CN103338590A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN103338590A CN103338590A CN2013102352956A CN201310235295A CN103338590A CN 103338590 A CN103338590 A CN 103338590A CN 2013102352956 A CN2013102352956 A CN 2013102352956A CN 201310235295 A CN201310235295 A CN 201310235295A CN 103338590 A CN103338590 A CN 103338590A
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- Prior art keywords
- base material
- circuit board
- flexible circuit
- plain conductor
- perforate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises a substrate, wherein the substrate comprises a first surface and a second surface which are parallel and opposite to each other; the first surface is provided with weld pads; the second surface is provided with a circuit diagram; openings are formed in the substrate and connected with the first surface and the second surface; an electric conductor is arranged in each opening and electrically connected with each weld pad and the circuit diagram; the second surface is provided with a protective film. The manufacturing method of the flexible circuit board comprises the following steps: providing the substrate with the two copper-clad surfaces; forming the openings in the substrate; arranging the weld pads on the first surface in the positions of the openings; arranging the circuit diagram on the second surface; then coating the second surface with the protective film. According to the invention, the available wiring area of the flexible circuit board is increased by forming the openings in the substrate.
Description
Technical field
The present invention relates to a kind of flexible circuit board and manufacture method thereof.
Background technology
Flexible circuit board (Flexible Printed Circuit board FPC) is widely used in each electronic product, plays a part support to be installed and to be electrically connected electronic component, and be indispensable critical elements in the electronic product.Flexible circuit board has flexible characteristics, it has proposed higher requirement to reliability, flexible circuit board of the prior art also has the lead-in wire that extends from weld pad except the weld pad that is connected with electronic component, described lead-in wire tends to occupy bigger space and makes that the wiring area of flexible circuit board is excessive, is unfavorable for lightening.
Summary of the invention
The invention provides a kind of flexible circuit board and manufacture method thereof; described flexible circuit board comprises base material and weld pad; described base material comprises first surface and second surface; described first surface extends along base material one direction; described second surface is parallel relative with described first surface; described first surface is provided with weld pad; described second surface is provided with circuitous pattern; offer the perforate that connects first surface and second surface on the described base material; be provided with electric conductor in the described perforate to be electrically connected described weld pad and circuitous pattern, described second surface is provided with diaphragm.Described flexible circuit board fabrication method comprises, the base material of a double-sided copper-clad is set, and offers perforate at described base material, and the tapping on described first surface is provided with weld pad; Be provided with circuitous pattern at second surface; On described second surface, be coated with diaphragm again.
Compared to prior art, the invention provides a kind of flexible circuit board and manufacture method thereof, it has improved flexible circuit board and can use the wiring area by the mode of perforate is set at base material.
Description of drawings
Fig. 1 is the schematic perspective view of flexible circuit board first embodiment of the present invention.
Fig. 2 is the schematic top view of Fig. 1 flexible circuit board.
Fig. 3 is the generalized section along III-III direction among Fig. 1.
Fig. 4 is the schematic diagram that the base material second surface of first embodiment of the invention among Fig. 3 is coated with diaphragm.
Fig. 5 is the generalized section of second embodiment of flexible circuit board of the present invention.
Fig. 6 is the generalized section of the 3rd embodiment of flexible circuit board of the present invention.
The main element symbol description
Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
As Fig. 1, Fig. 2 and shown in Figure 3, first embodiment of the invention provides a kind of flexible circuit board 1.Described flexible circuit board 1 comprises base material 10, weld pad 11, circuitous pattern 12, perforate 13, electric conductor 14 and diaphragm 21.
Described base material 10 comprises first surface 101 and second surface 102.Described second surface 102 is parallel two opposite surfaces with described first surface 101.Described base material 10 is made by the organic material of flexibility, for example polyimides.
The first surface 101 of described base material 10 is provided with a plurality of weld pads 11 near the end.Described weld pad 11 can obtain by the copper foil layer that covers on etching base material 10 first surfaces 101, and described weld pad 11 is used for connecting electronic device.
As shown in Figure 2, described circuitous pattern 12 is formed on the second surface 102 of base material 10.Described circuitous pattern 12 comprises some plain conductors 121.Described plain conductor 121 comprises the 121a of plain conductor first, plain conductor second portion 121b, plain conductor third part 121c and plain conductor the 4th part 121d.The end of plain conductor second portion 121b and plain conductor third part 121c connects the opposite both sides of electric conductor 14 respectively, and the other end of plain conductor second portion 121b and plain conductor third part 121c connects the 121a of plain conductor first and plain conductor the 4th part 121d respectively.The described plain conductor 121a of first is roughly parallel to plain conductor the 4th part 121d.
Described plain conductor second portion 121b and the 121a of plain conductor first have an angle.Described plain conductor the 4th part 121d and plain conductor third part 121c have certain angle.Described many strip metals lead first 121a space is parallel.Described many strip metals lead second portion 121b space is parallel.Described many strip metals lead third part 121c spaced and parallel.Described many strip metals lead the 4th part 121d spaced and parallel.The size of described angular range and described many strip metals lead 121 to arrange with the convenient wiring of flexible circuit board 1 be benchmark.
