CN105451434B - Circuit board, terminal and circuit board manufacturing method - Google Patents
Circuit board, terminal and circuit board manufacturing method Download PDFInfo
- Publication number
- CN105451434B CN105451434B CN201510999894.4A CN201510999894A CN105451434B CN 105451434 B CN105451434 B CN 105451434B CN 201510999894 A CN201510999894 A CN 201510999894A CN 105451434 B CN105451434 B CN 105451434B
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- China
- Prior art keywords
- layer
- circuit board
- cover layer
- empty window
- electronic component
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
Abstract
The invention discloses a kind of circuit board,Circuit board manufacturing method and terminal,The circuit board includes substrate layer,Cover layer,Electronic component and solder mask,The cover layer is laminated on the substrate layer,The cover layer is provided with empty window,The electronic component is fixed in the empty window,The solder mask includes insulator and identifying body,The insulator is identical with the identifying body material,The insulator is filled up completely with the empty window,And it is surrounded on the electronic component the week side of boss,The identifying body is laminated on the cover layer,And the neighbouring empty window,It is identical with the identifying body material using the insulator,The identifying body can also be laminated while so as to fill the insulator in the empty window on the cover layer,I.e. described insulator and the identifying body can make simultaneously,So as to improve the producing efficiency of the circuit board,So that the production cycle of the circuit board reduces,Reduce production cost.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of circuit board, terminal and circuit board manufacturing method.
Background technology
It is more on current most circuit board electronic device to be arranged in the opening on cover layer, in opening for cover layer
Intraoral filling solder mask, covered and protected with split intraoral line layer, while can also be set in the open outer side of cover layer
Silk-screen layer is put, to be identified to electronic device, but solder mask and silk-screen layer need separate machined at present, thus cause circuit
The producing efficiency of plate is not high, and the production cycle is grown, and wastes production cost.
The content of the invention
The present invention provides a kind of circuit board that can improve production efficiency, terminal and circuit board manufacturing method.
The present invention provides a kind of circuit board, wherein, the circuit board includes substrate layer, cover layer, electronic component, insulator
And identifying body, the cover layer are laminated on the substrate layer, the cover layer is provided with empty window, and the electronic component is fixed on institute
State on substrate layer, and in the region corresponding with the empty window, the insulator is fixed on the substrate layer, and is filled
In in the region corresponding with the empty window, the insulator is surrounded on the electronic component the week side of boss, for for the electronics member
Part provides insulation environment, and the identifying body and the insulation body by integral forming, the identifying body are laminated on the cover layer, and
The neighbouring empty window, for providing mark for the electronic component.
Wherein, the circuit board also includes line layer, the line layer be laminated in the substrate layer and the cover layer it
Between, line layer described in the empty window exposed portion, the electronic component is welded on the line layer.
Wherein, the cover layer includes the first cover layer and the second cover layer, and first cover layer and described second covers
Epiphragma is laminated in the substrate layer both sides respectively, and the empty window is opened on first cover layer, and the line layer is laminated in
Between second cover layer and the substrate layer, it is connected between the line layer and the electronic component through the base material
The electric-conductor of layer.
Wherein, the line layer includes first line layer and the second line layer, and the first line is laminated on described layer by layer
Between one cover layer and the substrate layer, second line layer is laminated between second cover layer and the substrate layer,
The empty window is opened on first cover layer, is connected between second line layer and the electronic component through described
The electric-conductor of substrate layer and the first line layer.
Wherein, the line layer includes conductor wire and pad, and the pad is fixed on the substrate layer, with the empty window
It is oppositely arranged, the conductor wire is fixed between the cover layer and the substrate layer, and electrically connects the pad, the electronics
Element is welded on the pad.
Wherein, the length dimension of the empty window or wide size are not less than 0.5mm, the number of the soft copy be it is multiple, it is more
The individual soft copy is both secured in the empty window, and spaced setting.
The present invention also provides a kind of terminal, wherein, the terminal includes the circuit board described in above-mentioned any one, the end
End also includes body and the mainboard located at the body interior, and the circuit board is located at the body interior, and with the mainboard
Electrical connection.
The present invention also provides a kind of circuit board manufacturing method, wherein, the circuit board manufacturing method includes step：
Substrate layer is provided；
Cover layer is molded on the substrate layer, the cover layer has empty window；
Electronic component is fixed in the region that the empty window is corresponded on the substrate layer；
Insulator and identifying body are integrally formed out on the substrate layer and respectively on the cover layer, the insulator is filled out
Fill in the region corresponding with the empty window, and be surrounded on the electronic component the week side of boss, the identifying body is adjacent to the empty window.
Wherein,
Cover layer is molded on the substrate layer, before the cover layer has the step of empty window, in addition to：
The circuit etching layer on the substrate layer；And corresponded on the substrate layer in the region step of the empty window, institute
State electronic component and be welded in the line layer.
Wherein, on the substrate layer and the cover layer on be integrally formed out insulator and identifying body respectively the step of
In, the insulator and the mark are printed on the substrate layer and integrally on the cover layer using silk-screen printing technique
Body.
Circuit board, circuit board manufacturing method and the terminal of the present invention, by setting the welding resistance oil on the cover layer
Ink, the solder mask includes insulator and identifying body, identical with the material of the identifying body using the insulator, so that
The identifying body, i.e., described insulator can also be laminated on the cover layer while insulator is filled in the empty window
It can be made simultaneously with the identifying body, so as to improve the producing efficiency of the circuit board so that the production week of the circuit board
Phase reduces, and reduces production cost.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, the required accompanying drawing used in embodiment will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the present invention, general for this area
For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the circuit board of first embodiment provided by the invention；
Fig. 2 is the schematic diagram of the circuit board of second embodiment provided by the invention；
Fig. 3 is the schematic diagram of the circuit board of 3rd embodiment provided by the invention；
Fig. 4 is the schematic diagram of the circuit board of fourth embodiment provided by the invention；
Fig. 5 is the schematic flow sheet of circuit board manufacturing method provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is carried out clear
Chu, it is fully described by.
Referring to Fig. 1, the present invention provides a kind of circuit board 100 of first embodiment, the circuit board 100 includes substrate layer
10th, cover layer 20, electronic component 30 and solder mask 40, the cover layer 20 are laminated on the substrate layer 10, the covering
Film 20 is provided with empty window 21.The electronic component 30 is fixed on the substrate layer 10, and positioned at corresponding with the empty window 21
In region.The solder mask 40 includes insulator 41 and identifying body 42, the insulator 41 and the material phase of the identifying body 42
Together.The insulator 41 is fixed on the substrate layer 10, and is filled in the region corresponding with the empty window 21, described exhausted
Edge body 41 is surrounded on the week side of boss of electronic component 30, for providing insulation environment for the electronic component 30.The identifying body 42
It is integrally formed with the insulator 41, the identifying body 42 is laminated on the cover layer 20, and the neighbouring empty window 21.Can be with
Understand, the circuit board 100 is applied in terminal, and the terminal can be mobile phone, tablet personal computer, notebook computer or broadcasting
The mancarried electronic aids such as machine.
By setting the solder mask 40 on the cover layer 20, the solder mask 40 includes insulator 41 and mark
Know body 42, it is identical with the material of identifying body 42 using the insulator 41, so as to described in the filling in the empty window 21
The identifying body 42, i.e., described insulator 41 and the mark can also be laminated while insulator 41 on the cover layer 40
Body 42 can make simultaneously, so as to improve the producing efficiency of the circuit board 100 so that the production cycle of the circuit board 100
Reduce, reduce production cost.
In present embodiment, the substrate layer 10 can use polyimides or the double stupid diformates of polyethylene
Materials such as (Polyethylene terephthalate PET), so that the substrate layer 10 can provide insulation environment, so as to
In etching copper foil on the substrate layer 10.
