CN106604540B - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN106604540B CN106604540B CN201510681153.1A CN201510681153A CN106604540B CN 106604540 B CN106604540 B CN 106604540B CN 201510681153 A CN201510681153 A CN 201510681153A CN 106604540 B CN106604540 B CN 106604540B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- extension area
- insulating layer
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
Abstract
The present invention discloses a kind of circuit board, the circuit board includes circuit board main body, multiple pads and insulating layer, multiple pads and the insulating layer are set in the circuit board main body, the pad includes first surface and second surface, the first surface fits in the circuit board main body, the second surface includes welding section, first extension area and the second extension area, the welding section is between first extension area and second extension area, the position that the insulating layer corresponds to multiple pads offers window, the gap between welding section and multiple welding sections to expose the second surface of multiple pads, the insulating layer covers first extension area and second extension area.The conducting wire that the circuit board not only can avoid connecting with pad exposes but also can prevent Pad off.
Description
Technical field
The present invention relates to field of circuit boards more particularly to a kind of circuit boards with pad.
Background technique
In various electronic products, camera module, mobile phone, electronic watch etc. are typically used for circuit board, to incite somebody to action
Each component of electronic product is electrically connected, forms various driving circuits or connect with external circuit.For example, the electricity of camera module
The surface of road plate is usually provided with the devices such as connector, Image Sensor, wherein connector passes through surface mounting technology
(Surface Mounted Technology, SMT) and circuit board are electrically connected.Surface mounting technology is usually required in circuit board
On be provided with pad, the number of the pad of placing connectors is usually more, density is larger, and arranges in queue, when mounting, first
By on paste solder printing to pad, then the corresponding site of connector is aligned with the pad, accurately by the connector
It is installed on the fixation position of circuit board, melts tin cream finally by Reflow Soldering high temperature, make the weldering on connector and circuit board
Disk welds together, to realize the electric connection of connector and circuit board.Connector is then usually set with mobile phone or other electronics
Standby mainboard is connected by pluggable mode.
In general, the surface layer of circuit board is a layer insulating, play insulation, welding resistance and protection, and the insulating layer is logical
Standing to be equipped with window, from window exposed pad, i.e., naked layer covers on pad.The position to connect on circuit board with connector is set
It is equipped with two rows of pads, the position of the corresponding two rows of pads of insulating layer is opened up there are two logical window, and logical window is through in each row's pad
Each pad between gap, in the prior art, the edge (that is, edge of insulating layer) of window is except pad, i.e. institute
The window for stating insulating layer is greater than the pad, and the insulating layer does not cover the pad, the edge of the window and described
There is gap between pad edge, in this way, connector plugging is when the mainboard of the electronic equipments such as mobile phone, pad is easy to fall off, and is influenced
It is provided with the signal transmission of the mainboards of electronic equipments such as circuit board and the mobile phone of connector.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of circuit board, the circuit board can prevent Pad off.
In order to solve the above-mentioned technical problem, the invention adopts the following technical scheme:
The present invention provides a kind of circuit board, and the circuit board includes circuit board main body, multiple pads and insulating layer, Duo Gesuo
It states pad and the insulating layer is set in the circuit board main body, the pad includes the first surface being oppositely arranged and second
Surface, the first surface fit in the circuit board main body, and the second surface includes welding section, the first extension area and second
Extension area, between first extension area and second extension area, the insulating layer corresponds to multiple institutes for the welding section
The position for stating pad offers window, with expose the second surface of multiple pads welding section and multiple welding
Gap between area, the insulating layer cover first extension area and second extension area.
Wherein, the first surface is greater than the second surface.
Wherein, the pad includes third surface and the 4th surface, the third surface and the 4th surface it is opposite and
Setting, third surface one end connect first extension area, and the other end connects the first surface, the 4th surface one
End connects second extension area, and the other end connects the first surface, and the third surface and the first surface are at 45 ° extremely
Angle within the scope of 85 °, the 4th surface and the first surface angle at 45 ° within the scope of 85 °.
Wherein, the circuit board further includes reinforcing layer, and the reinforcing layer is respectively arranged at the insulating layer and the third
Between surface and between the insulating layer and the 4th surface, and extend respectively to the circuit board main body.
Wherein, the reinforcing layer is transparent optical glue-line.
