CN103068166A - Method for forming metal substrate without inner position - Google Patents
Method for forming metal substrate without inner position Download PDFInfo
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- CN103068166A CN103068166A CN2012105577919A CN201210557791A CN103068166A CN 103068166 A CN103068166 A CN 103068166A CN 2012105577919 A CN2012105577919 A CN 2012105577919A CN 201210557791 A CN201210557791 A CN 201210557791A CN 103068166 A CN103068166 A CN 103068166A
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- metal substrate
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- backing plate
- air slot
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Abstract
The invention discloses a method for forming a metal substrate without an inner position. The method for forming the metal substrate without the inner position comprises the following steps: firstly, a working table of a forming machine is designed into an air-absorbing table with an air ducting slot; secondly, a table base plate is designed to the air ducting slot of the working table of the forming machine to absorb the to-be-formed metal substrate in a vacuum-pumping mode; then, positioning holes of the metal substrate are drilled in the base plate and pins are arranged on the base plate, and the to-be-formed metal substrate is sleeved on the pins; finally, an air-absorbing device is started to tightly absorb the to-be-formed metal substrate on the table, and the forming machine is started to manufacture. Consequently, the quality problems that after the metal substrate without the inner position is formed, substrate edges are damaged and uneven, solder mask ink falls, and outline dimensions are deviated can be solved, and production efficiency and quality yield can be improved.
Description
Technical field
The present invention relates to the printed wiring board manufacture technology field, relate in particular to a kind of forming method of the metal substrate without interior location.
Background technology
In the wiring board external form course of processing, generally adopt non-metallic hole to carry out the external form moulding process as location hole; Can not pull plated-through hole affects electric property, and positioning accuracy is high.But atresia in the plated-through hole and unit is arranged in the minority product unit nothing but, can not find anchor point.Usually the way of industry is the secondary positioning mode, and namely the not disposable gong in moulding periphery is complete, keeps several sections peripheries to be formed, then again locates with pin on the moulding periphery sides, and formed product is finally realized in gong connection breaking position again behind the fixed cell edges of boards.The quality abnormals such as this forming method is prone to that edges of boards damages is irregular, welding resistance oilyly comes off, overall dimension deviation have brought great puzzlement to production.
In view of this, prior art haves much room for improvement and improves.
Summary of the invention
In view of the deficiencies in the prior art, the object of the invention is to provide a kind of forming method of the metal substrate without interior location.Be intended to solve and adopt the pin location in the prior art in the metal substrate forming process, the edges of boards that cause damage, the problem of difference appears in quality.
Technical scheme of the present invention is as follows:
A kind of forming method of the metal substrate without interior location wherein, said method comprising the steps of:
S1, gong machine worktable face is designed to air-breathing table top with air slot, holds backing plate by vacuumizing mode;
S2, in the air slot of backing plate, bore some air-vents, hold metal substrate to be formed to realize vacuumizing;
S3, stick the approximately greenism film of 0.10mm of thickness at the metal basal plane of metal substrate to be formed, seal the hole in the metal substrate to be formed of holing;
S4, paste the thick diaphragm of one deck 25um at the backing plate working face, seal the air slot on the backing plate;
S5, get out PNL plate location hole at backing plate, and load onto pin, then open some ventilation mouths at the air slot diaphragm of putting Board position on the backing plate between several pins;
S6, metal substrate to be formed is enclosed within on the pin, and seals four limits of plate with the wide adhesive tape of 30mm;
S7, starting getter device, and guarantee vacuum degree 〉=700mmHg, firmly be adsorbed on metal substrate to be formed on the table top;
S8, call in gong plate program, starting gong machine is treated the moulding metal substrate and is carried out processing and forming.
The forming method of described metal substrate without interior location, wherein, described step S1 further comprises:
S11, at gong machine worktable face laterally and vertically be designed to respectively the air slot of dark 5.0mm, wide 10mm, the spacing between the air slot is 25MM, and forms a series of boss, is used for supporting backing plate;
S12, connect and extend above-mentioned air slot at the vacuum hole of gong machine worktable side opening 15mm, realize vacuumizing air-breathing.
The forming method of described metal substrate without interior location, wherein, described step S2 further comprises:
S21, on backing plate, open the second air slot of dark 2.0mm, wide 3.0mm with the corresponding air slot of gong machine worktable position;
S22, bore the 3.0mm air-vent in the second air slot position, air-vent must run through plate thickness and can realize air-breathing.
The forming method of described metal substrate without interior location, wherein, the number of ventilation mouth is 3-5 among the described step S5.
Beneficial effect:
The application's the forming method without the metal substrate of interior location, hold the processing plate by work top suction vacuum mode and carry out moulding, solve without edges of boards behind the mesoporous metal molding substrate of interior location damage uneven, fall the quality problem such as oil, overall dimension deviation, improved production efficiency and quality yield.
Description of drawings
Fig. 1 is the flow chart of the forming method of the metal substrate without interior location of the present invention.
Fig. 2 is with the schematic diagram of the embodiment of the air-breathing table top of air slot in the forming method of the metal substrate without interior location of the present invention.
Fig. 3 is with the schematic diagram of the embodiment of the organic tie plate of the second air slot in the forming method of the metal substrate without interior location of the present invention.
Embodiment
The invention provides a kind of forming method of the metal substrate without interior location, clearer, clear and definite for making purpose of the present invention, technical scheme and effect, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
See also Fig. 1, it is the flow chart of the forming method of the metal substrate without interior location of the present invention.As shown in the figure, said method comprising the steps of:
S1, gong machine worktable face is designed to air-breathing table top with air slot, holds backing plate by vacuumizing mode;
S2, in the air slot of backing plate, bore some air-vents, hold metal substrate to be formed to realize vacuumizing;
S3, stick the approximately greenism film of 0.10mm of thickness at the metal basal plane of metal substrate to be formed, seal the hole in the metal substrate to be formed of holing;
S4, paste the thick diaphragm of one deck 25um at the backing plate working face, seal the air slot on the backing plate;
S5, get out PNL plate location hole at backing plate, and load onto pin, then open some ventilation mouths at the air slot diaphragm of putting Board position on the backing plate between several pins;
S6, metal substrate to be formed is enclosed within on the pin, and seals four limits of plate with the wide adhesive tape of 30mm;
S7, starting getter device, and guarantee vacuum degree 〉=700mmHg, firmly be adsorbed on metal substrate to be formed on the table top;
S8, call in gong plate program, starting gong machine is treated the moulding metal substrate and is carried out processing and forming.
The below specifically describes for above-mentioned steps respectively.
Described step S1 holds backing plate for gong machine worktable face being designed to the air-breathing table top with air slot by vacuumizing mode.See also Fig. 2, it is the schematic diagram of the embodiment of the air-breathing table top with air slot of the present invention.Its specific implementation process is as follows:
Laterally reach the air slot 10 that vertically is designed to respectively dark 5.0mm, wide 10mm at gong machine worktable face 100, the spacing between the air slot 10 is 25MM; Form a series of boss 20, be used for supporting backing plate; Then, connect and extend above-mentioned air slot at the vacuum hole 30 of gong machine worktable side opening 15mm, realize vacuumizing air-breathing.
Described step S2 bores some air-vents in the air slot of backing plate, hold metal substrate to be formed to realize vacuumizing.In the present embodiment, as shown in Figure 3, described step S2 specifically comprises: at first, open the second air slot 40 of dark 2.0mm, wide 3.0mm with the corresponding air slot of gong machine worktable position on backing plate 200; Bore 3.0mm air-vent 50 in the second air slot 40 positions, air-vent 50 must run through plate thickness and can realize air-breathing.
Described step S4 pastes the thick diaphragm of one deck 25um at the backing plate working face, seals the air slot on the backing plate, then opens ventilation mouth by step S5 at diaphragm and realizes that the suction vacuum holds metal substrate to be formed.
Described step S5 is at backing plate and gets out PNL plate location hole (this location hole is positioned on the processing plate technique edges), and loads onto pin, then opens some ventilation mouths at the air slot diaphragm of putting Board position on the backing plate between several pins.In the present embodiment, the number of described ventilation mouth is 3-5.
Described step S6 is for to be enclosed within metal substrate to be formed (also claiming plate to be formed) on the pin, and avoids gas leakage to guarantee to inhale vacuum effectiveness with four limits that the wide adhesive tape of 30mm seals plate.Step S7 is starting getter device (can further check whether leak gas), and guarantees vacuum degree 〉=700mmHg, firmly is adsorbed on metal substrate to be formed on the table top; At last, step S8 calls in gong plate program, and starting gong machine is treated the moulding metal substrate and carried out processing and forming.
In sum, the forming method of the metal substrate without interior location of the present invention, hold the processing plate by work top suction vacuum mode and carry out moulding, solve without edges of boards behind the mesoporous metal molding substrate of interior location damage uneven, fall the quality problem such as oil, overall dimension deviation, improved production efficiency and quality yield.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (4)
1. the forming method without the metal substrate of interior location is characterized in that, said method comprising the steps of:
S1, gong machine worktable face is designed to air-breathing table top with air slot, holds backing plate by vacuumizing mode;
S2, in the air slot of backing plate, bore some air-vents, hold metal substrate to be formed to realize vacuumizing;
S3, stick the approximately greenism film of 0.10mm of thickness at the metal basal plane of metal substrate to be formed, seal the hole in the metal substrate to be formed of holing;
S4, paste the thick diaphragm of one deck 25um at the backing plate working face, seal the air slot on the backing plate;
S5, get out PNL plate location hole at backing plate, and load onto pin, then open some ventilation mouths at the air slot diaphragm of putting Board position on the backing plate between several pins;
S6, metal substrate to be formed is enclosed within on the pin, and seals four limits of plate with the wide adhesive tape of 30mm;
S7, starting getter device, and guarantee vacuum degree 〉=700mmHg, firmly be adsorbed on metal substrate to be formed on the table top;
S8, call in gong plate program, starting gong machine is treated the moulding metal substrate and is carried out processing and forming.
2. the forming method of the metal substrate without interior location according to claim 1 is characterized in that, described step S1 further comprises:
S11, at gong machine worktable face laterally and vertically be designed to respectively the air slot of dark 5.0mm, wide 10mm, the spacing between the air slot is 25MM, and forms a series of boss, is used for supporting backing plate;
S12, connect and extend above-mentioned air slot at the vacuum hole of gong machine worktable side opening 15mm, realize vacuumizing air-breathing.
3. the forming method of the metal substrate without interior location according to claim 1 and 2 is characterized in that, described step S2 further comprises:
S21, on backing plate, open the second air slot of dark 2.0mm, wide 3.0mm with the corresponding air slot of gong machine worktable position;
S22, bore the 3.0mm air-vent in the second air slot position, air-vent must run through plate thickness and can realize air-breathing.
4. the forming method of the metal substrate without interior location according to claim 1 is characterized in that, the number of ventilation mouth is 3-5 among the described step S5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557791.9A CN103068166B (en) | 2012-12-20 | 2012-12-20 | Method for forming metal substrate without inner position |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210557791.9A CN103068166B (en) | 2012-12-20 | 2012-12-20 | Method for forming metal substrate without inner position |
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| CN103068166A true CN103068166A (en) | 2013-04-24 |
| CN103068166B CN103068166B (en) | 2015-04-01 |
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| CN201210557791.9A Active CN103068166B (en) | 2012-12-20 | 2012-12-20 | Method for forming metal substrate without inner position |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN109348625A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of LED lamp panel shaping process |
| CN109807659A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of vacuum suction backing plate and application method |
| CN113498263A (en) * | 2020-04-02 | 2021-10-12 | 无锡深南电路有限公司 | Through hole processing method, through hole processing equipment and multilayer plate |
| CN116095964A (en) * | 2023-01-10 | 2023-05-09 | 圆周率半导体(南通)有限公司 | Method for solving problem of forming of PCB without through holes in small-size board |
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| US4554405A (en) * | 1982-06-28 | 1985-11-19 | International Business Machines Corporation | High density encapsulated wire circuit board |
| JPS63237806A (en) * | 1987-03-23 | 1988-10-04 | Nec Corp | Unfinished through-hole detection jig |
| JPH0230449A (en) * | 1988-07-15 | 1990-01-31 | Hitachi Seiko Ltd | Fixing method for print substrate |
| JPH0263614A (en) * | 1988-08-31 | 1990-03-02 | Fujikura Ltd | Enamel substrate and its manufacture |
| CN101316483A (en) * | 2007-06-01 | 2008-12-03 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN102387660A (en) * | 2011-10-31 | 2012-03-21 | 景旺电子（深圳）有限公司 | Metal base PCB (Printed Circuit Board) and production method thereof |
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2012
- 2012-12-20 CN CN201210557791.9A patent/CN103068166B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4554405A (en) * | 1982-06-28 | 1985-11-19 | International Business Machines Corporation | High density encapsulated wire circuit board |
| JPS63237806A (en) * | 1987-03-23 | 1988-10-04 | Nec Corp | Unfinished through-hole detection jig |
| JPH0230449A (en) * | 1988-07-15 | 1990-01-31 | Hitachi Seiko Ltd | Fixing method for print substrate |
| JPH0263614A (en) * | 1988-08-31 | 1990-03-02 | Fujikura Ltd | Enamel substrate and its manufacture |
| CN101316483A (en) * | 2007-06-01 | 2008-12-03 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN102387660A (en) * | 2011-10-31 | 2012-03-21 | 景旺电子（深圳）有限公司 | Metal base PCB (Printed Circuit Board) and production method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703396A (en) * | 2015-03-02 | 2015-06-10 | 西安金百泽电路科技有限公司 | Small circuit board forming method without inner orientation |
| CN104703396B (en) * | 2015-03-02 | 2017-08-15 | 西安金百泽电路科技有限公司 | Small size wiring board method for processing forming without interior positioning |
| CN109807659A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of vacuum suction backing plate and application method |
| CN109348625A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of LED lamp panel shaping process |
| CN113498263A (en) * | 2020-04-02 | 2021-10-12 | 无锡深南电路有限公司 | Through hole processing method, through hole processing equipment and multilayer plate |
| CN113498263B (en) * | 2020-04-02 | 2022-12-27 | 无锡深南电路有限公司 | Through hole processing method, through hole processing equipment and multilayer plate |
| CN116095964A (en) * | 2023-01-10 | 2023-05-09 | 圆周率半导体(南通)有限公司 | Method for solving problem of forming of PCB without through holes in small-size board |
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| CN103068166B (en) | 2015-04-01 |
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