CN106231786A - A kind of flexible PCB - Google Patents
A kind of flexible PCB Download PDFInfo
- Publication number
- CN106231786A CN106231786A CN201610807737.3A CN201610807737A CN106231786A CN 106231786 A CN106231786 A CN 106231786A CN 201610807737 A CN201610807737 A CN 201610807737A CN 106231786 A CN106231786 A CN 106231786A
- Authority
- CN
- China
- Prior art keywords
- electrolytic copper
- paper tinsel
- flexible pcb
- copper paper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Abstract
The invention discloses a kind of flexible PCB.Described flexible PCB includes: flexible PCB body, and described flexible PCB main body includes: the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel, there is interval between described first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel；And through described interval and connect the first electrolytic copper paper tinsel and the metal pathway of the second electrolytic copper paper tinsel, for conducting the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel.Can efficiently solve once metal level fracture occurs or fractures, the electric current in flexible PCB cannot turn on, and causes the technical problem that flexible PCB lost efficacy, and further increases the validity and reliability that flexible PCB uses.
Description
Technical field
The present invention relates to printed-board technology field, particularly relate to a kind of flexible PCB.
Background technology
The printed circuit board (PCB) that the flexible insulating substrate of flexible PCB is made, can with free bend, wind, fold,
Have the advantages that distribution density is high, lightweight, thickness is thin, bending property is good, be the unique solution meeting miniaturization and movement requirement
Method.Flexible circuit (sometimes referred to as flexible printed circuit) is to etch copper circuit on the base material of polymer or print polymer
Thick film circuit.For device thin and lightweight, that its compact conformation is complicated, its design solution includes from single-sided conductive line
Road assembles to complicated multi-layer three-dimension.The gross weight of flexible composition and the traditional round wire wire harness method of volume ratio to reduce
70%.Flexible circuit can also increase its intensity by the method using reinforcing material or liner plate, steady to obtain additional machinery
Qualitative.Can require arbitrarily to arrange according to space layout, and arbitrarily move at three dimensions and stretch, thus reach components and parts assembling
The integration connected with wire.
In the prior art, electric current is generally by the via conducting electric current in flexible PCB, once middle metal level
Fracture occurs or fractures, then the electric current in flexible PCB will be no longer turned on, and cause flexible PCB to lose efficacy.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of flexible PCB, to solve in prior art, middle metal level
There is fracture or the technical problem causing flexible PCB to lose efficacy that fractures.
Embodiments provide a kind of flexible PCB, including:
Flexible PCB body, described flexible PCB main body includes: the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel, described first
Interval is there is between electrolytic copper paper tinsel and the second electrolytic copper paper tinsel；With
Through described interval and connect the first electrolytic copper paper tinsel and the metal pathway of the second electrolytic copper paper tinsel, for conducting the first electrolytic copper paper tinsel
With the second electrolytic copper paper tinsel.
Further, described flexible PCB also includes:
It is positioned at the via of flexible PCB body one end, for turning on the first electrolytic copper paper tinsel in described flexible PCB body
With the second electrolytic copper paper tinsel.
Further, described metal pathway is cylindrical.
Further, described metal pathway is copper path.
Further, described interval includes that substrate layer, described substrate layer are arranged at described first electrolytic copper paper tinsel and the second electrolytic copper
Between paper tinsel.
Further, described interval also includes: the first adhesion layer and the second adhesion layer, and described first adhesion layer is arranged at institute
Stating between substrate layer and the first electrolytic copper paper tinsel, described second adhesion layer is arranged between described substrate layer and the second electrolytic copper paper tinsel.
Further, described flexible PCB also includes:
Cover layer, described cover layer lays respectively at the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel side away from substrate layer.
Further, described flexible PCB also includes: the 3rd adhesion layer and the 4th adhesion layer, and described 3rd adhesion layer sets
Being placed between described first cover layer and the first electrolytic copper paper tinsel, described 4th adhesion layer is arranged at described second cover layer and the second electricity
Between Copper Foil.The flexible PCB that the embodiment of the present invention provides, by the first electrolytic copper paper tinsel and second at flexible PCB body
Increasing metal pathway between electrolytic copper paper tinsel, this metal pathway is through the interval between the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel, and turns on first
Electrolytic copper paper tinsel and the second electrolytic copper paper tinsel, efficiently solve and caused metal level to rupture at flexible PCB by strong external impacts
Or when fractureing, the electric current in flexible PCB cannot turn on, and causes the technical problem that flexible PCB lost efficacy, improves further
The validity and reliability that flexible PCB uses.And the flexible PCB that provides of the present embodiment also has and is prone to processing, easily
Molding and low cost and other advantages.
Accompanying drawing explanation
By the detailed description that non-limiting example is made made with reference to the following drawings of reading, other of the present invention
Feature, purpose and advantage will become more apparent upon:
Fig. 1 is the structure chart of the flexible PCB of the embodiment of the present invention one.
The technical characteristic that reference in figure refers to respectively is:
1, substrate layer；2, the first electrolytic copper paper tinsel；3, the second electrolytic copper paper tinsel；4, the first adhesion layer；
5, the second adhesion layer；6, the first cover layer；7, the second cover layer；8, the 3rd adhesion layer；
9, the 4th adhesion layer；10, metal pathway.
Detailed description of the invention
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention is illustrate only rather than full content in description, accompanying drawing.
Fig. 1 is the structural representation of a kind of flexible PCB that the embodiment of the present invention provides.As it is shown in figure 1, described flexibility
Circuit board includes: flexible PCB body, and described flexible PCB main body includes: the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3, institute
State and between the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3, there is interval；And through described interval and connection the first electrolytic copper paper tinsel 2 and second
The metal pathway of electrolytic copper paper tinsel 3, for conducting the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3.
Flexible PCB can divide according to the number of plies of copper-foil conducting electricity, is divided into lamina, doubling plate, multi-layer sheet, dual platen etc..
In the present embodiment, described flexible PCB is Double-layer flexible circuit board, and Double-layer flexible circuit board generally includes two-layer electrolytic copper paper tinsel,
Described two-layer electrolytic copper paper tinsel is respectively the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3.First electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3 symmetrically divide
Cloth is in both sides, interval, and is each filled with Copper Foil, can use as the base material of flexible PCB, and conventional Copper Foil type mainly includes pressure
Prolong annealed copper foil and electrolytic copper foil two kinds.Copper Foil is suitable for use among flexible PCB, it can use electro-deposition or
It is coated with.Copper Foil one side surface using electro-deposition has gloss, and the intensely dark pool, surface that opposite side is processed.It is to have
The material of compliance, can be made into multi-thickness and width perhaps, and forging Copper Foil, in addition to having pliability, also has hard
Smooth feature, it is suitable for applying and is requiring among the occasion of Dynamic flexural.
Generally, being provided with interval between the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3, exemplary, described interval can be base
Flaggy 1, substrate layer 1 can provide the stability of size, and the arrangement for components and parts and wire provides physical support, and stress
Release.In the present embodiment, described flexible PCB also includes metal pathway 10, and described metal pathway 10 is through interval i.e. base
Flaggy 1, connects the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3 so that pass through the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3 when there being electric current
Time, electric current can turn on the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3 by this metal pathway.Described metal pathway 10 can be long
The various shapes such as cube, square, oval shape.Owing to metal pathway 10 can be realized by bore mode, it is preferable that described
Metal pathway 10 is cylindrical, and wherein metal pathway 10 is aluminum path and copper path, owing to copper has more preferable electric conductivity, preferably
For copper path.
Flexible PCB also includes that via, also referred to as plated through-hole, described via are positioned at flexible PCB body one end, is used for
Turn on each layer in described flexible PCB body so that electric current is turned on by via scolding tin.In the present embodiment, once flexible
Circuit board is when being caused via to damage by external impacts, and electric current can turn on the first electrolytic copper paper tinsel 2 He by above-mentioned metal pathway
Second electrolytic copper paper tinsel 3, so that flexible PCB still can normally work when via damages.
It should be noted that above-mentioned metal pathway 10 is applicable not only to doubling plate, can equally be well applied to multi-layer sheet, only need
The all electrolytic copper paper tinsels being set to metal pathway 10 connect in multi-layer sheet can realize, its principle and the flexible circuit of above-mentioned offer
Plate is identical, does not repeats at this.
As seen from Figure 1, the interval between the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3 also includes the first adhesion layer 4, second
Adhesion layer 5, wherein, the first adhesion layer 4 and the second adhesion layer 5 are symmetrically dispersed in basal plate 1 both sides, described first adhesion layer 4
Being arranged between described substrate layer 1 and the first electrolytic copper paper tinsel 2, described second adhesion layer 5 is arranged at described substrate layer 1 and the second electrolytic copper
Between paper tinsel 3.Exemplary, described first adhesion layer 4 and the second adhesion layer 5 can be then glue, and then the thickness of glue is according to visitor
The different demand in family is designed, and basal plate 1 thickness is designed also according to customer demand, and common thickness has 1mil and 1/
2mil two kinds.Together with first adhesion layer 4 and the second adhesion layer 5 will include that the substrate layer of rigid member has been bonded in electrolytic copper paper tinsel.
Be applied among flexible PCB additionally, also may be used without bonding synusia, it be coated with on the two sides of insulation film viscous
Connect agent and formed.Bonding synusia provides environmental protection and electronic isolation function, and can eliminate thin film, and has
The ability of the less multilamellar of the bonding number of plies.
In the present embodiment, flexible PCB also include cover layer, described cover layer include being positioned at the first electrolytic copper paper tinsel 2 away from
First cover layer 6 of the side of substrate layer 1 and be positioned at the second electrolytic copper paper tinsel 3, second cover layer 7 away from the side of substrate layer 1, covers
It is 1mil and 1/2mil two kinds that cap rock is used for making flexible PCB surface insulation, conventional insulation thickness.Additionally, flexible PCB
May also include that the 3rd adhesion layer 8 and the 4th adhesion layer 9, described 3rd adhesion layer 8 are arranged at described first cover layer 6 and first
Between electrolytic copper paper tinsel 2, described 4th adhesion layer 9 is arranged between described second cover layer 7 and the second electrolytic copper paper tinsel 3, same, and the 3rd
Adhesion layer 8 and the 4th adhesion layer 9 are symmetric, and the 3rd adhesion layer 8 and the 4th adhesion layer 9 are also then glue.
The flexible PCB that the present embodiment provides, by the first electrolytic copper paper tinsel 2 and the second electrolytic copper at flexible PCB body
Increasing metal pathway 10 between paper tinsel 3, this metal pathway 10 is through the interval between the first electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3, and turns on the
One electrolytic copper paper tinsel 2 and the second electrolytic copper paper tinsel 3, efficiently solves once metal level and fracture occurs or fractures, in flexible PCB
Electric current cannot turn on, and causes the technical problem that flexible PCB lost efficacy, and further increases the effectiveness that flexible PCB uses
And reliability.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious change,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although by above example, the present invention is carried out
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (8)
1. a flexible PCB, it is characterised in that including:
Flexible PCB body, described flexible PCB main body includes: the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel, described first electrolytic copper
Interval is there is between paper tinsel and the second electrolytic copper paper tinsel；With
Through described interval and connect the first electrolytic copper paper tinsel and the metal pathway of the second electrolytic copper paper tinsel, for conducting the first electrolytic copper paper tinsel and the
Two electrolytic copper paper tinsels.
Flexible PCB the most according to claim 1, it is characterised in that described flexible PCB also includes:
It is positioned at the via of flexible PCB body one end, for turning on the first electrolytic copper paper tinsel in described flexible PCB body and the
Two electrolytic copper paper tinsels.
Flexible PCB the most according to claim 1, it is characterised in that described metal pathway is cylindrical.
Flexible PCB the most according to claim 3, it is characterised in that described metal pathway is copper path.
Flexible PCB the most according to claim 1, it is characterised in that described interval includes substrate layer, described substrate layer
It is arranged between described first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel.
Flexible PCB the most according to claim 5, it is characterised in that described interval also includes: the first adhesion layer and
Two adhesion layers, described first adhesion layer is arranged between described substrate layer and the first electrolytic copper paper tinsel, and described second adhesion layer is arranged at
Between described substrate layer and the second electrolytic copper paper tinsel.
Flexible PCB the most according to claim 1, it is characterised in that described flexible PCB also includes:
Cover layer, described cover layer lays respectively at the first electrolytic copper paper tinsel and the second electrolytic copper paper tinsel side away from substrate layer.
Flexible PCB the most according to claim 1, it is characterised in that described flexible PCB also includes: the 3rd adheres to
Layer and the 4th adhesion layer, described 3rd adhesion layer is arranged between described first cover layer and the first electrolytic copper paper tinsel, and the described 4th glues
Attached layer is arranged between described second cover layer and the second electrolytic copper paper tinsel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807737.3A CN106231786A (en) | 2016-09-07 | 2016-09-07 | A kind of flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610807737.3A CN106231786A (en) | 2016-09-07 | 2016-09-07 | A kind of flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231786A true CN106231786A (en) | 2016-12-14 |
Family
ID=58074847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610807737.3A Pending CN106231786A (en) | 2016-09-07 | 2016-09-07 | A kind of flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109302795A (en) * | 2017-07-24 | 2019-02-01 | 上海和辉光电有限公司 | The production method of flexible circuit board, array substrate and flexible circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN204031568U (en) * | 2014-07-25 | 2014-12-17 | 深圳市牧泰莱电路技术有限公司 | Flexible printed circuit board |
| CN204721710U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of multi-layer flexible circuit board |
| CN206024245U (en) * | 2016-09-07 | 2017-03-15 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
-
2016
- 2016-09-07 CN CN201610807737.3A patent/CN106231786A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201477114U (en) * | 2009-03-25 | 2010-05-19 | 亮发科技股份有限公司 | Electric property testing module |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN204031568U (en) * | 2014-07-25 | 2014-12-17 | 深圳市牧泰莱电路技术有限公司 | Flexible printed circuit board |
| CN204721710U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of multi-layer flexible circuit board |
| CN206024245U (en) * | 2016-09-07 | 2017-03-15 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109302795A (en) * | 2017-07-24 | 2019-02-01 | 上海和辉光电有限公司 | The production method of flexible circuit board, array substrate and flexible circuit board |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |