CN211630498U - PCB and common bonding pad thereof - Google Patents
PCB and common bonding pad thereof Download PDFInfo
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- CN211630498U CN211630498U CN202020176178.2U CN202020176178U CN211630498U CN 211630498 U CN211630498 U CN 211630498U CN 202020176178 U CN202020176178 U CN 202020176178U CN 211630498 U CN211630498 U CN 211630498U
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Abstract
The utility model belongs to the technical field of the circuit board, more specifically say, relate to a PCB board and sharing pad thereof. This sharing pad is provided with the second weld part that supplies the subsides of second component adaptation including supplying the first weld part that first component adaptation pasted the dress in the first weld part, still is provided with in the first weld part and hinders the isolation region, hinders the isolation region around the outer peripheral edges of locating the second weld part in order to keep apart the second weld part. Therefore, the second component with small size is welded on the second welding part, and the first component with large size is welded on the first welding part, so that the purpose that the same welding pad can be used for compatibly mounting components with different specifications and sizes can be realized; meanwhile, the solder mask isolation area is arranged to isolate the second welding part, and solder paste on the first welding part and the second welding part cannot move when passing through a reflow oven during welding operation, so that the second component can be prevented from being subjected to pulling deviation, empty welding or false welding, and reliable mechanical and electrical connection relation can be established between the compatible surface-mounted two-component and the PCB.
Description
Technical Field
The present application belongs to the technical field of circuit boards, and more particularly, to a PCB and a common pad thereof.
Background
A Printed Circuit Board (PCB) is a provider for mounting various electronic components and electrically connecting various electrical components in an electronic product, and generally, a pad for mounting the components is provided on the PCB, and the electronic components are mounted on the PCB through the pad. In recent years, surface mount technology is gradually developing into one of the mainstream electronic assembly technologies because it is not necessary to drill a lead hole on a printed board, and when the surface mount technology is used for assembling components, the surface mount components are directly bonded to a pad of the printed board, and mechanical and electrical connection is formed between the components and the printed board through solder.
In the production process of electronic products, components with different specifications or power are often required to be compatibly mounted on the same printed board, and in actual production, the components with different specifications and sizes are mounted on the same bonding pad of the PCB, so that the production cost can be reduced. However, in the process of mounting components of different specifications and sizes by using the same bonding pad, the small-sized component needs to be compatibly mounted on the large-sized bonding pad, so that when the small-sized component is mounted, the conditions of component deviation, empty soldering or false soldering and the like occur in reflow soldering of the small-sized component due to the fact that the bonding pad is too large in size and too much in solder paste, the small-sized component cannot be effectively electrically connected with the PCB, and mounting of subsequent large-sized components is affected.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the application is to provide a PCB and a common bonding pad thereof, so as to solve the technical problem that the same bonding pad in the prior art cannot be reliably compatible with a small-size component and a large-size component.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a sharing pad, including the first welding part that supplies first component adaptation to paste dress, be provided with the second welding part that supplies second component adaptation to paste dress in the first welding part, still be provided with in the first welding part and hinder the isolation region, hinder the isolation region around locating the outer peripheral edges of second welding part are in order to be used for keeping apart the second welding part.
Optionally, the solder mask isolation region is a solder mask ink region.
Optionally, the width dimension of the solder mask isolation region separating the first welding part and the second welding part is 0.2 mm-0.3 mm.
Optionally, an intermediate solder mask is further disposed in the middle of the first soldering portion, the intermediate solder mask penetrates through the first soldering portion and divides the first soldering portion into a first tin-coating area and a second tin-coating area, and the first tin-coating area and the second tin-coating area are used for soldering two opposite ends of the first component.
Optionally, the second soldering portion is disposed in a middle portion of the first soldering portion, the middle solder mask penetrates the second soldering portion and divides the second soldering portion into a third tin-coating area and a fourth tin-coating area, and the third tin-coating area and the fourth tin-coating area are used for soldering two opposite end portions of the second component;
the middle solder mask area penetrates through the solder mask isolation area and divides the solder mask isolation area into a first isolation section and a second isolation section, the first isolation section divides the first tin coating area from the third tin coating area, and the second isolation section divides the second tin coating area from the fourth tin coating area.
Optionally, a plurality of second soldering portions are arranged in the first soldering portion at intervals along the length direction of the middle solder mask, and the middle solder mask sequentially penetrates through the second soldering portions and divides the second soldering portions into the third upper tin area and the fourth upper tin area respectively;
the solder mask isolation area further comprises a third isolation section and a fourth isolation section, the third isolation section is used for separating two adjacent third tin-coating areas, the fourth isolation section is used for separating two adjacent fourth tin-coating areas, the third isolation section is connected with the first isolation section, and the fourth isolation section is connected with the second isolation section.
Optionally, the intermediate solder mask region is a green oil region.
Optionally, the common pad is a square pad or a circular pad.
The application provides a beneficial effect of sharing pad lies in: compared with the prior art, this application sharing pad sets up first welding part and is used for welding and pastes dress first component, sets up second welding part welding and pastes dress second component in first welding part, and the outer peripheral edges of second welding part set up and hinder the isolation region and keep apart the second welding part. Therefore, when electronic components with different sizes need to be compatibly mounted, the small-sized second component is welded on the second welding part, and the large-sized first component is welded on the first welding part, so that the components with different specifications and sizes can be mounted on the same bonding pad, the bonding pad compatibility is high, and the production cost is favorably reduced; meanwhile, the solder mask isolation area is arranged to isolate the second welding part, so that mutual influence is avoided when welding operation is carried out on the first welding part and the second welding part, for example, solder paste and the like on the first welding part and the second welding part cannot jump each other when passing through a reflow oven, thereby effectively avoiding the second element from generating bad conditions such as deviation, empty welding or false welding, and ensuring that the first element and the second element which are compatible to be pasted can establish stable and reliable mechanical and electrical connection relation with the PCB.
The utility model discloses another technical scheme is: a PCB board is provided with the common bonding pad.
The utility model discloses a PCB board owing to used foretell shared pad, can realize pasting the electronic components of different specification and size on same pad, different size components and parts paste and do not influence each other, and components and parts paste the dress quality secure, and only need design a steel mesh mould can help the required tin cream when the subsides of deposit size components and parts paste, and steel mesh cost of manufacture reduces, and PCB board cost of manufacture reduces.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a first schematic structural diagram of a common pad according to an embodiment of the present application;
fig. 2 is a second schematic structural diagram of a common pad according to another embodiment of the present application;
fig. 3 is a schematic structural diagram of a common pad according to yet another embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
10-first soldering part 11-first tinning area 12-second tinning area
20-second soldering part 21-third tinning area 22-fourth tinning area
30-solder mask isolation area 31-first isolation section 32-second isolation section
33-third isolation section 34-fourth isolation section 40-intermediate solder mask.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly understood, the present application is further described in detail below with reference to fig. 1 to 3 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, a common pad provided in the embodiment of the present application will be described. Specifically, as shown in fig. 1, the common pad includes a first welding portion 10 for a first component (not shown) to be mounted in a matching manner, a second welding portion 20 for a second component (not shown) to be mounted in a matching manner is disposed in the first welding portion 10, a solder mask isolation region 30 is further disposed in the first welding portion 10, and the solder mask isolation region 30 is wound around an outer periphery of the second welding portion 20 for isolating the second welding portion 20. The length of the first component is greater than that of the second component, the width of the first component is greater than that of the second component, and the second component can be attached to the inner lower part of the first component during attachment, or the second component can be arranged in the opening or the groove of the first component when the first component is provided with the opening or the groove. Specifically, in the present embodiment, the above-described solder resist isolation region 30 is formed by opening the window 20 in the first solder part 10; the second welding part 20 can be disposed in the middle of the first welding part 10, and at this time, the solder mask isolation region 30 is disposed around the peripheral side edge of the second welding part 20 to isolate the second welding part 20; the second welding portion 20 can also be disposed at the side of the first welding portion 10, that is, one side of the second welding portion 20 is overlapped with the side of the first welding portion 10, in this case, the solder mask isolation region 30 only needs to be disposed around the outer peripheries of the other three sides of the second welding portion 20 to completely isolate the second welding portion 20, as shown in fig. 1.
The utility model discloses sharing pad sets up first welding part 10 and is used for welding and pastes first component, sets up second welding part 20 welding and pastes the second component in first welding part 10, and the outer peripheral edges of second welding part 20 set up and hinder isolation region 30 and keep apart second welding part 20. Therefore, when electronic components with different sizes need to be compatibly mounted, the small-sized second component is welded to the second welding part 20 through solder paste and the like, and the large-sized first component is welded to the first welding part 10 through solder paste and the like, so that the mounting of components with different specifications and sizes on the same bonding pad can be realized, the compatibility of the bonding pad is high, and the reduction of the production cost is facilitated; meanwhile, the solder mask isolation area 30 is arranged to isolate the second welding part 20, so that the first welding part 10 and the second welding part 20 are not affected when welding operation is performed, for example, solder paste on the first welding part 10 and the second welding part 20 cannot jump each other when passing through a reflow oven, thereby effectively avoiding the second component from generating bad conditions such as deviation, empty welding or false welding, and ensuring that the first component and the second component which are compatible to be mounted can establish stable and reliable mechanical and electrical connection relation with the PCB. In addition, the electronic components of different specification and dimension are pasted to the same pad compatibility, only need during the tin cream deposit design a steel mesh can, need not to design different steel meshes according to the subsides dress pad of different size components and parts, steel mesh cost of manufacture reduces.
In another embodiment of the present invention, referring to fig. 1, the solder mask isolation area 30 is preferably a solder mask ink area, the solder mask ink has a characteristic of preventing adhesion of solder such as solder, and the solder cannot be soldered to the component in the area sprayed with the solder mask ink, so that the second soldering portion 20 can be effectively isolated from the first soldering portion 10, so that the soldering operation on the first soldering portion 10 and the second soldering portion 20 is not affected by each other; meanwhile, the solder resist ink also has excellent solder resistance, and can avoid the damage to the parts which do not need to be welded, thereby ensuring that the quality of the bonding pad is not influenced after the first component and the second component are mounted.
In another embodiment of the present invention, please refer to fig. 1, the solder mask isolation area 30 isolates the first welding part 10 and the second welding part 20 with a width dimension of 0.2 mm-0.3 mm, i.e. the wide L solder mask ink area of 0.2 mm-0.3 mm is provided between the second welding part 20 and the first welding part 10 at an interval, so the solder mask isolation area 30 with a certain pattern is provided, it is ensured that the ink in the solder mask ink area can form an ink bridge, thereby reliably isolating the second welding part 20, and the phenomenon of false welding and the like due to the small-sized second component deviation caused by the tin overflow during the welding process is avoided. Specifically, in the present embodiment, the width dimension L may be 0.2mm, 0.22mm, 0.25mm, 0.28mm, or 0.3mm, and may be determined according to the dimensions of the first component and the second component. Further, in the present embodiment, the width of each of the solder resist isolation regions 30 may be set to be equal or partially equal on the premise that the above-described dimension requirements are satisfied.
In another embodiment of the present invention, referring to fig. 2, an intermediate solder mask 40 is further disposed in the middle of the first soldering portion 10, the intermediate solder mask 40 penetrates the first soldering portion 10 and divides the first soldering portion 10 into a first upper tin region 11 and a second upper tin region 12, and the first upper tin region 11 and the second upper tin region 12 are used for soldering two opposite ends of the first component. Specifically, the first tin-plating area 11 and the second tin-plating area 12 are copper-exposed areas on the pad for depositing tin paste, when the first component is mounted, the soldering portion of the first component is soldered to the solder paste on the first tin-plating area 11 and the second tin-plating area 12, the intermediate solder mask is used for preventing the tin paste on the first tin-plating area 11 and the second tin-plating area 12 from being connected into a tin bridge, and the portion of the first component which does not need to be soldered corresponds to the intermediate solder mask 40.
