CN107613631A - Wiring board pin ink indicating arrangement and its processing technology - Google Patents
Wiring board pin ink indicating arrangement and its processing technology Download PDFInfo
- Publication number
- CN107613631A CN107613631A CN201710771994.0A CN201710771994A CN107613631A CN 107613631 A CN107613631 A CN 107613631A CN 201710771994 A CN201710771994 A CN 201710771994A CN 107613631 A CN107613631 A CN 107613631A
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- China
- Prior art keywords
- ink
- wiring board
- transition zone
- marking layer
- pin
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Abstract
The invention discloses a kind of wiring board pin ink indicating arrangement and its processing technology, assist side coating bottoming transition zone；Wiring board bottoming transition zone is subjected to pattern transfer, the shape specified is made in specified location；Wiring board bottoming transition zone is solidified；Strong ink marking layer is coated on wiring board bottoming transition zone；Printing ink of circuit board marking layer carries out pattern transfer, and the shape specified is produced on ink marking layer；Printing ink of circuit board marking layer is solidified, and forms the ink sign of wiring board pin.The present invention is used as bottoming transition zone by first coating one layer of material good with base material adhesion on base material, as sign ink and the transition zone of base material, can solve the problems, such as the adhesion difference for indicating ink and base material, the problem of strong contrast color ink breakage can be reduced in process of production, come off, the yield of product is lifted, reduces the totle drilling cost of production.
Description
Technical field
The invention belongs to circuit board processing, LED encapsulation, field of semiconductor package, a kind of wiring board is particularly related to
Pin ink indicating arrangement and its processing technology.
Background technology
In circuit board processing, LED encapsulation, field of semiconductor package, needed for the electronic component of more pins to first device
The pin of part is indicated, and to prevent device during subsequent use because pin is too many, and pin indicates unclear appearance
Error definition during use, causes component failure.
The existing general angle using assist side of electronic component pin sign sets triangle gold PAD to draw to indicate
The pin position of pin, for part electronic component using setting colored color lump to indicate pin among pin, white sign is general
Made using white ink, but because the spot size as sign is very small, the adhesion of white ink and product
There can be certain unstability, frequently result in the sign meeting defect of white or come off, so during device attachment just
The pin of product, which occurs, to be identified, and produce the technical problem such as device material casting or the wrong direction of patch.If using other face
The sign of color, such as green, can produce contrast effect unobvious, during causing device attachment, the CCD detection devices of mounting device
The situation of None- identified, will largely occur material casting in actual application and paste the situation in wrong direction.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of wiring board pin ink indicating arrangement and its processing technology,
Cracky and do not come off.
The present invention in order to solve its technical problem used by technical scheme be：A kind of wiring board pin ink sign knot
Structure, including wiring board, the wiring board corresponding pin position indicate provided with ink, and the ink is denoted as double-deck ink structure,
The double-deck ink structure includes the bottoming transition zone formed with the good ink of board substrate adhesion and positioned at the bottoming
The ink marking layer crossed on layer, wherein, it is described with the good ink of board substrate adhesion be when hundred lattice are tested adhesive force >=
4B。
The present invention also provides a kind of processing technology of wiring board pin ink indicating arrangement as described above, including following step
Suddenly：
Step 1, wiring board coating bottoming transition zone：
The full plate face of assist side prints one layer of ink, then stands, the prebake conditions after ink levelling are preliminary by ink
Solidification, form the bottoming transition zone for the primary solidification being combined together with board substrate；
Step 2, wiring board bottoming transition zone carries out pattern transfer, and the shape specified is made in specified location：
The exposing material of ink is prepared, by exposure machine, the bottoming layer pattern of designed wiring board pin sign is turned
Move on on the bottoming transition zone of primary solidification, unnecessary ink is removed by ink developing line, remaining ink is to need to protect
The bottoming transition zone for the ink sign stayed；
Step 3, wiring board bottoming transition zone is solidified：
The wiring board completed to development is toasted again, and the bottoming transition zone ink of primary solidification is fully cured,
Form the bottoming transition zone of ink sign；
Step 4, coating printing ink marking layer on wiring board bottoming transition zone：
Full plate prints the ink of one layer strong contrastive colours in the circuit board again, then stands, the prebake conditions after ink levelling,
By ink primary solidification, to form the ink marking layer of primary solidification；
Step 5, printing ink of circuit board marking layer carries out pattern transfer, and the shape specified is produced on ink marking layer：
The exposing material of ink is prepared, by exposure machine, the sign layer pattern of designed wiring board pin sign is turned
Move on on the ink marking layer of primary solidification, unnecessary ink is removed by ink developing line, remaining ink is to need to protect
The ink marking layer stayed, the size of the ink marking layer are not less than the size of prime coat；
Step 6, printing ink of circuit board marking layer is solidified：
The wiring board completed to development is toasted again, and ink is fully cured, that is, forms the oil of wiring board pin
Ink sign.
As a further improvement on the present invention, in step 1, the bulk composition of the ink is acrylic acid and epoxy resin
At least one, the temperature of the prebake conditions is 80-100 degree, minute time 10-40.
As a further improvement on the present invention, in step 2, exposure machine of the exposure machine including the use of egative film, and
Without using the exposure machine of the direct imaging of egative film.
As a further improvement on the present invention, in step 3, the temperature of the baking is 140-160 degree, time 100-
150 minutes.
As a further improvement on the present invention, in step 4, the bulk composition of the ink is acrylic acid and epoxy resin
At least one, the temperature of the prebake conditions is 80-100 degree, and minute time 10-40, the ink of the strong contrastive colours is white
Color or black ink.
As a further improvement on the present invention, in steps of 5, exposure machine of the exposure machine including the use of egative film, and
Without using the exposure machine of the direct imaging of egative film.
As a further improvement on the present invention, in step 6, the temperature of the baking is 140-160 degree, time 100-
150 minutes.
The beneficial effects of the invention are as follows：The present invention is made by first coating one layer on base material with the good material of base material adhesion
For bottoming transition zone, as sign ink and the transition zone of base material, the adhesion difference that can solve to indicate ink and base material is asked
Topic, the problem of strong contrast color ink breakage can be reduced in process of production, come off, the yield of product is lifted, reduces production
Totle drilling cost.
Embodiment
In conjunction with the embodiments, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., but
All simple equivalent changes and modificationss made with scope of the present invention patent and description, all still belong to patent of the present invention
Within covering scope.
A kind of wiring board pin ink indicating arrangement, including wiring board, wiring board corresponding pin position indicate provided with ink,
The ink is denoted as double-deck ink structure, and the double-deck ink structure includes beating with what the good ink of board substrate adhesion was formed
Bottom transition zone and the ink marking layer on the bottoming transition zone, wherein, good ink is with board substrate adhesion
Adhesive force >=4B when hundred lattice are tested.
A kind of processing technology of above-mentioned wiring board pin ink indicating arrangement, comprises the following steps：
Step 1, wiring board coating bottoming transition zone：
The full plate face of assist side prints one layer of ink, the bulk composition of the ink including but not limited to：Acrylic acid, epoxy
The mixture of resin or both, stood after being completed for printing, the prebake conditions after ink levelling, the temperature and time of prebake conditions
Need to adjust according to actual printing ink difference, between 80 and 100 degrees, time control is between 10-40 minutes, preliminary drying for temperature control
Rear ink pellet surface primary solidification is baked, forms the bottoming transition zone for the primary solidification being combined together with board substrate, can
To carry out following process；
Step 2, wiring board bottoming transition zone carries out pattern transfer, and the shape specified is made in specified location：
The exposing material of ink is prepared, by exposure machine (including the use of the exposure machine of egative film, and without using the straight of egative film
It is connected into the exposure machine of picture), by the bottoming transition of the prime coat pattern transfer of designed wiring board pin sign to primary solidification
On layer, unnecessary ink is removed by ink developing line, remaining ink as needs the bottoming transition that the ink retained indicates
Layer；
Step 3, wiring board bottoming transition zone is solidified：
The wiring board completed to development toasts again, and between 140-160 degree, time control exists the temperature of baking
100-150 minutes, the bottoming transition zone ink of primary solidification is fully cured, forms the bottoming transition zone of ink sign；
Step 4, strong ink marking layer is coated on wiring board bottoming transition zone：
Full plate prints the ink (the strong contrast color ink such as white or black) of one layer strong contrastive colours in the circuit board again, should
The bulk composition of ink including but not limited to：The mixture of acrylic acid, epoxy resin or both, carried out after being completed for printing so quiet
Put, the prebake conditions after ink levelling, the temperature and time of prebake conditions needs to adjust according to actual printing ink difference, and temperature control exists
Between 80-100 degree, time control ink pellet surface primary solidification after prebake conditions, forms primary solidification between 10-40 minutes
Ink marking layer, following process can be carried out；
Step 5, printing ink of circuit board marking layer carries out pattern transfer, and the shape specified is produced on ink marking layer：
The exposing material of ink is prepared, by exposure machine (including the use of the exposure machine of egative film, and without using the straight of egative film
It is connected into the exposure machine of picture), the ink of the marking layer pattern transfer of designed wiring board pin sign to primary solidification is indicated
On layer, unnecessary ink is removed by ink developing line, remaining ink as needs the ink marking layer retained, the ink mark
Show that the size of layer is not less than the size of prime coat；
Step 6, printing ink of circuit board marking layer is solidified：
The wiring board completed to development toasts again, and the temperature control of baking is between 140-160 degree, time control
In 100-150 minutes, ink is fully cured, that is, forms the ink sign of wiring board pin.
Common pin is indicated on PCB, metal sign or ink sign can be used, on the small-size product of part
Leaving the positions and dimensions of sign for has strict limitation, so many signs are indicated using ink.But white ink is due to this
The problem of body product performance, component product and ink adhesion are exactly one bigger, ink are easy to generation and come off etc. ask
Topic.
And the present invention changes the structure of the ink of sign, first encapsulating carrier plate (PCB) base material applied atop it is a kind of with
The good material of base material adhesion (includes but is not limited to ink, resin), then using normal PCB processing mode, passes through exposure
The modes such as photodevelopment make prime coat in the position for needing to make sign, and the white for needing finally to spill then is indicated into ink again
It is printed onto on prime coat, again by modes such as exposure imagings, final sign is made in the position for needing to make sign.
As can be seen here, it is used as bottoming transition zone by first coating one layer of material good with base material adhesion on base material, makees
For sign ink and the transition zone of base material, can solve the problems, such as the adhesion difference for indicating ink and base material, in process of production
The problem of strong contrast color ink breakage can be reduced, come off, the yield of product is lifted, reduce the totle drilling cost of production.
Claims (8)
1. a kind of wiring board pin ink indicating arrangement, including wiring board, the wiring board corresponding pin position is provided with ink mark
Show, it is characterised in that：The ink is denoted as double-deck ink structure, and the double-deck ink structure includes and board substrate adhesion
The bottoming transition zone and the ink marking layer on the bottoming transition zone that good ink is formed, wherein, described and wiring board
The good ink of base material adhesion is adhesive force >=4B when hundred lattice are tested.
A kind of 2. processing technology of wiring board pin ink indicating arrangement as claimed in claim 1, it is characterised in that including with
Lower step：
Step 1, wiring board coating bottoming transition zone：
The full plate face of assist side prints one layer of ink, then stands, the prebake conditions after ink levelling are tentatively solid by ink
Change, form the bottoming transition zone for the primary solidification being combined together with board substrate；
Step 2, wiring board bottoming transition zone carries out pattern transfer, and the shape specified is made in specified location：
The exposing material of ink is prepared, by exposure machine, the prime coat pattern transfer that designed wiring board pin indicates is arrived
On the bottoming transition zone of primary solidification, unnecessary ink is removed by ink developing line, remaining ink is to need what is retained
The bottoming transition zone of ink sign；
Step 3, wiring board bottoming transition zone is solidified：
The wiring board completed to development is toasted again, and the bottoming transition zone ink of primary solidification is fully cured, and is formed
The bottoming transition zone of ink sign；
Step 4, coating printing ink marking layer on wiring board bottoming transition zone：
Full plate prints the ink of one layer strong contrastive colours in the circuit board again, then stands, the prebake conditions after ink levelling, will
Ink primary solidification, form the ink marking layer of primary solidification；
Step 5, printing ink of circuit board marking layer carries out pattern transfer, and the shape specified is produced on ink marking layer：
The exposing material of ink is prepared, by exposure machine, the marking layer pattern transfer that designed wiring board pin indicates is arrived
On the ink marking layer of primary solidification, unnecessary ink is removed by ink developing line, remaining ink is to need what is retained
Ink marking layer, the size of the ink marking layer are not less than the size of prime coat；
Step 6, printing ink of circuit board marking layer is solidified：
The wiring board completed to development is toasted again, and ink is fully cured, that is, forms the ink mark of wiring board pin
Show.
3. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 1
In, the bulk composition of the ink for acrylic acid and epoxy resin at least one, the temperature of the prebake conditions is 80-100
Degree, minute time 10-40.
4. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 2
In, exposure machine of the exposure machine including the use of egative film, and the exposure machine of the direct imaging without using egative film.
5. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 3
In, the temperature of the baking is 140-160 degree, and the time is 100-150 minutes.
6. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 4
In, the bulk composition of the ink for acrylic acid and epoxy resin at least one, the temperature of the prebake conditions is 80-100
Degree, minute time 10-40, the ink of the strong contrastive colours is white or black ink.
7. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 5
In, exposure machine of the exposure machine including the use of egative film, and the exposure machine of the direct imaging without using egative film.
8. the processing technology of wiring board pin ink indicating arrangement according to claim 2, it is characterised in that：In step 6
In, the temperature of the baking is 140-160 degree, and the time is 100-150 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710771994.0A CN107613631A (en) | 2017-08-31 | 2017-08-31 | Wiring board pin ink indicating arrangement and its processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710771994.0A CN107613631A (en) | 2017-08-31 | 2017-08-31 | Wiring board pin ink indicating arrangement and its processing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107613631A true CN107613631A (en) | 2018-01-19 |
Family
ID=61057130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710771994.0A Pending CN107613631A (en) | 2017-08-31 | 2017-08-31 | Wiring board pin ink indicating arrangement and its processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107613631A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114025496A (en) * | 2021-11-11 | 2022-02-08 | 江苏普诺威电子股份有限公司 | Manufacturing method of PCB equilateral triangle |
| CN114845474A (en) * | 2022-07-01 | 2022-08-02 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886875A (en) * | 1996-01-02 | 1999-03-23 | Motorola, Inc. | Apparatus using a circuit board having a frangible portion apparatus |
| CN101619478A (en) * | 2009-07-29 | 2010-01-06 | 艾默生网络能源有限公司 | Method for oxygenizing aluminium base plate into characters, aluminium base plate manufacturing method and aluminium base plate |
| JP2014154577A (en) * | 2013-02-05 | 2014-08-25 | Panasonic Corp | Recognition mark for printed wiring board and manufacturing method of printed wiring board |
| CN105451434A (en) * | 2015-12-24 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board, terminal and circuit board manufacturing method |
| CN105764249A (en) * | 2016-05-16 | 2016-07-13 | 广东欧珀移动通信有限公司 | Printed circuit board splicing board and method for preventing disengagement of ink mark on printed circuit board splicing board |
| CN106061128A (en) * | 2016-08-09 | 2016-10-26 | 深圳市景旺电子股份有限公司 | Printed circuit board and method of coating white oil on surface |
-
2017
- 2017-08-31 CN CN201710771994.0A patent/CN107613631A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5886875A (en) * | 1996-01-02 | 1999-03-23 | Motorola, Inc. | Apparatus using a circuit board having a frangible portion apparatus |
| CN101619478A (en) * | 2009-07-29 | 2010-01-06 | 艾默生网络能源有限公司 | Method for oxygenizing aluminium base plate into characters, aluminium base plate manufacturing method and aluminium base plate |
| JP2014154577A (en) * | 2013-02-05 | 2014-08-25 | Panasonic Corp | Recognition mark for printed wiring board and manufacturing method of printed wiring board |
| CN105451434A (en) * | 2015-12-24 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board, terminal and circuit board manufacturing method |
| CN105764249A (en) * | 2016-05-16 | 2016-07-13 | 广东欧珀移动通信有限公司 | Printed circuit board splicing board and method for preventing disengagement of ink mark on printed circuit board splicing board |
| CN106061128A (en) * | 2016-08-09 | 2016-10-26 | 深圳市景旺电子股份有限公司 | Printed circuit board and method of coating white oil on surface |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114025496A (en) * | 2021-11-11 | 2022-02-08 | 江苏普诺威电子股份有限公司 | Manufacturing method of PCB equilateral triangle |
| CN114025496B (en) * | 2021-11-11 | 2023-11-07 | 江苏普诺威电子股份有限公司 | Manufacturing method of PCB equilateral triangle |
| CN114845474A (en) * | 2022-07-01 | 2022-08-02 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
| CN114845474B (en) * | 2022-07-01 | 2022-09-16 | 深圳市板明科技股份有限公司 | PCB (printed Circuit Board) spray printing graph solder resisting method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180119 |
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| RJ01 | Rejection of invention patent application after publication |