CN202222083U - Mobile phone and its circuit board formed by combining soft, hard plates - Google Patents
Mobile phone and its circuit board formed by combining soft, hard plates Download PDFInfo
- Publication number
- CN202222083U CN202222083U CN2011203323478U CN201120332347U CN202222083U CN 202222083 U CN202222083 U CN 202222083U CN 2011203323478 U CN2011203323478 U CN 2011203323478U CN 201120332347 U CN201120332347 U CN 201120332347U CN 202222083 U CN202222083 U CN 202222083U
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- copper sheet
- circuit board
- soft
- sheet layer
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Abstract
The utility model discloses a mobile phone and its circuit board formed by combining soft, hard plates. An FPC soft plate layer is combined with PCB hard plate layers on the two sides to form more than two mutually separated hard plate parts and a flexible soft plate part integrally connected between the hard plate parts, wherein the FPC soft plate layer comprises a first copper sheet layer and a protection film respectively adhered on the surfaces on the two sides of the first copper sheet layer; the PCB hard plate layer comprises a second copper sheet layer electrically connected with the first copper sheet layer, a semi-solidification slice arranged on the surface on the inner side of the second copper sheet layer and a green oil layer adhered on the surface on the outer side of the second copper sheet layer; a semi-solidification slice layer is contacted with the surface on the outer side of the protection film. Because the multi-layer circuit board in a composite layer structure is used, the mutually separated hard plate parts are connected by the sandwiched soft plate part and the material and the assembly cost of the interface parts such as connectors are saved, the valuable space in the mobile phone is also saved and the adverse rate of the electric connection between the PCB hard plates is reduced.
Description
Technical field
The utility model relates to mobile portable equipment fields such as mobile phone, and in particular, what improvement related to is the circuit board that a kind of mobile phone and soft or hard thereof combine.
Background technology
Mobile phone of today is when the design circuit plate; Most area is because Structural Design Requirement uses PCB (Printed Circuit Board) hardboard; And sometimes; Because the PCB hardboard need be arranged on again on the inclined plane or side outside the mobile phone front, often all can adopt independently little PCB hardboard, and adopt FPC (Flexible Printed Circuit) soft board to connect big PCB hardboard through connector.
But; The circuit board that soft or hard combines in the prior art has not only increased the cost of each interface connector parts; PCB hardboard and mobile phone volume inside have been taken; And increased the fraction defective that contacts between the interface, and reduced the combination property that mobile phone bears drop test, shortened the useful life of mobile phone.
Therefore, prior art still haves much room for improvement and develops.
The utility model content
The purpose of the utility model is, the circuit board that provides a kind of mobile phone and soft or hard thereof to combine is saved the mobile phone inner space, reduces the fraction defective that electrically connects between the PCB hardboard.
The technical scheme of the utility model is following: the circuit board that a kind of soft or hard combines, and mutually compound by FPC soft board layer with the PCB hardboard layer of its both sides, form the hardboard portion be separated from each other more than two and one and be connected flexible soft board portion between each hardboard portion; Wherein: FPC soft board layer comprises the first copper sheet layer and sticks on the diaphragm on the first copper sheet layer both side surface respectively; PCB hardboard layer comprises the second copper sheet layer that electrically connects the first copper sheet layer and is arranged on the layer pf prepreg on the second copper sheet layer inner surface and sticks on the green oil layer on the second copper sheet layer outer surface; Layer pf prepreg contacts with the outer surface of diaphragm.
The circuit board that described soft or hard combines, wherein: the said second copper sheet layer electrically connects via the through hole and the first copper sheet layer; Through hole passes layer pf prepreg and diaphragm setting.
The circuit board that described soft or hard combines, wherein: said diaphragm is set to the polyimides diaphragm.
A kind of mobile phone comprises shell and the circuit board that is arranged on enclosure; Wherein: said circuit board is set to the circuit board that above-mentioned each described soft or hard combines.
The circuit board that a kind of mobile phone that the utility model provided and soft or hard thereof combine; Owing to adopted the multilayer circuit board of lamination layer structure, connect each hardboard portion that is separated from each other through sandwich soft board portion, not only saved the material and the assembly cost of interface parts such as connector; Also saved the inner expensive real estate of mobile phone; But also reduced the fraction defective that electrically connects between the PCB hardboard, improve mobile phone and born the combination property of drop test, and the useful life that has prolonged mobile phone.
Description of drawings
Fig. 1 is the combine lamination layer structure sketch map of circuit board of the utility model soft or hard.
Fig. 2 is the utility model soft or hard embodiment plane graph of circuit board in mobile phone application that combine.
Embodiment
Below will combine accompanying drawing, the embodiment and the embodiment of the utility model specified, described specific embodiment in order to explain the utility model, is not the embodiment that is used to limit the utility model only.
The circuit board that a kind of soft or hard of the utility model combines; As shown in Figure 1; Be combined into three layers of wiring board by FPC soft board layer that is positioned at the intermediate layer and the PCB hardboard layer that is positioned at the both sides, intermediate layer, form two or more hardboard portions 110 (and 120) that are separated from each other and one and be connected flexible soft board portion 130 between each hardboard portion 110 (and 120); Wherein, said FPC soft board layer comprises the first copper sheet layer 211 that is positioned at central core and sticks on the diaphragm 230 on the first copper sheet layer, 211 both side surface through glue-line 240 respectively; At the PCB hardboard layer that is arranged in FPC soft board layer both sides, each PCB hardboard layer all comprises the second copper sheet layer 212 (or 213) that electrically connects the first copper sheet layer 211 and is arranged on the layer pf prepreg 220 on second copper sheet layer 212 (or 213) inner surface and sticks on the green oil layer 110 on second copper sheet layer 212 (or 213) outer surface through glue-line 240; Layer pf prepreg 220 in the said PCB hardboard layer contacts with diaphragm 230 outer surfaces in the FPC soft board layer; The area of both sides PCB hardboard layer is respectively all less than the area of middle FPC soft board layer.
