CN111315123A

CN111315123A - PCB and connecting structure of PCB and connector

Info

Publication number: CN111315123A
Application number: CN202010122112.XA
Authority: CN
Inventors: 李敬
Original assignee: Goertek Inc
Current assignee: Goertek Optical Technology Co Ltd
Priority date: 2020-02-26
Filing date: 2020-02-26
Publication date: 2020-06-19

Abstract

The invention discloses a connecting structure of a PCB and a connector, wherein the PCB comprises: a substrate; a solder resist layer covering the surface of the base material; the fixed pad is arranged on the substrate, a first windowing region is formed on the position of the fixed pad by the solder mask, the fixed pad comprises a first welding region and a first non-welding region circumferentially surrounding along the welding region, the first welding region corresponds to the first windowing region, the first welding region is used for being fixedly connected with a connector, and the first non-welding region is covered by the solder mask; the signal pad is arranged on the substrate, the signal pad is used for being fixedly connected with the connector and transmitting signals between the PCB and the connector, and the second windowing area is formed at the position of the signal pad on the solder mask layer. The invention ensures that the connector is not easy to separate from the PCB substrate, enhances the adhesive force between the connector and the PCB, and improves the quality of the connector.

Description

PCB and connecting structure of PCB and connector

Technical Field

The invention relates to the field of circuit boards, in particular to a PCB and a connecting structure of the PCB and a connector.

Background

A Printed Circuit Board (PCB), also called a PCB, is an important component of physical support and signal transmission of electronic products.

The connector is also called a connector, and generally refers to an electrical connector, i.e. a device for connecting two active devices to transmit current or signals. The connector is an indispensable element in both the connection design of the PCB and the connection design of the PCB and the wire, and due to the fact that the connector needs to be plugged and unplugged for many times in the production, test and use processes of terminal customers, particularly the wire-to-board type connector, the plugging and unplugging in the production process of a factory and the plugging and unplugging or stressing in the use process of the terminal customers are required, if the adhesive force between the welding pins of the connector and the PCB is small, the connector is easy to damage after being plugged and unplugged for many times, the production efficiency is influenced if the adhesive force is small, and the product quality problem is caused if the adhesive force is heavy, so that the customer complaint is caused.

Disclosure of Invention

The invention mainly aims to provide a PCB and a connecting structure of the PCB and a connector, aiming at solving the problem that the connector is easy to damage after being inserted and pulled for many times due to small adhesive force between the PCB and the connector at present.

In order to achieve the above object, the present invention provides a PCB including:

a substrate;

a solder resist layer covering the surface of the base material;

the fixed pad is arranged on the substrate, a first windowing region is formed on the position of the fixed pad by the solder mask, the fixed pad comprises a first welding region and a first non-welding region circumferentially surrounding along the welding region, the first welding region corresponds to the first windowing region, the first welding region is used for being fixedly connected with a connector, and the first non-welding region is covered by the solder mask;

the signal pad is arranged on the substrate, the signal pad is used for being fixedly connected with the connector and transmitting signals between the PCB and the connector, and the second windowing area is formed at the position of the signal pad on the solder mask layer.

Preferably, the PCB further includes a plurality of first circuit traces disposed on the substrate, and the first circuit traces are connected to the outer edge of the fixed pad.

Preferably, the substrate is provided with a via hole penetrating through each layer of the substrate, and the fixed pad is provided with a through hole communicated with the via hole in a first non-welding area.

Preferably, the number of the through holes is multiple, and the through holes are distributed at intervals along the periphery of the first welding area.

Preferably, the distance between the through hole and the edge of the first land is 0.07mm to 0.08 mm.

Preferably, the fixed pad is a grounding pad, and a copper foil hollow area is arranged in the first non-welding area of the fixed pad.

Preferably, the signal pad includes a second soldering region and a second non-soldering region disposed at two opposite ends of the second soldering region, the second soldering region corresponds to the second windowing region and is used for being fixedly connected to the connector, and the second non-soldering region is covered by the solder resist layer.

Preferably, the PCB board further comprises a second circuit trace connected to an end of the second non-soldering area, and a joint of the second circuit trace and the second non-soldering area is of a teardrop structure.

Preferably, the number of the signal pads is multiple, the signal pads are arranged at intervals along the width direction of the signal pads, and the second non-bonding region extends along the length direction of the signal pads.

In addition, the invention also provides a connecting structure of the PCB and the connector, which comprises the connector and the PCB, wherein the pins of the connector are welded with the first welding area of the fixing welding disc of the PCB.

In the technical scheme of the invention, the fixed pad is fixedly connected with the connector, the signal pad is fixed with the connector and transmits signals between the PCB and the connector, the solder mask layer is provided with a first windowing area at the fixed pad, and a second windowing area at the signal pad. Wherein, the anchor pad is divided into first welding zone and along the first non-welding zone that first welding zone axial encircleed by first windowing region, first welding zone corresponds in order to be used for with the pin fixed connection of connector with first shipment area, first non-welding zone is covered by the solder mask, the edge all around of anchor pad is covered by the solder mask promptly, make the anchor pad difficult for deviating from, make the connector difficult break away from with PCB's base plate, the adhesive force between connector and the PCB board has been strengthened, the quality of connector has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a fixing pad of a PCB board according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another portion of a PCB board according to an embodiment of the invention;

fig. 3 is a schematic structural diagram of another part of a PCB board according to an embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Fixed welding pad	110	First welding zone
120	First non-welding region	121	Through hole
				122	Copper foil excavated area	200	Signal pad
210	Second welding area	220	Second non-welding area
				300	Second circuit wiring	310	Tear drop structure
410	First window area	420	Second window area

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The present invention provides a PCB, as shown in fig. 1 and 2, including:

a substrate;

the solder mask is covered on the surface of the base material;

the fixed pad 100 is arranged on the substrate, a first windowing region 410 is formed on the fixed pad 100 by the solder mask, the fixed pad 100 comprises a first welding region 110 and a first non-welding region 120 which surrounds along the circumferential direction of the welding region, the first welding region 110 corresponds to the first windowing region 410, the first welding region 110 is used for being fixedly connected with a connector, and the first non-welding region 120 is covered by the solder mask;

and a signal pad 200 disposed on the substrate, the signal pad 200 being used for being fixedly connected with the connector and transmitting a signal between the PCB and the connector, the solder resist layer being formed with a second windowed area 420 at the signal pad 200.

The solder resist layer is composed of a solder resist material, which is used by a liquid wet process or a dry film stack. The fixed PAD 100 and the signal PAD 200 are metal layers, and copper foil is selected, that is, copper foil is laid on a substrate, and then a solder mask is covered, the solder mask can be a layer of green ink, and then a window is opened on the solder mask to expose the metal layer, and the metal layer exposed in the window is a PAD of a PCB board, for example, in the present invention, the solder mask is opened to expose a first soldering area 110 and a second soldering area 210, and then the first soldering area 110 and the second soldering area 210 are tinned for connecting with a connector. The thickness of this green printing ink layer is greater than the thickness of metal level to when making the printing ink layer fill the clearance between the PCB board circuit, can also cover fixed pad 100's all around edge, both protected PCB's circuit, make fixed pad 100 be difficult for droing again, reinforcing fixed pad 100's peeling strength has improved the adhesive force of connector on the PCB board, even the connector also can not be damaged easily through many times of plugs.

The fixing pad 100 is only used for connecting with a pin of a connector and is not used for transmitting signals, and the second bonding region 210 of the signal pad 200 is also connected with a pin of a connector and can also be used for transmitting signals. The positions of the fixing pads 100 and the signal pads 200 on the substrate are designed according to the specific model of the connector, and whether signals can be transmitted or not is also determined by the connector end.

Specifically, the PCB further includes a plurality of first circuit traces (not shown) disposed on the substrate, and the first circuit traces are connected to the outer edges of the fixed pads 100. The substrate of this embodiment is made of insulating materials such as glass fibers, and a layer of copper foil (usually oxygen-free copper) is covered on the substrate, and after the copper foil is etched, a section of zigzag copper foil is left, and the copper foils become circuit traces for connecting pins of components together. And the copper foil used for welding with the pins of the component is a bonding pad. The fixed pad 100 of this embodiment is connected with many first circuit traces, can strengthen the adhesion between fixed pad 100 and the base plate for fixed pad 100 is difficult for deviating from, further improves the adhesive force between connector and the PCB. Wherein the plurality of first circuit traces may extend from different directions around the first non-soldering area 120, so that the fixing pad 100 is firmly covered on the substrate.

The substrate is provided with a via hole penetrating through each layer of the substrate, and the fixed pad 100 is provided with a through hole 121 communicating with the via hole in the first non-soldering area 120. After the copper foil is laid on the substrate, the substrate is drilled through machining to form the through hole 121 and the via hole, then copper paste is filled in the via hole and the through hole 121, and the copper paste is solidified to conduct all layers of the substrate, so that the fixing pad 100 is more firmly covered on the substrate, the fixing pad 100 is not easy to fall off, the stripping force of the fixing pad 100 is enhanced, and the adhesive force between the connector and the PCB is improved.

Preferably, the number of the through holes 121 is plural, and the plural through holes 121 are spaced along the circumference of the first soldering region 110. If limited by the design space, the number and arrangement orientation of the through holes 121 can be reduced properly, and at least two sides of the first soldering region 110 have the through holes 121. The plurality of through holes 121 may be uniformly distributed along the periphery of the first soldering area 110, so that the boards of the circuit boards are well grounded, the peeling force of the fixing pad 100 is further enhanced, and the adhesion between the connector and the PCB board is improved.

More finely, the distance between the through-hole 121 and the edge of the first welding region 110 is 0.07mm to 0.08 mm. The through hole 121 is designed to be a certain distance away from the first welding area 110, but there is a certain tolerance in actual manufacturing, and in order to prevent the through hole 121 from being drilled into the first welding area 110 during actual plate manufacturing, a safe distance, preferably 0.075mm, between the through hole 121 and the edge of the first welding area 110 is selected in the present embodiment. The diameter of the through hole 121 of the present embodiment is greater than or equal to 0.15mm, and the diameter of the through hole 121 in other embodiments may be determined according to specific needs, and is not specifically limited herein.

If the bonding pad 100 is a ground pad, the bonding pad 100 has a copper foil cut-out 122 in the first non-bonding region 120. The area of the general grounding bonding pad is larger, so that partial copper foil needs to be hollowed, and the false welding caused by excessive heat dissipation of the cross section during welding is avoided.

The signal pad 200 of the present embodiment includes a second soldering region 210 and second non-soldering regions 220 disposed at opposite ends of the second soldering region 210, the second soldering region 210 corresponds to the second windowing region 420 and is used for being fixedly connected with a connector, and the second non-soldering regions 220 are covered by a solder resist layer. The signal pad 200 on the conventional PCB generally does not have the elongated second non-soldering area 220, and the signal pad 200 is easily detached from the substrate, so that the signal of the connector cannot be transmitted. The second non-soldering area 220 of the signal pad 200 of the embodiment is covered by the solder resist layer, so that the signal pad 200 is not easy to fall off from the substrate, the peeling force of the signal pad 200 is enhanced, and the adhesion between the PCB board and the connector of the embodiment is further improved.

The PCB board further includes a second circuit trace 300 connected to an end of the second non-soldering area 220, and a connection of the second circuit trace 300 and the second non-soldering area 220 is a teardrop structure 310. The second circuit trace 300 may be led out from one end of the signal pad 200 in the length direction, or the second circuit trace 300 may be led out from both ends of the signal pad 200 in the length direction. The teardrop structure 310 is similar to a triangular structure, and the relatively wide side is connected to the signal pad 200, so that the connection area is increased, and the contact point of the second circuit trace 300 and the signal pad 200 is prevented from being disconnected when the PCB is impacted by a large external force. And the two sides of the teardrop structure 310 are arc-shaped, so that the connection between the second circuit trace 300 and the signal pad 200 tends to be in smooth transition.

As shown in fig. 3, the number of the signal pads 200 is multiple, the signal pads 200 are arranged at intervals along the width direction of the signal pads 200, and the second non-bonding region 220 extends along the length direction of the signal pads 200. Typically, a plurality of uniformly distributed signal pads 200 are disposed on the substrate for connecting to a plurality of pins of the connector, respectively. Since it is generally difficult to widen the width direction of the signal pad 200 due to the limitation of the pitch of the connector pins, the length direction of the signal pad 200 is lengthened, i.e., the second non-soldering regions 220 are provided at both ends of the second soldering region 210 to enhance the peeling force of the signal pad 200.

In addition, the invention also provides a connecting structure of the PCB board and the connector, which comprises the connector and the PCB board, wherein the pin of the connector is welded with the first welding area 110 of the fixed welding pad 100 of the PCB board. The connecting structure of the PCB and the connector of the present embodiment further includes a signal pad 200, and the second soldering region 210 of the signal pad 200 is connected to the pin of the connector and is used for transmitting signals.

The specific structure of the PCB refers to the above embodiments, and since the PCB adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by the present specification or directly/indirectly applied to other related technical fields under the spirit of the present invention are included in the scope of the present invention.

Claims

1. A PCB board, comprising:

a substrate;

a solder resist layer covering the surface of the base material;

2. The PCB board of claim 1, further comprising a plurality of first circuit traces disposed on the substrate, the first circuit traces being connected to outer edges of the anchor pads.

3. The PCB of claim 1, wherein the substrate is provided with a via hole penetrating through each layer of the substrate, and the anchor pad is provided with a through hole communicating with the via hole at the first non-soldering area.

4. The PCB of claim 3, wherein the number of the through holes is plural, and the plural through holes are spaced along the periphery of the first soldering region.

5. The PCB of claim 3, wherein the via is spaced from the edge of the first land by 0.07mm to 0.08 mm.

6. The PCB board of any one of claims 1-5, wherein the anchor pad is a ground pad, and the anchor pad is provided with a copper foil cutout in the first non-soldering area.

7. The PCB board of any one of claims 1-5, wherein the signal pad comprises a second soldering region and a second non-soldering region disposed at opposite ends of the second soldering region, the second soldering region corresponding to the second windowed region and being for fixed connection with the connector, the second non-soldering region being covered by the solder resist layer.

8. The PCB of claim 7, further comprising a second circuit trace connected to an end of the second non-soldered region, wherein a connection of the second circuit trace to the second non-soldered region is a teardrop structure.

9. The PCB board of claim 7, wherein the number of the signal pads is plural, the plural signal pads are arranged at intervals along a width direction of the signal pads, and the second non-soldering region extends along a length direction of the signal pads.

10. A connecting structure of a PCB and a connector, which comprises the PCB as claimed in any one of claims 1 to 9 and the connector, wherein the pin of the connector is welded with the first welding area of the fixing pad of the PCB.