As shown in Figure 1, the perforate 13 of present embodiment has a plurality of, all is opened in described base material 10.Described each perforate 13 is for the circuitous pattern 12 that arranges on the weld pad 11 that is communicated with setting on base material 10 first surfaces 101 and base material 10 second surfaces 102.In the present embodiment, the arranging of described a plurality of perforates 13 is skew lines shape from top to bottom, and namely the line of these a plurality of perforates 13 is straight line or curve-like, and is certain included angle with the edge of base material 10 ends.
Fig. 3 is the generalized section along III-III direction among Fig. 1.Scheme shown in Figure 3ly, in the present embodiment, described perforate 13 is through hole, and described through hole 13 roughly penetrates described base material 10, weld pad 11 and circuitous pattern 12 along the direction of vertical first surface 101 and second surface 102.Described electric conductor 14 roughly is hollow columnar, and in the present embodiment, this electric conductor 14 embeds and is arranged on the inwall face of cylinder of through hole, and extends the edge of the second surface 102 of base material 10.The opposite end of described electric conductor 14 respectively with first surface 101 on weld pad 11 and the circuitous pattern 12 on the second surface 102 be electrically connected, thereby realize signal transmission between weld pad 11 and the circuitous pattern 12.In the present embodiment, the material of described electric conductor 14 can be Copper Foil.
As shown in Figure 4, in the alternate embodiments, can also be coated with diaphragm 21 on the described circuitous pattern 12, to prevent that circuitous pattern 12 is exposed in the air and oxidized.Described diaphragm 21 can be protective paint, three anti-glue.
As shown in Figure 5, the structure of the flexible circuit board 1 among the flexible circuit board that second embodiment of the invention provides and first embodiment is basic identical, and its difference is: be filled with insulator 15 in the metallic conductor 14 of described hollow.When described insulator 15 is used for preventing that weld pad 11 is connected with electronic device, because entering perforate 13, steam cause electronic device to come off from weld pad 11.In the present embodiment, described insulator 15 can be welding resistance printing ink.
As shown in Figure 6, the structural slab of the flexible circuit board that provides of third embodiment of the invention and the flexible circuit 1 among first embodiment is basic identical.Its difference is: described perforate 13 is blind hole.The direction of the vertical first surface 101 in described blind hole edge and second surface 102 penetrated the circuitous pattern 12 on described base material 10 and the second surface 102, but did not penetrate weld pad 11.By such design, in the time of can preventing that weld pad 11 is connected with electronic device, cause electronic device to come off from weld pad 11 because steam enters perforate 13 from weld pad 11 directions, thereby effectively raise reliability of products.
It is little that the wiring of flexible circuit board that the embodiment of the invention provides takies the base material area, when effectively avoiding simultaneously weld pad 11 to be connected with electronic device, thereby causes electronic device from the weld pad 11 raising reliability of products that comes off because steam enters perforate 13.
The present invention also provides a kind of manufacture method of flexible circuit board, and it comprises the steps:
Step S101 provides the base material 10 of a double-sided copper-clad, offers perforate 13 at described base material 10, and perforate 13 places on the first surface 101 of described base material 10 are provided with weld pad 11, and described weld pad 11 can form by modes such as etchings.
Step S102 is formed with circuitous pattern 12 at the second surface 102 of base material 10 by modes such as etchings.Method by chemical deposition forms electric conductor 14 on the described perforate 13 inwall faces of cylinder again, and described electric conductor 14 parts extend around 102 perforates 13 of base material 10 second surfaces.
Step S103, coating protective film 21 on the second surface 102 of described base material 10.Described diaphragm 21 can be protective paint, three anti-glue.
Compare with prior art, do not need to arrange stiffening plate and some glue on the flexible circuit board fabrication method that the embodiment of the invention provides, reduced the cost of material, shorten the flow process of producing.
Be understandable that; quantity and the arrangement mode of crossing perforate in the flexible circuit board 1 provided by the present invention on the weld pad 11 are not limited thereto; above-mentioned each weld pad 11 correspondence arrange the explanation of a perforate 13 and only understand for convenient; any perforate 13 is for the circuitous pattern 12 that arranges on the second surface 102 of the weld pad 11 that arranges on the first surface 101 that is communicated with base material 10 and base material 10, all within protection scope of the present invention.In addition, plain conductor 121 quantity and arrangement mode also can be not quite similar among the present invention, but can do corresponding adjustment according to specific design.
Above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although with reference to preferred embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and scope of technical solution of the present invention.
Claims (10)
1. flexible circuit board, it comprises base material and weld pad, described base material comprises first surface and parallel opposing second surface with first surface, described first surface is provided with a plurality of weld pads near the end, it is characterized in that, the second surface of described base material is provided with circuitous pattern, opens corresponding each weld pad on the described base material and is provided with the perforate that connects first surface and second surface, is provided with the electric conductor that is electrically connected described weld pad and circuitous pattern in the described perforate.
2. flexible circuit board as claimed in claim 1 is characterized in that, and has certain included angle between the edge of the line of described a plurality of perforates and base material end.
3. flexible circuit board as claimed in claim 1, it is characterized in that, described circuitous pattern comprises some plain conductors, a described plain conductor comprises plain conductor first, plain conductor second portion, plain conductor third part and plain conductor the 4th part, one end of plain conductor second portion and plain conductor third part connects the opposite both sides of electric conductor respectively, and the other end of plain conductor second portion and plain conductor third part connects plain conductor first and plain conductor the 4th part respectively; Described plain conductor first is roughly parallel to plain conductor the 4th part, and described plain conductor second portion and plain conductor first have an angle, and described plain conductor the 4th part and plain conductor third part have certain angle.
4. flexible circuit board as claimed in claim 1, it is characterized in that, described perforate is through hole, and described through hole penetrated described base material, is arranged on the weld pad on the first surface and is arranged on the circuitous pattern of second surface along the direction of vertical first surface and second surface.
5. flexible circuit board as claimed in claim 1 is characterized in that, described electric conductor embeds and is arranged in the perforate, and part extends around the second surface perforate of base material.
6. flexible circuit board as claimed in claim 4 is characterized in that, described electric conductor inwall is filled with insulator.
7. flexible circuit board as claimed in claim 1 is characterized in that, described perforate is blind hole, and the direction of the vertical first surface in described blind hole edge and second surface penetrated the circuitous pattern on described base material and the second surface, and described perforate does not penetrate corresponding pad.
8. a flexible circuit board fabrication method is characterized in that, comprising:
The base material of one double-sided copper-clad is provided, offers perforate at described base material, the tapping on the first surface of described base material is provided with weld pad;
Second surface at base material forms circuitous pattern, and the described perforate inwall face of cylinder is provided with the electric conductor that is electrically connected described weld pad and circuitous pattern; And
Second surface at described base material is coated with diaphragm.
9. flexible circuit board fabrication method as claimed in claim 8 is characterized in that, weld pad forms by the copper that covers of etching base material first surface.
10. flexible circuit board fabrication method as claimed in claim 8 is characterized in that, forms in the method for described electric conductor by chemical deposition.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310235295.6A CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
| TW102127372A TWI536879B (en) | 2013-06-14 | 2013-07-31 | Flexible printed circuit board and a manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310235295.6A CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103338590A true CN103338590A (en) | 2013-10-02 |
| CN103338590B CN103338590B (en) | 2016-12-28 |
Family
ID=49246666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310235295.6A Expired - Fee Related CN103338590B (en) | 2013-06-14 | 2013-06-14 | Flexible circuit board and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103338590B (en) |
| TW (1) | TWI536879B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
| CN107300436A (en) * | 2017-07-18 | 2017-10-27 | 南昌欧菲光科技有限公司 | Touch control display apparatus and its pressure sensor |
| TWI617223B (en) * | 2014-02-25 | 2018-03-01 | 財團法人工業技術研究院 | Flexible substrate embedded with wires and method for fabricating the same |
| WO2021119990A1 (en) * | 2019-12-17 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI705748B (en) * | 2019-11-21 | 2020-09-21 | 頎邦科技股份有限公司 | Double-sided flexible printed circuit board and layout structure thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063756A (en) * | 2006-04-29 | 2007-10-31 | 胜华科技股份有限公司 | Optical displaying module with heat sinking structure |
| US20100115767A1 (en) * | 2008-11-11 | 2010-05-13 | Phoenix Precision Technology Corporation | Method for fabricating printed circuit board having capacitance components |
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
-
2013
- 2013-06-14 CN CN201310235295.6A patent/CN103338590B/en not_active Expired - Fee Related
- 2013-07-31 TW TW102127372A patent/TWI536879B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063756A (en) * | 2006-04-29 | 2007-10-31 | 胜华科技股份有限公司 | Optical displaying module with heat sinking structure |
| US20100115767A1 (en) * | 2008-11-11 | 2010-05-13 | Phoenix Precision Technology Corporation | Method for fabricating printed circuit board having capacitance components |
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617223B (en) * | 2014-02-25 | 2018-03-01 | 財團法人工業技術研究院 | Flexible substrate embedded with wires and method for fabricating the same |
| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
| CN107300436A (en) * | 2017-07-18 | 2017-10-27 | 南昌欧菲光科技有限公司 | Touch control display apparatus and its pressure sensor |
| CN107300436B (en) * | 2017-07-18 | 2022-08-23 | 安徽精卓光显技术有限责任公司 | Touch display device and pressure sensor thereof |
| WO2021119990A1 (en) * | 2019-12-17 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI536879B (en) | 2016-06-01 |
| TW201513748A (en) | 2015-04-01 |
| CN103338590B (en) | 2016-12-28 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20190614 |
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| CF01 | Termination of patent right due to non-payment of annual fee |