CN110662351A - Connect reliable PCB board - Google Patents
Connect reliable PCB board Download PDFInfo
- Publication number
- CN110662351A CN110662351A CN201910942064.6A CN201910942064A CN110662351A CN 110662351 A CN110662351 A CN 110662351A CN 201910942064 A CN201910942064 A CN 201910942064A CN 110662351 A CN110662351 A CN 110662351A
- Authority
- CN
- China
- Prior art keywords
- pin
- dielectric layer
- insulating dielectric
- green oil
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 59
- 238000012536 packaging technology Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a PCB board with reliable connection, which mainly comprises an insulating dielectric layer, a copper-clad layer and green oil; covering the surface of the insulating dielectric layer with a copper-clad layer, and etching a circuit pattern; the circuit pattern comprises at least one PIN area, and each PIN area consists of a plurality of PIN PINs; the method is characterized in that: and each PIN area adopts a green oil hollow design, namely, the periphery of each PIN is a naked insulating dielectric layer. Therefore, the connection between the PIN foot and an external circuit is not influenced by the factors of the height of the green oil and the uneven printing thickness, and the full connection between the conductive adhesive tape or the ACF conductive particles and part of the PIN foot can be ensured.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB (printed circuit board) with reliable connection.
Background
With the rapid development of electronic technologies and the diversified development requirements of electronic product packaging technologies, the application of technologies such as the COB packaging technology of the conductive adhesive tape and the PCB, the packaging technology of the external circuit and the PIN of the PCB by using the ACF for binding through the FPC, and the like is more and more common. Compared with the traditional tin wire welding mode, the two packaging technologies have obvious technical advantages in the aspects of labor cost, production efficiency, material cost, environmental protection requirements and the like.
The existing PCB mainly comprises an insulating dielectric layer, a copper-clad layer and green oil. The copper-clad layer is positioned on the insulating dielectric layer, and the circuit pattern is etched. The green oil is coated on the circuit pattern area which does not need to be welded of the copper-clad layer and the area which is not covered by the circuit pattern of the dielectric layer. The main purpose of the green oil is to protect the formed wiring pattern and solder resist for a long time. In order to ensure the insulation between the PIN feet in the PIN foot area in the copper-coated circuit pattern, the exposed insulating dielectric layer between the PIN feet is coated with green oil (as shown in figures 1 and 2).
The thickness tolerance of the existing green oil printing process control green oil generally exceeds more than 20u, and the green oil in the PIN foot area also has the phenomena of uneven thickness and copper surface exposure of the green oil higher than the PIN foot circuit of the PCB. Therefore, once the green oil height difference among different PIN PINs is different, the electrical connection effect of the compression joint packaging can be influenced; in addition, the green oil is higher than the contact plane of the PIN foot, and the conductive adhesive tape is lifted during pressure welding, so that the contact PIN is suspended; thereby finally causing the problem that the connection between the conductive adhesive tape or ACF conductive particles and partial PIN PINs is not enough.
Disclosure of Invention
The invention aims to solve the problem that the connection between a conductive adhesive tape or ACF conductive particles and partial PIN PINs is insufficient due to green oil in the PIN PIN area, and provides a PCB with reliable connection.
In order to solve the problems, the invention is realized by the following technical scheme:
a PCB board with reliable connection mainly comprises an insulating dielectric layer, a copper-clad layer and green oil; covering the surface of the insulating dielectric layer with a copper-clad layer, and etching a circuit pattern; the circuit pattern comprises at least one PIN area, and each PIN area consists of a plurality of PIN PINs; the difference is as follows: and each PIN area adopts a green oil hollow design, namely, the periphery of each PIN is a naked insulating dielectric layer.
In the scheme, the width of the insulating dielectric layer exposed at the periphery of each PIN foot is between 1mm and 5 mm.
In the scheme, the width of the exposed insulating dielectric layer on one side, close to the copper-clad layer, of each PIN foot is smaller than the width of the exposed insulating dielectric layer on one side, far away from the copper-clad layer, of each PIN foot.
In the above scheme, a bare insulating dielectric layer is arranged between 2 adjacent PIN legs.
In the scheme, the thickness of the green oil is between 20 and 30 microns.
In the above scheme, the green oil is a liquid photosolder resist.
In the above scheme, the PIN is electrically connected with an external circuit through the conductive adhesive tape or the ACF conductive particles.
Compared with the prior art, the green oil in the PIN area of the external circuit of the PCB adopts a hollow design scheme, the PIN is hollow and is not printed with the green oil, so that the connection between the PIN and an external circuit is not influenced by the uneven factors of the height of the green oil and the printing thickness, and the full connection between the conductive adhesive tape or the ACF conductive particles and part of the PIN can be ensured.
Drawings
Fig. 1 is a schematic diagram of a PIN foot area of a conventional PCB board.
Fig. 2 is a partially enlarged schematic view of a circle in fig. 1.
Fig. 3 is a schematic diagram of a PIN field of a PCB of the present invention for reliable connection.
Fig. 4 is a partially enlarged schematic view of a circle in fig. 3.
Reference numbers in the figures: 1. an insulating dielectric layer; 2. coating a copper layer; 2-1, PIN foot; 3. green oil.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings in conjunction with specific examples. It should be noted that directional terms such as "upper", "lower", "middle", "left", "right", "front", "rear", and the like, referred to in the examples, refer only to the direction of the drawings. Accordingly, the directions used are for illustration only and are not intended to limit the scope of the present invention.
Referring to fig. 3 and 4, a PCB with reliable connection is mainly composed of an insulating dielectric layer 1, a copper clad layer 2 and green oil 3.
The insulating dielectric layer 1 is used to maintain the insulation between the circuit and each layer, and is commonly referred to as a substrate.
The copper-clad layer 2 is coated on the surface or inside the insulating dielectric layer 1, and a circuit pattern is etched to be used as a tool for conducting components welded on the PCB. For a single-layer PCB, the copper-clad layer 2 is only located on the upper surface or the lower surface of the insulating dielectric layer 1. For a double-layer PCB, the copper-clad layers 2 are only positioned on the upper and lower surfaces of the insulating dielectric layer 1, and at the moment, the upper and lower layer circuit patterns are conducted through via holes. For the multilayer PCB, the copper-clad layers 2 are not only positioned on the upper and lower surfaces of the insulating dielectric layer 1, but also positioned inside the insulating dielectric layer 1, and at the moment, the multilayer circuit patterns are conducted through via holes. Since the present invention focuses on highlighting the relationship between the green oil 3 and the surface of the PCB, only the scheme of providing the copper-clad layer 2 on the surface of the insulating dielectric layer 1, i.e. the single-layer PCB and the double-layer PCB, is mentioned, but it does not mean that the present invention is not applicable to the double-layer PCB. For the upper and lower surfaces of the insulating dielectric layer 1, the area covered by the circuit pattern is a copper-clad layer 2; the area not covered by the circuit pattern is the exposed insulating dielectric layer 1.
In order to realize the connection between the PCB and an external circuit, at least one PIN 2-1 area is arranged in a circuit pattern etched by the copper-clad layer 2, wherein each PIN 2-1 area consists of a plurality of PIN 2-1, and the PIN 2-1 is generally regularly arranged. In the invention, the designed PIN 2-1 area mainly aims at the contact-type conducted PIN 2-1 area, and the conducted PIN 2-1 area is not welded. Considering that the area of the PIN 2-1 which is conducted in a contact way needs to be electrically communicated with an external circuit through a conductive adhesive tape or ACF conductive particles and the like, and if the problem that the green oil 3 is unevenly coated or is excessively thick coated around the PIN 2-1, the contact electric conduction effect can be influenced, the green oil 3 hollowed-out design is adopted for the area of each PIN 2-1, namely, the periphery of each PIN 2-1, particularly the space between the PIN 2-1 and the PIN 2-1 is a naked insulating dielectric layer 1, as shown in figure 2.
Considering that the contact effect is still affected when the green oil 3 is not coated in an excessively small range around each PIN 2-1, i.e. the exposed insulating dielectric layer 1 is too close; meanwhile, the fact that the protective effect of the green oil 3 on the flexible circuit board is reduced due to the fact that the green oil 3 is not coated in an overlarge range around each PIN PIN 2-1 is considered, and meanwhile, the hardness of the PIN PIN 2-1 area is reduced too much; the width of the insulating dielectric layer 1 exposed around each PIN leg 2-1 is thus between 1mm and 5 mm. The width of the exposed insulating dielectric layer 1 at one side of each PIN PIN 2-1 close to the copper-coated layer 2 is smaller than that of the exposed insulating dielectric layer 1 at one side far away from the copper-coated layer 2, the width of the exposed insulating dielectric layer 1 at one side of each PIN PIN 2-1 close to the copper-coated layer 2, namely the upper side, is 1mm, and the width of the exposed insulating dielectric layer 1 at one side far away from the copper-coated layer 2, namely the lower side, is 3 mm. In particular, in the preferred embodiment of the present invention, each PIN leg 2-1 has a width of 0mm in the exposed insulating dielectric layer 1 on the side close to the copper clad layer 2, i.e., the upper side, and a width of 2mm in the exposed insulating dielectric layer 1 on the side away from the copper clad layer 2, i.e., the lower side, the left side, and the right side. Between 2 adjacent PIN legs 2-1 is a bare insulating dielectric layer 1. Except for the area of the PIN 2-1 for contact conduction, the other areas of the PCB board of the present invention are coated with green oil 3 as in the prior art, and these green oil 3 is liquid photo solder resist with a thickness of 20-30 μm.
The main production process of the PCB with reliable connection is as follows:
And 2, printing a film screen pattern design by using green oil 3, and mainly designing a hollow pattern of the green oil 3 in a PIN (PIN) 2-1 area of the PCB.
And 3, removing oxides, grease and other impurities on the surface of the copper foil, and ensuring the firm adhesion of the printing ink.
And 4, printing the green ink 3 on the PCB to ensure that the ink is printed uniformly without passing through holes.
And step 5, pre-baking the green ink 3, and evaporating redundant volatile solvent in the ink.
And 6, aligning the film screen and the PCB, and mainly ensuring that the hollow position of the PIN 2-1 region of the PCB is accurately aligned with the designed hollow position of the film screen, and the alignment precision is ensured to be within +/-0.2 mm.
And 7, exposing and developing.
It should be noted that, although the above-mentioned embodiments of the present invention are illustrative, the present invention is not limited thereto, and thus the present invention is not limited to the above-mentioned embodiments. Other embodiments, which can be made by those skilled in the art in light of the teachings of the present invention, are considered to be within the scope of the present invention without departing from its principles.
Claims (7)
1. A PCB board with reliable connection mainly comprises an insulating dielectric layer (1), a copper-clad layer (2) and green oil (3); the copper-clad layer (2) is coated on the surface of the insulating dielectric layer (1), and a circuit pattern is etched; the circuit pattern comprises at least one PIN (personal identification number) PIN (2-1) area, and each PIN PIN (2-1) area consists of a plurality of PIN PINs (2-1); the method is characterized in that: the area of each PIN (2-1) adopts a hollow-out design of green oil (3), namely, the periphery of each PIN (2-1) is provided with a naked insulating dielectric layer (1).
2. A PCB board with reliable connection according to claim 1, wherein the width of the insulating dielectric layer (1) exposed around each PIN leg (2-1) is between 1mm and 5 mm.
3. A PCB board with reliable connection according to claim 1, wherein the width of the insulating dielectric layer (1) exposed on the side of each PIN leg (2-1) close to the copper clad layer (2) is smaller than the width of the insulating dielectric layer (1) exposed on the side far from the copper clad layer (2).
4. A PCB board with reliable connection according to claim 1, wherein there is a bare insulating dielectric layer (1) between 2 adjacent PIN legs (2-1).
5. A PCB board with reliable connection according to claim 1, wherein the thickness of the green oil (3) is between 20-30 μm.
6. A PCB board with reliable connection according to claim 1, characterized in that the green oil (3) is liquid photo solder resist.
7. A PCB board with reliable connection according to claim 1, wherein the PIN (2-1) is electrically connected to the external circuit through the conductive adhesive tape or ACF conductive particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910942064.6A CN110662351A (en) | 2019-09-30 | 2019-09-30 | Connect reliable PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910942064.6A CN110662351A (en) | 2019-09-30 | 2019-09-30 | Connect reliable PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110662351A true CN110662351A (en) | 2020-01-07 |
Family
ID=69040269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910942064.6A Pending CN110662351A (en) | 2019-09-30 | 2019-09-30 | Connect reliable PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110662351A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201234402Y (en) * | 2008-07-14 | 2009-05-06 | 比亚迪股份有限公司 | PCB board |
| CN202262058U (en) * | 2011-07-20 | 2012-05-30 | 青岛海信移动通信技术股份有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN105163501A (en) * | 2015-08-18 | 2015-12-16 | 珠海方正科技高密电子有限公司 | Bonding pad windowing method and printed circuit board (PCB) |
| CN206061289U (en) * | 2016-10-11 | 2017-03-29 | 信利半导体有限公司 | A kind of FPC pad structures of adapter and FPC |
| CN210807797U (en) * | 2019-09-30 | 2020-06-19 | 广西天山电子股份有限公司 | Connect reliable PCB board |
-
2019
- 2019-09-30 CN CN201910942064.6A patent/CN110662351A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201234402Y (en) * | 2008-07-14 | 2009-05-06 | 比亚迪股份有限公司 | PCB board |
| CN202262058U (en) * | 2011-07-20 | 2012-05-30 | 青岛海信移动通信技术股份有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN105163501A (en) * | 2015-08-18 | 2015-12-16 | 珠海方正科技高密电子有限公司 | Bonding pad windowing method and printed circuit board (PCB) |
| CN206061289U (en) * | 2016-10-11 | 2017-03-29 | 信利半导体有限公司 | A kind of FPC pad structures of adapter and FPC |
| CN210807797U (en) * | 2019-09-30 | 2020-06-19 | 广西天山电子股份有限公司 | Connect reliable PCB board |
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