CN201234441Y - Circuit substrate surface pasting tool for digital camera - Google Patents
Circuit substrate surface pasting tool for digital camera Download PDFInfo
- Publication number
- CN201234441Y CN201234441Y CNU2008200411600U CN200820041160U CN201234441Y CN 201234441 Y CN201234441 Y CN 201234441Y CN U2008200411600 U CNU2008200411600 U CN U2008200411600U CN 200820041160 U CN200820041160 U CN 200820041160U CN 201234441 Y CN201234441 Y CN 201234441Y
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- CN
- China
- Prior art keywords
- circuit substrate
- digital camera
- locating pin
- base plate
- die cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a tool used for mounting printing solder paste on the surface of the circuit substrate of a digital camera. The tool has the technical proposal that the surface munting tool of the circuit substrate of the digital camera comprises a bottom plate, wherein, one surface of the bottom plate is connected with a support plate; a die cavity matched with the size and the height of the circuit substrate is arranged on the support plate; the bottom plate is also connected with a positioning pin; one end of the positioning pin is fixed on the bottom plate, while the other end passes through the bottom plate and the die cavity of a positioning plate, and is almost leveled with the die cavity surface of the die cavity; a through hole is formed in the middle of the positioning pin; and a flexible sucker is arranged at the upper part of the positioning pin. A recessed cavity is arranged on the surface of the flexible sucker on the positioning pin, which is opposite to the circuit substrate, and a metal connecting rod is arranged at the lower part of the positioning pin. The vacuum and flexible sucker with the recessed cavity is adopted to replace the original rigid sucker of a printing template, on which holes are directly formed, and the die cavity matched with the size and the height of the circuit substrate is arranged on the support plate, therefore the printing quality and the printing stability are ensured, the working time of operating personnel is saved, and the productivity is greatly improved.
Description
Technical field
The present invention relates to a kind of instrument that is used for the real dress of digital camera circuit substrate surface (SMT) printing soldering paste, belong to real packing technique field.
Background technology
Densification along with circuit substrate in the real dress in digital camera circuit plate surface, the microminiaturization of parts, the amount of printing with paste is more and more littler, and spacing is also more and more meticulousr, in order to reach higher quality, more and more higher requirement has been proposed for the quality and the stability of printing with paste.Add the soldering paste particle diameter about 30 μ m, for printing with paste has increased new difficulty.Existing technology, reach support insufficient because circuit substrate is fixed, on the one hand, cause printing the soldering paste skew, on the other hand, when printing, because support is insufficient, there are the gap in circuit substrate and printing stencil, cause the printing with paste amount more or less, bad phenomenon generations such as bridging appear in the soldering paste shape difference between adjacent soldering paste, can not guarantee good press quality and stability.In order to reduce the generation of printing with paste undesirable condition, take the frequent cleans printing stencil, cleaning is owing to the soldering paste method that remains in the printing process on the template back side, and 20 pieces of circuit substrates of general every printing need manually cleaning one-step print lamina membranacea.For the quality of improving printing with paste must be improved fixing the reaching in the circuit board support of circuit board.In SMT, take the vacuum setting tool to realize the fixing and support of substrate when printing, but have following problems: (1) is fixing.The first, on setting tool, to open the sorption of the way enforcement circuit substrate in hole and fix, the difficulty of this way is that curved substrate is difficult to fixing substantially; The second, when going face behind the production high density circuit board, in order to avoid circuit substrate, take on setting tool, to slot, thereby the zone that perforate is provided seldom, only on the auxiliary limit of substrate, often do not have enough sorptive forces and very difficult fixing base, the printing skew often takes place.(2) support.Under the situation of setting tool fluting, for reaching good supporting, utilization has the metal cylinder conduct nail of the diameter 3-5mm of certain altitude.The position of supporting is arranged under the element big on the circuit substrate, and still, the precision control of the height of metallic support nail and the position of supporting are provided with the comparison difficulty, need artificial the adjustment for a long time, and are difficult to obtain ideal results.For the bad circuit substrate of printing, must put expensive man power and material again into production by wiping.
Summary of the invention
The present invention seeks to guarantee good press quality and printing stability, enhance productivity, solve said fixing and support and the new setting tool that designs in order to realize that the circuit substrate high density mounts.
Technical scheme: a kind of digital camera circuit substrate surface mounts instrument, comprise base plate, the one side of base plate is connected with location-plate, location-plate is provided with and the suitable die cavity of circuit substrate size height, also is connected with locating pin on the base plate, and an end and the base plate of locating pin are fixed, the other end passes the die cavity of base plate and described location-plate, remain basically stable with the cavity surface on the die cavity, the centre of locating pin is a through hole, and the top of locating pin is flexible sucker.
The face of the relative circuit substrate of flexible sucker is provided with cavity on the locating pin, and the bottom of locating pin is the metal connecting rod.
The lower metal connecting rod of locating pin is provided with screw thread, passes described base plate, is connected by bolt and nut with base plate.
The material of flexible sucker is a rubber on the locating pin.
Base plate is connected by screw with supporting bracket, and the material of supporting bracket is plastics.
Beneficial effect: the utility model adopts flexible sucker to replace original directly rigidity sorption of perforate on printing stencil; Adopt incorporate support to replace original metallic support nail.Adopt the mode of the vacuum cup of band cavity to implement to fix, the position of sorption, can be arranged on the one hand on the auxiliary limit of circuit substrate, can be arranged on the big element of circuit substrate simultaneously, evaded the restriction that circuit substrate sorption position is provided with, be both because sucker is flexible rubber, when sorption, do not allow the leakiness vacuum, for bent circuit board equally can be good fixing.The postpartum row face circuit substrate of making a living provides good fixing and support.Make circuit substrate in when printing, not can owing to fixing bad about skew up and down, cause printing the bad printing that the printing skew of soldering paste produces.Because good supporting, gap between circuit substrate and the printing stencil is reduced to minimum, makes soldering paste when printing, is unlikely to leak into the printing stencil back side, what are inhomogeneous to cause above-mentioned mentioned printing with paste amount, the soldering paste shape difference, it is bad to put up a bridge between the adjacent soldering paste etc., reaches 100 pieces of productions to need not to stop to produce, guarantee press quality and printing stability on the one hand, on the other hand, save operation personnel's operating time, improve productivity greatly.
Description of drawings
Fig. 1 is a front view of the present utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation of the utility model locating pin.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
A kind of digital camera circuit substrate surface mounts instrument, comprise base plate 1, the one side of base plate 1 is connected with supporting bracket 2, supporting bracket 2 is provided with and the suitable die cavity 8 of circuit substrate size height, also is connected with locating pin 3 on the base plate 1, and an end of locating pin 3 and base plate 1 are fixing, the other end passes the die cavity 8 of base plate 1 and described supporting bracket 2, remain basically stable with the cavity surface 9 on the die cavity 8, the centre of locating pin 3 is a through hole 10, and the top of locating pin 3 is flexible sucker 4.
The face of flexible sucker 4 relative circuit substrates is provided with cavity 7 on the locating pin 3, and the bottom of locating pin 3 is a metal connecting rod 5.The lower metal connecting rod 5 of locating pin 3 is provided with screw thread, passes described base plate 1, is connected by bolt and nut with base plate 1.The material of flexible sucker 4 is a rubber on the locating pin 3.Base plate 1 and supporting bracket 2 are connected by screw, and the material of supporting bracket is plastics.Tight fit between the lower metal connecting rod 5 of firm nail 3 and the top flexible sucker 4.4 of the quantity of supporting bracket 2 upper impression 8 are firmly followed closely 3 the quantity and the quantity of die cavity 8 and are complementary.
During use, circuit board is placed in the die cavity 8 of supporting bracket 2, remain basically stable with the cavity surface 9 on the die cavity 8, die cavity 8 is suitable with circuit substrate size height, the top flexible sucker 4 of locating pin 3 is supported on the circuit board, the face of flexible sucker 4 relative circuit boards is provided with cavity 7, the centre of locating pin 3 is a through hole 10, air between circuit substrate and the flexible sucker 4 flows out from the intermediate throughholes 10 of locating pin 3, guarantee that between circuit substrate and the flexible sucker 4 be vacuum, so, the fixing of circuit substrate and firmly support have just been guaranteed.