Preferably, the thickness of the substrate layer 10 can be 20 μm.Specifically, the substrate layer 10 includes the be disposed opposite to each other
The side 12 of side 11 and second.Copper foil circuit can be etched on first side 11 or second side 12, can also be described
Copper foil circuit is etched on side 11 and second side 12.In present embodiment, the cover layer 20 can be individual layer covering
Film, then the cover layer 20 be laminated in first side 11 or second side 12.The cover layer 20 can also be double-deck, double
The layer cover layer 20 can be laminated in respectively on first side 11 and second side 12.
Wherein, the cover layer 20 can use polyester material to carry out hot-forming.Specifically, the cover layer 20 passes through
In on the first side 11 of the substrate layer 10, the cover layer 20 is carried out paste adhesive to the copper foil circuit on the substrate layer 10
Protection.Meanwhile the cover layer 20 using paste adhesive by the way of the substrate layer 10, it is also possible that the cover layer 20
Be connected with copper foil circuit on the substrate layer 10 it is closer, prevent the cover layer 20 from shifting and can not be to needing to the covering
The copper foil circuit that film 20 covers is protected.In other embodiments, the cover layer 20 can also be using spraying plated film
Mode, which is carved, to be plated on the substrate layer 10.
In present embodiment, the empty window 21 is rectangular through-hole, and the length dimension or width dimensions of the empty window 21 are not
Less than 0.05mm, the electronic component 30 is fixed in the empty window 21 so as to convenient.The empty window 21 can use photoetch
Technological forming, i.e., the shaping of the empty window 21 is completed while the cover layer 20 is molded, so as to reduce processing step, improved
The producing efficiency of the circuit board 100；It can also be after first molding whole film layer, then the sky is molded in whole film layer
Window 21, so as to improve the positional precision of the empty window 21, so as to improve the quality of the circuit board 100.In other implementations
In mode, the number of the empty window 21 can be multiple, and the shape of the empty window 21 can also be the combination of other multiple rectangles,
Can also be circular, or pentagon or hexagon etc..
In present embodiment, the electronic component 30 can be electric capacity, resistance, electronic chip, connecting seat or grafting group
Part etc..The electronic component 30 is fixed in the empty window 21, and the copper foil so as to be electrically connected on the substrate layer 10 is led
Line, so as to realize that electronic component 30 is accessed in the circuit of the circuit board 100, and then realize a variety of work(of the circuit board 100
Energy.Specifically, the number of the electronic component 30 can be multiple, and multiple electronic components 30 are densely arranged in described
In empty window 21, so as to reduce the space-consuming of electronic component 30, conveniently by the empty window 21 and multiple electronics members
Part 30 may be contained within the non-flex area of the circuit board 100, so that the flex area of the circuit board 100 only sets copper foil to lead
Line, and then improve the flexibility of the circuit board 100.And it is fixed on an empty window using multiple electronic components 30
21 so that the empty size of window 21 is larger, is easily worked, and is filled up completely with by the insulator 41 in the empty window 21,
The short circuit of electronic component 30 is prevented, improves the security performance of the circuit board 100.In other embodiments or
One electronic component 30 is set in an empty window 21.
In present embodiment, the solder mask 40 is made of liquid photopolymerizable solder resist, i.e., described solder mask 40 is
Green oil.After the cover layer 20 is formed on the substrate layer 10, the solder mask 40 is coated on the cover layer 20,
And the empty window 21 is filled, so that the insulator 41 and the identifying body 42 are molded simultaneously.The insulator 41 has
Insulating properties and viscosity, so as to prevent the electronic component 30 and copper foil conductor cord disconnection, and it is also prevented from the electronics
The short circuit of element 30.The material of identifying body 42 is liquid photopolymerizable solder resist, also referred to as green oil, so as to the color of the identifying body 42
It is different from the color of the cover layer 30 and the color of the substrate layer 10, so as to which the identifying body 42 has mark action.Institute
The type of the electronic component 30 can be identified by stating identifying body 42, can also identify the electrical parameter of the circuit board 100, and
The connected mode of multiple electronic components 30 in the empty window 21 can also be identified, and SMT is carried out in the circuit board 100
During technique, the identifying body 42 is also used as the positioning datum of the electronic component 30, facilitates the patch of the electronic component 30
Piece.In other embodiments, the solder mask 40 can also be takes shape in the cover layer 20 using silk-screen printing technique
On.
Further, the circuit board 100 also includes line layer 50, and the line layer 50 is laminated in the He of substrate layer 10
Between the cover layer 20, line layer 50 described in the empty exposed portion of window 21, the electronic component 30 is welded in the circuit
On layer 20.
In present embodiment, the line layer 50 has earth lead (not indicating) and signal conductor (not indicating), institute
It is copper foil conductor wire to state earth lead and the signal conductor.The earth lead realizes the ground connection of the circuit board 100, institute
State signal conductor to electrically connect with the electronic component 30, so as to realize the electric conductivity of the circuit board 100.It is specifically, described
The empty window 21 is passed through in signal conductor part, is welded with the phase of electronic component 30, so as to realize that the electronic component 30 is firm
In in the empty window 21, and realize that the electronic component 30 is accessed in the circuit of the circuit board 100.The earth lead can
To be disposed on the signal conductor side, it is isolated with the signal wires, so as to provide ground connection electricity for the circuit board 100
Pole.In other embodiments, the line layer 50 can also be only setting signal wire.
Further, referring to Fig. 2, providing second embodiment, unlike first embodiment, the cover layer 20 wraps
The first cover layer 21 and the second cover layer 22 are included, the first cover layer 20a and the second cover layer 20b are laminated in institute respectively
The both sides of substrate layer 10 are stated, the empty window 21 is opened on the first cover layer 20a, and the line layer 50 is laminated in described second
Between cover layer 22 and the substrate layer 10, it is connected between the line layer 50 and the electronic component 30 through the base material
The electric-conductor 51 of layer 10.
In present embodiment, the line layer 50 is individual layer copper foil.The line layer 50 is arranged at the substrate layer 10 and carried on the back
From the empty side of window 21, after avoiding the breakage of insulator 41, the line layer 50 is exposed to the open air, so as to improve the circuit
The security of plate 100.One end of the electric-conductor 51 is connected on the line layer 50, and the other end is welded in the electronic component
30, so as to realize that the electronic component 30 is connected with the line layer 50.Multiple electric-conductors can also be set in the empty window 21
51。
Referring to Fig. 3, providing 3rd embodiment, roughly the same with second embodiment, its difference is：The line layer
50 are laminated between the first cover layer 20a and the substrate layer 10.Realized using the second cover layer 20b to the electricity
The reinforcement of road plate 100, or the reinforcement protection to the circuit board 100 is realized, so as to the peace for improving the circuit board 100
Full performance.And the electric-conductor 51 need not be connected between the electronic component 30 and the line layer 50, it is described so as to reduce
The production cost of circuit board 100.
Referring to Fig. 4, providing fourth embodiment, roughly the same with second embodiment, its difference is：The line layer
50 be double-deck copper foil.Specifically, the line layer 50 includes first line layer 50a and the second line layer 50b, the first line
Layer 50a is laminated between the first cover layer 20a and the substrate layer 10, and the second line layer 50b is laminated in described the
Between two cover layer 20b and the substrate layer 10, the empty window 21 is opened on the first cover layer 20a, second line
The electric-conductor through the substrate layer 10 and the first line floor 50a is connected between road floor 50b and the electronic component 30
51, i.e., described electric-conductor 51 is connected between the second line layer 50b and the electronic component 30.More specifically, it is described
First line layer 50a and the second line layer 50b are equipped with signal conductor, the first line layer 50a and second line
Road floor 50b provides two different conducting channels respectively, so as to which the circuit board 100 improves electric conductivity.The electric-conductor 51
Through the substrate layer 10 and the first line layer 50a, and the conductor wire on the first line layer 50a is avoided, so as to keep away
It is conductive to exempt from the first line layer 50a and the second line layer 50b, and is conveniently installed on multiple electronic components 30
The side of substrate layer 10, so that the circuit board 100 can meet more circuits demand.
