CN109348625A - A kind of LED lamp panel shaping process - Google Patents

A kind of LED lamp panel shaping process Download PDF

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Publication number
CN109348625A
CN109348625A CN201811205233.XA CN201811205233A CN109348625A CN 109348625 A CN109348625 A CN 109348625A CN 201811205233 A CN201811205233 A CN 201811205233A CN 109348625 A CN109348625 A CN 109348625A
Authority
CN
China
Prior art keywords
pcb board
backing plate
led lamp
lamp panel
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811205233.XA
Other languages
Chinese (zh)
Inventor
郑朝屹
陈洁亮
黄家振
黄蝉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xin Qiang Electronics (qingyuan) Co Ltd
Original Assignee
Xin Qiang Electronics (qingyuan) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xin Qiang Electronics (qingyuan) Co Ltd filed Critical Xin Qiang Electronics (qingyuan) Co Ltd
Priority to CN201811205233.XA priority Critical patent/CN109348625A/en
Publication of CN109348625A publication Critical patent/CN109348625A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints

Abstract

The invention discloses a kind of LED lamp panel shaping process, production method is following steps: S1: first molding, S2: test, S3: post forming, S4: forming three times, S5: visually.The present invention has devised a kind of LED lamp panel shaping process, in actual use, it is operated by using CCD molding machine, traditional cultivation pin mode is replaced using suction vacuum simultaneously, and it is positioned using CCD image identification mark point, and using pumping fixed form, not only overcome without interior PIN, and the problem of compact dimensions precision +/- 2mil, and solves the problems, such as edges of boards out-of-flatness after technique edges removal, simultaneously avoid the problem that technique edges removal after edges of boards out-of-flatness and influence the splicing between wiring board, the present invention is not only simple to operation, novel functions, and it is at low cost, accuracy is high, and improve production efficiency, further enhance the quality of product.

