CN109302795A - The production method of flexible circuit board, array substrate and flexible circuit board - Google Patents
The production method of flexible circuit board, array substrate and flexible circuit board Download PDFInfo
- Publication number
- CN109302795A CN109302795A CN201710605270.9A CN201710605270A CN109302795A CN 109302795 A CN109302795 A CN 109302795A CN 201710605270 A CN201710605270 A CN 201710605270A CN 109302795 A CN109302795 A CN 109302795A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- substrate
- plain conductor
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
Abstract
The embodiment of the invention discloses the production methods of a kind of flexible circuit board, array substrate and flexible circuit board.The flexible circuit board includes: substrate, and including first direction and the second direction vertical with the first direction, the second direction is the bent direction of the flexible circuit board；Form a plurality of plain conductor being arranged successively along the first direction on the substrate；The plain conductor includes multiple first to be intervally installed and second, and the multiple first to be intervally installed and second successively connect, and first width in the first direction is greater than second width in the first direction.Compared to existing flexible circuit board, the flexibility of flexible circuit board provided in an embodiment of the present invention is more preferably.
Description
Technical field
The present embodiments relate to flexible circuit board manufacturing technology more particularly to a kind of flexible circuit board, array substrate with
And the production method of flexible circuit board.
Background technique
Flexible circuit board refers to the printed circuit made of insulating substrate flexible.Since flexible circuit board is with excellent
Electrical property, while having flexibility, is widely used in various electronic equipments, as computer, mobile phone, digital camera,
Printer and the information enquiry machine of saloon etc..
But in existing flexible circuit board, plain conductor is often arranged to prolong along the bent direction of the flexible circuit board
The long straight conductor stretched.In the process of bending, internal plain conductor is easily broken off the flexible circuit board of this kind of structure, to lead
The number of writing can not normal transmission, influence the service life of flexible circuit board.
Summary of the invention
The present invention provides the production method of a kind of flexible circuit board, array substrate and flexible circuit board, is improved with realizing
The purpose of the flexibility of flexible circuit board.
In a first aspect, the embodiment of the invention provides a kind of flexible circuit board, which includes:
Substrate, including first direction and the second direction vertical with the first direction, the second direction is described soft
The bent direction of property wiring board；
Form a plurality of plain conductor being arranged successively along the first direction on the substrate；The plain conductor packet
Include multiple first to be intervally installed and second, the successively phase of the multiple first to be intervally installed and second
It connects, first width in the first direction is greater than second width in the first direction.
Further, first width in the first direction is greater than or equal to described second described first
2 times of the width in direction.
Further, the shape of the plain conductor is bow font or zigzag.
Further, the flexible circuit board further includes the multiple stress release blocks being arranged successively along the second direction,
The stress release block is located between second of adjacent two plain conductors.
Further, the material of the stress release block is inorganic material.
It further, further include the first protective layer, first protective layer is located at the plain conductor and the stress is released
The side that block deviates from the substrate is put, the upright projection of the plain conductor and the stress release block on the substrate is located at
In the upright projection of first protective layer on the substrate.
Further, the material of first protective layer is organic material.
Second aspect, the embodiment of the invention also provides a kind of array substrate, which includes driving chip binding
The flexible wires that area, the film layer structure in driving chip binding area and any one embodiment provided in an embodiment of the present invention provide
The film layer structure of road plate is identical.
The third aspect, the embodiment of the invention also provides a kind of production method of flexible circuit board, the flexible circuit board
Production method includes:
Substrate is provided, determines first direction and second direction, the first direction and the second party on the substrate
To vertical, the second direction is the bent direction of the flexible circuit board；
The a plurality of plain conductor being arranged successively along first direction is formed on the substrate, wherein the plain conductor packet
Include multiple first to be intervally installed and second, the successively phase of the multiple first to be intervally installed and second
It connects, first width in the first direction is greater than second width in the first direction.
Further, it is formed on the substrate after a plurality of plain conductor step that first direction is arranged successively, also
Including,
The multiple stress release blocks being arranged successively along the second direction, the stress release block are formed on the substrate
Between second of adjacent two plain conductors.
The embodiment of the present invention includes multiple first to be intervally installed and second by the way that plain conductor is arranged, described
Multiple first to be intervally installed and second successively connect, and first width in the first direction is greater than institute
Second width in the first direction is stated, it is bad to solve existing flexible circuit board flexibility, so that existing flexibility
In the process of bending, internal plain conductor is easily broken off wiring board, so as to cause signal can not normal transmission, influence flexibility
The problem of service life of wiring board, realizes the purpose for improving flexible circuit board flexibility.
Detailed description of the invention
Fig. 1 is a kind of existing structural schematic diagram of flexible circuit board；
Fig. 2 is a kind of structural schematic diagram of flexible circuit board provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of flexible circuit board provided in an embodiment of the present invention in the process of bending；
Fig. 4 is the structural schematic diagram of another flexible circuit board provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of another flexible circuit board provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of another flexible circuit board provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram of the section structure of the A1-A2 along Fig. 6；
Fig. 8 is a kind of structural schematic diagram of array substrate provided in an embodiment of the present invention；
Fig. 9 is a kind of flow chart of the production method of flexible circuit board provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Fig. 1 is a kind of existing structural schematic diagram of flexible circuit board.Referring to Fig. 1, which includes: substrate
The 10 a plurality of plain conductor 11 with formation on the substrate 10.Substrate 10 includes first direction (X-direction in Fig. 1) and and first party
To (X-direction in Fig. 1) vertical second direction (Y direction in Fig. 1), second direction (Y direction in Fig. 1) is flexible circuitry
The bent direction of plate 1.Wherein, the shape of plain conductor 11 is rectangle.A plurality of plain conductor 11 is along first direction (X in Fig. 1
Axis direction) arrangement (Y direction in Fig. 1) extension in a second direction.
When being bent (especially crooked process radius is larger) to the flexible circuit board 1, plain conductor 11 is by external force
Bending, and it is in tensional state, there is the tensile deformation of (Y direction in Fig. 1) in a second direction.Plain conductor 11 is in its drawing
The development length for stretching direction is only dependent upon the ductility of metal material.Plain conductor 11 is in a stretched state in its draw direction
Development length is greater than under its unstretched state in 1.01 times or more of the length of its draw direction, and plain conductor 11 can be broken.
Undoubtedly, this will lead to signal can not normal transmission, influence the service life of flexible circuit board.
In view of this, the embodiment of the present invention provides a kind of flexible circuit board, to improve the flexibility of flexible circuit board, extend
The service life of flexible circuitry.
Fig. 2 is a kind of structural schematic diagram of flexible circuit board provided in an embodiment of the present invention.Referring to fig. 2, the flexible circuitry
Plate 1 includes: substrate 10, including first direction (X-direction in Fig. 2) and vertical with first direction (X-direction in Fig. 2) second
Direction (Y direction in Fig. 2), second direction (Y direction in Fig. 2) are the bent direction of flexible circuit board 1；It is formed in substrate
The a plurality of plain conductor 11 being arranged successively along first direction (X-direction in Fig. 2) on 10；Plain conductor 11 include it is multiple each other
Spaced first 111 and second 112, the successively phase of multiple first to be intervally installed 111 and second 112
It connects, first 111 (X-direction in Fig. 2) in a first direction width is greater than second 112 width in a first direction (in Fig. 2
X-direction).
Here first 111 (X-direction in Fig. 2) in a first direction width, refer to any one it is parallel with X-axis straight
The upright projection of line on the substrate 10 is with first 111 upright projection intersection on the substrate 10 along the length of first direction
Degree.Second 112 width in a first direction refers to the upright projection of any one straight line parallel with X-axis on the substrate 10
With second 112 upright projection intersection on the substrate 10 along the length of first direction.
Studies have shown that deformation occurs under the action of the external force when plain conductor 11 is bent by external force, internal meeting
The internal force of interaction is generated, to resist the effect of this external force, and attempts to restore plain conductor 11 from deformed position
Position before to deformation.The internal force on unit area is known as stress in this process.
Above-mentioned technical proposal setting plain conductor includes multiple first to be intervally installed 111 and second 112, is somebody's turn to do
Multiple first to be intervally installed 111 and second 112 successively connect, and first 111 width in a first direction is greater than
Second 112 width in a first direction is substantially to widen first 111 of plain conductor 11, reaches increase plain conductor
11 first 111 sectional areas perpendicular to its draw direction (Y direction in Fig. 2), and then reduce first 111 internal stress,
So that first of plain conductor 11 is 111 not easy to break.
