CN210537028U - Printed circuit board and electronic equipment - Google Patents
Printed circuit board and electronic equipment Download PDFInfo
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- CN210537028U CN210537028U CN201921409490.5U CN201921409490U CN210537028U CN 210537028 U CN210537028 U CN 210537028U CN 201921409490 U CN201921409490 U CN 201921409490U CN 210537028 U CN210537028 U CN 210537028U
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- hole
- circuit board
- printed circuit
- signal line
- pin
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Abstract
The application provides a printed circuit board and electronic equipment, wherein the electronic equipment comprises the printed circuit board, a first through hole, a second through hole and a signal line used for being electrically connected with a pin of an electronic element are arranged on the printed circuit board; the first through hole is used for inserting a pin of an electronic element, and a welding disc used for being welded with the pin is arranged on the periphery of the first through hole; the second through hole is arranged adjacent to the first through hole, and the aperture of the second through hole is smaller than that of the first through hole; and a conducting layer is arranged on the inner side wall of the second through hole and is electrically connected with the bonding pad and the signal line respectively. Therefore, the pins of the electronic element can be fixed, and the electric connection between the conductive layer and the bonding pad and among the signal lines can be effectively ensured.
Description
Technical Field
The utility model relates to a printed circuit board makes technical field, especially relates to a printed circuit board and electronic equipment.
Background
A Printed Circuit Board (PCB) is provided with a plurality of soldering holes and at least one signal line for electrically connecting with a pin of an electronic component; wherein, the welding hole is used for installing the electronic component printing.
A soldering hole in the prior art, referring to fig. 1 to 2, wherein fig. 1 is a top view of a printed circuit board having a soldering hole in the prior art, fig. 2 is a cross-sectional view taken along direction a of fig. 1, the soldering hole penetrates through the upper and lower surfaces of the printed circuit board, and a copper film is plated on the inner side wall of the soldering hole, a pad for soldering with a pin of an electronic component is disposed at the periphery of the soldering hole, and the copper film is electrically connected with the pad and each signal line to mount the electronic component on the printed circuit board through the soldering hole.
However, in the prior art, the hole diameter of the solder hole is large, so that the problem of dry film sealing breakage is easily caused in the etching process, and the copper film in the solder hole is also etched, thereby causing the disconnection of the electrical connection between the copper film and the bonding pad and between the copper film and each signal wire.
SUMMERY OF THE UTILITY MODEL
The application provides a printed circuit board and electronic equipment not only can fix electronic component's pin, and can effectively guarantee the electric connection between conducting layer and pad, each signal line.
In order to solve the technical problem, the application adopts a technical scheme that:
a printed circuit board is provided with a first through hole, a second through hole and a signal line which is electrically connected with a pin of an electronic element;
the first through hole is used for inserting a pin of the electronic element, and a welding disc used for being welded with the pin is arranged on the periphery of the first through hole;
the second through hole is adjacent to the first through hole, and the aperture of the second through hole is smaller than that of the first through hole; and a conducting layer is arranged on the inner side wall of the second through hole and is electrically connected with the bonding pad and the signal wire respectively.
The number of the second through holes is multiple, and each second through hole is arranged around the first through hole.
The distance between each second through hole and the first through hole is equal, and the distance between two adjacent second through holes is equal.
Wherein the second via is disposed on the pad.
The second through hole is arranged on an area outside the bonding pad, and the conducting layer on the inner side wall of the second through hole is connected with the bonding pad through a conducting wire.
Wherein the printed circuit board comprises a first signal line layer; the first through hole and the second through hole penetrate through the signal line layer; the signal line is arranged on the first signal line layer and is connected with the conductive layer arranged on the inner side wall of the second through hole.
Wherein the number of the signal lines is at least one; the number of the first signal line layers is multiple, the first signal line layers are mutually stacked, and the signal lines are respectively arranged on one or more of the first signal line layers.
The top of the printed circuit board is provided with a second signal line layer, the bonding pad is arranged on the second signal line layer, and the first signal line layer is arranged in the middle or at the bottom of the printed circuit board.