Claims (6)
1, a kind of digital camera circuit substrate surface mounts instrument, comprise base plate (1), it is characterized in that: the one side of base plate (1) is connected with supporting bracket (2), supporting bracket (2) is provided with and the suitable die cavity (8) of circuit board size height, also be connected with locating pin (3) on the base plate (1), one end of locating pin (3) and base plate (1) are fixing, the other end passes the die cavity (8) of base plate (1) and described supporting bracket (2), remain basically stable with the cavity surface (9) on the die cavity (8), the centre of locating pin (3) is through hole (10), and the top of locating pin (3) is flexible sucker (4).
2, digital camera circuit substrate surface according to claim 1 mounts instrument, it is characterized in that: the face that locating pin (3) goes up the relative circuit board of flexible sucker (4) is provided with cavity (7), and the bottom of locating pin (3) is metal connecting rod (5).
3, digital camera circuit substrate surface according to claim 2 mounts instrument, it is characterized in that: the lower metal connecting rod (5) of locating pin (3) is provided with screw thread, passes described base plate (1), is connected by bolt and nut with base plate (1).
4, digital camera circuit substrate surface according to claim 1 mounts instrument, it is characterized in that: the material that locating pin (3) goes up flexible sucker (4) is a rubber.
5, digital camera circuit substrate surface according to claim 1 mounts instrument, it is characterized in that: base plate (1) is connected by screw with supporting bracket (2).
6, digital camera circuit substrate surface according to claim 1 mounts instrument, it is characterized in that: the material of described supporting bracket (2) is plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200411600U CN201234441Y (en) | 2008-07-24 | 2008-07-24 | Circuit substrate surface pasting tool for digital camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200411600U CN201234441Y (en) | 2008-07-24 | 2008-07-24 | Circuit substrate surface pasting tool for digital camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201234441Y true CN201234441Y (en) | 2009-05-06 |
Family
ID=40620828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200411600U Expired - Fee Related CN201234441Y (en) | 2008-07-24 | 2008-07-24 | Circuit substrate surface pasting tool for digital camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201234441Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411113A (en) * | 2014-11-14 | 2015-03-11 | 镇江华印电路板有限公司 | High-efficient printed circuit board surface-mounted pallet base |
| CN106034384A (en) * | 2015-01-19 | 2016-10-19 | 深圳市堃琦鑫华股份有限公司 | Component plugging method |
| CN106034385A (en) * | 2015-03-13 | 2016-10-19 | 深圳市堃琦鑫华股份有限公司 | Surface mounting method |
| CN106535496A (en) * | 2016-11-04 | 2017-03-22 | 厦门通士达照明有限公司 | Patch fixture of flexible light source plate |
| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
-
2008
- 2008-07-24 CN CNU2008200411600U patent/CN201234441Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411113A (en) * | 2014-11-14 | 2015-03-11 | 镇江华印电路板有限公司 | High-efficient printed circuit board surface-mounted pallet base |
| CN106034384A (en) * | 2015-01-19 | 2016-10-19 | 深圳市堃琦鑫华股份有限公司 | Component plugging method |
| CN106034385A (en) * | 2015-03-13 | 2016-10-19 | 深圳市堃琦鑫华股份有限公司 | Surface mounting method |
| CN106034385B (en) * | 2015-03-13 | 2019-07-05 | 深圳市堃琦鑫华股份有限公司 | A kind of surface mount method |
| CN106535496A (en) * | 2016-11-04 | 2017-03-22 | 厦门通士达照明有限公司 | Patch fixture of flexible light source plate |
| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
| CN108598839B (en) * | 2018-03-07 | 2019-09-24 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090506 Termination date: 20140724 |
|
| EXPY | Termination of patent right or utility model |