CN205185515U - Carrier is supported in solder paste printing process vacuum - Google Patents
Carrier is supported in solder paste printing process vacuum Download PDFInfo
- Publication number
- CN205185515U CN205185515U CN201521037763.XU CN201521037763U CN205185515U CN 205185515 U CN205185515 U CN 205185515U CN 201521037763 U CN201521037763 U CN 201521037763U CN 205185515 U CN205185515 U CN 205185515U
- Authority
- CN
- China
- Prior art keywords
- base
- carrier
- solder printing
- printing process
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007639 printing Methods 0.000 title claims abstract description 47
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title abstract description 14
- 238000005086 pumping Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 101100117236 Drosophila melanogaster speck gene Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
The utility model discloses a carrier is supported in solder paste printing process vacuum belongs to the production field of electronic circuit board, the utility model discloses how the technical problem who solves is for guaranteeing that SMT solder paste printing process technological structure is simple, convenient operation and long service life when guaranteeing that SMT solder paste printing process technology is supported to the solder paste printing process carrier. Technical scheme does: its structure includes panel, base and suction hole, the panel sets up on the base, base and panel constitution enclosure space, and this enclosure space is hollow out construction, align to grid's suction hole is seted up to the both sides of base.
Description
Technical field
The utility model relates to the production field of electronic circuit board, specifically a kind of paste solder printing vacuum pump carrier.
Background technology
Along with the development of electron trade, electronic circuit board is towards frivolous future development, and the processing technology of electronic product determines the quality of product.For ensureing the production quality of electronic circuit board, paste solder printing and reflow soldering have become SMT technique and have faced the two technique problems being badly in need of greatly promoting.Paste solder printing vacuum pump carrier adopts the principle of vacuum suction by the upgrading of stencil printer, effectively fixes PCB during paste solder printing, ensures the stability of paste solder printing, thus in the first operation of SMT, carries out the guarantee of quality.
Solder paste printing carrier emerges along with the appearance of tin cream vacuum printer, add the artificial mode supporting PIN of arranging from initial simple employing vacuum barrier and be evolved into now integrated fixing carrier, period experienced by process certification repeatedly, finally can promote the use of.But solder paste printing carrier complex structure of the prior art, service life is short, need often to change, not only reduce operating efficiency, and add production cost, how can while guaranteeing that solder paste printing carrier supports SMT paste solder printing technique, guarantee that SMT paste solder printing process structure is simple, easy to operate and long service life is the technical problem existed in currently available technology.
Summary of the invention
Technical assignment of the present utility model is to provide a kind of paste solder printing vacuum pump carrier, how solve can while guaranteeing that solder paste printing carrier supports SMT paste solder printing technique, guarantee that SMT paste solder printing process structure is simple, the easy to operate and problem of long service life.
The utility model solves the technical scheme that its technical problem adopts: a kind of paste solder printing vacuum pump carrier, comprise panel, base and suction hole, described panel is arranged on base, and base and panel form enclosure space, and this enclosure space is engraved structure; The both sides of base offer evenly distributed suction hole.
As preferably, described upper panel is provided with vacuum tank, is provided with pcb board in vacuum tank.
As preferably, described panel is provided with evenly distributed vacuum pumping hole.
A kind of paste solder printing vacuum pump carrier of the present utility model compared to the prior art, have following beneficial effect: the utility model can be applicable in the paste solder printing process of multiple electronic circuit board, the time can saving artificial arrangement support PIN while of effectively can ensureing the stability of the printing of tin cream by using this paste solder printing vacuum pump carrier improves production efficiency greatly.The paste solder printing that this paste solder printing vacuum pump carrier can also realize each size board according to the size of board by the faceplate part size revising carrier supports.
This paste solder printing supporting carrier can be fixed on the base of stencil printer by magnet, and the vacuum tank of stencil printer need cover by the confined space of base portion completely, the phenomenon leaked air when avoiding vacuumizing, thus ensures effective absorption of vacuum.The layout of the faceplate part foundation electronic circuit board of this paste solder printing vacuum pump carrier, support for without element area, keep the uniformity of plane simultaneously, when paste solder printing, the strong electronic circuit board that supports makes together with steel mesh is tightly attached to electronic circuit board plane, thus paste solder printing is smooth, without draw point etc. bad.Improve the yield of paste solder printing greatly, and then ensure that the production yield of electronic circuit board
This paste solder printing supporting carrier adopts aluminium alloy to make, and tool is light, durable in use.Combined by helicitic texture and floatless switch magnet, the suction by magnet time on the base being loaded into stencil printer is tightly fixed together.The utility model effectively fixes the position of PCB simultaneously, save the time of artificial arrangement supporting baffle and processing procedure PIN, thus improve production efficiency greatly, the paste solder printing of the different board of size can be realized by the size revising carrier, for paste solder printing provides carrier standardization to demonstrate.
The utility model have reasonable in design, structure simple, be easy to the features such as processing, volume are little, easy to use, one-object-many-purposes, thus, have good value for applications.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further illustrated.
Accompanying drawing 1 is a kind of structural representation of paste solder printing vacuum pump carrier.
In figure: 1, panel, 2, base, 3, suction hole, 4, vacuum tank, 5, vacuum pumping hole.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Figure 1, a kind of paste solder printing vacuum pump carrier of the present utility model, its structure comprises panel 1, base 2 and suction hole 3, and panel 1 is arranged on base 2, and base 2 and panel 1 form enclosure space, and this enclosure space is engraved structure; The both sides of base 2 offer evenly distributed suction hole 3.Panel 1 top is provided with vacuum tank 4, is provided with pcb board in vacuum tank 4.Panel 1 is provided with evenly distributed vacuum pumping hole 5.
Concrete steps are as follows:
(1) by pcb board streamline to the top of paste solder printing vacuum pump carrier, by the sensitivity speck on the camera lens identification pcb board of stencil printer, fix the stop position of pcb board;
(2) track stops rear paste solder printing machine base 2 to carry the rising of paste solder printing vacuum carrier;
(3) after paste solder printing vacuum carrier contacts with pcb board, stencil printer starts to vacuumize, and makes together with pcb board fits to paste solder printing vacuum pump carrier;
(4), after carrier and pcb board are fitted, continue rising and pcb board upper surface and steel mesh are fit together;
(5), after pcb board and steel mesh are fitted, paste solder printing starts; After printing terminates, vacuum discharges, and plank drops to track streamline again.
By detailed description of the invention above, described those skilled in the art can be easy to realize the utility model.But should be appreciated that the utility model is not limited to above-mentioned detailed description of the invention.On the basis of disclosed embodiment, described those skilled in the art can be combined different technical characteristics, thus realize different technical schemes.
Claims (3)
1. a paste solder printing vacuum pump carrier, is characterized in that: comprise panel, base and suction hole, and described panel is arranged on base, and base and panel form enclosure space, and this enclosure space is engraved structure; The both sides of base offer evenly distributed suction hole.
2. a kind of paste solder printing vacuum pump carrier according to claim 1, is characterized in that: described upper panel is provided with vacuum tank, is provided with pcb board in vacuum tank.
3. a kind of paste solder printing vacuum pump carrier according to claim 1 and 2, is characterized in that: described panel is provided with evenly distributed vacuum pumping hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521037763.XU CN205185515U (en) | 2015-12-15 | 2015-12-15 | Carrier is supported in solder paste printing process vacuum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521037763.XU CN205185515U (en) | 2015-12-15 | 2015-12-15 | Carrier is supported in solder paste printing process vacuum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205185515U true CN205185515U (en) | 2016-04-27 |
Family
ID=55778543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521037763.XU Expired - Fee Related CN205185515U (en) | 2015-12-15 | 2015-12-15 | Carrier is supported in solder paste printing process vacuum |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205185515U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108638644A (en) * | 2018-05-16 | 2018-10-12 | 郑州云海信息技术有限公司 | A kind of attached seat of vacuum branch |
| CN109677111A (en) * | 2019-03-06 | 2019-04-26 | 昆山苏杭电路板有限公司 | Intelligent FPC/PI ink prints carrier |
-
2015
- 2015-12-15 CN CN201521037763.XU patent/CN205185515U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108638644A (en) * | 2018-05-16 | 2018-10-12 | 郑州云海信息技术有限公司 | A kind of attached seat of vacuum branch |
| CN109677111A (en) * | 2019-03-06 | 2019-04-26 | 昆山苏杭电路板有限公司 | Intelligent FPC/PI ink prints carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202037984U (en) | Screen print scraper | |
| CN106686905A (en) | Surface mount technology for sheet components | |
| CN205185515U (en) | Carrier is supported in solder paste printing process vacuum | |
| CN203526759U (en) | Wave soldering clamp | |
| CN204335176U (en) | Functional module components and parts weld fixture apparatus | |
| CN102285263A (en) | Method for printing crystalline silicon solar cell electrodes | |
| CN102107552B (en) | Surface mount technology (SMT) printing steel mesh | |
| CN201234441Y (en) | Circuit substrate surface pasting tool for digital camera | |
| CN203446121U (en) | Printed circuit board through hole tool | |
| CN202721911U (en) | Hand scrubber printing bench | |
| CN201365376Y (en) | Support tool of printed circuit board | |
| CN201947551U (en) | PCB (printed circuit board) supporting filling block jig | |
| CN208369986U (en) | A kind of LGA device wards off tin jig | |
| CN204836795U (en) | Grafting circuit board | |
| CN204431962U (en) | SMT printing machine scraper chip architecture | |
| CN209664586U (en) | A kind of five golden shell of minicell automation laser carving device | |
| CN102970826B (en) | A kind of wiring board uses dustproof support frame hand to the processing method of exposure | |
| CN202294894U (en) | Board maintaining trolley for pre-plated circuit board | |
| CN206993492U (en) | A kind of board production cornering machine | |
| CN206393170U (en) | Mobile phone screen assembles positioning tool | |
| CN204887728U (en) | PCB board soaks washing medicine basin | |
| CN206423050U (en) | A kind of plug-in element suitable for Reflow Soldering | |
| CN204539633U (en) | A kind of base for supporting | |
| CN205005358U (en) | Tin cream three -dimensional printing steel mesh structure | |
| CN205793696U (en) | A kind of mechanical blind hole board production removing glue device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20161215 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |