CN107592730B - Hole plugging structure of solder mask ink and hole plugging method thereof - Google Patents
Hole plugging structure of solder mask ink and hole plugging method thereof Download PDFInfo
- Publication number
- CN107592730B CN107592730B CN201710823796.4A CN201710823796A CN107592730B CN 107592730 B CN107592730 B CN 107592730B CN 201710823796 A CN201710823796 A CN 201710823796A CN 107592730 B CN107592730 B CN 107592730B
- Authority
- CN
- China
- Prior art keywords
- solder mask
- ink
- hole
- diameter
- mask ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides a hole plugging structure of solder mask ink and a hole plugging method thereof, comprising a PCB substrate and an ink screen, wherein the PCB substrate comprises a via hole, one end of the via hole is provided with an S-surface windowing, the other end of the via hole is provided with a C-surface windowing, the ink screen is provided with a mesh, the diameter of the via hole is d, the diameter of the S-surface windowing is d, the diameter of the C-surface windowing is 0.8 d-0.9 d, and the diameter of the mesh is d; and aligning the meshes with the S-surface windows, filling solder-resisting ink into the via holes from the S-surface windows through the ink screen printing plate, and baking the PCB substrate. The invention can effectively contain and bear the solder mask ink, and can effectively balance the air pressure at two ends of the solder mask ink, so that the solder mask ink can smoothly enter the via hole, thereby ensuring the saturation of the solder mask ink hole plugging; in addition, the solder mask ink can not expand abnormally due to unbalanced air pressure during baking, the solder mask ink can be effectively prevented from remaining on the tin surface of the PCB, and the quality of the PCB plug hole is obviously improved.
Description
Technical Field
The invention relates to a hole plugging structure and a hole plugging method, and particularly discloses a hole plugging structure of solder mask ink and a hole plugging method thereof.
Background
With the development of technology, the structure and mounting manner of electronic products are continuously updated, and thus the quality requirement of the PCB is higher and higher. At present, hole plugging operation is needed during PCB manufacturing, and solder mask ink is used for filling some via holes of the PCB. The function of the plug hole is as follows: in each through hole of the PCB, except for the hole for mounting an electric component, aiming at the other through holes which are not necessarily exposed, the solder mask ink can prevent soldering flux or soldering tin from reaching a C surface from a welding surface through the through holes during subsequent welding, wherein the C surface is a component surface, and the S surface is a pin welding surface; in the SMT process, the solder mask ink plug holes can prevent glue used for adhering electronic packaging components in the PCB from flowing out of the through holes, and the SMT is a surface mounting technology; and the solder mask ink hole plugging can effectively avoid soldering flux remaining in the hole, and can avoid chemicals and moisture in the external environment from entering the plated metal in the via hole to corrode the hole.
The traditional hole plugging method is that a base plate is arranged at the bottom of a through hole of a PCB, solder mask ink is plugged into the through hole through a screen, when the solder mask ink enters the through hole, the top of the through hole is sealed, so that a closed space is formed between the solder mask ink and the base plate through the through hole, the closed space is continuously reduced along with the penetration of the solder mask ink until the air pressure formed inside the closed space is equal to the sum of the external atmospheric pressure and the weight of the solder mask ink, the solder mask ink cannot be plugged into the through hole any more, the saturation of the solder mask ink hole is insufficient, and the hole plugging effect cannot be satisfactory; meanwhile, gas expansion easily occurs during baking, so that solder resist ink residue is caused on the tin surface at the top of the via hole, and the performance of the tin surface at the top of the via hole is influenced.
Disclosure of Invention
Accordingly, there is a need to provide a hole plugging structure of solder mask ink and a hole plugging method thereof, which can smoothly enter the via hole, effectively prevent the solder mask ink from remaining on the solder surface of the PCB, and improve the hole plugging effect.
In order to solve the problems of the prior art, the invention discloses a hole plugging structure of solder mask ink, which comprises a PCB substrate and an ink screen, wherein the ink screen is positioned on the PCB substrate;
the PCB substrate comprises a via hole, wherein an S-face windowing is arranged at one end of the via hole, a C-face windowing is arranged at the other end of the via hole, the S-face windowing is positioned at one end close to the printing ink screen, a mesh is arranged in the printing ink screen, and the axes of the via hole, the S-face windowing, the C-face windowing and the mesh are the same;
the diameter of the through hole is d, the diameter of the S-surface window is d, the diameter of the C-surface window is 0.8 d-0.9 d, and the diameter of the mesh hole is d.
