CN206154431U - Mould of die -cut cover membrane of flexible line way board volume to volume - Google Patents
Mould of die -cut cover membrane of flexible line way board volume to volume Download PDFInfo
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- CN206154431U CN206154431U CN201621224130.4U CN201621224130U CN206154431U CN 206154431 U CN206154431 U CN 206154431U CN 201621224130 U CN201621224130 U CN 201621224130U CN 206154431 U CN206154431 U CN 206154431U
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Abstract
The utility model provides a mould of die -cut cover membrane of flexible line way board volume to volume, its characterized in that: follow closely the position of leading that has two rows of parallels on the mould bottom plate, two rectangular region have in two rows of regions of leading between the nail of position, four summit positions of the rectangular region on the left side are equipped with four positioning hole punch die cavity holes respectively, and four summit positions of the rectangular region on the right are equipped with four location nails respectively, and the diameter in above -mentioned positioning hole punch die cavity hole is the same with the diameter of location nail, article four, seted up product hole ram type lumen pore in the square area that the tangent line encloses, these four tangent lines are: the horizontal tangent that are located the top that are located the horizontal tangent of below, following two location nails that are located two location nails of right -hand vertical tangent line, the higher authority that are located right -hand vertical tangent line, the right two location nails in two positioning hole punch die cavity holes on the right. The utility model discloses simple structure, convenient to use.
Description
Technical field
The utility model belongs to a kind of flexible circuit board processing device, more particularly to a kind of cover layer of flexible PCB adds
The mould that man-hour uses.
Background technology
FPC(FPC)It is typically necessary on the line, pastes last layer cover layer, the cover layer must be according to design
Hole position well and specification, go out various windowings, to expose pad required on circuit with mould.
Current method is all the cover layer for adopting width for 250mm entire volumes, is cut into the chip material of given size, then bores fixed
Position hole, with location hole mould is inserted in, and goes out required windowing, is then fitted with the circuit for having etched.This mode due to
Need first to be cut into chip, get out and be punched again after location hole, it is less efficient, and location hole need to be bored.If can be rushed using direct entire volume
Cut, then be cut into chip and fit with circuit, then just can save drilling operating, improve efficiency and reduces cost.
And it is the complete volume to volume equipment using costliness that at present entire volume is punched more advanced method, but this mode is due to adjusting
Examination is slow, is generally adapted the big product of batch.
The content of the invention
The utility model provides the mould that a kind of FPC volume to volume is punched cover layer, its objective is to solve existing skill
The shortcoming that art is present, makes the mould of volume to volume punching cover layer simply effective.
The utility model solves the technical scheme that its technical problem adopted:
A kind of FPC volume to volume is punched the mould of cover layer, it is characterised in that:There are two rows on die bottom plate
Parallel leads position nail, and upper row leads the lower limb of position nail and the distance between top edge of position nail and cover layer width phase are led to lower row
Together;There are two rectangular regions in the region that two rows lead between the nail of position, the size of two rectangular regions is identical, and two
The upper sideline of rectangular region is located on straight line, and the lower sideline of two rectangular regions also is located on straight line;The left side
Four vertex positions of rectangular region be respectively equipped with four gage punch die cavity holes, four of the rectangular region on the right
Vertex position is respectively equipped with four locating pins, and the diameter of above-mentioned gage punch die cavity holes is identical with the diameter of locating pin;Mould
Base plate offers holes of products drift die cavity holes in the square region that four tangent lines are surrounded, and this four tangent lines are:Two of the right
The vertical tangent line positioned at right of gage punch die cavity holes, the vertical tangent line positioned at right of two locating pins on the right, on
The horizontal tangent above of the underlying horizontal tangent of two locating pins on side, two following locating pins.
It is of the present utility model to be beneficial in that:
The utility model simple structure, it is easy to use;The guiding of cover layer is carried out by leading position nail, by location hole die cavity
Punching and locating pin carry out the positioning hole machined of product and the positioning of subsequent handling punching, so as to realize cover layer in a mould
Upper continuous punching processing exactly.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the utility model structure chart;
Fig. 2 is first step operation schematic diagram;
Fig. 3 is second step operation schematic diagram;
Fig. 4 is the utility model entire volume punching schematic diagram.
Specific embodiment
In order to be illustrated more clearly that the technical solution of the utility model, the accompanying drawing to be used needed for description will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present utility model, for this area
For those of ordinary skill, on the premise of not paying creative work, can be implemented with obtaining others according to these accompanying drawings
Example.
Upper and lower, left and right of the present utility model, vertical, level are that the orientation carried out for Figure of description is described, it is assumed that
Mould is vertically to place(Mould is horizontal positioned in actual production), therefore be only used for tying the relative position between each structure
The description that accompanying drawing does an intuitive and convenient is closed, is not that the physical location to structure in real space is defined.
As shown in Figure 1:
Position nail 2 is led in the taper for having two rows parallel on die bottom plate 1, and upper row leads the lower limb of position nail 2 and leads position to lower row
The distance between top edge of nail 2 and cover layer 9(Shown in Fig. 2, Fig. 3, Fig. 4)Width is identical.Namely:Cover layer 9 can be from two
Row leads and pass through and be directed to without drifting about up and down between position nail 2.
There are two rectangular regions in the region that two rows lead between position nail 2, the size of two rectangular regions is identical,
And the upper sideline of two rectangular regions is located on straight line, the lower sideline of two rectangular regions also is located at straight line
On;Four vertex positions of the rectangular region on the left side are respectively equipped with four gage punch die cavity holes 3, the rectangle on the right
Four vertex positions in domain are respectively equipped with four locating pins 4, and the diameter of above-mentioned gage punch die cavity holes 3 is straight with locating pin 4
Footpath is identical.That is, the rectangle that four gage punch die cavity holes 3 on the left side are constituted is moved to behind the right, can be with the four of the right
Individual locating pin 4 constitute rectangle overlap, in operation first with drift using four gage punch die cavity holes 3 on cover layer 9
Location hole 92 is gone out, next operation location hole 92 just can exactly be set in four locating pins 4 and be positioned, such operation
In cover layer 9 rushed the region 90 of holes of products 91 can be positioned successively again and again.
The square region 10 that die bottom plate 1 is surrounded in four tangent lines(Dotted portion)Inside offer holes of products drift die cavity holes
11, this four tangent lines are:Two of the vertical tangent line 31, the right positioned at right of two gage punch die cavity holes 3 on the right
It is the underlying horizontal tangent 42 of two locating pins 4 of the vertical tangent line 41, top positioned at right of locating pin 4, following
The horizontal tangent 43 above of two locating pins 4, die bottom plate 1 is opened in the square region 10 that above-mentioned four tangent lines are surrounded
It is provided with holes of products drift die cavity holes 11.A region 90 on the cover layers such as the size in region 10 9(Dotted portion), this region
It is exactly the size of a single unit of cover layer 9, holes of products 91 is contained in this region 90.
As shown in Figure 2:
The first step, cover layer 9 into two rows it is parallel lead position nail 2 between, in place after, using 4 location holes on mould
4 gage punch die cavity holes 3 on drift and die bottom plate 1, first go out 4 location holes 92.
As shown in Figure 3:
Second step, draws to the right cover layer 9, and 4 made location holes 92 of the first step are inserted in into 4 locating pins 4, is punched,
With using the holes of products drift die cavity holes 11 on the holes of products drift and die bottom plate 1 on mould, the region 90 of cover layer 9 is gone out
On holes of products 91, meanwhile, the cover layer on the left side of region 90, using on 4 gage punch and die bottom plate 1 on mould
4 gage punch die cavity holes 3, go out 4 location holes 92 of the first step, analogize later.
As shown in Figure 4:
Draw orientation film 9 length by length to the right always, so just go out windowing figure needed for entire volume step pitch identical, in front and back
Putting rewinding can rush after a segment length, artificial loose winding and winding.If volume to volume pastes film convering machine automatically, just can automatic attaching.
If manual assembly cover layer, can by existing automatic cutting machine by the step pitch size automatic cutting for setting into chip, then enter
Row laminating.
Each embodiment is described by the way of progressive in this specification, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.To the upper of the disclosed embodiments
State bright, professional and technical personnel in the field is realized or use the utility model.Various modifications to these embodiments are right
Will be apparent for those skilled in the art, generic principles defined herein can be without departing from this reality
In the case of with new spirit or scope, realize in other embodiments.Therefore, the utility model is not intended to be limited to this
These embodiments shown in text, and it is to fit to the most wide scope consistent with principles disclosed herein and features of novelty.
Claims (1)
1. a kind of FPC volume to volume is punched the mould of cover layer, it is characterised in that:It is flat with two rows on die bottom plate
Capable to lead position nail, upper row leads the lower limb of position nail, and to lead the distance between the top edge that position is followed closely to lower row identical with cover layer width;
There are two rectangular regions in the region that two rows lead between the nail of position, the size of two rectangular regions is identical, and two long
The upper sideline of square region is located on straight line, and the lower sideline of two rectangular regions also is located on straight line;The left side
Four vertex positions of rectangular region are respectively equipped with four gage punch die cavity holes, four tops of the rectangular region on the right
Point position is respectively equipped with four locating pins, and the diameter of above-mentioned gage punch die cavity holes is identical with the diameter of locating pin;Mould bottom
Plate offers holes of products drift die cavity holes in the square region that four tangent lines are surrounded, and this four tangent lines are:Two of the right are fixed
Vertical tangent line positioned at right, vertical tangent line, the top positioned at right of two locating pins on the right of position hole drift die cavity holes
Two locating pins underlying horizontal tangent, the horizontal tangent above of two following locating pins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621224130.4U CN206154431U (en) | 2016-11-16 | 2016-11-16 | Mould of die -cut cover membrane of flexible line way board volume to volume |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201621224130.4U CN206154431U (en) | 2016-11-16 | 2016-11-16 | Mould of die -cut cover membrane of flexible line way board volume to volume |
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Publication Number | Publication Date |
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CN206154431U true CN206154431U (en) | 2017-05-10 |
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CN201621224130.4U Active CN206154431U (en) | 2016-11-16 | 2016-11-16 | Mould of die -cut cover membrane of flexible line way board volume to volume |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108673639A (en) * | 2018-07-05 | 2018-10-19 | 深圳市麦肯机电有限公司 | A kind of continuous mould and continuous cutting method |
CN108839084A (en) * | 2018-06-27 | 2018-11-20 | 无锡积捷光电材料有限公司 | Flat cutter mold monitoring contraposition mark |
-
2016
- 2016-11-16 CN CN201621224130.4U patent/CN206154431U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108839084A (en) * | 2018-06-27 | 2018-11-20 | 无锡积捷光电材料有限公司 | Flat cutter mold monitoring contraposition mark |
CN108673639A (en) * | 2018-07-05 | 2018-10-19 | 深圳市麦肯机电有限公司 | A kind of continuous mould and continuous cutting method |
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