CN105451434A - Circuit board, terminal and circuit board manufacturing method - Google Patents
Circuit board, terminal and circuit board manufacturing method Download PDFInfo
- Publication number
- CN105451434A CN105451434A CN201510999894.4A CN201510999894A CN105451434A CN 105451434 A CN105451434 A CN 105451434A CN 201510999894 A CN201510999894 A CN 201510999894A CN 105451434 A CN105451434 A CN 105451434A
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- China
- Prior art keywords
- coverlay
- circuit board
- substrate layer
- line layer
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
Abstract
The invention discloses a circuit board, a terminal and a circuit board manufacturing method. The circuit board comprises a base material layer, cover film, an electronic element and solder resist ink; the cover film is laminated on the base material layer; a hollow window is arranged on the cover film; the electronic element is arranged in the hollow window; the solder resist ink comprises insulators and markers; the insulators and markers are the same in material; the insulator is completely filled in the hollow window and surrounds the electronic element; the markers are laminated on the base material layer and are adjacent to the hollow window; because the insulators and markers are the same in material, the insulator can be filled in the hollow window, and simultaneously the markers can be laminated on the base material layer, namely, the insulators and the markers can be manufactured at the same time, therefore the manufacturing efficiency of the circuit board is improved, the production cycle of the circuit board is shortened, and the production cost is reduced.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of circuit board, terminal and circuit board manufacturing method.
Background technology
On current most circuit board in many openings that electronic device can be arranged on coverlay; solder mask is filled in the opening of coverlay; to hide the line layer in opening and to protect; also silk-screen layer can be set in the open outer side of coverlay simultaneously; to identify electronic device, but solder mask and silk-screen layer need separate machined at present, thus cause the make efficiency of circuit board not high; and the production cycle is long, waste production cost.
Summary of the invention
The invention provides a kind of circuit board, terminal and the circuit board manufacturing method that can enhance productivity.
The invention provides a kind of circuit board, wherein, described circuit board comprises substrate layer, coverlay, electronic component, insulator and identifying body, described coverlay is laminated on described substrate layer, described coverlay is provided with sky window, described electronic component is fixed on described substrate layer, and be positioned at the region corresponding with described empty window, described insulator is fixed on described substrate layer, and be filled in the region corresponding with described empty window, described insulator is surrounded on described electronic component week side, for providing insulation environment for described electronic component, described identifying body and described insulator one-body molded, described identifying body is laminated on described coverlay, and contiguous described empty window, for providing mark for described electronic component.
Wherein, described circuit board also comprises line layer, and described line layer is laminated between described substrate layer and described coverlay, and line layer described in described empty window exposed portion, described welding electronic elements is on described line layer.
Wherein, described coverlay comprises the first coverlay and the second coverlay, described first coverlay and described second coverlay are laminated in described substrate layer both sides respectively, described empty window is opened on described first coverlay, described line layer is laminated between described second coverlay and described substrate layer, is connected with the electric-conductor through described substrate layer between described line layer and described electronic component.
Wherein, described line layer comprises first line layer and the second line layer, described first line layer is laminated between described first coverlay and described substrate layer, described second line layer is laminated between described second coverlay and described substrate layer, described empty window is opened on described first coverlay, is connected with the electric-conductor through described substrate layer and described first line layer between described second line layer and described electronic component.
Wherein, described line layer comprises conductor wire and pad, and described pad is fixed on described substrate layer, be oppositely arranged with described empty window, described conductor wire is fixed between described coverlay and described substrate layer, and is electrically connected described pad, and described welding electronic elements is on described pad.
Wherein, length dimension or the wide size of described empty window are not less than 0.5mm, and the number of described soft copy is multiple, and multiple described soft copy is all fixed in described empty window, and spaced setting.
The present invention also provides a kind of terminal, and wherein, described terminal comprises the circuit board described in above-mentioned any one, and described terminal also comprises body and is located at the mainboard of described body interior, and described body interior is located at by described circuit board, and is electrically connected with described mainboard.
The present invention also provides a kind of circuit board manufacturing method, and wherein, described circuit board manufacturing method comprises step:
Substrate layer is provided;
Shaping coverlay on described substrate layer, described coverlay has sky window;
The region fixed electronic element of corresponding described empty window on described substrate layer;
On described substrate layer and on described coverlay respectively one-body molded go out insulator and identifying body, described insulator is filled in the region corresponding with described empty window, and is surrounded on described electronic component week side, the contiguous described empty window of described identifying body.
Wherein,
Shaping coverlay on described substrate layer, described coverlay also comprises before having the step of sky window:
Circuit etching layer on described substrate layer; And on described substrate layer corresponding described empty window region step in, described welding electronic elements is in described line layer.
Wherein, on described substrate layer and on described coverlay respectively one-body molded go out insulator and identifying body step in, adopt silk-screen printing technique integrally to print described insulator and described identifying body on described substrate layer He on described coverlay.
Circuit board of the present invention, circuit board manufacturing method and terminal, by arranging described solder mask on described coverlay, described solder mask comprises insulator and identifying body, utilize described insulator identical with the material of described identifying body, thus fill described insulator in described empty window while can also on described coverlay stacked described identifying body, namely described insulator and described identifying body can make simultaneously, thus improve the make efficiency of described circuit board, the production cycle of described circuit board is reduced, reduces production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the circuit board of the first embodiment provided by the invention;
Fig. 2 is the schematic diagram of the circuit board of the second embodiment provided by the invention;
Fig. 3 is the schematic diagram of the circuit board of the 3rd embodiment provided by the invention;
Fig. 4 is the schematic diagram of the circuit board of the 4th embodiment provided by the invention;
Fig. 5 is the schematic flow sheet of circuit board manufacturing method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, the invention provides a kind of circuit board 100 of the first embodiment, described circuit board 100 comprises substrate layer 10, coverlay 20, electronic component 30 and solder mask 40, and described coverlay 20 is laminated on described substrate layer 10, and described coverlay 20 is provided with sky window 21.Described electronic component 30 is fixed on described substrate layer 10, and is positioned at the region corresponding with described empty window 21.Described solder mask 40 comprises insulator 41 and identifying body 42, and described insulator 41 is identical with described identifying body 42 material.Described insulator 41 is fixed on described substrate layer 10, and is filled in the region corresponding with described empty window 21, and described insulator 41 is surrounded on described electronic component 30 weeks sides, for providing insulation environment for described electronic component 30.Described identifying body 42 and described insulator 41 one-body molded, described identifying body 42 is laminated on described coverlay 20, and contiguous described empty window 21.Be understandable that, described circuit board 100 is applied in terminal, and this terminal can be the mancarried electronic aids such as mobile phone, panel computer, notebook computer or player.
By arranging described solder mask 40 on described coverlay 20, described solder mask 40 comprises insulator 41 and identifying body 42, utilize described insulator 41 identical with described identifying body 42 material, thus while described insulator 41 can being filled in described empty window 21 can also on described coverlay 40 stacked described identifying body 42, namely described insulator 41 and described identifying body 42 can make simultaneously, thus improve the make efficiency of described circuit board 100, the production cycle of described circuit board 100 is reduced, reduces production cost.
In present embodiment, described substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, to make described substrate layer 10 can provide insulation environment, so that etch Copper Foil on described substrate layer 10.
Preferably, the thickness of described substrate layer 10 can be 20 μm.Concrete, described substrate layer 10 comprises the first side 11 and the second side 12 of opposing setting.Described first side 11 or described second side 12 can etch copper foil circuit, can also be that described first side 11 and described second side 12 all etch copper foil circuit.In present embodiment, described coverlay 20 can be individual layer coverlay, then described coverlay 20 is laminated in described first side 11 or described second side 12.Described coverlay 20 can also be double-deck, and double-deck described coverlay 20 can be laminated in respectively on described first side 11 and described second side 12.
Wherein, that polyester material can be adopted to carry out is hot-forming for described coverlay 20.Concrete, described coverlay 20 is by paste adhesive on the first side 11 of described substrate layer 10, and described coverlay 20 is protected the copper foil circuit on described substrate layer 10.Simultaneously; described coverlay 20 adopts paste adhesive in the mode of described substrate layer 10; also described coverlay 20 can be made to be connected with copper foil circuit on described substrate layer 10 tightr, prevent described coverlay 20 be shifted and cannot protect needing the copper foil circuit covered to described coverlay 20.In other embodiments, described coverlay 20 can also be adopt spraying plated film mode to carve to be plated on described substrate layer 10.
In present embodiment, described empty window 21 is rectangular through-hole, and length dimension or the width dimensions of described empty window 21 are all not less than 0.05mm, thus convenience electronic component 30 described in described empty window 21 internal fixtion.Described empty window 21 can adopt light etching process shaping, namely while described coverlay 20 is shaping, completes the shaping of described empty window 21, thus reduces processing step, improves the make efficiency of described circuit board 100; Also can be after first molding whole rete, then on whole rete, mold described empty window 21, thus the positional precision of described empty window 21 can be improved, thus improve the quality of described circuit board 100.In other embodiments, the number of described empty window 21 can be multiple, and the shape of described empty window 21 can also be the combination of other multiple rectangles, also can be circular, or pentagon or hexagon etc.
In present embodiment, described electronic component 30 can be electric capacity, resistance, electronic chip, Connection Block or connecting element etc.Described electronic component 30 is fixed in described empty window 21, thus can be electrically connected on the Copper Foil wire on described substrate layer 10, thus realizes electronic component 30 and access in the circuit of described circuit board 100, and then realizes the several functions of described circuit board 100.Concrete, the number of described electronic component 30 can be multiple, and multiple described electronic component 30 is densely arranged in described empty window 21, thus described electronic component 30 can be reduced take up room, the convenient non-flex area described empty window 21 and multiple described electronic component 30 being all arranged at described circuit board 100, thus make the flex area of described circuit board 100 that Copper Foil wire is only set, and then improve the flexibility of described circuit board 100.And utilize multiple described electronic component 30 to be fixed on a described empty window 21, make described empty window 21 size comparatively large, easily process, and be filled in described empty window 21 completely by described insulator 41, prevent the short circuit of described electronic component 30, improve the security performance of described circuit board 100.In other embodiments, also can be that a described electronic component 30 is set in a described empty window 21.
In present embodiment, described solder mask 40 adopts liquid photopolymerizable solder resist to make, and namely described solder mask 40 is green oil.After described substrate layer 10 forms described coverlay 20, described solder mask 40 is coated on described coverlay 20, and fills described empty window 21, thus shaping while of making described insulator 41 and described identifying body 42.Described insulator 41 has insulating properties and viscosity, thus can prevent described electronic component 30 and Copper Foil conductor cord disconnection, but also can prevent the short circuit of described electronic component 30.Described identifying body 42 material is liquid photopolymerizable solder resist, and also referred to as green oil, thus the color of described identifying body 42 is different with the color of described substrate layer 10 from the color of described coverlay 30, thus described identifying body 42 has mark action.Described identifying body 42 can identify the type of described electronic component 30, the electrical parameter of described circuit board 100 can also be identified, and the connected mode of multiple described electronic component 30 in described empty window 21 can also be identified, and when described circuit board 100 carries out SMT technique, described identifying body 42 as the positioning datum of described electronic component 30, can also facilitate the paster of described electronic component 30.In other embodiments, described solder mask 40 can also be adopt silk-screen printing technique to take shape on described coverlay 20.
Further, described circuit board 100 also comprises line layer 50, and described line layer 50 is laminated between described substrate layer 10 and described coverlay 20, and line layer 50 described in described empty window 21 exposed portion, described electronic component 30 is welded on described line layer 20.
In present embodiment, described line layer 50 has been provided with earth lead (sign) and signal conductor (sign), and described earth lead and described signal conductor are Copper Foil conductor wire.Described earth lead realizes the ground connection of described circuit board 100, and described signal conductor is electrically connected with described electronic component 30, thus realizes the electric conductivity of described circuit board 100.Concrete, described signal conductor part, through described empty window 21, is welded mutually with described electronic component 30, thus realizes described electronic component 30 and be stable in described empty window 21, and realizes described electronic component 30 and access in the circuit of described circuit board 100.Described earth lead can be arranged at described signal conductor side, isolated with described signal wires, thus provides grounding electrode for described circuit board 100.In other embodiments, described line layer 50 can also be only signalization wire.
Further, refer to Fig. 2, second embodiment is provided, with the first embodiment unlike, described coverlay 20 comprises the first coverlay 21 and the second coverlay 22, described first coverlay 20a and described second coverlay 20b is laminated in described substrate layer 10 both sides respectively, described empty window 21 is opened on described first coverlay 20a, described line layer 50 is laminated between described second coverlay 22 and described substrate layer 10, is connected with the electric-conductor 51 through described substrate layer 10 between described line layer 50 and described electronic component 30.
In present embodiment, described line layer 50 is individual layer Copper Foil.Described line layer 50 is arranged at described substrate layer 10 and deviates from described empty window 21 side, thus after avoiding the breakage of described insulator 41, exposes described line layer 50 to the open air, thus improves the fail safe of described circuit board 100.One end of described electric-conductor 51 is connected on described line layer 50, and the other end is welded in described electronic component 30, thus realizes described electronic component 30 and connect with described line layer 50.In described empty window 21, multiple electric-conductor 51 can also be set.
Refer to Fig. 3, provide the 3rd embodiment, roughly the same with the second embodiment, its difference is: described line layer 50 is laminated between described first coverlay 20a and described substrate layer 10.Utilize described second reinforcement of coverlay 20b realization to described circuit board 100, or realize the more protection to described circuit board 100, thus the security performance of the described circuit board 100 of described raising.And described electric-conductor 51 need not be connected between described electronic component 30 with described line layer 50, thus reduce the production cost of described circuit board 100.
Refer to Fig. 4, provide the 4th embodiment, roughly the same with the second embodiment, its difference is: described line layer 50 is double-deck Copper Foil.Concrete, described line layer 50 comprises first line layer 50a and the second line layer 50b, described first line layer 50a is laminated between described first coverlay 20a and described substrate layer 10, described second line layer 50b is laminated between described second coverlay 20b and described substrate layer 10, described empty window 21 is opened on described first coverlay 20a, the electric-conductor 51 through described substrate layer 10 and described first line layer 50a is connected with between described second line layer 50b and described electronic component 30, namely described electric-conductor 51 is connected between described second line layer 50b and described electronic component 30.More specifically, described first line layer 50a and described second line layer 50b is equipped with signal conductor, and described first line layer 50a and described second line layer 50b provides two different conducting channels respectively, thus described circuit board 100 improves electric conductivity.Described electric-conductor 51 is through described substrate layer 10 and described first line layer 50a, and the conductor wire avoided on described first line layer 50a, thus avoid described first line layer 50a and described second line layer 50b to conduct electricity, and conveniently multiple described electronic component 30 is installed on described substrate layer 10 side, thus makes described circuit board 100 can meet more multicircuit demand.
Further, described line layer 50 comprises conductor wire (sign) and pad (sign), described pad is fixed on described substrate layer 10, be oppositely arranged with described empty window 41, described conductor wire is fixed between described coverlay 20 and described substrate layer 10, and being electrically connected described pad, described electronic component 30 is welded on described pad.Utilize described pad and described empty window 41 to be oppositely arranged, thus conveniently described electronic component 30 is welded on described pad, increase the steadiness of described electronic component 30 and described line layer 50, thus improve the stabilized structure performance of described circuit board 100.
Below in conjunction with Fig. 5, the circuit board manufacturing method that the embodiment of the present invention provides is described in detail, it should be noted that, the circuit board manufacturing method of Fig. 5, for the preparation of the structure of Fig. 1 of the present invention ~ embodiment illustrated in fig. 4, for convenience of explanation, illustrate only the part relevant to the embodiment of the present invention, concrete ins and outs do not disclose, and please refer to the embodiment shown in Fig. 1-Fig. 4 of the present invention.
Refer to Fig. 1 ~ 5, be a kind of circuit board manufacturing method provided by the invention, described circuit board manufacturing method comprises step:
S01: substrate layer 10 is provided.
Described substrate layer 10 adopts the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, and the first side 10a of described substrate layer 10 and the second side 10b all can laminated conductive Copper Foil.
S02: circuit etching layer 50 on described substrate layer 10.
Described line layer 50 is copper-foil conducting electricity, and described line layer 50 is etched on described substrate layer 10, thus realizes the circuit configuration of described circuit board 100.
S03: shaping coverlay 20 on described substrate layer 10, described coverlay 20 has sky window 21.
It is hot-forming that described coverlay 30 adopts polyester material to carry out, and be adhered on described line layer 50 by viscose glue.Line layer 50 described in described empty window 21 Partial exposure.
S04: the region fixed electronic element 30 of corresponding described empty window 21 on described substrate layer 10.
Described electronic component 30 adopts welding procedure to be welded on described line layer 50, thus increases the structural soundness of described circuit board 100.
S05: on described substrate layer 10 and described coverlay 20 on respectively one-body molded go out insulator 41 and identifying body 42, described insulator 41 is filled in the region corresponding with described empty window 21, and be surrounded on described electronic component 30 weeks sides, the contiguous described empty window 21 of described identifying body 42.
Shaping solder mask 40 on described coverlay 20, described solder mask 40 has insulator 41 and identifying body 42, and described insulator 41 is filled in described empty window 21 completely, and is surrounded on described electronic component 30 weeks sides, described identifying body 42 is laminated on described coverlay 20, and contiguous described empty window 21.
Described solder mask 40 adopts silk-screen printing technique to be printed on described coverlay 20, thus described insulator 41 and described identifying body 42 can be simultaneously shaping, and then reduce the production cycle of described circuit board 100, and the scale error precision of described solder mask 40 is-0.05mm ~+0.05mm, thus improve the machining accuracy of described circuit board 100, the positioning precision of described identifying body 42 is increased, improves the quality of production of described circuit board 100.