Further, the PCB substrate is an FR4 board.
Furthermore, the thickness of the PCB substrate is 1.2-2.0 mm.
Further, the diameter of the C-plane fenestration is 0.875 d.
Furthermore, the material of the printing ink screen is aluminum.
The invention also discloses a hole plugging method of the solder mask ink, which comprises the following steps:
s1, setting the diameter of the via hole in the PCB substrate to be d;
s2, setting the diameter of an S-side window in the PCB substrate to be d, and setting the diameter of a C-side window in the PCB substrate to be 0.8 d-0.9 d;
s3, manufacturing an ink screen printing plate, and setting the mesh diameter of the ink screen printing plate to be d;
s4, windowing the meshes in alignment with the S surface;
s5, filling solder mask ink into the via holes from the window on the S surface through the ink screen printing plate;
s6, baking the PCB substrate for 50-60 min at the baking temperature of 125-140 ℃.
The invention has the beneficial effects that: the invention discloses a hole plugging structure of solder mask ink and a hole plugging method thereof.A diameter difference exists between an S-surface windowing and a C-surface windowing at two ends of a via hole, the structure is simple, the processing is convenient, the solder mask ink can be effectively contained and borne, meanwhile, the air pressure at two ends of the solder mask ink can be effectively balanced, the solder mask ink can smoothly enter the via hole, and the saturation of the solder mask ink hole plugging is ensured; in addition, the solder mask ink can not expand abnormally due to unbalanced air pressure during baking, the solder mask ink can be effectively prevented from remaining on the tin surface of the PCB, and the quality of the PCB plug hole is obviously improved.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
The reference signs are: the PCB comprises a PCB substrate 10, a via hole 11, an S-surface window 12, a C-surface window 13, an ink screen 20 and a mesh 21.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1.
The embodiment of the invention discloses a hole plugging structure for solder mask ink, which comprises a PCB (printed circuit board) substrate 10 and an ink screen 20, wherein the ink screen 20 is positioned on the PCB substrate 10; the PCB substrate 10 comprises a via hole 11, one end of the via hole 11 is provided with an S-face window 12, the other end of the via hole 11 is provided with a C-face window 13, the S-face window 12 is positioned at one end close to an ink screen 20, a mesh 21 is arranged in the ink screen 20, and the axes of the via hole 11, the S-face window 12, the C-face window 13 and the mesh 21 are the same; the diameter of the through hole 11 is d, the diameter of the S-surface window 12 is d, the diameter of the C-surface window 13 is 0.8 d-0.9 d, and the diameter of the mesh 21 is d.
The S-side window 12 faces upwards, the solder mask ink enters the through hole 11 from the mesh 21 through the S-side window 12, the diameter of the C-side window 13 is smaller than that of the S-side window 12, so that the bearing capacity of the through hole 11 on the solder mask ink can be effectively improved, the position of the solder mask ink in the through hole 11 is temporarily stabilized through the capillary action, the solder mask ink is cured through timely baking, and hole plugging processing is completed.
According to the invention, the S-side windowing 12 and the C-side windowing 13 at the two ends of the through hole have a diameter difference, so that the solder mask ink can be effectively contained and borne, meanwhile, the air pressure at the two ends of the solder mask ink can be effectively balanced, the solder mask ink can smoothly enter the through hole 11, and the saturation of the solder mask ink hole plugging is ensured; in addition, the solder mask ink can not expand abnormally due to unbalanced air pressure during baking, the solder mask ink can be effectively prevented from remaining on the tin surface of the PCB, and the quality of the PCB plug hole is obviously improved.
Based on the above embodiment, the PCB substrate 10 is an FR4 board, and the FR4 board is an epoxy glass cloth laminated board, and has the advantages of stable electrical insulation performance, good flatness, smooth surface, no pits, standard thickness tolerance, and the like.
Based on the above embodiment, the thickness of the PCB substrate 10 is 1.2-2.0 mm, and the hole plugging effect of the solder mask ink can be effectively improved.
Based on above-mentioned embodiment, the diameter of C face windowing 13 is 0.875d, can effectively improve the ability that via hole 11 holds and bears the weight of solder mask printing ink, avoids improving the processing degree of difficulty simultaneously, can effectively save the processing cost, obtains better consent effect simultaneously.
Based on the above embodiment, the material of the ink screen 20 is aluminum, the solder mask ink cannot penetrate, and the aluminum ink screen 20 has an excellent guiding effect for the solder mask ink.
The invention also discloses a hole plugging method of the solder mask ink, which comprises the following steps:
s1, setting the diameter of the via hole 11 in the PCB substrate 10 to be d;
s2, setting the diameter of the S-side window 12 in the PCB substrate 10 to be d, and setting the diameter of the C-side window 13 in the PCB substrate 10 to be 0.8 d-0.9 d;
s3, manufacturing the ink screen plate 20, and setting the diameter of the mesh 21 of the ink screen plate 20 to be d;
s4, aligning the meshes 21 to the S-side windowing 12;
s5, filling the solder mask ink into the through holes 11 from the S-side windows 12 through the ink screen plate 20;
s6, baking the PCB substrate 10 for 50-60 min at 125-140 ℃.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. The hole plugging structure for solder mask ink is characterized by comprising a PCB (printed circuit board) substrate (10) and an ink screen (20), wherein the ink screen (20) is positioned on the PCB substrate (10);
the PCB substrate (10) comprises a via hole (11), one end of the via hole (11) is provided with an S-face window (12), the other end of the via hole (11) is provided with a C-face window (13), the S-face window (12) is positioned at one end close to the printing ink screen (20), a mesh (21) is arranged in the printing ink screen (20), and the axes of the via hole (11), the S-face window (12), the C-face window (13) and the mesh (21) are the same;
the diameter of the through hole (11) is d, the diameter of the S-surface window (12) is d, the diameter of the C-surface window (13) is 0.8 d-0.9 d, and the diameter of the mesh (21) is d.
2. The solder mask ink receptacle structure of claim 1, wherein said PCB substrate (10) is an FR4 board.
3. The via structure of solder mask ink according to claim 1, wherein the thickness of the PCB substrate (10) is 1.2-2.0 mm.
4. The solder mask ink receptacle structure according to claim 1, wherein the diameter of the C-face fenestration (13) is 0.875 d.
5. The plug hole structure of solder mask ink as claimed in claim 1, wherein the material of said ink screen (20) is aluminum.
6. A hole plugging method of solder mask ink is characterized by comprising the following steps:
s1, setting the diameter of a via hole (11) in the PCB substrate (10) to be d;
s2, setting the diameter of an S-side window (12) in the PCB substrate (10) to be d, and setting the diameter of a C-side window (13) in the PCB substrate (10) to be 0.8 d-0.9 d;
s3, manufacturing an ink screen (20), and setting the diameter of a mesh (21) of the ink screen (20) to be d;
s4, aligning the meshes (21) with the S-side windows (12);
s5, filling solder mask ink into the through hole (11) from the S-side window (12) through the ink screen (20);
s6, baking the PCB substrate (10) for 50-60 min at the baking temperature of 125-140 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710823796.4A CN107592730B (en) | 2017-09-13 | 2017-09-13 | Hole plugging structure of solder mask ink and hole plugging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710823796.4A CN107592730B (en) | 2017-09-13 | 2017-09-13 | Hole plugging structure of solder mask ink and hole plugging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107592730A CN107592730A (en) | 2018-01-16 |
| CN107592730B true CN107592730B (en) | 2020-09-08 |
Family
ID=61050612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710823796.4A Active CN107592730B (en) | 2017-09-13 | 2017-09-13 | Hole plugging structure of solder mask ink and hole plugging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107592730B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182743B (en) * | 2020-01-06 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of ceramic-based circuit board |
| CN113133223B (en) * | 2021-04-14 | 2022-02-08 | 电子科技大学 | Manufacturing method of printed circuit board half plug hole |
| CN113423183A (en) * | 2021-07-01 | 2021-09-21 | 定颖电子（昆山）有限公司 | Manufacturing process of 5G communication high-frequency signal plate |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3102126A1 (en) * | 1981-01-23 | 1982-08-26 | Loewe Opta Gmbh, 8640 Kronach | Screen-printing machine for printed-circuit boards |
| CN201601896U (en) * | 2009-10-30 | 2010-10-06 | 湖南寰球电子科技有限公司 | Piston hole plugging device in printed circuit board manufacturing |
| CN102523699A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Resin plug-hole apparatus of PCB back borehole and method thereof |
| CN203934150U (en) * | 2014-05-06 | 2014-11-05 | 江苏统信电子科技有限公司 | A kind of PCB consent plate |
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN206442596U (en) * | 2016-12-29 | 2017-08-25 | 奥士康科技股份有限公司 | Print aeroscopic plate |
| CN206498604U (en) * | 2017-02-23 | 2017-09-15 | 金安国纪科技（珠海）有限公司 | Aluminium base consent filler device |
| CN207305071U (en) * | 2017-09-13 | 2018-05-01 | 东莞联桥电子有限公司 | A kind of consent structure of anti-solder ink |
-
2017
- 2017-09-13 CN CN201710823796.4A patent/CN107592730B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3102126A1 (en) * | 1981-01-23 | 1982-08-26 | Loewe Opta Gmbh, 8640 Kronach | Screen-printing machine for printed-circuit boards |
| CN201601896U (en) * | 2009-10-30 | 2010-10-06 | 湖南寰球电子科技有限公司 | Piston hole plugging device in printed circuit board manufacturing |
| CN102523699A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Resin plug-hole apparatus of PCB back borehole and method thereof |
| CN203934150U (en) * | 2014-05-06 | 2014-11-05 | 江苏统信电子科技有限公司 | A kind of PCB consent plate |
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN206442596U (en) * | 2016-12-29 | 2017-08-25 | 奥士康科技股份有限公司 | Print aeroscopic plate |
| CN206498604U (en) * | 2017-02-23 | 2017-09-15 | 金安国纪科技（珠海）有限公司 | Aluminium base consent filler device |
| CN207305071U (en) * | 2017-09-13 | 2018-05-01 | 东莞联桥电子有限公司 | A kind of consent structure of anti-solder ink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107592730A (en) | 2018-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107592730B (en) | Hole plugging structure of solder mask ink and hole plugging method thereof | |
| US7637415B2 (en) | Methods and apparatus for assembling a printed circuit board | |
| RU2016150382A (en) | PCB SYSTEM AND METHOD OF MOUNTING THE PRODUCT ON THE MOTHERBOARD | |
| US20180005733A1 (en) | Mounting structure for mounting shunt resistor and method of manufacturing mounting structure for mounting shunt resistor | |
| US20100206626A1 (en) | Printed circuit board unit | |
| CN105307419A (en) | Manufacturing method for effectively reducing manufacturing cost of PCBA | |
| JP2012104632A (en) | Circuit module and electronic apparatus including the same | |
| CN104470258B (en) | Circuit board ink plugging process | |
| CN111010807A (en) | PCB thin plate solder mask hole plugging method with plate thickness less than 600um | |
| CN203691749U (en) | Circuit board assembly | |
| WO2019235189A1 (en) | Busbar laminate, electronic component mounting module including same, and method of manufacturing busbar laminate | |
| CN105357899B (en) | A kind of two-sided welding method that anti-large chip comes off | |
| JP2000208935A (en) | Manufacture of printed wiring board, printed wiring board and part for conducting double face patterns used for the same | |
| CN207305071U (en) | A kind of consent structure of anti-solder ink | |
| US10389051B2 (en) | Connector structure with standoff region for improved soldering and method of making the same | |
| KR101103967B1 (en) | Jig apparatus for surface-mounting shield-can | |
| CN204836822U (en) | Printed circuit board of encapsulation in casing | |
| US20210084773A1 (en) | Diversified assembly printed circuit board and method for making the same | |
| CN217470407U (en) | Tooling for preventing thermal deformation of printed circuit board | |
| CN203631462U (en) | Patch type resettable fuse structure | |
| CN211457496U (en) | Fireproof and moistureproof circuit board structure | |
| CN220606183U (en) | Novel jig for BGA dense products | |
| KR101935285B1 (en) | Electronic element having lead terminal with positive temporary fixing on PCB plate | |
| US20200113062A1 (en) | Pcb panel, pcb, and manufacturing method | |
| JP2005150652A (en) | Substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |