CN204836822U - Printed circuit board of encapsulation in casing - Google Patents
Printed circuit board of encapsulation in casing Download PDFInfo
- Publication number
- CN204836822U CN204836822U CN201520606845.5U CN201520606845U CN204836822U CN 204836822 U CN204836822 U CN 204836822U CN 201520606845 U CN201520606845 U CN 201520606845U CN 204836822 U CN204836822 U CN 204836822U
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- Prior art keywords
- circuit board
- pcb
- casing
- solder mask
- housing
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Abstract
The embodiment of the utility model discloses printed circuit board of encapsulation in casing, this printed circuit board includes: the circuit board, formation is in circuit Board hinders the solder paste china ink, formation is in hinder on the solder paste china ink with the white oil silk screen printing printing ink in the region that the casing contacted. The utility model discloses in, hinder only to form with the non - the contact region of casing on the solder paste china ink and hinder the solder paste china ink, short circuit on the circuit board that corresponding tin cream increase in thickness led to the fact when having avoided forming the tin cream on the circuit board between the intensive gadget, hinder the regional white oil silk screen printing printing ink that forms that contacts on the solder paste china ink with the casing for printing ink can not galled by the casing easily, has avoided the short circuit between the outer circuit of the regional circuit board of metal casing and this, and simultaneously, the subsides dress that also can satisfy PCB's electronic components requires and can not result in the PCB short circuit.
Description
Technical field
The utility model relates to circuit board production techniques, particularly relates to a kind of encapsulation printed circuit board (PCB) in the housing.
Background technology
Printed circuit board (PCB) (PrintedCircuitBoard, PCB) is important electronic unit, is the supporter of electronic devices and components, and be the carrier of electronic devices and components electrical connection, it adopts electron printing to be made.
When prior art manufactures PCB, usually can apply one deck solder mask at circuit board surface, in order to the outer-layer circuit on protective circuit plate.The thickness of conventional solder mask is between 20 μm ~ 40 μm, and error range is ± 10 μm.If the minimum thickness arranging the solder mask of circuit board surface coating is 20 μm, then the thickness of the solder mask of whole circuit board zones of different all reaches more than 20 μm.The thickness of solder mask subregion may exceed the height of pad on circuit board thus, then when forming tin cream on circuit boards, corresponding tin cream thickness increases.For the PCB being integrated with intensive gadget, the increase of tin cream thickness easily causes the short circuit between gadget intensive on circuit board.
If add man-hour at PCB, the minimum thickness arranging the solder mask of circuit board surface coating is more than 10 μm, although the PCB be processed to form also can meet the attachment requirement of electronic devices and components, also can not cause PCB short circuit, not be suitable for some special scenes.As being encapsulated in the PCB in handset shell, its solder mask can contact with the metal center of mobile phone, if when the thickness of the solder mask in this region is 10 μm, then the solder mask of 10 μm of thickness is easy to be galled by metal center, causes the outer-layer circuit short circuit of metal center and circuit board.
Utility model content
The utility model embodiment provides a kind of encapsulation printed circuit board (PCB) in the housing, with the problem of the circuit board outer layer circuit solving PCB in prior art with the easy short circuit of the metal contacted.
The utility model embodiment still provides a kind of encapsulation printed circuit board (PCB) in the housing, comprising:
Circuit board;
Be formed in the solder mask of described circuit board surface;
Be formed in the white oil ink for screen printing in the region that described solder mask contacts with described housing.
A kind of encapsulation printed circuit board (PCB) in the housing that the utility model provides, form solder mask on the surface of circuit board, the region that solder mask contacts with housing forms white oil ink for screen printing to form printed circuit board (PCB).The beneficial effects of the utility model are, solder mask only forms solder mask with housing non-contact area is optional, avoid the short circuit between intensive gadget on circuit board that when circuit board being formed tin cream, the increase of corresponding tin cream thickness causes; The region that solder mask contacts with housing forms white oil ink for screen printing, ink can not be galled by housing easily, avoid the short circuit between metal shell and the circuit board outer layer circuit in this region, meanwhile, the attachment that also can meet the electronic devices and components of PCB requires and can not cause PCB short circuit.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, the accompanying drawing used required in describing embodiment is done one below to introduce simply, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the manufacture method of the encapsulation PCB in the housing that the utility model embodiment one provides;
Fig. 2 is the schematic diagram of the encapsulation PCB in the housing that the utility model embodiment two provides.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearly, hereinafter with reference to the accompanying drawing in the utility model embodiment, clearly and completely the technical solution of the utility model is described by execution mode, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment one
The flow chart of the manufacture method of the encapsulation PCB in the housing that Fig. 1 provides for the utility model embodiment one, the present embodiment is applicable to the situation that encapsulation PCB local in the housing contacts with housing.
The manufacture method of a kind of encapsulation printed circuit board (PCB) in the housing that the present embodiment provides comprises:
Step 110, the surface of circuit board formed solder mask.
PCB, by circuit board, forms the part such as pad, via hole, solder mask, circuit, various components and parts composition on circuit boards.Wherein, the pad of PCB is used for welding component, and the solder mask of PCB is used for playing insulation, anti-oxidation effect not needing exposed circuit out and pad to hide.
Solder mask is formed on the surface of circuit board at this optional employing electrostatic painting process.Electrostatic painting process advantage is nonhazardous, pollution-free, coating quality good, mechanical strength and adhesive force is high, corrosion-resistant, ageing-resistant, curing time is short, technique is simple, cost is low.Also optional employing development exposure technology forms solder mask on the surface of circuit board.The advantage of development exposure technology is that curing time is short, technique is simple.
