handled easily personnel can weld this small electronic devices and components, welding position is stable, solder joint is good.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of wiring board welding localization tool, comprise chassis, described chassis is rectangle, and described chassis comprises alignment layers fixed with each other and backplane level; Described alignment layers is above described backplane level, and described alignment layers has default one-tenth-value thickness 1/10; Described alignment layers is provided with multiple locating hole group, and described locating hole group comprises multiple positioning through hole; The profile of the electronic devices and components in described positioning through hole and described wiring board matches, and described electronic devices and components can be fixed in described positioning through hole, and the pin of described electronic devices and components is upward, and perpendicular to the upper surface on described chassis; The positioning through hole of multiple described locating hole group can be identical, also can not be identical.
Preferably, the suitable for reading of described locating slot is provided with chamfering or rounding.
Preferably, the material of described alignment layers is polytetrafluoroethylene (PTFE).
Preferably, the material of described backplane level is stainless steel.
Preferably, together with described alignment layers is fixed by screws in backplane level.
Pass through technique scheme, a kind of wiring board welding localization tool of the present utility model, the chassis of a rectangle arranges the locating hole of the small electronic devices and components (abbreviation element) on terminated line plate, such elder generation is placed on element in locating hole, pin upward, again wiring board back-off on chassis, the pin of element stretches into wiring board, in such welding process, position of components is stablized, solder joint is also desirable, operating personnel also facilitate, and in order to not lesion element, chassis is divided into two-layer, the employing polytetrafluoroethylene (PTFE) processing that top contacts with element, below adopts stainless steel (having certain weight and intensity) processing, processing is also convenient, and (locating hole is through hole, and without processing blind hole).Its beneficial effect is: handled easily personnel can weld this small electronic devices and components, welding position is stable, solder joint is good.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram (comprise and tip upside down on wiring board on tool-namely it is seen that the back side) of a kind of wiring board welding localization tool disclosed in the utility model embodiment;
Fig. 2 is the schematic diagram in the front of a wiring board.
Corresponding component title in figure represented by numeral:
11. alignment layers 12. backplane level 2. locating hole group 21. positioning through hole
3. wiring board 31. solder joint 4. electronic devices and components.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent.
In order to more succinct explanation the present embodiment, at accompanying drawing or in illustrating, the known but parts incoherent with the main contents of this patent of some the art those of ordinary skill can be omitted.In addition, in order to interpreting blueprints of being more convenient for, in accompanying drawing, some parts has amplification, reduces and part omission, but does not represent size or the entire infrastructure of actual product; When not affecting interpreting blueprints and can not producing ambiguity, some parts may not chart by National Standard of Mechanical Drawing.
Embodiment.
As depicted in figs. 1 and 2, a kind of wiring board welding localization tool, comprise chassis, chassis is rectangle, and chassis comprises alignment layers 11 fixed with each other and backplane level 12; Alignment layers 11 is above backplane level 12, and alignment layers 11 has default one-tenth-value thickness 1/10; Alignment layers 11 is provided with multiple locating hole group 2, and locating hole group 2 comprises multiple positioning through hole 21; Positioning through hole 21 matches with the profile of the electronic devices and components 4 in wiring board 3, and electronic devices and components 4 can be fixed in positioning through hole 21, and the pin of electronic devices and components 4 is upward, and perpendicular to the upper surface on chassis; The positioning through hole 21 of multiple locating hole group can be identical, also can not be identical.
Above-mentioned electronic devices and components 4, namely will weld small electronic devices and components in the circuit board, for convenience, hereinafter referred to as element.
Chassis is divided into two-layer, on the one hand in order to not lesion element is (if all adopt plastics, then relatively lighter, also easily damage, all adopt steel, then than being easier to lesion element), on the other hand, be for the ease of processing, be divided into two-layer, then the alignment layers of top just only processes through hole, without processing blind hole.
Positioning through hole 21 matches with the profile of the element in wiring board, namely element can be located, inactive all around, the cross sectional shape of particular hole can be that (in diagram is circular port and cruciform vent for circle, rectangle or other shape, only for example), as long as can locate.
In Fig. 1 shown in the upper right corner is that a wiring board tips upside down on chassis, and element all below, be can't see, and can, it is seen that the pin of element, be alternatively solder joint 31.
The positioning through hole 21 of multiple locating hole group can be identical, also can not be identical, (be exactly that a locating hole group has multiple positioning through hole if identical, the quantity of positioning through hole, type, size, mutual spacing are all identical), exactly a chassis can be placed simultaneously the duplicate wiring board of multiple specification (carrying out welding the work of small element), welding efficiency is very high.Also can be a wiring board chassis being placed different size, be applicable to the little wiring board of batch (what illustrate in figure is the situation that the positioning through hole of locating hole group is all identical).
Wherein, the suitable for reading of positioning through hole is provided with chamfering or rounding (not shown).So both easily put element (having guide function), and be also not easy lesion element, after chamfering or rounding, sharp edge just eliminates.
Wherein, the material of alignment layers 11 is polytetrafluoroethylene (PTFE).Polytetrafluoroethylene (PTFE), be commonly called as " King ", intensity is high, than general plastic wear-resisting, but smooth surface, frictional force is little, is not easy lesion element.
Wherein, the material of backplane level 12 is stainless steel.Stainless intensity is high, anti-corrosion, is good baseboard material (the stainless concrete trade mark is SUS304, and this is that in stainless steel, intensity is higher, anti-corrosion capability is a kind of preferably).
Wherein, alignment layers 11 and backplane level 12 are fixed together by screw (not shown).Like this, if alignment layers 11 has worn and torn, rear replacing alignment layers 11 can be dismantled, need not wholely scrap together.
Pass through above-described embodiment, a kind of wiring board welding localization tool of the present utility model, the chassis of a rectangle arranges the locating hole of the small electronic devices and components (abbreviation element) on terminated line plate, such elder generation is placed on element in locating hole, pin upward, again wiring board back-off on chassis, the pin of element stretches into wiring board, in such welding process, position of components is stablized, solder joint is also desirable, operating personnel also facilitate, and in order to not lesion element, chassis is divided into two-layer, the employing polytetrafluoroethylene (PTFE) processing that top contacts with element, below adopts stainless steel (having certain weight and intensity) processing, processing is also convenient, and (locating hole is through hole, and without processing blind hole).Its beneficial effect is: handled easily personnel can weld this small electronic devices and components, welding position is stable, solder joint is good.
Above-described is only preferred embodiment of the present utility model; it should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design; can also make some distortion and improvement, these all belong to protection domain of the present utility model.

Claims (5)

1. a wiring board welding localization tool, it is characterized in that, comprise chassis, described chassis is rectangle, and described chassis comprises alignment layers fixed with each other and backplane level; Described alignment layers is above described backplane level, and described alignment layers has default one-tenth-value thickness 1/10; Described alignment layers is provided with multiple locating hole group, and described locating hole group comprises multiple positioning through hole; The profile of the electronic devices and components in described positioning through hole and described wiring board matches, and described electronic devices and components can be fixed in described positioning through hole, and the pin of described electronic devices and components is upward, and perpendicular to the upper surface on described chassis; The positioning through hole of multiple described locating hole group can be identical, also can not be identical.
2. a kind of wiring board welding localization tool according to claim 1, it is characterized in that, the suitable for reading of described locating slot is provided with chamfering or rounding.
3. a kind of wiring board welding localization tool according to claim 1, it is characterized in that, the material of described alignment layers is polytetrafluoroethylene (PTFE).
4. a kind of wiring board welding localization tool according to claim 1, it is characterized in that, the material of described backplane level is stainless steel.
5. a kind of wiring board welding localization tool according to claim 1, is characterized in that, together with described alignment layers is fixed by screws in backplane level.
CN201520118438.XU 2015-02-27 2015-02-27 A kind of wiring board welding localization tool Expired - Fee Related CN204545651U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520118438.XU CN204545651U (en) 2015-02-27 2015-02-27 A kind of wiring board welding localization tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520118438.XU CN204545651U (en) 2015-02-27 2015-02-27 A kind of wiring board welding localization tool

Publications (1)

Publication Number Publication Date
CN204545651U true CN204545651U (en) 2015-08-12

Family

ID=53820816

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520118438.XU Expired - Fee Related CN204545651U (en) 2015-02-27 2015-02-27 A kind of wiring board welding localization tool

Country Status (1)

Country Link
CN (1) CN204545651U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108284267A (en) * 2018-03-20 2018-07-17 马斯特模具(昆山)有限公司 A kind of jig for welding display lamp
CN108356382A (en) * 2018-01-03 2018-08-03 佛山杰致信息科技有限公司 A kind of electronic component fixed equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108356382A (en) * 2018-01-03 2018-08-03 佛山杰致信息科技有限公司 A kind of electronic component fixed equipment
CN108284267A (en) * 2018-03-20 2018-07-17 马斯特模具(昆山)有限公司 A kind of jig for welding display lamp
CN108284267B (en) * 2018-03-20 2023-09-22 马斯特模具(昆山)有限公司 Jig for welding display lamp

Similar Documents

Publication Publication Date Title
CN204545651U (en) A kind of wiring board welding localization tool
CN202151006U (en) Printed circuit board fabricating board
CN111581683B (en) Display panel information extraction method and device and electronic equipment
CN201797652U (en) Structure for splicing multiple different types of PCB boards
CN205142653U (en) PCB board convenient to gong board
CN203814042U (en) Novel developing / etching / stripping machine
CN204807001U (en) Two -dimentional size detection tool of cell -phone apron
CN203942697U (en) Flexible printed wiring board
CN106465544A (en) PCB board splitting method and related equipment thereof
CN101782725A (en) Printed circuit board positioning exposure device and positioning exposure method
CN206154431U (en) Mould of die -cut cover membrane of flexible line way board volume to volume
CN208680853U (en) A kind of positioning component
CN202335075U (en) PCS circuit board positioning device
CN202846625U (en) Board split die structure for quickly positioning PCBA (Printed Circuit Board Assembly) board
CN108237410B (en) A kind of IC support plate sharp processing localization method and its equipment used
CN105704923A (en) Backlight gold finger welding structure and welding method
CN204441261U (en) A kind of pasting board tool
CN204308793U (en) A kind of positioner of pcb board
CN204330825U (en) A kind of system integrated circuit plate detects clamp
CN204217198U (en) There is the pcb board of the uropore of detection aperture mistake
CN203301875U (en) SMT steel mesh
CN204498476U (en) A kind of PCB localization tool
CN201331333Y (en) System for checking correctness of SMT patch formula
CN203151870U (en) Work fixture for transporting flexible circuit board
CN203896602U (en) Doubly-spliced FPC (flexible printed circuit) exposure positioning fixture

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150812

Termination date: 20180227

CF01 Termination of patent right due to non-payment of annual fee