The present invention also provides a kind of terminal (not shown), described terminal comprises described circuit board 100, body (not shown) and is located at the mainboard (not shown) of described body interior, described body interior is located at by described circuit board 100, and is electrically connected with described mainboard.Described terminal can be the mancarried electronic aids such as mobile phone, panel computer, notebook computer or player.
Circuit board of the present invention, circuit board manufacturing method and terminal, by arranging described solder mask on described coverlay, described solder mask comprises insulator and identifying body, utilize described insulator identical with described identifying body material, thus while described insulator can being filled in described empty window can also on described coverlay stacked described identifying body, namely described insulator and described identifying body can make simultaneously, thus improve the make efficiency of described circuit board, the production cycle of described circuit board is reduced, reduces production cost.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a circuit board, it is characterized in that, described circuit board comprises substrate layer, coverlay, electronic component, insulator and identifying body, described coverlay is laminated on described substrate layer, described coverlay is provided with sky window, described electronic component is fixed on described substrate layer, and be positioned at the region corresponding with described empty window, described insulator is fixed on described substrate layer, and be filled in the region corresponding with described empty window, described insulator is surrounded on described electronic component week side, for providing insulation environment for described electronic component, described identifying body and described insulator one-body molded, described identifying body is laminated on described coverlay, and contiguous described empty window, for providing mark for described electronic component.
2. circuit board according to claim 1, it is characterized in that, described circuit board also comprises line layer, and described line layer is laminated between described substrate layer and described coverlay, line layer described in described empty window exposed portion, described welding electronic elements is on described line layer.
3. circuit board according to claim 2, it is characterized in that, described coverlay comprises the first coverlay and the second coverlay, described first coverlay and described second coverlay are laminated in described substrate layer both sides respectively, described empty window is opened on described first coverlay, described line layer is laminated between described second coverlay and described substrate layer, is connected with the electric-conductor through described substrate layer between described line layer and described electronic component.
4. circuit board according to claim 2, it is characterized in that, described line layer comprises first line layer and the second line layer, described first line layer is laminated between described first coverlay and described substrate layer, described second line layer is laminated between described second coverlay and described substrate layer, described empty window is opened on described first coverlay, is connected with the electric-conductor through described substrate layer and described first line layer between described second line layer and described electronic component.
5. circuit board according to claim 2, it is characterized in that, described line layer comprises conductor wire and pad, described pad is fixed on described substrate layer, be oppositely arranged with described empty window, described conductor wire is fixed between described coverlay and described substrate layer, and is electrically connected described pad, and described welding electronic elements is on described pad.
6. circuit board according to claim 1 and 2, is characterized in that, length dimension or the wide size of described empty window are not less than 0.5mm, and the number of described soft copy is multiple, and multiple described soft copy is all fixed in described empty window, and spaced setting.
7. a terminal, is characterized in that, described terminal comprises the circuit board described in claim 1 ~ 6 any one, and described terminal also comprises body and is located at the mainboard of described body interior, and described body interior is located at by described circuit board, and is electrically connected with described mainboard.
8. a circuit board manufacturing method, is characterized in that, described circuit board manufacturing method comprises step:
Substrate layer is provided;
Shaping coverlay on described substrate layer, described coverlay has sky window;
The region fixed electronic element of corresponding described empty window on described substrate layer;
On described substrate layer and on described coverlay respectively one-body molded go out insulator and identifying body, described insulator is filled in the region corresponding with described empty window, and is surrounded on described electronic component week side, the contiguous described empty window of described identifying body.
9. circuit board manufacturing method according to claim 8, is characterized in that,
Shaping coverlay on described substrate layer, described coverlay also comprises before having the step of sky window:
Circuit etching layer on described substrate layer; And on described substrate layer corresponding described empty window region step in, described welding electronic elements is in described line layer.
10. circuit board manufacturing method according to claim 8, it is characterized in that, on described substrate layer and on described coverlay respectively one-body molded go out insulator and identifying body step in, adopt silk-screen printing technique integrally to print described insulator and described identifying body on described substrate layer He on described coverlay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510999894.4A CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510999894.4A CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
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| CN105451434A true CN105451434A (en) | 2016-03-30 |
| CN105451434B CN105451434B (en) | 2018-03-27 |
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| CN201510999894.4A Active CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
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| CN107613631A (en) * | 2017-08-31 | 2018-01-19 | 江苏普诺威电子股份有限公司 | Wiring board pin ink indicating arrangement and its processing technology |
| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
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| WO2006011320A1 (en) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | Composite electronic component and its manufacturing method |
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| CN112272445A (en) * | 2020-10-29 | 2021-01-26 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
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| Publication number | Publication date |
|---|---|
| CN105451434B (en) | 2018-03-27 |
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