The circuit board that a kind of soft or hard that the utility model provides combines is applicable to that the most area more than 90% is all used the PCB hardboard when PCB designs, and the fraction area below 10% is because the mobile phone space requirement uses the crooked situation of FPC soft board.
In the circuit board preferred implementation that the utility model soft or hard combines; The second copper sheet layer 212 (or 213) in the PCB hardboard layer of both sides can electrically connect via the through hole that passes self layer pf prepreg and FPC soft board layer diaphragm 214 and wherein the first copper sheet layer 211, the hardboard portion 110 (with 120) that is separated from each other with electric connection.
Preferably, said diaphragm 230 can be selected PI (Polyimide) polyimides diaphragm for use, improves the pliability of FPC soft board portion 130 with high bending, stretching and the high impact resistance that utilizes the polyimide film sheet, prolongs the useful life of circuit board.In addition, said glue-line 240 also can be selected the PI glue of adaptive bonding polyimides diaphragm for use, to improve the adhesive property of diaphragm 230.
Based on the circuit board that above-mentioned soft or hard combines, the utility model has also proposed a kind of mobile phone, comprises shell and the circuit board that is arranged on enclosure; As shown in Figure 2; Said circuit board comprise two hardboard portions 110 that are separated from each other and 120 and one be connected flexible soft board portion 130 between two hardboard portions 110 and 120, and adopted the combine syndeton of circuit board of the said soft or hard of above-mentioned arbitrary embodiment.
Compare with mobile phone of the prior art and circuit board thereof; The circuit board that a kind of mobile phone that the utility model provided and soft or hard thereof combine; Owing to adopted the multilayer circuit board of lamination layer structure, connect each hardboard portion that is separated from each other through sandwich soft board portion, not only saved the material and the assembly cost of interface parts such as connector; Also saved the inner expensive real estate of mobile phone; But also reduced the fraction defective that electrically connects between the PCB hardboard, improve mobile phone and born the combination property of drop test, and the useful life that has prolonged mobile phone.
Should be understood that; The preferred embodiment that the above is merely the utility model is not sufficient to limit the technical scheme of the utility model, concerning those of ordinary skills; Within the spirit and principle of the utility model; Can increase and decrease according to above-mentioned explanation, replacement, conversion or improvement, and all these increases and decreases, replacement, conversion or improve after technical scheme, all should belong to the protection range of the utility model accompanying claims.
Claims (4)
1. the circuit board that soft or hard combines is mutually compound with the PCB hardboard layer of its both sides by FPC soft board layer, forms the hardboard portion be separated from each other more than two and one and is connected flexible soft board portion between each hardboard portion; It is characterized in that: FPC soft board layer comprises the first copper sheet layer and sticks on the diaphragm on the first copper sheet layer both side surface respectively; PCB hardboard layer comprises the second copper sheet layer that electrically connects the first copper sheet layer and is arranged on the layer pf prepreg on the second copper sheet layer inner surface and sticks on the green oil layer on the second copper sheet layer outer surface; Layer pf prepreg contacts with the outer surface of diaphragm.
2. the circuit board that soft or hard according to claim 1 combines is characterized in that: the said second copper sheet layer electrically connects via the through hole and the first copper sheet layer; Through hole passes layer pf prepreg and diaphragm setting.
3. the circuit board that soft or hard according to claim 1 combines is characterized in that: said diaphragm is set to the polyimides diaphragm.
4. a mobile phone comprises shell and the circuit board that is arranged on enclosure; It is characterized in that: said circuit board is set to the circuit board that combines like each described soft or hard in the claim 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203323478U CN202222083U (en) | 2011-09-06 | 2011-09-06 | Mobile phone and its circuit board formed by combining soft, hard plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203323478U CN202222083U (en) | 2011-09-06 | 2011-09-06 | Mobile phone and its circuit board formed by combining soft, hard plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202222083U true CN202222083U (en) | 2012-05-16 |
Family
ID=46044102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203323478U Expired - Fee Related CN202222083U (en) | 2011-09-06 | 2011-09-06 | Mobile phone and its circuit board formed by combining soft, hard plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202222083U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN106686885A (en) * | 2016-12-29 | 2017-05-17 | 欣旺达电子股份有限公司 | Printed circuit board (PCB) protection plate of rapid charging battery |
| CN107318234A (en) * | 2016-10-20 | 2017-11-03 | 湖南维胜科技有限公司 | Soft or hard combination half-finished product plate and preparation method thereof, Rigid Flex preparation method |
-
2011
- 2011-09-06 CN CN2011203323478U patent/CN202222083U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN103298240B (en) * | 2012-08-09 | 2016-01-27 | 伟裕(厦门)电子有限公司 | A kind of rigid-flexible circuit board and preparation method thereof |
| CN107318234A (en) * | 2016-10-20 | 2017-11-03 | 湖南维胜科技有限公司 | Soft or hard combination half-finished product plate and preparation method thereof, Rigid Flex preparation method |
| CN106686885A (en) * | 2016-12-29 | 2017-05-17 | 欣旺达电子股份有限公司 | Printed circuit board (PCB) protection plate of rapid charging battery |
| CN106686885B (en) * | 2016-12-29 | 2023-09-26 | 欣旺达电子股份有限公司 | PCB protection board for quick battery charging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120516 Termination date: 20130906 |