In addition, multiple first to be intervally installed 111 and are arranged with continued reference to Fig. 2, in above-mentioned technical proposal
Successively connect for two 112, first 111 width in a first direction is greater than second 112 width in a first direction, can make
Multiple turnings 113 are formed on plain conductor 11.Fig. 3 be in the process of bending, flexible circuit board provided in an embodiment of the present invention
Structural schematic diagram.Comparison diagram 2 and Fig. 3 constitute first 111 of each turning 113 and second 112 phase in the process of bending
It changes to position, so that the size of the angle α between first 111 and second 112 changes, and then gives metal
The extension surplus certain in overbending direction (Y direction in Fig. 2) of conducting wire 11.That is, technical scheme, in bending process
Process, plain conductor 11 are derived from the ductility of metal material in development length a part of its draw direction, and another part is derived from
Constitute the first 111 and second 112 relative position variation at each turning 113.
It will be understood by those skilled in the art that in practice, when the development length of plain conductor 11 in a stretched state is
Under its unstretched state in 1.01 times or more of the development length of its draw direction, from constituting the first of each turning 113
The relative position of portion 111 and second 112 change so that plain conductor 11 plays a leading role in the extension of its draw direction, is originated from
Make plain conductor 11 in the development length very little of its draw direction in the ductility of metal material, it might even be possible to ignore and not remember.
Because bending to flexible circuit board, the ductility due to being derived from metal material makes plain conductor 11 in its draw direction
Development length very little, do not exceed under its unstretched state at 1.01 times of the length of its draw direction, not will lead to metal
Conducting wire 11 be broken, not will lead to signal can not normal transmission, more will not influence the service life of flexible circuit board.
To sum up, the embodiment of the present invention includes multiple first to be intervally installed and second by setting plain conductor
Portion, the multiple first to be intervally installed and second successively connect, first width in the first direction
Degree is greater than second width in the first direction, and it is bad to can solve existing flexible circuit board flexibility, so that
In the process of bending, internal plain conductor is easily broken off existing flexible circuit board, can not normally be passed so as to cause signal
Defeated, the problem of influencing the service life of flexible circuit board, realizes the purpose for improving flexible circuit board flexibility.The present invention is implemented
The technical solution that example provides is particularly suitable for the larger situation of crooked process radius.
Further, first 111 width in a first direction is greater than or equal to second 112 width in a first direction
2 times.The benefit being arranged in this way is on the one hand to increase plain conductor 11 first 111 sectional areas perpendicular to its draw direction,
When reducing bending, first 111 internal stress.On the other hand, give plain conductor 11 the extension surplus bigger in overbending direction.
With continued reference to Fig. 2 and Fig. 3, the shape of the plain conductor 11 is bow font, this is only one of the invention and specifically shows
Example, rather than limitation of the present invention.Optionally, the shape of the plain conductor 11 is bow font or zigzag etc..Fig. 4 is the present invention
The structural schematic diagram for another flexible circuit board that embodiment provides, referring to fig. 4, the shape zigzag of the plain conductor 11.
Fig. 5 is the structural schematic diagram of another flexible circuit board provided in an embodiment of the present invention.Referring to Fig. 5, the flexible wires
Road plate 1 further includes multiple stress release blocks 12 that (Y direction in Fig. 5) is arranged successively in a second direction, and stress release block 12
Between second 112 of adjacent two plain conductors 11.Since plain conductor 11 second 112 perpendicular to its draw direction
Sectional area is smaller, and when bending, 11 second 112 stress accumulations of plain conductor are serious, by adjacent two plain conductors 11
Stress release block 12 is set between second 112, makes stress while being scattered on second 112 and stress release block 12, to rise
To the effect of stress release, and then plain conductor 11 and stress of the stress release block 12 on overbending direction are reduced, improved flexible
The flexibility of wiring board.Optionally, the material of the stress release block 12 is inorganic material.Optionally, stress release block 12 and gold
Belong to conducting wire 11 and is located at same film layer.
