CN206061289U - A kind of FPC pad structures of adapter and FPC - Google Patents
A kind of FPC pad structures of adapter and FPC Download PDFInfo
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- CN206061289U CN206061289U CN201621112457.2U CN201621112457U CN206061289U CN 206061289 U CN206061289 U CN 206061289U CN 201621112457 U CN201621112457 U CN 201621112457U CN 206061289 U CN206061289 U CN 206061289U
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- fpc
- pad
- solder mask
- base material
- adapter
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Abstract
The utility model discloses the FPC pad structures and FPC of a kind of adapter.The pad structure includes base material, solder mask and some pin pads, and the solder mask is covered in the surface of the base material, and on the welding region of the base material leaves windowed regions；The pin pad is arranged on the welding region of the base material, and the length of the pin pad is more than the width of the windowed regions of the solder mask.The problems such as pad structure can avoid FPC from occurring displacement, rosin joint in SMT with adapter, while also strengthening the reliability of welding, improving element thrust test and reduce production cost.
Description
Technical field
This utility model is related to FPC fields, more particularly to a kind of FPC pad structures and FPC of adapter.
Background technology
The flexible circuit board of liquid crystal display module（FPC）Adapter is used often, as production development obtains more and more lighter
Thinning, adapter are also being gradually reduced volume, particularly BTB adapters, and its PIN length is shorter and shorter, and this just gives FPC processing procedures
Difficulty be increased with SMT.
It is usually at present the pin pad size recommended according to adapter specifications on FPC designing pad structure, to keep away
Exempt from the windowed regions of solder mask because manufacturing deviation is covered above pin pad, the width of the windowed regions of solder mask be all by
What monolateral 0.05 ~ 0.1mm of length more than pin pad was designed.Solder mask is usually to use PI films, PI films to have punch die tolerance in itself
（±0.05mm）And pad pasting deviation（±0.15mm）, so the gross tolerance of the windowed regions of the PI films of adapter pad structure will
± 0.15mm is reached, this is just to the adapter that some PINs are very short（The PIN effective length of BTB adapters has been made at present
0.2mm）SMT make a big impact, the quality problems such as adapter displacement, rosin joint can be caused.Solder mask can also adopt green oil
Or butter technique is formed, windowed regions are made using gold-tinted processing procedure, its tolerance can be controlled in ± 0.05mm, but on flexible FPC
Face adopts green oil or butter processing procedure, because increasing many road techniques, and can increase the cost of manufacture of flexibility FPC.
Utility model content
In order to solve above-mentioned the deficiencies in the prior art, this utility model provide a kind of FPC pad structures of adapter and
FPC.The problems such as pad structure can avoid FPC from occurring displacement, rosin joint in SMT with adapter, while also strengthening welding
Reliability, the test of raising element thrust and reduction production cost.
Technical problem to be solved in the utility model is achieved by the following technical programs：
A kind of FPC pad structures of adapter, including base material, solder mask and some pin pads, the solder mask are covered
In the surface of the base material, and windowed regions are left on the welding region of the base material；The pin pad is arranged on described
On the welding region of base material, and the length of the pin pad is more than the width of the windowed regions of the solder mask.
Further, the length of the pin pad it is more monolateral than the width of the windowed regions of the solder mask it is big by 0.15 ~
0.2mm。
Further, the solder mask is PI films.
A kind of FPC, including above-mentioned pad structure.
This utility model has the advantages that：
（1）Pad structure is less than the length of the pin pad due to the width of the windowed regions of the solder mask, therefore
The upper and lower ends of the pin pad are covered to the solder mask, even if solder mask off normal can also keep the pin pad
Length it is consistent neat all the time, be conducive to SMT management and control deviation problems；
（2）The pin Pad off can be prevented, strengthens the peeling force of the pin pad, be improved element thrust and survey
Examination；
（3）The effect of PI pad pastings substantially can be compared favourably using the scheme of gold-tinted processing procedure with green oil or butter, and cost
It is lower, the price competitiveness of product can be kept.
Description of the drawings
The FPC pad structures of the adapter that Fig. 1 is provided for this utility model；
Fig. 2 is the partial enlarged drawing at labelling A in Fig. 1.
Specific embodiment
With reference to the accompanying drawings and examples this utility model is described in detail.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of FPC pad structures of adapter, including base material 1, solder mask 2 and some pin pads
3, the solder mask 2 is covered in the surface of the base material 1, and on the welding region of the base material 1 leaves windowed regions；It is described
Pin pad 3 is arranged on the welding region of the base material 1, and length L of the pin pad 3 is more than the solder mask 2
The width H of windowed regions.
The pad structure of the technical program is less than the pin pad 3 due to the width H of the windowed regions of the solder mask 2
Length L, therefore the upper and lower ends of the pin pad 3 are covered to the solder mask 2, even if 2 off normal of solder mask also can
Keep length L of each pin pad 3 consistent all the time neat, be conducive to SMT management and control deviation problems.
Preferably, length L of the pin pad 3 it is more monolateral than the width H of the windowed regions of the solder mask 2 it is big by 0.15 ~
0.2mm, i.e. E and F are the not of uniform size fixed identical of 0.15 ~ 0.2mm, wherein E and F, can so prevent the pin pad 3 from taking off
Fall, strengthen the peeling force of the pin pad 3, improve element thrust test.
The solder mask 2 is PI films.
The pad structure of the technical program can't be produced to length L of the pin pad 3 due to the off normal of solder mask 2
Affect, therefore, even if the solder mask 2 is formed by the way of PI pad pastings, pad pasting deviation also will not be to the pin pad 3
Length L produces impact, and uniquely influential on length L of the pin pad 3 is punch die tolerance（±0.05mm）, effect is basic
On can be compared favourably using the scheme of gold-tinted processing procedure with green oil or butter, and cost is lower, and the price of product can be kept competing
Strive power.
Embodiment 2
A kind of FPC, including the pad structure described in embodiment 1.
Embodiment described above only expresses embodiment of the present utility model, and its description is more concrete and detailed, but and
Therefore the restriction to this utility model the scope of the claims can not be interpreted as, as long as the institute in the form of equivalent or equivalent transformation
The technical scheme of acquisition, all should fall within protection domain of the present utility model.
Claims (4)
1. a kind of FPC pad structures of adapter, including base material, solder mask and some pin pads, it is characterised in that the resistance
Layer is covered in the surface of the base material, and on the welding region of the base material leaves windowed regions；The pin pad sets
Put on the welding region of the base material, and the length of the pin pad is more than the width of the windowed regions.
2. FPC pad structures of adapter according to claim 1, it is characterised in that the length ratio of the pin pad
The monolateral big 0.15 ~ 0.2mm of width of the windowed regions of the solder mask.
3. FPC pad structures of adapter according to claim 1, it is characterised in that the solder mask is PI films.
4. a kind of FPC, it is characterised in that including arbitrary described pad structure in claim 1-3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621112457.2U CN206061289U (en) | 2016-10-11 | 2016-10-11 | A kind of FPC pad structures of adapter and FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621112457.2U CN206061289U (en) | 2016-10-11 | 2016-10-11 | A kind of FPC pad structures of adapter and FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206061289U true CN206061289U (en) | 2017-03-29 |
Family
ID=58363760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621112457.2U Active CN206061289U (en) | 2016-10-11 | 2016-10-11 | A kind of FPC pad structures of adapter and FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206061289U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
| CN111315123A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | PCB and connecting structure of PCB and connector |
| CN112135467A (en) * | 2020-08-27 | 2020-12-25 | 广州国显科技有限公司 | Welded structure and display module |
| CN113453423A (en) * | 2021-07-14 | 2021-09-28 | 广东合通建业科技股份有限公司 | Resistance welding windowing structure of miniLED circuit board bonding pad |
-
2016
- 2016-10-11 CN CN201621112457.2U patent/CN206061289U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662351A (en) * | 2019-09-30 | 2020-01-07 | 广西天山电子股份有限公司 | Connect reliable PCB board |
| CN111315123A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | PCB and connecting structure of PCB and connector |
| CN112135467A (en) * | 2020-08-27 | 2020-12-25 | 广州国显科技有限公司 | Welded structure and display module |
| US12108541B2 (en) | 2020-08-27 | 2024-10-01 | Guangzhou Govisionox Technology Co., Ltd. | Welding structure and display module |
| CN113453423A (en) * | 2021-07-14 | 2021-09-28 | 广东合通建业科技股份有限公司 | Resistance welding windowing structure of miniLED circuit board bonding pad |
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