CN201146630Y

CN201146630Y - Electron carrier plate and pad-soldering structure

Info

Publication number: CN201146630Y
Application number: CNU2008200019953U
Authority: CN
Inventors: 曾文明
Original assignee: MICRO ONE ELECTRONICS (KUNSHAN) Inc; Micro Star International Co Ltd
Current assignee: MICRO ONE ELECTRONICS (KUNSHAN) Inc; Micro Star International Co Ltd
Priority date: 2008-01-28
Filing date: 2008-01-28
Publication date: 2008-11-05
Anticipated expiration: 2018-01-28

Abstract

The utility model relates to an electronic carrier and a pad structure. The electronic carrier includes a substrate; a plurality of round pads are arranged on the substrate; a solder mask is covered on the substrate and the solder mask are equipped with a plurality of openings at the position corresponding to the round pads to lead to the exposure of the round pads; a plurality of solder layers which are formed on the round pads. The solder layers can be completely covered on the pads through the design of the round pads. And the adjacent sides of pairing solder layers are lower than the opposite sides. Thus, an electronic element can be stably fixed on the pairing solder layers to avoid the phenomena of tomb stone or deviation of the electronic element that further causes the poor electronic quality of the electronic substrate. The design of the round pads saves the area of the substrate and leads to that the substrate with same area can accommodate more electronic elements and facilitates the wiring design of circuit. And the round pads can also improve the exiting situation that the periphery of present square pads can not eat tin easily.

Description

Electronic carrier board and welding pad structure

Technical field

The utility model relates to a kind of electronic carrier board and welding pad structure, electronic carrier board and welding pad structure that particularly a kind of a plurality of electronic components electrically connect by solder layer and with weld pad.

Background technology

Along with integrated circuit (IC) development of technology, the design of electronic component is microminiaturized day by day with manufacturing, and the electronic circuit that feasible electronic product now has higher integration makes that the function of electronic product is complete more powerful.

Based on electrically and the demand on the performance, on the circuit support plate, electrically be provided with a plurality of as passive electronic components such as electric capacity, resistance, inductance, with stablizing of the electrical quality of keeping electronic product.At present with surface mount technology (Surface Mount Technology, SMT) be the main flow of electronics mount technology, be provided with a plurality of weld pads to reach on the circuit support plate of minimum area, and on each weld pad, insert tin cream, with as the material that connects between circuit support plate and electronic component.

Because surface mount technology has inseparable relation with the welding pad structure of circuit support plate, if the design of welding pad structure is incorrect, for example at present common square structure design, its tin cream is in the process of reflow, only in the fusion of weld pad centre, and can't cover weld pad fully, or too much tin cream such as overflows at problem, the bond strength that is arranged at the electronic component on the weld pad is not good with causing, the skew of position or set up a monument phenomenons such as (tombstone), and then causes the electrical quality of circuit support plate significantly to reduce.

Moreover, because existing weld pad is how made with metal materials such as copper or copper alloys, scolding tin after the reflow concentrates on weld pad central authorities, and can't cover weld pad fully, to make that being exposed to outer weld pad produces oxidation, and the formation cupric oxide has more hindered flowing of scolding tin, has also increased the probability that electronic component causes short circuit simultaneously.

Summary of the invention

In view of above problem, the utility model provides a kind of electronic carrier board, improve the above-mentioned shortcoming of prior art with this, the bond strength that makes electronic component be welded on the substrate to be produced better, be difficult for producing phenomenon such as be shifted, set up a monument, thereby can not cause producing the problem of the electrical quality reduction of circuit support plate.

For addressing the above problem, the utility model provides a kind of electronic carrier board, includes: a substrate; A plurality of circular bond pad are arranged on the substrate; One welding resisting layer is covered on this substrate, and this welding resisting layer is formed with a plurality of openings corresponding to the position of described a plurality of circular bond pad, so that outside described a plurality of circular bond pad is exposed to; A plurality of solder layers are formed at respectively on the described a plurality of circular bond pad that expose, and wherein the sides adjacent of solder layer is lower than opposite side in pairs; And a plurality of electronic components, be arranged at respectively on described a plurality of solder layer, and by described a plurality of solder layers, and electrically connect with described a plurality of circular bond pad.

The utility model also provides a kind of welding pad structure, is applied to comprise on the electronic carrier board: a plurality of circular bond pad; And a plurality of solder layers, be respectively formed on described a plurality of circular bond pad, wherein the sides adjacent of solder layer is lower than opposite side in pairs.

In the utility model, term " circle " refers to the shape that closed curve surrounds, and it can be positive circle, ellipse, oval etc.

In an embodiment, electronic carrier board includes a substrate, a plurality of circular bond pad, a welding resisting layer, a plurality of solder layer, reaches a plurality of electronic components.Wherein, circular bond pad is arranged on the substrate, and welding resisting layer is covered on the substrate, and welding resisting layer is formed with a plurality of openings corresponding to the position of each circular bond pad, so that outside circular bond pad is exposed to.Solder layer is formed on each circular bond pad that exposes, and weld pad is covered fully, and the sides adjacent height of two solder layers is lower than the opposite side of two solder layers, so that electronic component stably is arranged at the solder layer top, and electrically connects with weld pad.

The utility model also provides a kind of circular bond pad, and it is applied on the electronic carrier board, be formed with a solder layer respectively on described a plurality of circular bond pad, and the sides adjacent of described two solder layers is lower than opposite side.

Effect of the present utility model is, the design of circular bond pad can be saved the area of substrate, make the substrate of same units area can hold the electronic component of greater number, and make things convenient for the design of wiring, and circular bond pad also can be improved the problem that the periphery of existing square bond pad is difficult for eating tin.And both sides have the solder layer of difference in height, can stably make electronic component weld admittedly thereon, have avoided electronic component to produce and have set up a monument or the phenomenon that is offset, and then caused the not good problem of electrical quality of electronic carrier board.

Above about the utility model content explanation and the explanation of following execution mode in order to demonstration with explain principle of the present utility model, and provide protection range of the present utility model further to explain.

Description of drawings

Fig. 1 is the sectional perspective schematic diagram of first embodiment of the present utility model;

Fig. 2 is the part plan schematic diagram of first embodiment of the present utility model;

Fig. 3 is the generalized section of first embodiment of the present utility model; And

Fig. 4 is the sectional perspective schematic diagram of second embodiment of the present utility model.

Wherein, description of reference numerals is as follows:

100 electronic carrier boards, 110 substrates

120 weld pads, 130 welding resisting layers

140 solder layers, 150 electronic components

Embodiment

The electronic carrier board of putting down in writing according to the utility model, base plate for packaging, circuit board or the printed circuit board (PCB) of using including, but not limited to Chip Packaging etc. have the support plate of circuit pattern.Below in the detailed description of the present utility model, will be with printed circuit board (PCB) as most preferred embodiment of the present utility model.Yet accompanying drawing only provides the usefulness of reference with explanation, is not in order to restriction the utility model.

The schematic diagram of the utility model first embodiment as shown in Figure 1 to Figure 3, the related electronic carrier board 100 of the utility model include a substrate 110, a plurality of circular bond pad 120, a welding resisting layer 130, a plurality of solder layer 140 and a plurality of electronic component 150.Wherein, substrate 110 can be insulating sheet material, or its middle storehouse has the insulating sheet material of line layer (not shown), and circular bond pad 120 is made with the metal material that for example copper or copper alloy etc. have high conductivity matter, yet the design that this form can be understood for the personnel that are familiar with this technology is not so give unnecessary details in addition.

The shaped design of circular bond pad 120 is positive circular, and is arranged on the substrate 110 with array format, and the spacing of each circular bond pad 120 is 0.8mm～0.85mm, so that the substrate 110 of same units area can hold the circular bond pad 120 of greater number.Welding resisting layer 130 is covered on the substrate 110, and offers a plurality of openings in welding resisting layer 130 corresponding to the position of each circular bond pad 120, so that welding resisting layer 130 is when being covered on the substrate 110, outside circular bond pad 120 is exposed to.

Tin cream (solder paste) fills on each circular bond pad 120 that exposes with mode of printing, to form solder layer 140, yet the personnel that are familiar with this technology also can by be coated with, scrape, mode such as sprinkling, tin cream is filled on the circular bond pad, and the embodiment that is put down in writing with the utility model does not exceed.And in the process that forms solder layer 140, control the opposite side height of the sides adjacent height of two contiguous solder layers 140 a little less than two solder layers 140.