Fig. 6 is the structural schematic diagram of another flexible circuit board provided in an embodiment of the present invention.Fig. 7 is A1-A2 in Fig. 6
The schematic diagram of the section structure.Compared with above-mentioned technical proposal, which further includes the first protective layer 13.Specifically, referring to
Fig. 6 and Fig. 7, this further includes the first protective layer 13 to the flexible circuit board, which is located at plain conductor 11 and stress
The side that block 12 deviates from substrate 10 is discharged, and the upright projection of plain conductor 11 and stress release block 12 on the substrate 10 is located at the
In the upright projection of one protective layer 13 on the substrate 10, to prevent plain conductor 11 in use and stress release block 12 because rubbing
Sidewipe collision etc. causes plain conductor 11 or stress release block 12 to be broken, or because dust accumulation leads to short circuit of plain conductor 11 etc. no
Good phenomenon occurs.
Optionally, the material of the first protective layer 13 is organic material.Since organic material is better than inorganic material flexibility, choosing
A possibility that the first protective layer 13 can reduce the first protective layer 13 cracking is made with organic material.Meanwhile even if in bending
First protective layer 13 cracks, and part bending deformation can be absorbed, prevent cracking source to be diffused on plain conductor 11, in turn
A possibility that reducing flexible circuit board damage.
The embodiment of the present invention also provides and has arrived a kind of array substrate.Fig. 8 is a kind of array base provided in an embodiment of the present invention
The structural schematic diagram of plate.Referring to Fig. 8, which includes that driving chip binds area 20, and driving chip binds the film layer in area 20
Structure is identical as the film layer structure of any one flexible circuit board provided in an embodiment of the present invention.
Array substrate provided in an embodiment of the present invention includes multiple first to be intervally installed by setting plain conductor
Portion and second, the multiple first to be intervally installed and second successively connect, and described first described first
The width in direction is greater than second width in the first direction, solves existing flexible circuit board flexibility not
Good, so that existing flexible circuit board is in the process of bending, internal plain conductor is easily broken off, can not so as to cause signal
Normal transmission, the problem of influencing the service life of flexible circuit board, realize the purpose for improving flexible circuit board flexibility.
It should be noted that the embodiment of the present invention, which is also provided to a kind of array substrate, can be used for making flexible organic light emission
Display panel or flexible liquid crystal panel.
The embodiment of the invention also provides a kind of production methods of flexible circuit board.Fig. 9 is provided in an embodiment of the present invention
A kind of flow chart of the production method of flexible circuit board.Referring to Fig. 9, the flow chart of the production method of the flexible circuit board includes:
S301, substrate being provided, first direction and second direction is determined on substrate, first direction is vertical with second direction,
Second direction is the bent direction of flexible circuit board；
S302, a plurality of plain conductor being arranged successively along first direction is formed on substrate.
Wherein, plain conductor includes multiple first to be intervally installed and second, multiple to be intervally installed
First and second successively connects, and first width in a first direction is greater than second width in a first direction.
The production method of flexible circuit board provided in an embodiment of the present invention, by be arranged plain conductor include it is multiple to each other
Every first of setting and second, the multiple first to be intervally installed and second successively connect, and described first
Portion is greater than second width in the first direction in the width of the first direction, solves existing flexible circuitry
Plate flexibility is bad, so that existing flexible circuit board is in the process of bending, internal plain conductor is easily broken off, to lead
The number of writing can not normal transmission, the problem of influencing the service life of flexible circuit board realizes and improves flexible circuit board flexibility
Purpose.
Further, after S302, further include,
The multiple stress release blocks being arranged successively in a second direction are formed on substrate, stress release block is located at adjacent two
Between second of plain conductor.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above embodiments to this
Invention is described in further detail, but the present invention is not limited to the above embodiments only, is not departing from present inventive concept
In the case of, it can also include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of flexible circuit board characterized by comprising
Substrate, including first direction and the second direction vertical with the first direction, the second direction is the flexible wires
The bent direction of road plate；
Form a plurality of plain conductor being arranged successively along the first direction on the substrate；The plain conductor includes more
A first to be intervally installed and second, the multiple first to be intervally installed and second successively connect,
First width in the first direction is greater than second width in the first direction.
2. flexible circuit board according to claim 1, which is characterized in that first width in the first direction
More than or equal to 2 times of second width in the first direction.
3. flexible circuit board according to claim 1, which is characterized in that the shape of the plain conductor is bow font or Z-shaped
Shape.
