CN205029965U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN205029965U CN205029965U CN201520811303.1U CN201520811303U CN205029965U CN 205029965 U CN205029965 U CN 205029965U CN 201520811303 U CN201520811303 U CN 201520811303U CN 205029965 U CN205029965 U CN 205029965U
- Authority
- CN
- China
- Prior art keywords
- edge
- pad
- circuit board
- line
- electrically conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a circuit board, circuit board includes circuit board main part, pad, insulating layer and transparent conductive adhesive layer, the pad with the insulating layer set up in in the circuit board main part, the insulating layer corresponds the position of pad has been offered the window and has been exposed the pad, the insulating layer is in the edge of window department near the outer wall of pad, be provided with on partly edge of pad or the whole edge transparent conductive adhesive layer. Circuit board can avoid exposing with solder connection's the line of walking, and prevents that the tin cream on the pad runs off.
Description
Technical field
The utility model relates to field of circuit boards, particularly relates to a kind of circuit board with pad.
Background technology
In various electronic product, such as camera module, mobile phone, electronic watch etc., use circuit board usually, in order to be electrically connected or to form various drive circuit by each parts of electronic product.Such as, the surface of the circuit board of camera module is provided with the elements such as image sensor, electric capacity and resistance usually, wherein, the element such as electric capacity, resistance is electrically connected by surface mounting technology (SurfaceMountedTechnology, SMT) and circuit board.Surface mounting technology needs to be provided with pad on circuit boards usually, when mounting, first by paste solder printing on pad, then by the corresponding site of the element such as electric capacity, resistance and described pad alignment, so that described element is installed on the fixed position of circuit board exactly, finally by Reflow Soldering high temperature, tin cream is melted, make the element such as electric capacity, resistance together with the pad solder on circuit board, thus realize the electric connection of the element such as electric capacity, resistance and circuit board.
Usually, the top layer of circuit board is a layer insulating, play insulation, welding resistance and protection, and described insulating barrier is provided with window usually, and from window exposed pad, namely on pad, naked layer covers.In the prior art, the edge (that is edge of insulating barrier) of window is outside pad, namely described window is greater than described pad, gap is had between the edge of described window and described pad edge, when pad applies tin cream and tin cream fusing time, tin cream easily flows to described gap, causes the tin amount of pad very few, affects welding quality; Often pad size is done larger than actual required size in prior art, thus insulating barrier is covered pad edge, but, larger wiring area can be taken like this, be not suitable on the circuit board of area and limited space.
Utility model content
Technical problem to be solved in the utility model is, provides a kind of circuit board, and tin cream when described circuit board can prevent from applying tin cream or tin cream fusing in welding process on pad runs off, and without the need to the size of pad is done larger than actual required size.
In order to solve the problems of the technologies described above, embodiment of the present utility model provides a kind of circuit board, described circuit board comprises circuit board main body, pad, insulating barrier and electrically conducting transparent glue-line, described pad and described insulating barrier are arranged in described circuit board main body, the position of the corresponding described pad of described insulating barrier offers window and exposes described pad, and a part of edge of described pad or whole edge are provided with described electrically conducting transparent glue-line.
Wherein, described insulating barrier at the edge at described window place near the outer wall of described pad.
Wherein, the number of described window is identical with the number of described pad, a corresponding described pad of described window.
Wherein, described electrically conducting transparent glue-line ringwise or shaped as frame be arranged at the edge of described pad, and described electrically conducting transparent glue-line is provided with one or more breach.
Wherein, the shape of described pad is quadrangle, the four edges of described quadrangle is the first edge of corresponding described pad, the second edge, the 3rd edge and the 4th edge respectively, described electrically conducting transparent glue-line covers described first edge of described pad, described second edge, described 3rd edge and described 4th edge, and described electrically conducting transparent glue-line is respectively arranged with a breach on described first edge and described 3rd edge.
Wherein, the shape of described pad is quadrangle, and the four edges of described quadrangle distinguishes the first edge of corresponding described pad, the second edge, the 3rd edge and the 4th edge, and described electrically conducting transparent glue-line covers wherein three edges of described pad.
Wherein, for close to each other two adjacent described pads, described first edge of pad described in one of them, described second edge and described 3rd edge cover by described electrically conducting transparent glue-line, described first edge of pad described in another, described 3rd edge and described 4th edge cover by described electrically conducting transparent glue-line.
Wherein, described electrically conducting transparent glue-line covers two relative edges of described pad.
Wherein, described circuit board main body is flexible board or hardboard.
Wherein, described insulating barrier is coverlay or solder mask.
Compared with prior art, the technical solution of the utility model at least has following beneficial effect: the electrically conducting transparent glue-line of the circuit board in the utility model covers the part or all of edge of pad, in welding process, when described pad applies tin cream or tin cream fusing time, the electrically conducting transparent glue-line covering the edge of described pad plays barrier effect, thus make tin cream be not easy to run off, ensure tin cream amount, and then promote welding yield; Simultaneously, because described electrically conducting transparent glue-line is transparent, the profile of pad can be seen clearly through electrically conducting transparent glue-line, not affect the element of required attachment and the aligning accuracy of electrically conducting transparent glue-line during welding, and due to electrically conducting transparent glue-line conduction, not needing must be larger than actual required area by pad design.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic top plan view of circuit board in the utility model embodiment;
Fig. 2 a is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model first embodiment;
Fig. 2 b be in the utility model first embodiment circuit board along the schematic cross-section of cutting line A-A in Fig. 2 a;
Fig. 2 c is circuit board main body and offer the schematic cross-section of insulating barrier of window in the utility model first embodiment;
Fig. 2 d is the structural representation of pad in the utility model first embodiment;
Fig. 3 is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model second embodiment;
Fig. 4 is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model the 3rd embodiment;
Fig. 5 a is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model the 4th embodiment;
Fig. 5 b be in the utility model the 4th embodiment circuit board along the schematic cross-section of cutting line B-B in Fig. 5 a;
Fig. 6 a is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model the 5th embodiment;
Fig. 6 b be in the utility model the 5th embodiment circuit board along the schematic cross-section of cutting line C-C in Fig. 6 a;
Fig. 7 a is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model the 6th embodiment;
Fig. 7 b be in the utility model the 6th embodiment circuit board along the schematic cross-section of cutting line D-D in Fig. 7 a.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly described.
Please refer to Fig. 1, Fig. 2 a, Fig. 2 b and Fig. 2 c, circuit board of the present utility model comprises circuit board main body 10, pad 20, insulating barrier 30 and electrically conducting transparent glue-line 40.Described pad 20 and described insulating barrier 30 are arranged in described circuit board main body 10, the position of the corresponding described pad 20 of described insulating barrier 30 offers window 31 and exposes described pad 20, the shape of described window is consistent with the shape of described pad 20, described pad 20 can be polygon, circle or other geometric figure, accordingly, described window 31 is also polygon, circle or other geometric figure.Preferably, described pad 20 is rectangle or circle.The number of described window 31 is identical with the number of described pad 20, i.e. a corresponding described pad 20 of described window 31.Described insulating barrier 30 near the outer wall of described pad 20, thus makes between described insulating barrier 30 and pad 20 very close to each other at the edge at described window 31 place.A part of edge of described pad 20 or whole edge are provided with described electrically conducting transparent glue-line 40.Because described electrically conducting transparent glue-line 40 is transparent, the profile of pad 20 can be seen clearly, not affect the element of required attachment and the contraposition of electrically conducting transparent glue-line 40 during welding, not need pad 20 to be designed larger than actual required area; Because electrically conducting transparent glue-line 40 conducts electricity, therefore, the conductive cross-sectional area of pad 20 is not affected.In addition, described circuit board main body 10 comprises base material and is arranged at the cabling (not illustrating in the drawings) on described base material, described cabling comprises the cabling (not illustrating in the drawings) be connected with pad 20, due to very close to each other between described insulating barrier 30 and pad 20, so, the cabling be connected with pad 20 can not expose, and namely described insulating barrier 30 covers the described cabling be connected with pad 20, thus avoids short circuit; Described electrically conducting transparent glue-line 40 is arranged on all or part of edge of described pad 20, electrically conducting transparent glue-line 40 is arranged on all or part of edge of pad 20, namely refer to described electrically conducting transparent glue-line ringwise or shaped as frame be arranged at the edge of described pad, in welding process, when applying tin cream or tin cream fusing, electrically conducting transparent glue-line 40 on pad 20 edge plays barrier effect to described tin cream, prevents tin cream to run off, thus ensures tin cream amount.In the accompanying drawing of the utility model embodiment, although the thickness of insulating barrier 30 in the circuit board main body 10 shown in figure is less than the thickness of pad 20, in embodiment of the present utility model, the thickness of insulating barrier 30 can be set to the thickness being equal to or greater than pad 20.
Please refer to the partial enlarged drawing that Fig. 2 a, Fig. 2 b, Fig. 2 c and 2d, Fig. 2 a are e parts in circuit board corresponding diagram 1 in the utility model first embodiment; Fig. 2 b be in the utility model first embodiment circuit board along the schematic cross-section of cutting line A-A in Fig. 2 a; Fig. 2 c is circuit board main body and offer the schematic cross-section of insulating barrier of window in the utility model first embodiment; Fig. 2 d is the structural representation of pad in the utility model first embodiment.In first embodiment of the present utility model, circuit board comprises circuit board main body 10, pad 20 and insulating barrier 30 and electrically conducting transparent glue-line 40.In the present embodiment, described circuit board main body 10 can be flexible board or hardboard, can be lamina, doubling plate or multi-layer sheet.Described insulating barrier 30 can be coverlay, solder mask or other high molecular polymer.Pad 20 and insulating barrier 30 are arranged in circuit board main body 10, the position of the corresponding described pad 20 of described insulating barrier 30 offers window 31 and exposes described pad 20, described insulating barrier 30 near the outer wall of described pad 20, thus makes between described insulating barrier 30 and pad 20 very close to each other at the edge at described window 31 place.The edge of described pad 20 is provided with described electrically conducting transparent glue-line 40.In the present embodiment, the number of described window 31 is identical with the number of described pad 20, and a corresponding described pad 20 of described window 31, the shape of window 31 is consistent with the shape of pad 20, and namely the shape of window 20 becomes similar fitgures with the shape of pad 31.Electrically conducting transparent glue-line 40 covers every bar edge of described pad 20.In the present embodiment, are rectangles for the shape of pad 20, signal is as Fig. 2 d, and pad 20 comprises the first edge 22, edge 21, second, the 3rd edge 23 and the 4th edge 24, the four edges of the corresponding pad 20 of this four edges edge difference.Window 31 correspondingly has four edges edge, and this four edges edge is all near the outer wall of described pad 20, or concordant with the four edges edge of pad 20 respectively, and so, the cabling be connected with pad 20 can not expose, thus avoids short circuit; Electrically conducting transparent glue-line 40 covers the first edge 22, edge 21, second, the 3rd edge 23 and the 4th edge 24, form closed rectangle occlusion shapes, in installation elements process, pad 20 applies tin cream and tin cream when melting under Reflow Soldering high temperature, described tin cream converges in the rectangle that described electrically conducting transparent glue-line 40 formed, and electrically conducting transparent glue-line 40 plays barrier effect to described tin cream, prevents described tin cream to run off, thus ensure tin cream amount, and then ensure welding quality; Simultaneously, because described electrically conducting transparent glue-line 40 is transparent, the profile of pad 20 can be seen clearly, not affect the element of required attachment and the contraposition of electrically conducting transparent glue-line 40 during welding, and conduct electricity due to electrically conducting transparent glue-line 40, do not need pad 20 to be designed larger than actual required area.
Refer to Fig. 3, Fig. 3 is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model second embodiment.The structure of the circuit board described in any one of accompanying drawing of the structure of circuit board described in the present embodiment and the first embodiment and the first embodiment is substantially identical, and difference part is: in the present embodiment, electrically conducting transparent glue-line 40 is provided with a breach 41 on an edge of pad 20.Shown in accompanying drawing, breach 41 is arranged on the 3rd edge 23 of pad 20, and namely above the 3rd edge 23, breach 41 place, without electrically conducting transparent glue-line 40, is understandable that, breach 41 can also be arranged on the first edge 22, edge 21, second or the 4th edge 24.In the present embodiment, because electrically conducting transparent glue-line 40 is provided with breach 41, in installation elements process, while electrically conducting transparent glue-line 40 plays barrier effect to described tin cream, breach 41 can drain the gas that tin cream in welding process produces in time, thus avoids tin layers bubble bad.
Refer to Fig. 4, Fig. 4 is the partial enlarged drawing of e part in circuit board corresponding diagram 1 in the utility model the 3rd embodiment.The structure of the circuit board described in any one of accompanying drawing of the structure of circuit board described in the present embodiment and the first embodiment and the first embodiment is substantially identical, and difference part is: in the present embodiment, electrically conducting transparent glue-line 40 is respectively arranged with a breach 41 on two relative edges of pad 20.Illustrate in accompanying drawing 4 that electrically conducting transparent glue-line 40 is provided with breach 41 on first edge 21 and the 3rd edge 23 of pad 20, namely breach 41 place above first edge 21 and the 3rd edge 23 of pad 20 is without electrically conducting transparent glue-line 40, be understandable that, breach 41 also can be arranged at pad 20 the second edge 22 and the 4th edge 24 on, and not to be arranged on the first edge 21 and the 3rd edge 23.In the present embodiment, electrically conducting transparent glue-line 40 is respectively arranged with a breach 41 on two relative edges of pad 20, two breach 41 are distributed on pad 20 symmetrically, in installation elements process, while electrically conducting transparent glue-line 40 plays barrier effect to described tin cream, two breach 41 can drain the gas that tin cream in welding process produces in time, thus the phenomenon that tin layers bubble can be avoided further bad.
Refer to the partial enlarged drawing that Fig. 5 a and Fig. 5 b, Fig. 5 a is e part in circuit board corresponding diagram 1 in the utility model the 4th embodiment; Fig. 5 b be in the utility model the 4th embodiment circuit board along the schematic cross-section of cutting line B-B in Fig. 5 a.The structure of circuit board described in the present embodiment is substantially identical with the structure of circuit board described in the first embodiment and any one of respective figure thereof, and difference part is: in the present embodiment, electrically conducting transparent glue-line 40 covers three edges of pad 20.Illustrate in Figure 5 a, electrically conducting transparent glue-line 40 covers the first edge 22, edge 21, second and the 3rd edge 23 of pad 20, is understandable that, in a further embodiment, what electrically conducting transparent glue-line 40 covered is an edge 22, edge 21, second and the 4th edge 24, or other combination.For adjacent two pads 20, the position covered by electrically conducting transparent glue-line 40 is identical.In the present embodiment, electrically conducting transparent glue-line 40 does not cover the 4th edge 24 of pad 20.Insulating barrier 30 is concordant with the top surface edge of pad 20 at the edge at window 31 place, and described upper surface refers to that pad is exposed to the surface of electrically conducting transparent glue-line 40, avoids the cabling be connected with pad 20 to expose further, prevents short circuit.In the process of installation elements, due to the first edge 22, edge 21, second of pad 20 and the 3rd edge 23 being provided with electrically conducting transparent glue-line 40, therefore, when coating tin cream or tin cream fusing, described tin cream is gathered to the first edge 22, edge 21, second of described pad 20 and the 3rd edge 23, and electrically conducting transparent glue-line 40 barrier effects on the first edge 22, edge 21, second of pad 20 and the 3rd edge 23, thus described tin cream is prevented to run off; Meanwhile, the 4th edge 24 of pad 20 does not have electrically conducting transparent glue-line 40 to stop, during welding, can discharge produced gas in time, thus avoid tin layers bubble, and then reduces failure welding.
Refer to the partial enlarged drawing that Fig. 6 a and Fig. 6 b, Fig. 6 a is e part in circuit board corresponding diagram 1 in the utility model the 5th embodiment; Fig. 6 b be in the utility model the 5th embodiment circuit board along the schematic cross-section of cutting line C-C in Fig. 6 a.The structure of circuit board described in the present embodiment is substantially identical with the structure of circuit board described in the 4th embodiment, difference part is: for the first adjacent pad 201 and the second pad 202 close to each other, first edge 21 of the first pad 201, second edge 22 and the 3rd edge 23 are covered by insulating barrier 30, expose the 4th edge 24, and the first edge 21 of the second pad 202, 3rd edge 23 and the 4th edge 24 cover by electrically conducting transparent glue-line 40, expose the second edge 22, thus make the first pad 201 not relative with the edge not by electrically conducting transparent glue-line 40 covering of the second pad 202.So, the discharge directions producing gas and adjacent two pads close to each other when avoiding welding causes the phenomenon be vented not in time relatively, thus avoids occurring the problem that bubble is bad during welding.In other embodiment of the present utility model, can other edge of exposed pad 20, such as, insulating barrier 30 can be made to cover the second edge 22 of the first pad 201, the 3rd edge 23 and the 4th edge 24, and expose the first edge 21.
Refer to the partial enlarged drawing that Fig. 7 a and Fig. 7 b, Fig. 7 a is e part in circuit board corresponding diagram 1 in the utility model the 6th embodiment; Fig. 7 b be in the utility model the 6th embodiment circuit board along the schematic cross-section of cutting line D-D in Fig. 7 a.The structure of circuit board described in the present embodiment is substantially identical with the structure of circuit board described in the 5th embodiment, and difference part is: electrically conducting transparent glue-line 40 covers two relative edges of pad 20.Fig. 7 a illustrates, electrically conducting transparent glue-line 40 covers the first edge 21 and the 3rd edge 23 of pad 20, and expose the second edge 22 and the 4th edge 24, be understandable that, in a further embodiment, electrically conducting transparent glue-line 40 can cover the second edge 22 and the 4th edge 24 of pad 20, and the first edge 21 of exposed pad 20 and the 3rd edge 23.In the present embodiment, in installation elements process, when coating tin cream or tin cream fusing, described tin cream distributes to the first edge 21 of described pad 20 and the 3rd edge 23, the both sides tin cream of pad 20 is symmetric, thus element is not easy to any while offset when installation elements, be conducive to promoting welding yield; In addition, insulating barrier 30 barrier effects on the first edge 21 of pad 20 and the 3rd edge 23, thus prevent described tin cream to run off; Meanwhile, the second edge 22 and the 4th edge 24 of pad 20 do not have electrically conducting transparent glue-line 40 to stop, during welding, can discharge produced gas in time, thus avoid tin layers bubble, and then reduce failure welding.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Upper described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a circuit board, it is characterized in that, comprise circuit board main body, pad, insulating barrier and electrically conducting transparent glue-line, described pad and described insulating barrier are arranged in described circuit board main body, the position of the corresponding described pad of described insulating barrier offers window and exposes described pad, and a part of edge of described pad or whole edge are provided with described electrically conducting transparent glue-line.
2. circuit board as claimed in claim 1, is characterized in that, described insulating barrier at the edge at described window place near the outer wall of described pad.
3. circuit board as claimed in claim 1, it is characterized in that, the number of described window is identical with the number of described pad, the corresponding described pad of window described in each.
4. circuit board as claimed in claim 2, is characterized in that, described electrically conducting transparent glue-line ringwise or shaped as frame be arranged at the edge of described pad, and described electrically conducting transparent glue-line is provided with one or more breach.
5. circuit board as claimed in claim 4, it is characterized in that, the shape of described pad is quadrangle, the four edges of described quadrangle is the first edge of corresponding described pad, the second edge, the 3rd edge and the 4th edge respectively, described electrically conducting transparent glue-line covers described first edge of described pad, described second edge, described 3rd edge and described 4th edge, and described electrically conducting transparent glue-line is respectively arranged with a breach on described first edge and described 3rd edge.
6. circuit board as claimed in claim 2, it is characterized in that, the shape of described pad is quadrangle, and the four edges of described quadrangle distinguishes the first edge of corresponding described pad, the second edge, the 3rd edge and the 4th edge, and described electrically conducting transparent glue-line covers wherein three edges of described pad.
7. circuit board as claimed in claim 6, it is characterized in that, for close to each other two adjacent described pads, described first edge of pad described in one of them, described second edge and described 3rd edge cover by described electrically conducting transparent glue-line, described first edge of pad described in another, described 3rd edge and described 4th edge cover by described electrically conducting transparent glue-line.
8. the circuit board as described in any one of claims 1 to 3, is characterized in that, described electrically conducting transparent glue-line covers two relative edges of described pad.
9. the circuit board as described in any one of claim 1 to 7, is characterized in that, described circuit board main body is flexible board or hardboard.
10. the circuit board as described in any one of claim 1 to 7, is characterized in that, described insulating barrier is coverlay or solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520811303.1U CN205029965U (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520811303.1U CN205029965U (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205029965U true CN205029965U (en) | 2016-02-10 |
Family
ID=55262464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520811303.1U Expired - Fee Related CN205029965U (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205029965U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604539A (en) * | 2015-10-19 | 2017-04-26 | 南昌欧菲光电技术有限公司 | Circuit board |
-
2015
- 2015-10-19 CN CN201520811303.1U patent/CN205029965U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604539A (en) * | 2015-10-19 | 2017-04-26 | 南昌欧菲光电技术有限公司 | Circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8345436B2 (en) | Printed wiring board and connection configuration of the same | |
| US11337308B2 (en) | Display panel and display apparatus | |
| US20140120401A1 (en) | Connecting structure between circuit boards and battery pack having the same | |
| CN103874320B (en) | Circuit board and manufacturing method thereof | |
| CN105430877A (en) | Flexible circuit board, terminal and preparation method of flexible circuit board | |
| TWI699143B (en) | Printed circuit board and method of fabricating the same | |
| CN211630498U (en) | PCB and common bonding pad thereof | |
| US8525043B2 (en) | Printed substrate through which very strong currents can pass and corresponding production method | |
| JP2010003800A (en) | Chip component, method for manufacturing thereof, module with built-in component, and method for manufacturing thereof | |
| CN206525017U (en) | Adhesive-spill-preventing circuit board | |
| CN205029966U (en) | Circuit board | |
| CN205029965U (en) | Circuit board | |
| CN202737135U (en) | Electric connection structure and piezoceramic transducer using electric connection structure | |
| CN209930597U (en) | Resin multilayer substrate, transmission line, and module | |
| CN106604540B (en) | Circuit board | |
| TWM502303U (en) | Printed circuit board | |
| US20160370683A1 (en) | Display apparatus and manufacturing method thereof | |
| CN103338590A (en) | Flexible circuit board and manufacturing method thereof | |
| JP2014107541A (en) | Circuit board and method of mounting electronic component on circuit board | |
| US20240251503A1 (en) | Circuit board and electronic device | |
| CN106604539A (en) | Circuit board | |
| CN201146630Y (en) | Electron carrier plate and pad-soldering structure | |
| CN201717256U (en) | Passive device and circuit board embedded with same | |
| CN203788557U (en) | PCB bonding pad | |
| RU2448397C2 (en) | Connection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210628 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160210 Termination date: 20211019 |