At the thickness of this optional solder mask between 10 μm ~ 50 μm.
Step 120, the region contacted with housing on solder mask form white oil ink for screen printing, to form printed circuit board (PCB).
When PCB encapsulates in the housing, PCB local may contact with housing, the solder mask region so contacted with housing may be galled by housing and be caused the circuit of PCB cruelly to spill, if the shell material that this place contacts with PCB is metal, also may cause short circuit between the circuit that cruelly spills and metal shell, damage device.White oil ink for screen printing is formed in the region that this contacts with housing on this solder mask.
The region contacted with housing on solder mask at this optional employing silk-screen printing technique forms white oil ink for screen printing.The advantage of silk-screen printing technique be easy to operate, typography is simple and easy and with low cost.Be more than or equal to 20 μm at the thickness of this optional white oil ink for screen printing, and maximum ga(u)ge is less than or equal to 50 μm.
In sum, the thickness of white oil ink for screen printing can accomplish 20 ~ 50 μm, and the thickness of solder mask can accomplish 10 μm ~ 50 μm.Man-hour is added at PCB, the preferred region that only contacts with housing on solder mask forms white oil ink for screen printing, white oil ink for screen printing is not formed on solder mask with on housing non-contact area, then this region with solder mask and white oil ink for screen printing is that PCB contacts with housing region, and this region only with solder mask is PCB and housing non-contact area.For PCB and the non-contacting region of housing, the ink thickness in this region can not be blocked up, thus avoid the short circuit between intensive gadget on circuit board that when circuit board being formed tin cream, the increase of corresponding tin cream thickness causes.
In addition, man-hour is added at PCB, if choose solder mask and the white oil ink for screen printing of minimum thickness, then PCB to be contacted with housing region, the ink in this region is solder mask and the white oil ink for screen printing on it, its most minimal thickness is still more than or equal to 30 μm, and the ink thickness of more than 30 μm can not be galled by housing easily, can avoid the short circuit between metal shell and the circuit board outer layer circuit in this region thus.For PCB with housing non-contact area, the ink in this region is only solder mask, and its minimum thickness is still more than or equal to 10 μm, and the attachment that also can meet the electronic devices and components of PCB requires and can not cause PCB short circuit.
The manufacture method of a kind of encapsulation printed circuit board (PCB) in the housing that the present embodiment provides, solder mask only forms solder mask with housing non-contact area, avoids the short circuit between intensive gadget on circuit board that when circuit board being formed tin cream, the increase of corresponding tin cream thickness causes; The region that solder mask contacts with housing forms white oil ink for screen printing, ink can not be galled by housing easily, avoid the short circuit between metal shell and the circuit board outer layer circuit in this region, meanwhile, the attachment that also can meet the electronic devices and components of PCB requires and can not cause PCB short circuit.
Embodiment two
The schematic diagram of the encapsulation PCB in the housing that Fig. 2 provides for the utility model embodiment two.A kind of encapsulation printed circuit board (PCB) in the housing that the utility model embodiment two provides, comprise: circuit board 210, be formed in the solder mask 220 on circuit board 210 surface, and be formed in the white oil ink for screen printing 240 in the region that solder mask 220 contacts with housing 230.
The thickness of solder mask 220 is more than or equal to 10 μm alternatively.The thickness of white oil ink for screen printing 240 is more than or equal to 20 μm alternatively.
It should be noted that, optional white oil ink for screen printing can also be formed on solder mask with housing non-contact area, then the gross thickness of corresponding preferably white oil ink for screen printing and solder mask is lower than 50 μm, the short circuit on the circuit board that during to avoid circuit board being formed tin cream, the increase of corresponding tin cream thickness causes between intensive gadget.And the thickness of the thickness of solder mask and white oil ink for screen printing may change according to the difference of board application.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and protection range of the present utility model can not be departed from.Therefore, although be described in further detail the utility model by above embodiment, but the utility model is not limited only to above embodiment, when not departing from the utility model design, can also comprise other Equivalent embodiments more, and scope of the present utility model is determined by appended right.
Claims (3)
1. an encapsulation printed circuit board (PCB) in the housing, is characterized in that, comprising:
Circuit board;
Be formed in the solder mask of described circuit board surface;
Be formed in the white oil ink for screen printing in the region that described solder mask contacts with described housing.
2. printed circuit board (PCB) according to claim 1, is characterized in that, the thickness of described solder mask is more than or equal to 10 μm.
3. printed circuit board (PCB) according to claim 1, is characterized in that, the thickness of described white oil ink for screen printing is more than or equal to 20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520606845.5U CN204836822U (en) | 2015-08-12 | 2015-08-12 | Printed circuit board of encapsulation in casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520606845.5U CN204836822U (en) | 2015-08-12 | 2015-08-12 | Printed circuit board of encapsulation in casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204836822U true CN204836822U (en) | 2015-12-02 |
Family
ID=54694371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520606845.5U Expired - Fee Related CN204836822U (en) | 2015-08-12 | 2015-08-12 | Printed circuit board of encapsulation in casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204836822U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050332A (en) * | 2015-08-12 | 2015-11-11 | 广东欧珀移动通信有限公司 | Manufacturing method of printed circuit board packaged in shell and printed circuit board |
-
2015
- 2015-08-12 CN CN201520606845.5U patent/CN204836822U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050332A (en) * | 2015-08-12 | 2015-11-11 | 广东欧珀移动通信有限公司 | Manufacturing method of printed circuit board packaged in shell and printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |