CN110278656B

CN110278656B - Circuit board assembly and storage device

Info

Publication number: CN110278656B
Application number: CN201810214717.4A
Authority: CN
Inventors: 李均锋; 郑明仁
Original assignee: Phison Electronics Corp
Current assignee: Phison Electronics Corp
Priority date: 2018-03-15
Filing date: 2018-03-15
Publication date: 2020-08-18
Anticipated expiration: 2038-03-15
Also published as: CN110278656A

Abstract

The invention provides a circuit board assembly and a storage device. The circuit board is provided with a board body, at least one electric conduction hole and at least one connecting pad, wherein the connecting pad and the electric conduction hole are arranged on the circuit board, the electric conduction hole is positioned in the range of the connecting pad, and the electric conduction hole penetrates through the connecting pad. The connector is provided with at least one pin, wherein the connector is assembled on the circuit board, the pin is welded on the connecting pad, and the pin shields the electric conducting hole in the range of the connecting pad.

Description

Circuit board assembly and storage device

Technical Field

The invention relates to a circuit board assembly and a storage device.

Background

With the progress of Printed Circuit Board (PCB) and electronic device manufacturing technology, the design of the PCB and the electronic device is also designed toward small size, so as to meet the requirement of miniaturization of the existing electronic product. However, the reduction of the size of the circuit board also means that the layout design of the circuit board and the assembly of the circuit board with the electronic components are increasingly difficult.

Generally, in the layout design of a circuit board, a pad configuration conforming to the size of an electronic device (including a connector) is usually used to couple (e.g., solder) the electronic device to a printed circuit board for electrical conduction with a wiring layer of the circuit board. Meanwhile, the circuit board itself can also be used as a conduction structure between the wiring layer of different layers and the connection pad or the electronic element through the existence of the through hole. However, in the conventional circuit board structure, in order to avoid the mutual influence during soldering, a certain safety distance must be maintained between the through hole and the pad, so as to prevent the solder material from flowing into the through hole due to the proximity of the through hole and the pad.

However, as the size of the circuit board is reduced, the circuit board may not have enough structural area to keep the safety distance between the through hole and the pad. Therefore, how to satisfy the requirements of the safety distance and product miniaturization is a problem to be solved by related technical personnel.

Disclosure of Invention

The invention provides a circuit board assembly and a storage device with a thin structure, which simultaneously meet the welding requirements required by the circuit board assembly.

The circuit board assembly comprises a circuit board and a connector. The circuit board has a board body, at least one electrical via and at least one pad. The electric conduction hole is positioned in the range of the connecting pad and penetrates through the connecting pad. The connector has at least one pin. The connector is assembled on the circuit board, the pins are welded on the connecting pads, and the pins shield the electric conducting holes in the range of the connecting pads.

The storage device comprises a circuit board, a connector, a memory module and a control circuit module. The circuit board has a board body, at least one electrical via and at least one pad. The electric conduction hole is positioned in the range of the connecting pad and penetrates through the connecting pad. The connector has at least one pin. The connector is assembled on the circuit board, the pins are welded on the connecting pads, and the pins shield the electric conducting holes in the range of the connecting pads. The memory module and the control circuit module are respectively arranged on the circuit board, and the memory module, the control circuit module and the connector are electrically connected with each other through the circuit and the connecting pad of the circuit board.

In view of the above, in the embodiment of the invention, the circuit board assembly and the storage device using the same form the pads and the electrical vias on the circuit board, and the electrical vias are located within the range of the pads, and then when the connector is assembled to the circuit board, the pins of the connector are shielded from the electrical vias within the range of the pads. Therefore, in the welding process, the electric conduction hole can avoid the welding material from flowing in due to the covering and shielding of the pins, and meanwhile, the configuration means that the electric conduction hole is positioned in the range of the connecting pad can further improve the utilization rate of the surface area of the circuit board, so that the circuit board is not limited any more.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic diagram of a storage device according to an embodiment of the invention.

Fig. 2 is an exploded view of the storage device of fig. 1.

Fig. 3 is a partial top view of the circuit board of fig. 2.

Fig. 4 is a partial cross-sectional view of the circuit board assembly of fig. 1.

Fig. 5 and 6 are partial cross-sectional views of circuit board assemblies according to further embodiments, respectively.

FIG. 7 is a schematic diagram of a storage device according to another embodiment of the invention.