Further, the line layer 50 includes conductor wire (not indicating) and pad (not indicating), the pad are fixed on
On the substrate layer 10, it is oppositely arranged with the empty window 41, the conductor wire is fixed on the cover layer 20 and the substrate layer
Between 10, and the pad is electrically connected, the electronic component 30 is welded on the pad.Utilize the pad and the empty window
41 are oppositely arranged, and the electronic component 30 is welded on the pad so as to convenient, increase the electronic component 30 with it is described
The steadiness of line layer 50, so as to improve the stabilized structure performance of the circuit board 100.
Below in conjunction with Fig. 5, circuit board manufacturing method provided in an embodiment of the present invention is described in detail, it is necessary to illustrate
, Fig. 5 circuit board manufacturing method, for preparing the structure of Fig. 1~embodiment illustrated in fig. 4 of the present invention, for convenience of description,
The part related to the embodiment of the present invention is illustrate only, particular technique details does not disclose, refer to shown in Fig. 1-Fig. 4 of the present invention
Embodiment.
Fig. 1~5 are referred to, are a kind of circuit board manufacturing method provided by the invention, the circuit board manufacturing method includes
Step：
S01：Substrate layer 10 is provided.
The substrate layer 10 is using polyimides or the double stupid diformate (Polyethylene of polyethylene
Terephthalate PET) etc. material, the first side 10a and the second side 10b of the substrate layer 10 can laminated conductive copper foils.
S02：The circuit etching layer 50 on the substrate layer 10.
The line layer 50 is copper-foil conducting electricity, and the line layer 50 is etched on the substrate layer 10, described so as to realize
The circuit configuration of circuit board 100.
S03：Cover layer 20 is molded on the substrate layer 10, the cover layer 20 has empty window 21.
The cover layer 30 is hot-forming using polyester material progress, and is adhered to by viscose glue on the line layer 50.
Line layer 50 described in the Partial exposure of empty window 21.
S04：Electronic component 30 is fixed in the region that the empty window 21 is corresponded on the substrate layer 10.
The electronic component 30 is welded on the line layer 50 using welding procedure, so as to increase the circuit board 100
Structural soundness.
S05：Insulator 41 and identifying body 42 are integrally formed out on the substrate layer 10 and respectively on the cover layer 20,
The insulator 41 is filled in the region corresponding with the empty window 21, and is surrounded on the week side of boss of electronic component 30, described
Identifying body 42 is adjacent to the empty window 21.
Solder mask 40 is molded on the cover layer 20, the solder mask 40 has insulator 41 and identifying body 42, institute
State insulator 41 to be filled up completely with the empty window 21, and be surrounded on the week side of boss of electronic component 30, the identifying body 42 is laminated
In on the cover layer 20, and the neighbouring empty window 21.
The solder mask 40 is printed on the cover layer 20 using silk-screen printing technique, so as to the He of insulator 41
The identifying body 42 can be molded simultaneously, and then reduce the production cycle of the circuit board 100, and the solder mask 40
Scale error precision is -0.05mm~+0.05mm, so as to improve the machining accuracy of the circuit board 100 so that the identifying body
42 positioning precision increase, improve the quality of production of the circuit board 100.
The present invention also provides a kind of terminal (not shown), the terminal include the circuit board 100, body (not shown) and
Located at the mainboard (not shown) of the body interior, the circuit board 100 is located at the body interior, and is electrically connected with the mainboard
Connect.The terminal can be the mancarried electronic aids such as mobile phone, tablet personal computer, notebook computer or player.
Circuit board, circuit board manufacturing method and the terminal of the present invention, by setting the welding resistance oil on the cover layer
Ink, the solder mask include insulator and identifying body, identical with the identifying body material using the insulator, so as to
The identifying body, i.e., described insulation can also be laminated while filling the insulator in the empty window on the cover layer
Body and the identifying body can make simultaneously, so as to improve the producing efficiency of the circuit board so that the production of the circuit board
Cycle reduces, and reduces production cost.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of circuit board, it is characterised in that the circuit board includes substrate layer, cover layer, electronic component, insulator and mark
Body, the cover layer are laminated on the substrate layer, and the cover layer is provided with empty window, and the electronic component is fixed on the base material
On layer, and in the region corresponding with the empty window, the insulator is fixed on the substrate layer, and is filled in and institute
State in the corresponding region of sky window, the insulator is surrounded on the electronic component the week side of boss, for being provided for the electronic component
Insulate environment, and the identifying body and the insulation body by integral forming, the identifying body are identical and same with the material of the insulator
When be made, the identifying body is laminated on the cover layer, and the neighbouring empty window, for being provided for the electronic component
Mark.
2. circuit board according to claim 1, it is characterised in that the circuit board also includes line layer, the line layer
It is laminated between the substrate layer and the cover layer, line layer described in the empty window exposed portion, the electronic component welding
In on the line layer.
3. circuit board according to claim 2, it is characterised in that the cover layer includes the first cover layer and the second covering
Film, first cover layer and second cover layer are laminated in the substrate layer both sides respectively, and the empty window is opened in described
On first cover layer, the line layer is laminated between second cover layer and the substrate layer, the line layer and described
The electric-conductor through the substrate layer is connected between electronic component.
4. circuit board according to claim 2, it is characterised in that the line layer includes first line layer and the second circuit
Layer, the first line are laminated between first cover layer and the substrate layer layer by layer, and second line layer is laminated in institute
State between the second cover layer and the substrate layer, the empty window is opened on first cover layer, second line layer and
The electric-conductor through the substrate layer and the first line layer is connected between the electronic component.
5. circuit board according to claim 2, it is characterised in that the line layer includes conductor wire and pad, the weldering
Disk is fixed on the substrate layer, is oppositely arranged with the empty window, the conductor wire is fixed on the cover layer and the base material
Between layer, and the pad is electrically connected, the electronic component is welded on the pad.
6. circuit board according to claim 1 or 2, it is characterised in that the length dimension of the empty window or wide size be not small
In 0.5mm, the number of the soft copy is multiple, and multiple soft copies are both secured in the empty window, and spaced is set
Put.
7. a kind of terminal, it is characterised in that the terminal includes the circuit board described in claim 1~6 any one, the end
End also includes body and the mainboard located at the body interior, and the circuit board is located at the body interior, and with the mainboard
Electrical connection.
8. a kind of circuit board manufacturing method, it is characterised in that the circuit board manufacturing method includes step：
Substrate layer is provided；
Cover layer is molded on the substrate layer, the cover layer has empty window；
Electronic component is fixed in the region that the empty window is corresponded on the substrate layer；
Insulator and identifying body are integrally formed out on the substrate layer and respectively on the cover layer, the insulator is filled in
In the region corresponding with the empty window, and the electronic component the week side of boss is surrounded on, the identifying body is described adjacent to the empty window
Identifying body is identical with the material of the insulator and is made simultaneously.
9. circuit board manufacturing method according to claim 8, it is characterised in that
Cover layer is molded on the substrate layer, before the cover layer has the step of empty window, in addition to：
The circuit etching layer on the substrate layer；And corresponded on the substrate layer in the region step of the empty window, the electricity
Subcomponent is welded in the line layer.
10. circuit board manufacturing method according to claim 8, it is characterised in that on the substrate layer and the covering
It is on the substrate layer and described using silk-screen printing technique in the step of being integrally formed out insulator and identifying body on film respectively
The insulator and the identifying body are integrally printed on cover layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510999894.4A CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510999894.4A CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451434A CN105451434A (en) | 2016-03-30 |
| CN105451434B true CN105451434B (en) | 2018-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510999894.4A Active CN105451434B (en) | 2015-12-24 | 2015-12-24 | Circuit board, terminal and circuit board manufacturing method |
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| Country | Link |
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| CN (1) | CN105451434B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613631A (en) * | 2017-08-31 | 2018-01-19 | 江苏普诺威电子股份有限公司 | Wiring board pin ink indicating arrangement and its processing technology |
| CN112272445B (en) * | 2020-10-29 | 2022-09-06 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1835659A (en) * | 2005-03-16 | 2006-09-20 | 杨合卿 | Anti-welding procedue of PCB |
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