4. flexible circuit board according to claim 1, which is characterized in that the flexible circuit board further includes along described second
Multiple stress release blocks that direction is arranged successively,
The stress release block is located between second of adjacent two plain conductors.
5. flexible circuit board according to claim 4, which is characterized in that the material of the stress release block is inorganic material
Material.
6. flexible circuit board according to claim 4, which is characterized in that it further include the first protective layer, first protection
Layer is located at the plain conductor and the stress release block deviates from the side of the substrate, and the plain conductor and the stress are released
The upright projection of block on the substrate is put to be located in the upright projection of first protective layer on the substrate.
7. flexible circuit board according to claim 6, which is characterized in that the material of first protective layer is organic material
Material.
8. a kind of array substrate, which is characterized in that bind area, the film layer structure in driving chip binding area including driving chip
It is identical as the film layer structure of the described in any item flexible circuit board of claim 1-7.
9. a kind of production method of flexible circuit board, which is characterized in that
Substrate is provided, determines that first direction and second direction, the first direction and the second direction are hung down on the substrate
Directly, the second direction is the bent direction of the flexible circuit board；
The a plurality of plain conductor being arranged successively along first direction is formed on the substrate, wherein the plain conductor includes more
A first to be intervally installed and second, the multiple first to be intervally installed and second successively connect,
First width in the first direction is greater than second width in the first direction.
10. the production method of flexible circuit board according to claim 9, which is characterized in that
It is formed after a plurality of plain conductor step that first direction is arranged successively on the substrate, further includes,
The multiple stress release blocks being arranged successively along the second direction are formed on the substrate, and the stress release block is located at
Between second of adjacent two plain conductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710605270.9A CN109302795A (en) | 2017-07-24 | 2017-07-24 | The production method of flexible circuit board, array substrate and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710605270.9A CN109302795A (en) | 2017-07-24 | 2017-07-24 | The production method of flexible circuit board, array substrate and flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN109302795A true CN109302795A (en) | 2019-02-01 |
Family
ID=65167528
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710605270.9A Pending CN109302795A (en) | 2017-07-24 | 2017-07-24 | The production method of flexible circuit board, array substrate and flexible circuit board |
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| Country | Link |
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| CN (1) | CN109302795A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110473474A (en) * | 2019-08-29 | 2019-11-19 | 上海天马微电子有限公司 | Production method, bending structure and the display panel of bending structure |
| CN111584557A (en) * | 2020-05-07 | 2020-08-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| TWI736098B (en) * | 2019-12-30 | 2021-08-11 | 大陸商業成科技（成都）有限公司 | Bending-resistant structure and display panel |
| CN114630489A (en) * | 2022-03-22 | 2022-06-14 | 广东湾区智能终端工业设计研究院有限公司 | Flexible circuit board, folding assembly and electronic equipment |
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| CN106231786A (en) * | 2016-09-07 | 2016-12-14 | 奥英光电（苏州）有限公司 | A kind of flexible PCB |
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| JP2008177463A (en) * | 2007-01-22 | 2008-07-31 | Kyocera Chemical Corp | Flexible wiring board adhesive composition, flexible wiring board cover lay, and flexible wiring board with electromagnetic wave shield layer |
| CN102342187A (en) * | 2009-03-06 | 2012-02-01 | 信越聚合物株式会社 | Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board |
| CN202018547U (en) * | 2011-04-15 | 2011-10-26 | Tcl显示科技（惠州）有限公司 | Main flexible printed circuit for liquid crystal display module |
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| CN110473474B (en) * | 2019-08-29 | 2022-02-01 | 上海天马微电子有限公司 | Manufacturing method of bending structure, bending structure and display panel |
| TWI736098B (en) * | 2019-12-30 | 2021-08-11 | 大陸商業成科技（成都）有限公司 | Bending-resistant structure and display panel |
| CN111584557A (en) * | 2020-05-07 | 2020-08-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN114630489A (en) * | 2022-03-22 | 2022-06-14 | 广东湾区智能终端工业设计研究院有限公司 | Flexible circuit board, folding assembly and electronic equipment |
| CN114630489B (en) * | 2022-03-22 | 2024-01-26 | 广东湾区智能终端工业设计研究院有限公司 | Flexible circuit board, folding assembly and electronic equipment |
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