Fig. 8 is a partial top view of the circuit board of fig. 7.

Description of the symbols:

100: a storage device;

110. 210: a circuit board;

111: welding materials;

112. 212, and (3): a plate body;

114: electrically conducting holes;

116. 216: a pad;

118: a wiring layer;

120. 220, and (2) a step of: a connector;

122. 222a, 222b, 222 c: a pin;

130: a memory module;

140: a control circuit module;

a1, A3: a first pad group;

a2, A4: a second pad group;

b1: a first pin group;

b2: a second pin group;

p1, P2: a circuit board assembly;

s1, S4: a first surface;

s2, S5: a second surface;

s3: a third surface;

ST: and (4) segment difference.

Detailed Description

Fig. 1 is a schematic diagram of a storage device according to an embodiment of the invention. Fig. 2 is an exploded view of the storage device of fig. 1. Referring to fig. 1 and fig. 2, in the present embodiment, the storage device 100 is, for example, a rewritable non-volatile memory storage device such as a personal disk, a memory card or a Solid State Drive (SSD), and is not limited thereto, and includes a circuit board 110, a connector 120, a memory module 130 and a control circuit module 140, wherein the circuit board 110 and the connector 120 form a circuit board assembly P1 of the present embodiment, so as to form an electronic device with different functions by being matched with the memory module 130, the control circuit module 140 or other electronic elements not shown.

Here, the circuit board 110 is, for example, a multilayer circuit board having a plurality of wiring layers, and includes a board body 112, an electrical via 114 and a pad 116, wherein the electrical via 114 is disposed on the circuit board 110 for electrically connecting the wiring layers of different layers or surfaces of the board body 112, which will be further described below. The pads 116 are disposed on the surface of the board body 112 for providing the solder joints of the connector 120, the memory module 130 and the control circuit module 140 and electrically connecting with the wiring layer disposed on the board body 112. In this way, the connector 120, the memory module 130 and the control circuit module 140 can be electrically connected to each other through the circuit formed by the pads 116 and the wiring layer of the circuit board 110.

However, the present embodiment does not limit the electrical conduction means between the memory module 130 and the control circuit module 140 and the wiring layer of the circuit board 110, and the electrical conduction means is different according to the existing electronic device package, the assembly technology and the requirement conditions. The following will describe the assembly relationship between the connector 120 and the circuit board 110.

Fig. 3 is a partial top view of the circuit board of fig. 2. Referring to fig. 2 and fig. 3, in the present embodiment, the board body 112 of the circuit board 110 has a first surface S1, a second surface S2 and a third surface S3 that are different from each other but parallel to each other, that is, when the board body 112 is viewed from the right side view in fig. 2, the second surface S2 is above the third surface S3, and the first surface S1 is between the second surface S2 and the third surface S3. The pads 116 are substantially disposed on the three surfaces, but as mentioned above, only those related to the circuit board 110 and the connector 120 are described, so that the rest of the pads are not shown and can be known in the art.

In detail, in order to make the circuit board assembly P1 meet the requirement of being light and thin, the circuit board 110 of the present embodiment adopts a partially sinking structure, as shown in fig. 2, the first surface S1 is lower than the second surface S2, and is matched with the pins 122 of the connector 120. Here, the pads 116 are divided into a first pad group a1 and a second pad group a2 along with the first surface S1 and the second surface S2, and the pins 122 of the connector 120 are correspondingly divided into a first pin group B1 and a second pin group B2, so that the connector 120 can be assembled to the circuit board 110 by soldering the first pin group B1 to the first pad group a1 and soldering the second pin group B2 to the second pad group a 2. Here, with respect to the connector 120, on a path along which it is assembled to the circuit board 110, the distance of the first pad group a1 with respect to the connector 120 is smaller than the distance of the second pad group a2 with respect to the connector 120. Therefore, as shown in the enlarged view of fig. 2, the second pin group B2 of the connector 120 extends linearly and is soldered to the second pad group a2, and the first pin group B1 is bent and extends in a zigzag shape by sinking in the first surface S1 of the board 112, and the pin length of the second pin group B2 is longer than that of the first pin group B1 in the aforementioned assembly path.

Furthermore, the electrical vias 114 of the circuit board 110 are respectively disposed at the pads 116 (i.e., the first pad group a1) of the first surface S1 and are used for connecting the first surface S1 and the third surface S3. It should be noted that, as mentioned above, the first surface S1 is in a sinking structure relative to the second surface S2, that is, the board 112 has a step ST between the first surface S1 and the second surface S2, and the step ST is disposed around three side edges of the first surface S1, so that the board 112 is recessed at the position where the connector 120 is to be assembled from a top view, as shown in fig. 3. Further, since there is no extra board surface on the first surface S1 of the board 112 enough to dispose the electrical vias, that is, as shown in fig. 2 and 3, in the first pad group a1, the pads located at the head or tail (the leftmost pad and the rightmost pad of the first pad group a1 shown in fig. 3) are substantially adjacent to the step ST in structure, which means that there is no extra and enough area for disposing the electrical vias after the first surface S1 is disposed on the first pad group a 1. Conversely, the second surface S2 of the board 112 has a sufficient area, so that no electrical vias are required within the pads 116.

Based on the above, in the embodiment, the electrical through holes 114 are disposed in the pads of the first pad group a1, so that different wiring layers of the circuit board 110 and the pads 116 on the first surface S1 or the third surface S3 can be electrically connected through the electrical through holes 114. As mentioned above, the circuit board has a sufficient structural area, and the electrical via hole is not disposed within the pad. However, as also described in the present embodiment, in order to achieve the light and thin effect, the first surface S1 of the present embodiment needs to have a lower profile to reduce the overall thickness of the circuit board 110, and thus the electrical vias 114 need to be disposed within the pad range of the first pad group a 1. The circuit board assembly P1 should be matched such that the connector 120 is used to connect the first pin group B1 of the first pad group a1, and the electrical vias 114 within the pad area can be shielded. Thus, the soldering operation can be performed smoothly without worrying about the solder material flowing into the electrical via hole 114.

Referring to fig. 3 again, the corresponding relationship between the pins 122 and the pads 116 is further described by way of example, in the embodiment, the size of the pins 122 shown in fig. 3 is 0.25mm × 0.6.6 mm (0.15 mm ═ 0.15 mm)²) And the size of the pad 116 is 0.5mm × 1.5.5 mm (═ 0.75 mm)²) Therefore, it is obvious that the pin 122 covers one seventh of the area of the pad 116.

Fig. 4 is a partial cross-sectional view of the circuit board assembly of fig. 1. Referring to fig. 3 and fig. 4, as mentioned above, the circuit board 110 is a multi-layer circuit board having a plurality of wiring layers 118, so that different wiring layers 118 can be electrically connected through the electrical via 114, and further, the electrical via 114 shown in fig. 4 is a through hole penetrating through the board body 112 (of course, in other embodiments, the electrical via may also be a blind hole partially penetrating through the board body 112). Meanwhile, as shown in fig. 1 and 2, when the connector 120 is assembled to the circuit board 110, the pins 122 of the first pin group B1 cover the pads 116 of the first pad group a1 and thus cover (shield) the electrical vias 114 within the pads 116, and then the pins 122 and the pads 116 are soldered together by the solder 111, and the solder 111 does not flow into the electrical vias 114 because the pins 122 shield the electrical vias 114. In other words, after the connector 120 shields the electrical via 114 with the pin 122, the circuit board element P1 does not visually recognize the presence of the electrical via 114. More importantly, during the soldering process, due to the shielding of the pins 122, the soldering material 111 can solder the pins 122 and the pads 116 with a fixed amount without worrying about the appearance inconsistency caused by poor tin-soldering, so that the circuit board assembly P1 of the present embodiment can still meet the inspection standard of IPC-610Class 1/2/3.

Fig. 5 and 6 are partial cross-sectional views of circuit board assemblies according to further embodiments, respectively. Referring to fig. 5, before the circuit board 110 is soldered, and before the pins 122 of the connector 120 are stacked on the pads 116, a small amount of solder 111 is applied to the surfaces of the pads 116, and due to the surface tension and viscosity of the solder, the solder is filled in the through holes 114 adjacent to the first surface S1 of the board 112, so as to block the through holes 114. Then, the soldering material 111 is used to solder the pins 122 and the pads 116, and the pins 122 are pressed out of the soldering material 111 between the pins and the pads 116 by pressure, so that the soldering material blocking the openings of the electrical vias 114 remains. Referring to fig. 6, another method is to provide no pressure, that is, the solder 111 still exists between the pin 122 and the pad 116, and thus the pin covers the conductive via 114.

In another embodiment, not shown, the pre-filling of the electrical via 114 can also be performed during the process of coating the insulating printing ink during the manufacturing process of the circuit board, i.e. the electrical via is blocked by the insulating printing ink, and the effect of filling the via hole is also achieved before the soldering process.

FIG. 7 is a schematic diagram of a storage device according to another embodiment of the invention. Fig. 8 is a partial top view of the circuit board of fig. 7. Referring to fig. 7 and 8, in the circuit board assembly P2, the same as the previous embodiment, it includes the circuit board 210 and the connector 220, and the pads 216 are also divided into a first pad group A3 and a second pad group a4, and the electrical vias 114 are still located in the range of the first pad group A3 close to the connector 220. In other words, the distance between the pads 216 disposed with the electrical vias 114 (i.e., the first pad group A3) and the connector 220 is smaller than the distance between the pads 216 not disposed with the electrical vias 114 (i.e., the second pad group a4) and the connector 220. That is, the first pad group A3 provided with the electrical vias 114 is substantially located at the structural edge of the board body 212, i.e., the notch edge shown in fig. 7 and 8, while the second pad group a4 not provided with the electrical vias 114 is relatively far away from the structural edge of the board body 212.

In addition, unlike the previous embodiment, the first pad group A3 and the second pad group a4 are located on the same first surface S4, and the first surface S4 and the second surface S5 are opposite surfaces of the board body 212. This is for making the pads 216 correspond to the pins of the connector 220, as shown in fig. 7, the connector 220 has

pins

222a, 222b and 222c, wherein the length of the pin 222c is shorter than the

pins

222a and 222b for welding with the first pad group A3 to shield the electrical via 114, and the

pins

222a and 222b have the same length in the orthogonal projection of the board body 212 although they have the difference of height, so that the

pins

222a and 222b can be welded with the second pad group a 4. Meanwhile, the ends of the

pins

222a, 222b and 222c are located on the same plane, so as to correspond to the first pad group A3 and the second pad group a4 located on the first surface S4.

In summary, in the embodiments of the invention, the circuit board assembly and the storage device using the same are formed by forming the pads and the through holes on the circuit board, and positioning the through holes within the range of the pads, and then shielding the pins of the connector from the through holes within the range of the pads when the connector is assembled to the circuit board. Therefore, in the welding process, the through holes can prevent welding materials from flowing in due to the covering and shielding of the pins, and meanwhile, the utilization rate of the surface area of the circuit board can be further improved by the configuration method that the through holes are positioned in the range of the connecting pads, so that the circuit board is not limited any more.

Furthermore, in order to make the storage device thin, the assembly relationship between the circuit board and the connector in the circuit board assembly needs to be adjusted correspondingly, so that the invention forms a sunken structure in the local area of the circuit board where the connector is to be assembled, that is, forms different surfaces of height and height, and arranges the pads to be welded with the connector on the different surfaces of height respectively. Meanwhile, the pins of the connector are correspondingly divided into two rows of pins with different heights, so that the pins can be smoothly welded to the connecting pads on different surfaces. However, the surface of the circuit board with the sinking structure does not have enough surface area to arrange the through holes, so that the through holes and the pads are arranged in the range of the pads respectively when the through holes and the pads are arranged on the surface of the sinking structure, and the pads cover and shield the through holes when the connector is assembled to the circuit board.

Accordingly, the circuit board assembly and the storage device of the invention have a thin appearance and meet the specifications required by the welding process due to the structural configuration.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A circuit board assembly, comprising:

a circuit board having a board body, at least one electrical via and at least one pad, wherein the pad and the electrical via are disposed on the circuit board, the electrical via is located within the pad, and the electrical via penetrates the pad; and

the connector is provided with at least one pin, wherein the connector is assembled on the circuit board, the pin is welded on the connecting pad, and the pin shields the electric conducting hole in the range of the connecting pad.

2. The circuit board assembly according to claim 1, wherein the circuit board is a multi-layered circuit board having a plurality of wiring layers, the wiring layers of different layers being electrically connected to each other through the electrical via.

3. The circuit board assembly according to claim 1, wherein the electrical via is a through hole penetrating the board body.

4. The circuit board assembly of claim 1, wherein the electrical vias are filled with solder material adjacent to the surface of the board body.

5. The circuit board assembly of claim 1, wherein a solder material is interposed between the pins and the pads to cover the conductive vias.

6. The circuit board assembly of claim 1, wherein the circuit board has a plurality of pads and a plurality of electrical vias, the plurality of electrical vias are located in a portion of the plurality of pads, and a distance between the plurality of pads with the plurality of electrical vias disposed thereon and the connector is less than a distance between the plurality of pads without the plurality of electrical vias disposed thereon and the connector.

7. The circuit board assembly of claim 6, wherein the plurality of pads configured with the plurality of electrical vias are proximate to an edge of the board body, and the plurality of pads not configured with the plurality of electrical vias are distal from the edge of the board body.

8. The circuit board assembly according to claim 6, wherein the board body has a first surface and a second surface that are different from each other but parallel to each other, and the circuit board has a plurality of pads disposed on the first surface and the second surface, respectively, the connector has a plurality of pins soldered to the plurality of pads on the first surface and the plurality of pads on the second surface, respectively, and the plurality of pads disposed with the plurality of electrical vias are located on the first surface.

9. The circuit board assembly according to claim 8, wherein the board body further has a third surface, the first surface, the second surface and the third surface are parallel to each other with respect to the second surface, the first surface is located between the second surface and the third surface, and the electrical via connects the first surface and the third surface.

10. The circuit board assembly according to claim 8, wherein the board body has a step between the first surface and the second surface, and the step is located around three lateral edges of the first surface.

11. The circuit board assembly according to claim 10, wherein among the pads on the first surface, the pad located at a leading position or the pad located at a trailing position is immediately adjacent to the level difference.

12. The circuit board assembly of claim 6, wherein the plurality of pads are located on a same surface of the board body.

13. The circuit board assembly of claim 1, wherein the pins cover one seventh of the pad area.

14. A storage device, comprising:

a circuit board having a board body, at least one electrical via and at least one pad, wherein the pad and the electrical via are disposed on the circuit board, the electrical via is located within the pad, and the electrical via penetrates the pad;

the connector is provided with at least one pin, the connector is assembled on the circuit board, the pin is welded on the connecting pad, and the pin shields the electric conducting hole in the range of the connecting pad; and

the memory module and the control circuit module are configured on the circuit board, and the memory module, the control circuit module and the connector are electrically connected with each other through the circuit of the circuit board and the connecting pad.

15. The storage device of claim 14, wherein the circuit board is a multi-layer circuit board having a plurality of wiring layers, the wiring layers of different layers being electrically connected to each other through the electrical vias.

16. The storage device of claim 14, wherein the electrical vias are through holes that extend through the plate body.

17. The storage device of claim 14 wherein the electrical vias are filled with solder material adjacent the surface of the plate body.

18. The storage device of claim 14 wherein a solder material is interposed between the pins and the pads to cover the conductive vias.

19. The storage device of claim 14, wherein the circuit board has a plurality of pads and a plurality of electrical vias, the plurality of electrical vias are located in a portion of the plurality of pads, and a distance between the plurality of pads with the plurality of electrical vias and the connector is smaller than a distance between the plurality of pads without the plurality of electrical vias and the connector.

20. The storage device of claim 19, wherein the pads configured with the plurality of electrical vias are proximate to an edge of the board body, and the pads not configured with the plurality of electrical vias are distal from the edge of the board body.

21. The storage device as claimed in claim 19, wherein the board body has a first surface and a second surface that are different but parallel to each other, the circuit board has a plurality of pads disposed on the first surface and the second surface, respectively, the connector has a plurality of pins soldered to the plurality of pads on the first surface and the plurality of pads on the second surface, respectively, and the plurality of pads disposed with the plurality of electrical vias are located on the first surface.

22. The storage device as claimed in claim 21, wherein the board further has a third surface, the first surface, the second surface and the third surface are parallel to each other relative to the second surface, the first surface is located between the second surface and the third surface, and the electrical via connects the first surface and the third surface.

23. The storage device of claim 21, wherein the plate body has a step between the first surface and the second surface, and the step is located around three lateral edges of the first surface.

24. The storage device of claim 23 wherein the pads at the leading or trailing position of the plurality of pads on the first surface are immediately adjacent to the step.

25. The storage device of claim 19 wherein the pads are located on a same surface of the board body.

26. The storage device of claim 14 wherein the pins cover one seventh of the pad area.