In another embodiment of the present invention, referring to fig. 2, the second soldering portion 20 is disposed in the middle of the first soldering portion 10, the middle solder mask 40 penetrates the second soldering portion 20 and divides the second soldering portion 20 into a third upper solder region 21 and a fourth upper solder region 22, and the third upper solder region 21 and the fourth upper solder region 22 are used for soldering two opposite ends of the second component; the third tin-plating area 21 and the fourth tin-plating area 22 are also copper-exposed areas where tin paste is deposited on the pad, when a second component is mounted, the soldering portion of the second component is soldered to the tin paste on the third tin-plating area 21 and the fourth tin-plating area 22, and the portion of the second component which does not need to be soldered corresponds to the middle solder-resist area 40.
Further, the intermediate solder mask area 40 penetrates through the solder mask isolation area 30 and divides the solder mask isolation area 30 into a first isolation section 31 and a second isolation section 32, the first isolation section 31 divides the first upper tin area 11 and the third upper tin area 21, so as to avoid a tin bridge formed between the first upper tin area 11 and the third upper tin area 21, the second isolation section 32 divides the second upper tin area 12 and the fourth upper tin area 22, so as to avoid a tin bridge formed between the second upper tin area 12 and the fourth upper tin area 22, so as to ensure that no tin bridge is formed between the upper tin areas during soldering, thereby ensuring the soldering quality of the first component and the second component.
Specifically, in the present embodiment, the width dimension L of the first isolation section 31 separating the first tin applying region 11 and the third tin applying region 21 is 0.2mm to 0.3mm, and the width dimension L of the second isolation section 34 separating the second tin applying region 12 and the fourth tin applying region 22 is also 0.2mm to 0.3 mm.
In another embodiment of the present invention, referring to fig. 3, a plurality of second welding portions 20 are disposed at intervals along the length direction of the middle solder mask 40 in the first welding portion 10, and each second welding portion 20 is used for welding a plurality of second components in a one-to-one correspondence, so that the common pad of the present embodiment can be compatible with a plurality of small-sized second components, and the pad compatibility is higher.
Further, in the present embodiment, referring to fig. 3, the intermediate solder mask region 40 sequentially penetrates through each of the second soldering portions 20 and divides each of the second soldering portions 20 into the third upper tin region 21 and the fourth upper tin region 22, so as to correspondingly deposit solder paste for soldering each of the second component devices. The solder mask isolation region 30 further comprises a third isolation section 33 for separating two adjacent third tin-on regions 21 and a fourth isolation section 34 for separating two adjacent fourth tin-on regions 22, the third isolation section 33 is connected with the first isolation section 31, and the fourth isolation section 34 is connected with the second isolation section 32, so that the third isolation section 33 is arranged to isolate the adjacent third tin-on regions 21 to avoid a tin bridge between the adjacent third tin-on regions 21, the fourth isolation section 34 is arranged to isolate the adjacent fourth tin-on regions 22 to avoid a tin bridge between the adjacent fourth tin-on regions 22, and thus, when a plurality of second components are compatibly mounted, the second components are not affected by each other.
Specifically, in the present embodiment, the width dimension L of the third separating section 33 separating two adjacent third tin-coated regions 21 is 0.2mm to 0.3mm, and the width dimension L of the fourth separating section 34 separating two adjacent fourth tin-coated regions 22 is also 0.2mm to 0.3 mm.
In another embodiment of the present invention, referring to fig. 2 and 3, the middle solder mask area 40 is a green oil area.
In another embodiment of the present invention, the common pad is a square pad or a circular pad, and the common pad is selected according to the size of the first component and the required peeling resistance. Of course, in other embodiments, the common pad of the present embodiment may also be an oval pad or another polygonal pad, which is not limited herein.
In another embodiment of the present invention, the third tin coating area 21 and the fourth tin coating area 22 may be square areas or arc areas, when the third tin coating area 21 and the fourth tin coating area 22 are square areas, the first isolation section 31 is a "[" shaped isolation section having a shape adapted to the shape of the third tin coating area 21, and the second isolation section 32 is a "]" shaped isolation section having a shape adapted to the shape of the fourth tin coating area 22, as shown in fig. 2 and 3; when the third tin-coating area 21 and the fourth tin-coating area 22 are arc-shaped areas, the first isolation section 31 and the second isolation section 32 are arc-shaped isolation sections (not shown) correspondingly, so as to ensure that the requirement of the isolation size of the third tin-coating area 21 and the fourth tin-coating area 22 is met.
Another embodiment of the present invention further provides a PCB (not shown) provided with the common bonding pad.
The PCB board of this embodiment owing to used foretell shared pad, can realize pasting the electronic components of different specification and dimension on same pad, different size components and parts paste and do not influence each other, and components and parts paste and paste the quality secure, and only need design a steel mesh mould can help the required tin cream when the subsides of the big small-size components and parts paste, and steel mesh cost of manufacture reduces, and PCB board cost of manufacture reduces.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (9)
1. A shared pad, characterized by: including supplying the first welding part that first component adaptation pasted the dress, be provided with the second welding part that supplies the second component adaptation to paste the dress in the first welding part, still be provided with in the first welding part and hinder the isolation region, hinder the isolation region around locating the outer peripheral edges of second welding part are in order to be used for keeping apart the second welding part.
2. The common pad of claim 1, wherein: the solder mask isolation area is a solder mask ink area.
3. The common pad of claim 1, wherein: the width dimension of the solder-resisting isolation area for isolating the first welding part and the second welding part is 0.2 mm-0.3 mm.
4. A common pad according to any one of claims 1 to 3, wherein: the middle part of first welding part still is provided with middle solder mask, middle solder mask runs through first welding part and will first welding part is separated into first tin-coating district and second tin-coating district, first tin-coating district with second tin-coating district is used for welding the relative both ends of first component.
5. The common pad of claim 4, wherein: the second welding part is arranged in the middle of the first welding part, the middle solder mask area penetrates through the second welding part and divides the second welding part into a third tin-coating area and a fourth tin-coating area, and the third tin-coating area and the fourth tin-coating area are used for welding two opposite end parts of the second component;
the middle solder mask area penetrates through the solder mask isolation area and divides the solder mask isolation area into a first isolation section and a second isolation section, the first isolation section divides the first tin coating area from the third tin coating area, and the second isolation section divides the second tin coating area from the fourth tin coating area.
6. The common pad of claim 5, wherein: a plurality of second welding parts are arranged in the first welding part at intervals along the length direction of the middle solder mask area, and the middle solder mask area sequentially penetrates through the second welding parts and divides the second welding parts into a third tinning area and a fourth tinning area respectively;
the solder mask isolation area further comprises a third isolation section and a fourth isolation section, the third isolation section is used for separating two adjacent third tin-coating areas, the fourth isolation section is used for separating two adjacent fourth tin-coating areas, the third isolation section is connected with the first isolation section, and the fourth isolation section is connected with the second isolation section.
7. The common pad of claim 5 or 6, wherein: the middle solder mask area is a green oil area.
8. A common pad according to any one of claims 1 to 3, wherein: the common bonding pad is a square bonding pad or a circular bonding pad.
9. A PCB board, its characterized in that: the PCB board is provided with the common bonding pad of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020176178.2U CN211630498U (en) | 2020-02-13 | 2020-02-13 | PCB and common bonding pad thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020176178.2U CN211630498U (en) | 2020-02-13 | 2020-02-13 | PCB and common bonding pad thereof |
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| Publication Number | Publication Date |
|---|---|
| CN211630498U true CN211630498U (en) | 2020-10-02 |
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| CN202020176178.2U Active CN211630498U (en) | 2020-02-13 | 2020-02-13 | PCB and common bonding pad thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411960A (en) * | 2021-06-22 | 2021-09-17 | 深圳市瑞科慧联科技有限公司 | Printed circuit board, finished circuit board and welding method |
| CN114449752A (en) * | 2021-12-31 | 2022-05-06 | 四川天邑康和通信股份有限公司 | Common pad of SMT |
| WO2024027244A1 (en) * | 2022-08-05 | 2024-02-08 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic device |
-
2020
- 2020-02-13 CN CN202020176178.2U patent/CN211630498U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113411960A (en) * | 2021-06-22 | 2021-09-17 | 深圳市瑞科慧联科技有限公司 | Printed circuit board, finished circuit board and welding method |
| CN114449752A (en) * | 2021-12-31 | 2022-05-06 | 四川天邑康和通信股份有限公司 | Common pad of SMT |
| WO2024027244A1 (en) * | 2022-08-05 | 2024-02-08 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic device |
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