The aperture range of the first through hole is 3-6 mm, and the aperture range of the second through hole is 0.2-0.5 mm.
Wherein the aperture of the second through hole is 0.3 mm.
In order to solve the above technical problem, another technical solution adopted by the present application is:
an electronic device comprising the printed circuit board and the electronic component.
The application provides a printed circuit board and electronic equipment, wherein the electronic equipment comprises the printed circuit board, and pins of electronic elements are fixed by arranging a first through hole on the printed circuit board; meanwhile, the second through holes are arranged at the adjacent positions of the first through holes, the conducting layers are arranged on the inner side walls of the second through holes and are respectively electrically connected with the signal lines which are used for being electrically connected with the welding pads welded with the pins and the pins of the electronic element, and the aperture of each second through hole is smaller than that of each first through hole, so that the probability of dry film hole sealing breakage at the second through hole in the etching process is greatly reduced, the pins of the electronic element can be fixed, and the electric connection between the conducting layers and the welding pads and among the signal lines can be effectively guaranteed.
Drawings
FIG. 1 is a top view of a prior art printed circuit board having solder holes formed therein;
FIG. 2 is a sectional view taken along line A of FIG. 1;
FIG. 3 is a top view of a printed circuit board provided in an embodiment of the present application;
FIG. 4 is a sectional view taken along line A of FIG. 3;
fig. 5 is a schematic structural diagram of a copper-clad plate in the prior art.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present application will be described in detail with reference to the accompanying drawings and examples.
Referring to fig. 3 to 5, fig. 3 is a top view of a printed circuit board according to an embodiment of the present disclosure; FIG. 4 is a sectional view taken along line A of FIG. 3; fig. 5 is a schematic structural diagram of a copper-clad plate in the prior art.
The present embodiment provides a printed circuit board 1, wherein the printed circuit board 1 is provided with a first through hole 100, a second through hole 101, and a signal line (not shown in the figure) for electrically connecting with a pin of an electronic component.
The first through hole 100 is used for inserting a pin of an electronic component to fixedly print the pin of the electronic component.
In a specific implementation process, the periphery of the first through hole 100 is provided with a pad for soldering with a pin, and the pin of the electronic component is printed by connecting the solder paste with the pad.
Specifically, the radial dimension of the first through hole 100 is not smaller than the radial dimension of the pin of the electronic component, so that the pin of the electronic component can be smoothly inserted into the first through hole 100; in a preferred embodiment, the radial dimension of the first through hole 100 is slightly larger than the radial dimension of the pin of the electronic component.
Optionally, the first through hole 100 is a cylinder with the same upper and lower calibers; of course, in other embodiments, the first through hole 100 may also be a polygon with the same upper and lower apertures, which is not limited in this embodiment.
Optionally, the first through hole 100 may also be a through hole structure with different upper and lower apertures, for example, the first through hole 100 is a tapered structure with a larger top opening and a smaller bottom opening.
Optionally, in an embodiment, the first through hole 100 may also be configured as a blind hole structure to fix the pin of the electronic component, which is not limited in this embodiment as long as the pin of the electronic component can be fixed.
It can be understood that, in the implementation process, the radial dimension of the blind hole is not less than the radial dimension of the pin of the electronic component, and the depth of the blind hole is not less than the length of the leg of the pin of the electronic component, so as to ensure that the pin of the electronic component can be stably plugged in the blind hole.
In the specific implementation process, because the length of the pin of the electronic element is generally within 1.5mm, the depth of the blind hole can be set between 1.5mm and 2 mm; of course, in other embodiments, the depth of the blind hole may also be set to 3mm, and specifically, the depth may be set according to the actual length of the pin of the electronic component.
Optionally, the blind hole is a cylinder with the same upper and lower calibers, and of course, in other embodiments, the blind hole may also be a polygon with the same upper and lower calibers, which is not limited in this embodiment.
Optionally, the blind hole has a structure with different upper and lower calibers, for example, the blind hole has a tapered structure with a larger top opening and a smaller bottom opening.
In a specific implementation, the first through hole 100 may be specifically a non-metallized hole; it is understood that, at this time, the first through holes 100 are only used for inserting pins of the electronic component to fix the pins of the electronic component.
It should be noted that the fixing manner of the pins of the electronic component in the first through holes 100 is the same as the fixing manner of the pins of the electronic component in the soldering holes 10 in the prior art, and the same or similar technical effects can be achieved, and are not described herein again.
Referring to fig. 4, the number of the second through holes 101 is multiple, and the multiple second through holes 101 are adjacent to the first through holes 100 and arranged around the first through holes 100.
Optionally, distances between each second through hole 101 and the first through hole 100 are equal, and distances between two adjacent second through holes 101 are equal.
Optionally, the number of the second through holes 101 may be eight; of course, in other embodiments, the number of the second through holes 101 may also be four or six, which is not limited in this embodiment.
Specifically, a conductive layer is disposed on an inner sidewall of the second via hole 101, and the conductive layer is electrically connected to the pad and each signal line, respectively.
Specifically, the signal line is electrically connected with a pin of the electronic element through a pad, and the conductive layer on the inner side wall of the second through hole is electrically connected with the signal line through the pad.
Specifically, the signal line is electrically connected to the pad, the pad is connected to the pin of the electronic component through solder paste, and the signal line is electrically connected to the pin of the electronic component through the pad and the solder paste.
Optionally, the second through hole 101 may be specifically a cylinder with the same upper and lower calibers; of course, in other embodiments, the second through hole 101 may also be a polygon with the same upper and lower diameters, which is not limited in this embodiment.
Optionally, in an embodiment, the second via 101 is disposed on the pad.
In another embodiment, the second via 101 is disposed on an area other than the pad, and the conductive layer on the inner sidewall of the second via 101 is connected to the pad through a wire.
Specifically, the aperture of the second through hole 101 is smaller than that of the first through hole 100, so that the probability of the problem of dry film sealing breakage at the second through hole 101 in the etching process is effectively reduced, the pins of the electronic element can be fixed, and the electric connection between the conductive layer and the bonding pad and among the signal lines can be effectively guaranteed.
The printed circuit board 1 provided by the embodiment fixes the pins of the electronic element by arranging the first through hole 100 on the printed circuit board 1, and simultaneously, the second through hole 101 is arranged at the adjacent position of the first through hole 100, the conducting layer is arranged on the inner side wall of the second through hole 101, and the conducting layer is respectively electrically connected with the bonding pad for being welded with the pins and the signal lines for being electrically connected with the pins of the electronic element, because the aperture of the second through hole 101 is smaller than that of the first through hole 100, the probability of dry film hole sealing breakage at the second through hole 101 in the etching process is greatly reduced, so that the pins of the electronic element can be fixed, and the conducting layer and the bonding pad can be effectively ensured, and the electrical connection between the signal lines is effectively ensured.
In the present embodiment, the printed circuit board 1 includes a first signal line layer on which signal lines are provided; and the first through hole 100 and the second through hole 101 both penetrate through the signal line layer, and the signal line is connected with the conductive layer arranged on the inner side wall of the second through hole.
Specifically, the first signal line layer is disposed at the middle or bottom of the printed circuit board 1.
Specifically, the number of the signal lines is at least one; the number of the first signal line layers is a plurality, the first signal line layers are mutually stacked, and the signal lines are respectively arranged on one or more of all the first signal line layers.
Specifically, the top of the printed circuit board 1 is further provided with a second signal line layer, and in a specific implementation process, the pad is specifically arranged on the second signal line layer.
In the embodiment, the aperture range of the first through hole 100 is 3-6 mm, and the aperture range of the second through hole 101 is 0.2-0.5 mm; specifically, the aperture of the first through hole 100 may be determined according to the size of the pin of the electronic component, and the aperture of the second through hole 101 may be 0.3mm, which is not limited in this embodiment as long as the first through hole 100 can be inserted with the pin of the electronic component, and the aperture of the second through hole 101 is smaller than the aperture of the first through hole 100.
Optionally, the conductive layer may be a metal layer.
Optionally, the metal layer is a copper film 11.
In a specific implementation process, the printed circuit board 1 may be a copper-clad plate 2.