Description

A kind of LED lamp panel shaping process
Technical field
The present invention relates to wiring board processing technique field, specifically a kind of LED lamp panel shaping process.
Background technique
With the continuous development of route board industry, wiring board for various purposes also occurs therewith, and production requires also increasingly smart It is close, fine, it is particularly due to the backboard of large LED display screen, is that muti-piece wiring board is spliced, plate is interior without positioning through hole or logical Bore dia is too small (1.0MM or less), and seamless spliced between wiring board is the key that LED display effect, traditional operation mode It has been unable to satisfy this requirement, as wiring board producer, has researched and developed the new production method production effect that reduces that increased production cost Rate, and the direction that the wiring board to meet the requirements of the customers is wiring board producer effort is manufactured out, while production process Management also become the key point that yields products of quality.
The assist side design phase encounters, common practice too small (1.0mm or less) without location hole or through-hole diameter in plate It is that design increases technique edges, satisfactory location hole is added on technique edges, is convenient for processing and forming, because of technique edges meeting after patch There are two ways to removal, common removal technique edges:
1, design stamp hole connects wiring board main body with technique edges, after the completion of patch, breaks except technique edges;
2, designed lines plate main body is directly connect with technique edges, is cut V slot by V-CUT, after the completion of patch, is broken except technique Side.
But both the above removes the design of technique edges, is only limitted to allow the client of technique edges shipment, and after technique edges removal Edges of boards out-of-flatness directly affects the splicing between wiring board plate, if client does not allow plus technique edges, both the above design is equal It cannot use.Therefore how to no location hole and route sheet metal forming and test position fix existing for technique edges to be not allow for as route Plate producer's urgent problem to be solved, therefore those skilled in the art provide a kind of LED lamp panel shaping process, with Solve the problems mentioned above in the background art.
Summary of the invention
The purpose of the present invention is to provide a kind of LED lamp panel shaping process, to solve to propose in above-mentioned background technique The problem of.
To achieve the above object, the invention provides the following technical scheme: a kind of LED lamp panel shaping process, production Method is following steps:
S1: pcb board is cut, reserves break edge by first molding, and the location hole using reserved break edge is determined Position;
S2: test carries out open-short circuit to finished product, the pin positioning opened up on the upper and lower reserved break edge of pcb board Hole, the convenient positioning to electromotive checking frame as pcb board;
S3: post forming is positioned using vacuum tool backing plate is inhaled using no pin, is inhaled vacuum and is fixed, is fished out by CCD optics Machine identifies mark point location;
S4: forming three times, needs to be cut into required shape according to client for the pcb board of formation, then carry out cutting post-processing, in turn Obtain LED lamp panel;
S5: visually: carrying out appearance detection for the finished product LED lamp panel after cutting process, after estimating normal inspection, be packaged into Library.
As a further solution of the present invention: the width range of the upper and lower reserved break edge of the pcb board is in 3-5mm.
As further scheme of the invention: the aperture of the pin location hole on the upper and lower reserved break edge of the pcb board Range is in 2-3.5mm.
As further scheme of the invention: reserving the width range of break edge in 0.5- in the left and right of the pcb board 1.0mm。
As further scheme of the invention: the figure on the upper and lower reserved break edge of the pcb board makes round copper point, The diameter range of the round copper point is in 1.5-2.5mm, and circle copper point is to use mark point as CCD crawl positioning.
As further scheme of the invention: the CCD optics fishing machine uses the design of jig backing plate using as follows:
Design 1: using thickness range 1.6-2.0mm FR-4 as jig backing material;
Design 2: opening up backing plate depthkeeping fishing slot on jig backing plate, and backing plate depthkeeping fishes out list of the size of slot than producing pcb board The big 2-3mm in side, so as to smoothly be put into pcb board to be produced;
Design 3: drilling is set at the position of backing plate depthkeeping fishing slot, pore diameter range exists in 1.0-1.6mm, the position of drilling The non-fishing empty position of pcb board to be produced, in this way design will not generate gas leakage;
Design 4: exhaust fan is connected by gas-guide tube with air guide table top, connects exhaust fan and air guide table top, connected position It is connected using lute, guarantee will not gas leakage;
Design 5: air guide table top uses to be made with a thickness of the stainless steel of 5-8cm, and the size range of stainless steel column is 6-8mm, Centre reserves air slot, as bleed-off passage;
Design 6: the depth bounds of air slot are 4-6mm, and convenient direction in length and breadth requires air slot;
Design 7: the quadrangle of jig backing plate is respectively provided with four jig backing plate screw holes, and the quadrangle of air guide table top is respectively provided with four Air guide table top screw hole, and the screw hole site on air guide table top and jig backing plate is overlapped, so as to the fixed backing plate that screws.
Compared with prior art, it the beneficial effects of the present invention are: the present invention is devised using CCD molding machine, uses simultaneously It inhales vacuum and replaces traditional cultivation pin mode, and identify mark point location using CCD image, and using pumping fixed form gram Clothes are without interior PIN, and the problem of compact dimensions precision +/- 2mil, while solving the problems, such as edges of boards out-of-flatness after technique edges removal, Avoid the problem that technique edges removal after edges of boards out-of-flatness and influence the splicing between wiring board, further improve production efficiency and The quality of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that CCD optics fishes out the jig backing plate that machine uses in a kind of LED lamp panel shaping process;
Fig. 2 is first molding structural schematic diagram in a kind of LED lamp panel shaping process;
Fig. 3 is a kind of flow diagram of LED lamp panel shaping process.
In figure: 1, jig backing plate;2, backing plate depthkeeping fishes out slot;3, it drills;4, exhaust fan;5, gas-guide tube;6, air guide table top;7, Air slot;8, steel column;9, jig backing plate screw hole;10, air guide table top screw hole;11, pcb board;12, break edge is reserved up and down; 13, location hole;14, the reserved break edge in left and right;15, circle copper point.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1~3, in the embodiment of the present invention, a kind of LED lamp panel shaping process, production method is following Step:
S1: pcb board 11 is cut, reserves break edge by first molding, is carried out using the location hole 13 of reserved break edge Positioning;
S2: test carries out open-short circuit to finished product, and the pin opened up on the upper and lower reserved break edge 12 of pcb board 11 is fixed Position hole 13, the convenient positioning to electromotive checking frame as pcb board 11;
S3: post forming is positioned using vacuum tool backing plate 1 is inhaled using no pin, is inhaled vacuum and is fixed, is fished out by CCD optics Machine identifies mark point location;
S4: forming three times, needs to be cut into required shape according to client for the pcb board 11 of formation, then carry out cutting post-processing, into And obtain LED lamp panel;
S5: visually: carrying out appearance detection for the finished product LED lamp panel after cutting process, after estimating normal inspection, be packaged into Library.
Further, the width range of the upper and lower reserved break edge 12 of pcb board 11 is in 3-5mm.
Further, the pore diameter range of the pin location hole 13 on the upper and lower reserved break edge 12 of pcb board 11 is in 2- 3.5mm。
Further, the width range of break edge 14 is reserved in 0.5-1.0mm in the left and right of pcb board 11.
Further, the figure on the upper and lower reserved break edge 12 of pcb board 11 makes round copper point 15, justifies the straight of copper point 15 Diameter range is in 1.5-2.5mm, and circle copper point 15 is to use mark point as CCD crawl positioning.
Further, CCD optics fishing machine is using the design of jig backing plate using as follows:
Design 1: using thickness range 1.6-2.0mm FR-4 as 1 material of jig backing plate;
Design 2: opening up backing plate depthkeeping fishing slot 2 on jig backing plate 1, and backing plate depthkeeping fishes out the size of slot 2 than production pcb board 11 Unilateral big 2-3mm, so as to smoothly be put into pcb board 11 to be produced;
Design 3: the setting drilling 3 at the position of backing plate depthkeeping fishing slot 2, pore diameter range in 1.0-1.6mm, drill 3 position The non-fishing empty position in pcb board 11 to be produced is set, design in this way will not generate gas leakage;
Design 4: exhaust fan 4 is connected by gas-guide tube 5 with air guide table top 6, exhaust fan 4 and air guide table top 6 is connected, is connected Position is connected using lute, and guarantee will not gas leakage;
Design 5: air guide table top 6 makes using with a thickness of the stainless steel of 5-8cm, and the size range of stainless steel column 8 is 6- 8mm, centre reserves air slot 7, as bleed-off passage;
Design 6: the depth bounds of air slot 7 are 4-6mm, and convenient direction in length and breadth requires air slot 7;
Design 7: the quadrangle of jig backing plate 1 is respectively provided with four jig backing plate screw holes 9, and the quadrangle of air guide table top 6 is respectively provided with Four air guide table top screw holes 10, and the screw hole site on air guide table top 6 and jig backing plate 1 is overlapped, so as to the fixation that screws Backing plate.
When designing and producing plate above, jig backing plate 1 is placed on air guide table top 6, and lock fixed screw, pcb board 11 are placed in the backing plate depthkeeping fishing slot 2 on jig backing plate 1, open exhaust fan 4 and vacuumize, make 1 phase of pcb board 11 and jig backing plate It mutually sucks, and uses CCD image molding machine, grab plate mark point, carrying out operations for forming can by the invention production method To solve the LED light plate high precision size requirement without interior PIN, precision can reach +/- 2mil, further improve production efficiency and The quality of product.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims (6)

1. a kind of LED lamp panel shaping process, production method is following steps:
S1: pcb board is cut, reserves break edge, positioned using the location hole of reserved break edge by first molding;
S2: test carries out open-short circuit, the pin location hole opened up on the upper and lower reserved break edge of pcb board, side to finished product Just positioning of the electromotive checking frame as pcb board is given;
S3: post forming is positioned using vacuum tool backing plate is inhaled using no pin, is inhaled vacuum and is fixed, and is fished out machine by CCD optics and is known Other mark point location;
S4: forming three times, needs to be cut into required shape according to client for the pcb board of formation, then carries out cutting post-processing, and then obtain LED lamp panel;
S5: visually: carrying out appearance detection for the finished product LED lamp panel after cutting process, after estimating normal inspection, be packed and stored.
2. a kind of LED lamp panel shaping process according to claim 1, which is characterized in that the pcb board it is pre- up and down Stay the width range of break edge in 3-5mm.
3. a kind of LED lamp panel shaping process according to claim 1, which is characterized in that the pcb board it is pre- up and down Stay the pore diameter range of the pin location hole on break edge in 2-3.5mm.
4. a kind of LED lamp panel shaping process according to claim 1, which is characterized in that the left and right of the pcb board is pre- Stay the width range of break edge in 0.5-1.0mm.
5. a kind of LED lamp panel shaping process according to claim 1, which is characterized in that the pcb board it is pre- up and down The figure on break edge is stayed to make round copper point, the diameter range of the round copper point is in 1.5-2.5mm, and circle copper point is as CCD Crawl positioning uses mark point.
6. a kind of LED lamp panel shaping process according to claim 1, which is characterized in that the CCD optics fishing machine makes With the design of jig backing plate using as follows:
Design 1: using thickness range 1.6-2.0mm FR-4 as jig backing material;
Design 2: opening up backing plate depthkeeping fishing slot on jig backing plate, and the size that backing plate depthkeeping fishes out slot is unilateral bigger than production pcb board 2-3mm, so as to smoothly be put into pcb board to be produced;
Design 3: drilling is set at the position of backing plate depthkeeping fishing slot, pore diameter range is in 1.0-1.6mm, and the position of drilling is to be generated The non-fishing empty position of pcb board is produced, design in this way will not generate gas leakage;
Design 4: exhaust fan is connected by gas-guide tube with air guide table top, connects exhaust fan and air guide table top, and connected position uses Lute connection, guarantee will not gas leakage;
Design 5: air guide table top uses to be made with a thickness of the stainless steel of 5-8cm, and the size range of stainless steel column is 6-8mm, intermediate Air slot is reserved, as bleed-off passage;
Design 6: the depth bounds of air slot are 4-6mm, and convenient direction in length and breadth requires air slot;
Design 7: the quadrangle of jig backing plate is respectively provided with four jig backing plate screw holes, and the quadrangle of air guide table top is respectively provided with four air guides Table top screw hole, and the screw hole site on air guide table top and jig backing plate is overlapped, so as to the fixed backing plate that screws.
CN201811205233.XA 2018-10-16 2018-10-16 A kind of LED lamp panel shaping process Pending CN109348625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201811205233.XA CN109348625A (en) 2018-10-16 2018-10-16 A kind of LED lamp panel shaping process