A plurality of electronic components 150, for example be passive electronic components such as electric capacity, resistance, inductance, be arranged at respectively on each paired solder layer 140 by the configuration of board, again via reflow (reflow) step, with heating solder layer 140, make solder layer 140 fusion when the reflow step also flow, to fill up the opening of welding resisting layer 130, and cover circular bond pad 120 fully, avoid the relation of existing square bond pad because of shape, make scolding tin can't cover weld pad fully, eat problems such as tin inequality and easy oxidation and produce the weld pad periphery.

In addition, electronic component 150 is because of the difference in height of solder layer 140 both sides, be able to stably be welded in admittedly on the paired solder layer 140, and connecting by solder layer 140, and electrically connect with circular bond pad 120, avoid electronic component 150 when carrying out reflow, to produce the off normal or the phenomenon of set up a monument (tombstoning), cause the contact short circuit of electronic component 150.

See also the schematic perspective view of the utility model second embodiment of Fig. 4.As shown in the figure, the shape of a plurality of circular bond pad 120 that the utility model is related also can be according to the wiring on the electronic carrier board of different type of machines (layout), and is designed to the positive circle of first embodiment, and the ellipse put down in writing of second embodiment.

In addition, because positive circle is different with the area size of oval-shaped weld pad 120, make that the tin amount of eating of difform circular bond pad 120 is also inequality, therefore also can be on substrate 110 of the present utility model according to dissimilar electronic component 150, and the weld pad 120 of the suitable shape of corresponding design, with the tin cream use amount of accurate control electronic carrier board 100, avoid too much tin cream to overflow or the tin cream quantity not sufficient, cause the short circuit of electronic component 150 or bond strength not good.

The electronic carrier board that the utility model is related, occupied substrate area will be significantly saved in the design of its circular bond pad, make that the electrical wiring on the substrate is more convenient, and can hold the electronic component of greater number, to promote the electrical quality of electronic carrier board.And solder layer is after the reflow step, fusion and being covered on the circular bond pad fully, and the edge that has solved existing square bond pad is difficult for eating tin, and causes problems such as oxidation easily.

The sides adjacent height of paired solder layer of the present utility model is lower than opposite side, and electronic component can stably be welded on two solder layers admittedly, and and have the excellent electrical property annexation between the weld pad, make the electrical quality and the qualification rate of electronic carrier board be greatly improved.

Though the record of embodiment of the present utility model as mentioned above; yet be not in order to limit the utility model; any personnel that are familiar with related art techniques; in not breaking away from spirit and scope of the present utility model; when doing multiple change, therefore protection range of the present utility model must be as the criterion with the scope that this specification appending claims is defined according to the described shape of claims of the present utility model, structure, feature and spirit.

Claims

1. a welding pad structure is characterized in that, this welding pad structure comprises:

A plurality of circular bond pad; And

A plurality of solder layers be respectively formed on described a plurality of circular bond pad, and this solder layer area do not exceed weld pad less than corresponding weld pad and position; And

The sides adjacent that wherein belongs to the paired solder layer of same electronic component is lower than opposite side.

2. welding pad structure as claimed in claim 1 is characterized in that, described a plurality of circular bond pad array rows establish.

3. welding pad structure as claimed in claim 1 is characterized in that the shape of described a plurality of circular bond pad can be positive circle or ellipse.

4. an electronic carrier board is characterized in that, includes:

One substrate;

A plurality of circular bond pad are arranged on the substrate;

One welding resisting layer is covered on this substrate, and this welding resisting layer is formed with a plurality of openings corresponding to the position of described a plurality of circular bond pad, so that outside described a plurality of circular bond pad is exposed to;

A plurality of solder layers are formed at respectively on the described a plurality of circular bond pad that expose. and this solder layer area does not exceed weld pad less than corresponding weld pad and position;

A plurality of electronic components are arranged at respectively on described a plurality of solder layer, and by described a plurality of solder layers, electrically connect with described a plurality of circular bond pad; And

5. electronic carrier board as claimed in claim 4 is characterized in that, described a plurality of circular bond pad array rows are located on this substrate.

6. electronic carrier board as claimed in claim 4 is characterized in that the shape of described a plurality of circular bond pad can be positive circle or ellipse.