The copper-clad plate 2 is a base material for manufacturing a circuit board, and includes a base material plate and a copper foil covered on the base material plate, wherein the base material plate is made by impregnating materials such as a paper substrate, a glass fiber fabric substrate, a synthetic fiber fabric substrate, a non-woven fabric substrate, a composite substrate and the like with resin to prepare bonding sheets, then a plurality of bonding sheets are combined to prepare the copper-clad plate 2, the copper foil is covered on one side or two sides of the prepared base material plate, and then hot-pressing and curing are carried out.
In the present embodiment, an electronic device is provided, which includes the printed circuit board 1 and the electronic component.
The electronic component provided by the embodiment comprises a printed circuit board 1, wherein the printed circuit board 1 is provided with a first through hole 100 through the printed circuit board 1 so as to fix pins of the electronic component, meanwhile, a second through hole 101 is arranged at the adjacent position of the first through hole 100, a conductive layer is arranged on the inner side wall of the second through hole 101, the conductive layer is respectively electrically connected with a pad for being welded with the pins and signal wires for being electrically connected with the pins of the electronic component, and the aperture of the second through hole 101 is smaller than that of the first through hole 100, so that the probability of dry film hole sealing breakage at the second through hole 101 in the etching process is greatly reduced, the pins of the electronic component can be fixed, and the conductive layer, the pad and the electrical connection among the signal wires can be effectively ensured.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (11)
1. A printed circuit board is characterized in that a first through hole, a second through hole and a signal line used for being electrically connected with a pin of an electronic element are arranged on the printed circuit board;
the first through hole is used for inserting a pin of the electronic element, and a welding disc used for being welded with the pin is arranged on the periphery of the first through hole;
the second through hole is adjacent to the first through hole, and the aperture of the second through hole is smaller than that of the first through hole; and a conducting layer is arranged on the inner side wall of the second through hole and is electrically connected with the bonding pad and the signal wire respectively.
2. The printed circuit board of claim 1, wherein the second through hole is plural in number, and each of the second through holes is disposed around the first through hole.
3. The printed circuit board of claim 2, wherein the distance between each second through hole and the first through hole is equal, and the distance between two adjacent second through holes is equal.
4. The printed circuit board of claim 1 or 2, wherein the second via is disposed on the pad.
5. The printed circuit board according to claim 1 or 2, wherein the second via hole is provided on an area other than the land, and the conductive layer on the inner side wall of the second via hole is connected to the land by a wire.
6. The printed circuit board of claim 1, wherein the printed circuit board comprises a first signal line layer; the first through hole and the second through hole penetrate through the signal line layer; the signal line is arranged on the first signal line layer and is connected with the conductive layer arranged on the inner side wall of the second through hole.
7. The printed circuit board of claim 6, wherein the number of signal lines is at least one; the number of the first signal line layers is multiple, the first signal line layers are mutually stacked, and the signal lines are respectively arranged on one or more of the first signal line layers.
8. The printed circuit board of claim 6, wherein a second signal line layer is disposed on a top portion of the printed circuit board, the pad is disposed on the second signal line layer, and the first signal line layer is disposed in a middle or bottom portion of the printed circuit board.
9. The printed circuit board of claim 1, wherein the first through hole has an aperture ranging from 3 to 6mm, and the second through hole has an aperture ranging from 0.2 to 0.5 mm.
10. The printed circuit board of claim 9, wherein the second through hole has an aperture of 0.3 mm.
11. An electronic device comprising the printed circuit board according to any one of claims 1 to 9 and the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921409490.5U CN210537028U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921409490.5U CN210537028U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210537028U true CN210537028U (en) | 2020-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921409490.5U Active CN210537028U (en) | 2019-08-27 | 2019-08-27 | Printed circuit board and electronic equipment |
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| CN (1) | CN210537028U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411953A (en) * | 2021-06-17 | 2021-09-17 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
-
2019
- 2019-08-27 CN CN201921409490.5U patent/CN210537028U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411953A (en) * | 2021-06-17 | 2021-09-17 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
| CN113411953B (en) * | 2021-06-17 | 2022-06-10 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
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