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Publication Number Publication Date
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167266A (en) * 2019-04-15 2019-08-23 柏承科技(昆山)股份有限公司 LED board edge forming technique
CN111295050A (en) * 2020-02-27 2020-06-16 梅州市志浩电子科技有限公司 Novel LED lamp panel alignment processing method
CN111954382A (en) * 2020-09-07 2020-11-17 胜宏科技(惠州)股份有限公司 Circuit board PAD and hole-to-edge size control method
CN112372714A (en) * 2020-11-03 2021-02-19 杭州辰彗科技有限公司 Intelligent electronic circuit board cleaning device capable of rapidly cleaning up scraps
CN113490337A (en) * 2021-07-15 2021-10-08 广东通元精密电路有限公司 CAM-based processing method for shape of non-process-edge LED circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068166A (en) * 2012-12-20 2013-04-24 景旺电子科技(龙川)有限公司 Method for forming metal substrate without inner position
CN105338746A (en) * 2015-11-03 2016-02-17 胜宏科技(惠州)股份有限公司 Method for forming circuit board without location holes
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103068166A (en) * 2012-12-20 2013-04-24 景旺电子科技(龙川)有限公司 Method for forming metal substrate without inner position
CN105338746A (en) * 2015-11-03 2016-02-17 胜宏科技(惠州)股份有限公司 Method for forming circuit board without location holes
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110167266A (en) * 2019-04-15 2019-08-23 柏承科技(昆山)股份有限公司 LED board edge forming technique
CN111295050A (en) * 2020-02-27 2020-06-16 梅州市志浩电子科技有限公司 Novel LED lamp panel alignment processing method
CN111954382A (en) * 2020-09-07 2020-11-17 胜宏科技(惠州)股份有限公司 Circuit board PAD and hole-to-edge size control method
CN111954382B (en) * 2020-09-07 2021-09-14 胜宏科技(惠州)股份有限公司 Circuit board PAD and hole-to-edge size control method
CN112372714A (en) * 2020-11-03 2021-02-19 杭州辰彗科技有限公司 Intelligent electronic circuit board cleaning device capable of rapidly cleaning up scraps
CN113490337A (en) * 2021-07-15 2021-10-08 广东通元精密电路有限公司 CAM-based processing method for shape of non-process-edge LED circuit board
CN113490337B (en) * 2021-07-15 2022-07-26 广东通元精密电路有限公司 CAM-based (computer-aided manufacturing) -based LED (light-emitting diode) circuit board shape processing method without technical edge

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Application publication date: 20190215