Wherein, the reinforcing layer is also provided at the gap between the pad, is set to the gap between the pad
The thickness of the reinforcing layer is less than or equal to the thickness of the pad.
Wherein, the reinforcing layer is extended from the third surface to first extension area, and the reinforcing layer is by described
Four surfaces extend to second extension area.
Wherein, the multiple pad is arranged in queue, and the area ratio positioned at the pad at the both ends of a queue is other
The area of pad is big.
Wherein, the reinforcing layer is triangle perpendicular to the section on the circuit board main body and the third surface.
Wherein, the circuit board main body is flexible board or hardboard.
Compared with prior art, technical solution provided by the present invention at least has the advantages that electricity of the invention
In the plate of road, pad includes first surface and second surface, and the first surface fits with circuit board main body, the second surface
Including welding section, the first extension area and the second extension area, insulating layer covers first extension area of the pad and described
Second extension area increases the insulating layer to the binding force of the pad, prevents the Pad off.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the schematic top plan view of the circuit board in the embodiment of the present invention；
Fig. 2 a is the partial enlarged view of the part e in circuit board corresponding diagram 1 in first embodiment of the invention；
Fig. 2 b is the schematic cross-section of circuit board cutting line A-A along Fig. 2 a in first embodiment of the invention；
Fig. 2 c is the structural schematic diagram of the pad of circuit board in first embodiment of the invention；
Fig. 2 d is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in first embodiment of the invention；
Fig. 3 is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in second embodiment of the invention；
Fig. 4 a is the schematic cross-section of circuit board cutting line A-A along Fig. 2 a in third embodiment of the invention；
Fig. 4 b is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in third embodiment of the invention；
Fig. 5 is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in fourth embodiment of the invention；
Fig. 6 a is the partial enlarged view of the part e in circuit board corresponding diagram 1 in fifth embodiment of the invention；
Fig. 6 b is the schematic cross-section of circuit board cutting line C-C along Fig. 6 a in fifth embodiment of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention is clearly retouched
It states.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Please refer to Fig. 1, Fig. 2 a, Fig. 2 b, Fig. 2 c and Fig. 2 d, Fig. 1 be the circuit board in the embodiment of the present invention vertical view signal
Figure；Fig. 2 a is the partial enlarged view of the part e in circuit board corresponding diagram 1 in first embodiment of the invention；Fig. 2 b is the present invention first
The schematic cross-section of circuit board cutting line A-A along Fig. 2 a in embodiment；Fig. 2 c is circuit board in first embodiment of the invention
The structural schematic diagram of pad；Fig. 2 d is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in first embodiment of the invention.
In the present embodiment, circuit board includes circuit board main body 10, multiple pads 20 and insulating layer 30.The circuit board main body 10 includes base
Material and the conducting wire being set on the substrate (being not shown), the conducting wire include the conducting wire that is connect with pad 20 (not
It is shown in figure).Multiple pads 20 and the insulating layer 30 are set in the circuit board main body 10, and the pad 20 includes the
One surface 21, second surface 22, third surface 23 and the 4th surface 24, first surface 21 and second surface 22 are opposite and are arranged,
Third surface 23 and the 4th surface 24 are arranged relatively.The first surface 21 fits in the circuit board main body 10, and described
Two surfaces 22 include welding section 221, the first extension area 222 and the second extension area 223, and the welding section 221 is located at described first
Between extension area 222 and second extension area 223.The position of the corresponding multiple pads 20 of the insulating layer 30 opens up fenestrate
Mouthfuls 31, between the welding section 221 and multiple welding sections 221 to expose the second surface 22 of multiple pads 20
The corresponding multiple pads 20 in gap 25, i.e. insulating layer 30 a window 31, multiple pads 20 are arranged in queue.The insulating layer 30
By the first extension area 222 and for extending to pad 20 in circuit board main body 10 via third surface 23 and the 4th surface 24 respectively
Two extension areas 223, that is to say, that first extension area 222 and second of the long side boundary of the window 31 of insulating layer 30 in pad 20
On extension area 223, and short side boundary is then except pad 20, that is, insulating layer 30 covers the third surface the 23, the 4th of pad 20
Surface 24, the first extension area 222 and the second extension area 223 make insulating layer 30 have binding force to pad 20, to reinforce pad
20 are attached to the fixed force of the circuit board main body 10, make the connector (not shown) being welded on pad 20 plug in electricity
Pad 20 is not easily to fall off when the mainboard of sub- equipment, while preventing the conducting wire (not shown) being connected with pad from exposing, and avoids short
Road, that is to say, that since the edge of the insulating layer 30 is Chong Die with the first extension area 222 of pad 20 and the second extension area 223,
Therefore, the conducting wire connecting with pad 20 will not expose, to avoid short circuit.In addition, 23 one end of third surface connection first extends
Area 222, the other end connect first surface 21, and 24 one end of the 4th surface connects the second extension area 223, and the other end connects first surface
21；Third surface 23 and the angle α at 45 ° within the scope of 85 ° of first surface 21, the 4th surface 24 and the first surface 21 at
Angle β within the scope of 45 ° to 85 °, to make the area of the first surface 21 of pad 20 greater than the face of the second surface 22 of pad
Product.The area of second surface 22 is the actually required area of welding, for the connection terminal phase with connector (not shown)
Matching, the variable amplitude of the size of the area of second surface 22 is very limited, and first surface 21 is not necessarily to match with any part,
Therefore the dynamic amplitude of its variable area is larger, therefore, the area of first surface 21 is arranged to obtain than welding reality for the embodiment of the present invention
Required area is big, i.e., is arranged bigger than the area of second surface 22 by the area of first surface 21, thus increase pad 20 with
The binding force of circuit board main body 10 further prevents pad 20 to fall off.In the present embodiment, the first surface 21 of pad 20 and
Two surfaces 22 are equal along the width of the extending direction of cutting line A-A, and on the extending direction of cutting line B-B, first surface 21
Length be greater than second surface 22 length, thus make first surface 21 area be greater than second surface 22 area, to increase
The contact area of big pad 20 and circuit board main body, thereby increases the binding force between pad 20 and circuit board main body 10, into
One step prevents pad from falling off during connector plugging.
Referring to Fig. 3, Fig. 3 is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in second embodiment of the invention.
The structure of circuit board in the present embodiment (i.e. second embodiment) attached drawing corresponding with first embodiment and first embodiment is retouched
The structure for the circuit board stated is essentially identical, and difference place is: the circuit board in the present embodiment further includes reinforcing layer 40, described to add
Gu layer 40 is respectively arranged between insulating layer 30 and third surface 23 and between insulating layer 30 and the 4th surface 24, and respectively to
Circuit board main body 10 extends, i.e., reinforcing layer 40 is set to the third surface 23 of insulating layer and pad 20, the 4th surface 24, circuit board
Between main body 10.In one embodiment, the reinforcing layer 40 perpendicular to the circuit board main body and the third surface
Section be triangle, i.e., reinforcing layer 40 along the section of cutting line B-B be triangle.In the present embodiment, reinforcing layer 40 is covered with
Three surfaces 23 and the 4th surface 24, but do not extend to the first surface 21 of pad 20, i.e., the thickness of reinforcing layer 40 is equal to pad
20 thickness.The reinforcing layer 40 is transparent optical glue-line, and transparent optical glue-line (reinforcing layer 40) has viscosity and toughness, by it
It is set between insulating layer 30 and third surface 23, the 4th surface 24 and extends to circuit board main body 10, make pad 20 and circuit
Plate main body 10 and insulating layer 30 become the one combined closely, so that pad 20 be further prevented to fall off.
Please refer to section that Fig. 4 a and Fig. 4 b, Fig. 4 a are circuit board cutting line A-A along Fig. 2 a in third embodiment of the invention
Face schematic diagram；Fig. 4 b is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in third embodiment of the invention.The present embodiment
The structure base of the structure of circuit board in (3rd embodiment) and circuit board described in second embodiment and its corresponding attached drawing
This is identical, and difference place is: the thickness of reinforcing layer 40 is also provided at the gap 25 between pad 20 in the present embodiment, is set to
The thickness of the reinforcing layer 40 in the gap 25 between the pad 20 is less than or equal to the thickness of pad 20.That is, plus
Gu layer 40 is arranged one week around the outer wall of pad 20, pad 20 and circuit board main body 10 is made to become closer one, thus
Further prevent Pad off.Preferably, reinforcing layer 40 is set as transparent optical glue-line, and the transparent optical glue-line can both increase
Binding force between pad 20 and circuit board main body 10, and can make to insulate between pad 20, since its is transparent, the company of will not influence
Connect aligning accuracy when device attachment.
Referring to Fig. 5, Fig. 5 is the schematic cross-section of circuit board cutting line B-B along Fig. 2 a in fourth embodiment of the invention.
Circuit board described in the structure of circuit board in the present embodiment (i.e. fourth embodiment) and 3rd embodiment and its respective figure it
Structure is essentially identical, the difference is that: the reinforcing layer 40 of circuit board is from the third surface 23 of pad 20 in the present embodiment
One extension area 222 extends, and reinforcing layer 40 is extended from the 4th surface 24 to the second extension area 223, the edge of reinforcing layer 40 and absolutely
Edge of the edge layer 30 at window 31 be concordant or the edge of reinforcing layer 40 relative to the insulating layer 30 to circuit board main body 10
Side inside contracts.That is, reinforcing layer 40 extends to the edge of the second surface 22 of pad 20, by pad 20 toward circuit board main body
10 sides constraint, to further prevent pad 20 from falling off.In the present embodiment, it is preferable that reinforcing layer 40 is set as transparent light
Glue-line is learned, the gap 25 between pad 20 is provided with transparent optical glue-line, at this point, the thickness of transparent optical glue-line can be greater than institute
The thickness of pad 20 is stated, does not influence the contraposition essence when connector attachment while can more efficiently preventing from short-circuit between pad
Degree.
The part that Fig. 6 a and Fig. 6 b, Fig. 6 a are the parts e in circuit board corresponding diagram 1 in fifth embodiment of the invention is please referred to put
Big figure；Fig. 6 b is the schematic cross-section of circuit board cutting line C-C along Fig. 6 a in fifth embodiment of the invention.The present embodiment is (i.e.
5th embodiment) in circuit board structure and the basic phase of structure of circuit board described in 3rd embodiment and its respective figure
Together, the difference is that: in the present embodiment multiple pads 20 of circuit board in queue arrange, be located at a queue both ends
Pad 20 the other pads 20 of area ratio area it is big, the short side boundary of the window 31 of insulating layer 30 be set to the queue it
On the pad at both ends, i.e., insulating layer 30 covers the first extension area of the pad at the both ends of the queue, the second extension area and one
Part welding section.20 area of pad at the both ends of the queue increases, and not only increases the knot of pad 20 Yu circuit board main body 10
Area is closed, insulating layer 30 is also increased and covers the area of pad 20, to further prevent Pad off, avoids influencing to connect
The transmission of the signal of device and circuit board.
In an embodiment of the present invention, the circuit board main body is flexible board or hardboard.
In an embodiment of the present invention, the insulating layer is solder mask, cover film (Cover layer) or other high scores
Sub- film.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means particular features, structures, materials, or characteristics described in conjunction with this embodiment or example
It is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are different
Surely identical embodiment or example is referred to.Moreover, the particular features, structures, materials, or characteristics of description can be any one
It can be combined in any suitable manner in a or multiple embodiment or examples.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (9)
1. a kind of circuit board, which is characterized in that including circuit board main body, multiple pads and insulating layer, multiple pads and institute
It states insulating layer to be set in the circuit board main body, the pad includes the first surface and second surface being oppositely arranged, described
First surface fits in the circuit board main body, and the second surface includes welding section, the first extension area and the second extension area, institute
Welding section is stated between first extension area and second extension area, the insulating layer corresponds to the position of multiple pads
Set and offer window, between the welding section and multiple welding sections to expose the second surface of multiple pads between
Gap, the insulating layer covers first extension area and second extension area, the pad further include third surface and the 4th
Surface, the third surface and the 4th surface are opposite and are arranged, and third surface one end connects first extension area,
The other end connects the first surface, and described 4th surface one end connects second extension area, other end connection described first
Surface, the circuit board further include reinforcing layer, and the reinforcing layer is respectively arranged between the insulating layer and the third surface
And between the insulating layer and the 4th surface, and extend respectively to the circuit board main body.
2. circuit board as described in claim 1, which is characterized in that the area of the first surface is greater than the second surface
Area.
3. circuit board as described in claim 1, which is characterized in that the third surface and the first surface are at 45 ° to 85 °
Angle in range, the 4th surface and the first surface angle at 45 ° within the scope of 85 °.
4. circuit board as described in claim 1, which is characterized in that the reinforcing layer is transparent optical glue-line.
5. circuit board as claimed in claim 4, which is characterized in that the reinforcing layer be also provided at the pad welding section it
Between gap, be set to the reinforcing layer in the gap between the pad thickness be less than or equal to the pad thickness.
6. circuit board as described in claim 1, which is characterized in that the reinforcing layer is prolonged from the third surface to described first
Qu Yanshen is stretched, the reinforcing layer extends from the 4th surface to second extension area.
7. circuit board as described in claim 1, which is characterized in that the multiple pad is arranged in queue, is located at described in one
The area of other pads is big in queue described in the area ratio of the pad at the both ends of queue.
8. circuit board as described in claim 1, which is characterized in that the reinforcing layer perpendicular to the circuit board main body and institute
The section for stating third surface is triangle.
9. such as the described in any item circuit boards of claim 4 to 8, which is characterized in that the circuit board main body is for flexible board or firmly
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681153.1A CN106604540B (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510681153.1A CN106604540B (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106604540A CN106604540A (en) | 2017-04-26 |
| CN106604540B true CN106604540B (en) | 2019-08-13 |
Family
ID=58555104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510681153.1A Active CN106604540B (en) | 2015-10-19 | 2015-10-19 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106604540B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121285B (en) * | 2018-09-29 | 2020-05-26 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| CN111352516B (en) * | 2018-12-24 | 2022-08-19 | 江西卓讯微电子有限公司 | Touch screen and electronic equipment |
| JPWO2020175476A1 (en) * | 2019-02-27 | 2021-12-23 | 住友電工プリントサーキット株式会社 | Manufacturing method of printed wiring board and printed wiring board |
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| US6734570B1 (en) * | 2003-01-24 | 2004-05-11 | Gennum Corporation | Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
| CN102045939A (en) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | Metal layer structure of flexible multilayer base plate and preparation method thereof |
| CN102625575A (en) * | 2011-01-31 | 2012-08-01 | 索尼公司 | Circuit board, semiconductor element, semiconductor apparatus, and making method thereof |
| CN103415885A (en) * | 2011-03-08 | 2013-11-27 | 大日本印刷株式会社 | Wiring circuit board, flexible substrate for suspension, and method of producing flexible substrate for suspension |
| CN103733740A (en) * | 2012-08-09 | 2014-04-16 | 日本特殊陶业株式会社 | Wiring board |
| CN103985691A (en) * | 2013-02-13 | 2014-08-13 | 三菱电机株式会社 | Semiconductor device |
| CN205029966U (en) * | 2015-10-19 | 2016-02-10 | 南昌欧菲光电技术有限公司 | Circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271484B2 (en) * | 2003-09-25 | 2007-09-18 | Infineon Technologies Ag | Substrate for producing a soldering connection |
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2015
- 2015-10-19 CN CN201510681153.1A patent/CN106604540B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6734570B1 (en) * | 2003-01-24 | 2004-05-11 | Gennum Corporation | Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
| CN102045939A (en) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | Metal layer structure of flexible multilayer base plate and preparation method thereof |
| CN102625575A (en) * | 2011-01-31 | 2012-08-01 | 索尼公司 | Circuit board, semiconductor element, semiconductor apparatus, and making method thereof |
| CN103415885A (en) * | 2011-03-08 | 2013-11-27 | 大日本印刷株式会社 | Wiring circuit board, flexible substrate for suspension, and method of producing flexible substrate for suspension |
| CN103733740A (en) * | 2012-08-09 | 2014-04-16 | 日本特殊陶业株式会社 | Wiring board |
| CN103985691A (en) * | 2013-02-13 | 2014-08-13 | 三菱电机株式会社 | Semiconductor device |
| CN205029966U (en) * | 2015-10-19 | 2016-02-10 | 南昌欧菲光电技术有限公司 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106604540A (en) | 2017-04-26 |
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Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20211011 Address after: 330000 east of Longtan Road and north of Longtan canal, Nanchang Economic and Technological Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |