CN101730382A - Connecting structure for circuit board and electronic component - Google Patents
Connecting structure for circuit board and electronic component Download PDFInfo
- Publication number
- CN101730382A CN101730382A CN200810175199A CN200810175199A CN101730382A CN 101730382 A CN101730382 A CN 101730382A CN 200810175199 A CN200810175199 A CN 200810175199A CN 200810175199 A CN200810175199 A CN 200810175199A CN 101730382 A CN101730382 A CN 101730382A
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- wiring board
- building brick
- electronic building
- duct
- pin
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Abstract
The invention discloses a connecting structure for a circuit board and an electronic component, which comprises a welding gasket, a solder, and a hole running through the welding gasket and the circuit board, wherein the welding gasket is arranged on a surface of the circuit board, and is used for accommodating a pin of the electronic component; the area of the welding gasket is greater than that of the pin; the solder is welded between the welding gasket and the pin; the welding gasket is provided with a reinforced connecting part extending downwards to the hole; and the reinforced connecting part covers the inner wall of the hole so as to reinforce the connecting strength of the welding gasket and the pin.
Description
Technical field
The invention relates to a kind of connected structure, and particularly relevant for the connected structure of a kind of wiring board and electronic building brick.
Background technology
Fig. 1 is the traditional wiring board and the connected structure schematic diagram of electronic building brick.Please refer to Fig. 1; traditional electronic building brick 10 (for example being connector) usually can be via surface mount technology (Surface Mount Technology; SMT) its signal terminal 12 and a wiring board 20 are formed and electrically connect, so that electronic signal can be transmitted between electronic building brick 10 and wiring board 20.Simultaneously, in order to strengthen the structure of electronic building brick 10, the surface 24 of wiring board 20 is provided with one or more welded gaskets 22, in order to the pin 14 of correspondence welding electronic building brick 10, so that retain strength to be provided, allows engage between electronic building brick 10 and the wiring board 20.
Yet, since the pin 14 of conditional electronic assembly 10 only with welded gasket 22 direct solder joints, there is no other reinforcement mode stably fixedly electronic building brick 10 and welded gasket 22, therefore retain strength is less, and pin 14 peels off from wiring board 20 when being subjected to bigger thermal stress easily, also simultaneously welded gasket 22 peeled off from wiring board 20.
For solving the problem that electronic building brick 10 engages with wiring board 20, can increase a bracket (not illustrating) usually and (Bracket) cover and tightly suppress electronic building brick 10, the angle of bracket is inserted and runs through the location perforation (not illustrating) of wiring board 20.Electronic building brick 10 then, is bonded on the wiring board 20 with scolder 30, so that can be stably fixed at wiring board 20 again.And above-mentioned increase by one bracket though can reach the effect of fluid-tight engagement, but must additionally increase part strengthening the fixedly mode of electronic building brick 10 on wiring board 20, not only improved the cost of making more complicated the assembling flow path of electronic building brick 10.
Summary of the invention
The invention provides the connected structure of a kind of wiring board and electronic building brick, to strengthen the bond strength of wiring board and electronic building brick.
The present invention proposes the connected structure of a kind of wiring board and electronic building brick, and it comprises that a welded gasket, a scolder and run through the duct of welded gasket and wiring board.Welded gasket is disposed at a surface of wiring board, and in order to a pin of placement electronic building brick, and the area of welded gasket is greater than the area of pin.Scolder is welded between welded gasket and the pin.Welded gasket has a reinforcement junction surface of extending towards the duct downwards, and the inwall in this covering duct, reinforcement junction surface, in order to strengthen the bond strength of welded gasket and pin.
In one embodiment of this invention, the duct be revealed in pin under, and scolder fills in the duct and strengthens that the junction surface is structural to be connected.
In one embodiment of this invention, the duct be positioned at pin around, the duct covers with the welding resisting layer on the wiring board (solder mask), and the part that welded gasket engages with pin is revealed in outside the welding resisting layer.
In one embodiment of this invention, wiring board has a ground plane (ground layer), and the duct is run through wiring board and manifested the inwall of ground plane in the duct, and strengthen the junction surface cover ground plane and with ground plane structure and electric connection.
In one embodiment of this invention, welded gasket comprises copper with the material of strengthening the junction surface.
In one embodiment of this invention, strengthening the junction surface is an annular or a cylinder in the duct.
In one embodiment of this invention, electronic building brick comprises connector or chip packing-body.
In one embodiment of this invention, the pin of electronic building brick is a non-signal terminal or a signal terminal.
In the connected structure of wiring board of the present invention and electronic building brick, strengthen the bond strength of junction surface because welded gasket has, and make that electronic building brick is difficult for peeling off with wiring board with reinforcement welded gasket and pin.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the traditional wiring board and the connected structure schematic diagram of electronic building brick.
Fig. 2 is the wiring board of first embodiment of the invention and the connected structure schematic diagram of electronic building brick.
Fig. 3 illustrates another connected structure schematic diagram into the wiring board of Fig. 2 and electronic building brick.
Fig. 4 is the wiring board of second embodiment of the invention and the connected structure schematic diagram of electronic building brick.
Embodiment
[first embodiment]
Fig. 2 is the wiring board of first embodiment of the invention and the connected structure schematic diagram of electronic building brick.Fig. 3 illustrates another connected structure into the wiring board of Fig. 1 and electronic building brick.Please refer to Fig. 2, the connected structure 100 of present embodiment is suitable for an electronic building brick 300 is fixed on the wiring board 200.Electronic building brick 300 for example is a connector, can (Surface Mount Technology SMT) is bonded together a pin 310 (non-signal terminal) of electronic building brick 300 and wiring board 200 via surface mount technology.In the present embodiment, electronic building brick 300 also can be chip packing-body.
With the chip packing-body is example, the signal terminal of corner regions often can't completely be welded on the wiring board 200 because of warpage, therefore the wiring board 200 among the present invention can make pin 310 (signal terminal) can firmly be welded on the wiring board 200 by the reinforcement junction surface 112 of welded gasket 110, is not vulnerable to the destruction of thermal stress and loses efficacy.In addition, when the signal terminal 312 (as shown in Figure 2) of connector electrically connects with wiring board 200 welding, wiring board 200 among the present invention also can make the surface of pin 310 (non-signal terminal) and wiring board 200 firmly weld by the reinforcement junction surface 112 of welded gasket 110, thereby difficult the generation lifts off.Therefore, no matter be that pin 310 is signal terminal or non-signal terminal, all can strengthen bond strength by above-mentioned reinforcement junction surface 112.
Above-mentioned connected structure 100 comprises a welded gasket 110, a scolder 120 and a duct 130.Wiring board 200 for example is printed circuit board (PCB) (printed circuit board, PCB), and a surface 210 of wiring board 200 is provided with a welded gasket 110, welded gasket 110 is to cooperate the position of electronic building brick 300 pins 310 and design, place in order to the pin 310 that electronic building brick 300 is provided, and the area of welded gasket 110 is greater than the area of pin 310.When the pin 310 of electronic building brick 300 is fixed on welded gasket 110, have bigger fixed-area, make pin 310 difficult drop-offs, thereby increase stability.
It should be noted that welded gasket 110 has the 130 reinforcement junction surfaces 112 of extending towards the duct downwards.This strengthens junction surface 112 can for example be that an annular (as shown in Figure 2) or a cylinder (do not illustrate in duct 130, for example be that the complete electric conducting material of inserting is in duct 130, this moment, welding resisting layer 220 can't be inserted in the duct 130), and cover the inwall in duct 130, in order to strengthen the bond strength of welded gasket 110 and pin 310.In the present embodiment, welded gasket 110 is a copper with the material of strengthening junction surface 112.
Hold above-mentionedly, scolder 120 is disposed between welded gasket 110 and the pin 310.After the pin 310 of electronic building brick 300 is positioned over welded gasket 110, heat reflow again, so that the scolder 120 of the pin 310 of electronic building brick 300 by fusion engages with welded gasket 110.In addition, the signal terminal 312 of electronic building brick 300 (only illustrate its two) also can electrically connect by the holding wire on surface mount technology and the wiring board 200 240, and then makes electronic signal to transmit between electronic building brick 300 and wiring board 200.In addition, when electronic building brick 300 is welded on the wiring board 200, because welded gasket 110 is by strengthening junction surface 112 to strengthen the bond strength of pin 310 and welded gasket 110.Therefore, the pin 310 of electronic building brick 300 can be firmly on wiring board 200 and be not easy to be stripped from.In the present embodiment, scolder 120 for example is tin or other metal.
In the present embodiment, duct 130 be positioned at pin 310 around and run through welded gasket 110 and wiring board 200.Extend to duct 130 inwalls from the surface 210 of wiring board 200 always; all cover with a welding resisting layer 220 (soldermask) (being commonly called as green lacquer); and the part that welded gasket 110 engages with pin 310 is revealed in outside the welding resisting layer 220; with the line layer of protection welding resisting layer 220 belows, to avoid producing electrical short circuit between the line layer.
Please refer to Fig. 3, in another embodiment of the present invention, run through wiring board 200 and the ground plane 230 that manifests wiring board 200 inside during 130 inwall, is strengthened junction surface 112 in the duct except covering duct 130 when duct 130, also can cover the ground plane 230 on the inwall.Can be the metal (for example copper) of identical material owing to ground plane 230 and reinforcement junction surface 112, thereby reinforcement junction surface 112 and ground plane 230 structural and electric connections, at this moment, ground plane 230 is connected as one with reinforcement junction surface 112, retain strength increases thereupon, so that it is more firm to strengthen the structure at junction surface 112, further improved the bond strength of welded gasket 110 with pin 310.
Though in the present embodiment, duct 130 is for running through the through hole of wiring board 200 and ground plane 230, but in another embodiment (not illustrating), duct 130 also can only be run through the some of wiring board 200 and form a buried via hole, and appear ground plane 230 in this buried via hole, and same, strengthen junction surface 112 and also be formed in the buried via hole, do not run through wiring board 200 fully, and structural and electrically connect with ground plane 230.
[second embodiment]
Fig. 4 is the wiring board of second embodiment of the invention and the connected structure schematic diagram of electronic building brick.The wiring board 200 of second embodiment is roughly the same with the part member of the connected structure 100 of electronic building brick 300 and first embodiment, so do not add to give unnecessary details, only illustrate, and same or analogous assembly label is represented same or analogous assembly at more important and difference.The duct 130 of second embodiment be revealed in pin 310 under, and scolder 120 fills in the duct 130 and strengthens 112 structural connections of junction surface.Say further, the pin 310 of electronic building brick 300 (non-signal terminal) is when being fixed on welded gasket 110, because being filled in the duct 130 and with reinforcement junction surface 112, scolder 120 is connected, the bonding area of scolder 120 increases, retain strength increases thereupon, makes pin 310 and welded gasket 110 have better joint capacity.So, electronic building brick 300 firmly can be positioned on the wiring board 200.Because pin 310 closely weld with welded gasket 110 and fixes, the pin 310 that makes electronic building brick 300 can held stationary and be not easy to separate with wiring board 200.
In sum, in the connected structure of wiring board of the present invention and electronic building brick, because welded gasket has the reinforcement junction surface, by strengthening the junction surface pin of electronic building brick and the welded gasket of wiring board stably are fixed together, and then can promote the bond strength of electronic building brick and wiring board.Moreover the area of welded gasket makes pin have bigger fixed-area and difficult drop-off greater than the area of pin, thereby increases stability.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (10)
1. the connected structure of wiring board and electronic building brick comprises:
One welded gasket is disposed at a surface of this wiring board, and in order to place a pin of this electronic building brick, the area of this welded gasket is greater than the area of this pin;
One scolder is welded between this welded gasket and this pin; And
One runs through the duct of this welded gasket and this wiring board, and this welded gasket has towards this duct and to extend one downwards and strengthen the junction surface, and this reinforcement junction surface covers the inwall in this duct, in order to strengthen the bond strength of this welded gasket and this pin.
2. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, this duct be revealed in this pin under, and this scolder fills in this duct, and the reinforcement junction surface is structural is connected with this.
3. the connected structure of wiring board as claimed in claim 1 and electronic building brick, it is characterized in that, this duct be positioned at this pin around, this duct covers with the welding resisting layer on this wiring board, and the part that this welded gasket engages with this pin is revealed in outside this welding resisting layer.
4. the connected structure of wiring board as claimed in claim 1 and electronic building brick, it is characterized in that, this wiring board has a ground plane, this duct is run through this wiring board and is manifested the inwall of this ground plane in this duct, and this reinforcement junction surface cover this ground plane and with this ground plane structure and electric connection.
5. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, the material at this welded gasket and this reinforcement junction surface comprises copper.
6. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, this reinforcement junction surface is an annular or a cylinder in this duct.
7. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that this electronic building brick comprises connector or chip packing-body.
8. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, this pin of this electronic building brick is a non-signal terminal or a signal terminal.
9. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, this duct is for running through the through hole of this wiring board fully.
10. the connected structure of wiring board as claimed in claim 1 and electronic building brick is characterized in that, this duct is not for running through the buried via hole of this wiring board fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810175199A CN101730382A (en) | 2008-10-28 | 2008-10-28 | Connecting structure for circuit board and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810175199A CN101730382A (en) | 2008-10-28 | 2008-10-28 | Connecting structure for circuit board and electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101730382A true CN101730382A (en) | 2010-06-09 |
Family
ID=42450329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810175199A Pending CN101730382A (en) | 2008-10-28 | 2008-10-28 | Connecting structure for circuit board and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101730382A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139467A (en) * | 2019-04-28 | 2019-08-16 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board arrangement |
| CN110278656A (en) * | 2018-03-15 | 2019-09-24 | 群联电子股份有限公司 | Circuit board assemblies and storage device |
| WO2020216029A1 (en) * | 2019-04-23 | 2020-10-29 | Oppo广东移动通信有限公司 | Laminated board and terminal device |
| WO2022000173A1 (en) * | 2020-06-29 | 2022-01-06 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method therefor |
-
2008
- 2008-10-28 CN CN200810175199A patent/CN101730382A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278656A (en) * | 2018-03-15 | 2019-09-24 | 群联电子股份有限公司 | Circuit board assemblies and storage device |
| CN110278656B (en) * | 2018-03-15 | 2020-08-18 | 群联电子股份有限公司 | Circuit board assembly and storage device |
| WO2020216029A1 (en) * | 2019-04-23 | 2020-10-29 | Oppo广东移动通信有限公司 | Laminated board and terminal device |
| CN110139467A (en) * | 2019-04-28 | 2019-08-16 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board arrangement |
| WO2022000173A1 (en) * | 2020-06-29 | 2022-01-06 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method therefor |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100609 |