CN201282594Y - Flexible circuit board - Google Patents
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- CN201282594Y CN201282594Y CNU2008201252067U CN200820125206U CN201282594Y CN 201282594 Y CN201282594 Y CN 201282594Y CN U2008201252067 U CNU2008201252067 U CN U2008201252067U CN 200820125206 U CN200820125206 U CN 200820125206U CN 201282594 Y CN201282594 Y CN 201282594Y
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Abstract
A flexible printed circuit board comprises at least a film layer. The film layer comprises a first metal layer, a first protective layer and a first electromagnetic wave shielding film, which are sequentially arranged on one surface of a substrate, wherein, a part of the first electromagnetic wave shielding film directly contacts the a part of the first metal layer. The flexible printed circuit board has both good shielding effect and good bending resistance. When being applied in electronic products, especially a slide-cover mobile phone, the flexible printed circuit board has good screen display, sound and mobile phone signals, and can reduce the radiation of the entire mobile phone; and the flexible printed circuit board has low fracture probability at the force-bearing region, resulting in good bending resistance, so as to improve the quality and prolong the service life of the entire product. The flexible printed circuit board needs not to be grounded via electroless nickel and immersion gold, so as to reduce use of the electroless nickel and immersion gold, thereby reducing cost.
Description
Technical field
The utility model relates to a kind of flexible circuit board.
Background technology
Flexible circuit board (Flexible Printed Circuit, be called for short FPC) is to be the printed circuit board (PCB) that the copper-clad plate of base material is made in order to polyimides or polyester film, has the reliability of height and excellent pliability.FPC uses more and more widely owing to have special function, is becoming a most important product of copper-clad plate.In recent years, nearly all high-tech electronic product all adopts flexible print circuit board in a large number.Particularly the application in slide phone is more popular.Along with continuous progress in science and technology, the improving constantly of living standards of the people, slide phone has incorporated our life.The existing flexible circuit board that is used for slide phone generally comprises: the base material that is arranged in order, the welding resistance part that constitutes as the copper foil layer of metal level, as the polyimide film (PI) of protective layer and/or poly terephthalic acid ethanol ester film (PET) etc. and welding portion and as the silver foil layer of electromagnetic shielding film.Wherein, described metal level is formed with line map on described base material, and by having machinery and protection against oxidation and good electrical insulation property in compacting or the printing concurrently and can realizing that the protective layer of welding forms final products.For two-sided, multilayer printed wiring board, its top layer and inner conductor metallize by metal level, to realize being electrically connected of ectonexine circuit.But; in the flexible circuit board of prior art; described electromagnetic shielding film directly links to each other with the welding resistance part or the welding portion of described protective layer; such flexible circuit board or have anti-preferably flexion capabilities but shield effectiveness is relatively poor perhaps has preferably shield effectiveness but anti-flexion capabilities is relatively poor.
The utility model content
The purpose of this utility model is to overcome the ability that can not having simultaneously of above-mentioned flexible circuit board of the prior art tolerate flexing preferably and the better defective of shield effectiveness, provides a kind of and can side by side have the ability of better tolerance flexing and the better flexible circuit board of shield effectiveness.
The utility model provides a kind of flexible circuit board; this flexible circuit board comprises at least one film body layer; described film body layer is included in the first metal layer, first protective layer and first electromagnetic shielding film that is arranged in order on the face of base material; wherein, the part of described first electromagnetic shielding film directly contacts with the part of described the first metal layer.
Inventor of the present utility model finds, in the flexible circuit board of the prior art, normally first electromagnetic shielding film is directly linked to each other with the welding resistance part or the welding portion of described first protective layer.When described first electromagnetic shielding film directly is connected with the welding portion of first protective layer; this first electromagnetic shielding film connects the first metal layer and ground connection by the welding portion of first protective layer; that is between first electromagnetic shielding film and the first metal layer, be the welding portion of first protective layer.But, welding portion is harder and crisp materials such as nickel gold, tin normally, therefore, when flexible circuit board is subjected to external force, for example as twisting resistance, bending power, be easy to be delivered to the uneven problem of stress distribution on the more crisp welding portion, and then cause some part on flexible circuit board to cause the fracture of flexible circuit board easily because stress is concentrated, influence the flexion capabilities of flexible circuit board.When described first electromagnetic shielding film directly is connected with the welding resistance part of first protective layer; because the welding resistance of described first protective layer part polyimide film (PI) and/or poly terephthalic acid ethanol ester film materials such as (PET) better by pliability usually, that insulate constitute; therefore described first electromagnetic shielding film can't be communicated with described metal level and be grounded; that is, also have one deck to have certain flexible welding resistance part between described first electromagnetic shielding film in this flexible circuit board and the first metal layer.Therefore, described first electromagnetic shielding film and described the first metal layer is connected the direct connection that is not harder objuct matter.Though this flexible circuit board can avoid occurring the problem that stress is concentrated by the buffering of welding resistance part preferably on flexible circuit board when being subjected to external force, reduced the fracture rate of flexible circuit board, and then improved the anti-flexion capabilities of flexible circuit board, but because described first electromagnetic shielding film can't be communicated with the first metal layer and ground connection, the ability of this flexible circuit board shielding interference from outside signals is relatively poor.
According to flexible circuit board of the present utility model, concrete condition according to employed flexible circuit board, on flexible circuit board, determine and the part of first electromagnetic shielding film at this place to be connected the place of the first electromagnetic shielding film ground connection with the direct contact of the corresponding part of the first metal layer.First electromagnetic shielding film is grounded by directly contacting with the first metal layer on the one hand, can obtain to shield preferably the interference from outside signals ability.On the other hand, though first electromagnetic shielding film also is that the direct of harder objuct matter is connected with the first metal layer, but there is not more crisp welding portion between them, thereby when this flexible circuit board is subjected to external force, for example twisting resistance, bending power etc., can avoid rupturing owing to stress uneven distribution on the more crisp material of forming welding portion causes the concentrated flexible circuit board that causes of stress on flexible circuit board in the prior art, and then influence the problem of the flexion capabilities of this flexible circuit board.Therefore, can side by side have shield effectiveness and the ability that tolerates flexing preferably according to flexible circuit board of the present utility model.Be applied to electronic product according to flexible circuit board of the present utility model, in the time of particularly in the slide phone, screen display, sound and mobile phone signal preferably can be arranged, and the radiation of complete machine reduces, simultaneously, bear the probability that fracture appears in strength zone (being generally slipper) and reduce, thereby have and tolerate flexion capabilities preferably, improve the quality of entire product, prolonged useful life.Simultaneously, because usually higher as the cost of the materials such as nickel gold of the welding portion in first protective layer, and the flexible circuit board that the utility model provides does not need by ground connection such as nickel gold at the ground connection place, has reduced the use of nickel gold etc., has reduced cost.
Description of drawings
Fig. 1 is the flex region structural representation according to two-sided flexible circuit board of the present utility model;
Fig. 2 is the flex region structural representation according to the flexible circuit board of the utility model exemplary embodiment;
Fig. 3 is the flex region structural representation that is used for the flexible circuit board of slide phone in the prior art;
Fig. 4 is the flex region structural representation that is used for the flexible circuit board of slide phone in the prior art.
Embodiment
Flexible circuit board that the utility model is provided below in conjunction with accompanying drawing and preparation method thereof is described in detail.
As shown in the figure; according to flexible circuit board of the present utility model; this flexible circuit board comprises at least one film body layer; described film body layer is included in the first metal layer 2, first protective layer 3 and first electromagnetic shielding film 4 that is arranged in order on the surface of base material 1; wherein, the part of described first electromagnetic shielding film 4 directly contacts with the part of described the first metal layer 2.
According to the concrete condition of employed flexible circuit board, on flexible circuit board, determine and the part of first electromagnetic shielding film 4 at this place to be connected the place of first electromagnetic shielding film, 4 ground connection with the direct contact of the first metal layer 2 corresponding parts.That is, according to flexible circuit board of the present utility model, the part of described first electromagnetic shielding film 4 directly contacts with the part of described the first metal layer 2, and another part contacts with described first protective layer 3.Described first electromagnetic shielding film 4 can directly contact with described the first metal layer 2 by any way, does not have other material or structure between the contacting of described first electromagnetic shielding film 4 of this direct contact finger and described the first metal layer 2.
As a kind of execution mode, comprise that also at least one runs through the ground slot of described first protective layer 3 on first protective layer 3 of this flexible circuit board, described first electromagnetic shielding film 4 directly contacts with described the first metal layer 2 at this ground slot place.In Fig. 1-3; be shorter than other layer and the described ground slot of space representation that between the described the first metal layer 2 and first electromagnetic shielding film 4, forms with first protective layer 3 (the first welding resistance part 32 among Fig. 3); simultaneously; in the flexible circuit board shown in Fig. 1-3; only at one of them represented ground slot place; schematically show contacting of described first electromagnetic shielding film 4 and described the first metal layer 2; so that purposes of illustration, this kind expression should not be construed as the restriction to the way of contact between described first electromagnetic shielding film 4 and the described the first metal layer 2.
Because described ground slot has run through the thickness of described first protective layer 3; that is to say; the first metal layer 2 at this ground slot place is directly relative with first electromagnetic shielding film 4, and in other words, the first metal layer 2 is exposed to described first electromagnetic shielding film 4 at described ground slot place.In this case, on the one hand can be by strengthening the thickness of first electromagnetic shielding film 4 and/or the first metal layer 2, make to be full of in this ground slot and form identical materials with the first battery ripple screened film 4 or be full of and the first metal layer 2 is formed identical materials, realize that described first electromagnetic shielding film 4 directly contacts and then is grounded with described the first metal layer 2.Also promptly, according to a kind of execution mode of the present utility model, as illustrated in fig. 1, described first electromagnetic shielding film 4 directly contacts to described the first metal layer 2 extensions and with this first metal layer 2 corresponding to the part at described ground slot place.Execution mode as an alternative, the first metal layer 2 at this ground slot place directly contacts to 4 extensions of described first electromagnetic shielding film and with this first electromagnetic shielding film 4, that is, being equivalent to the first metal layer 2 in this ground slot part is filled in this ground slot and directly contacts and be grounded with described first electromagnetic shielding film 4.
Be full of in the preferred described ground slot of the utility model with the first battery ripple screened film 4 and form identical materials, that is, preferred first electromagnetic shielding film 4 directly contacts to described the first metal layer 2 extensions and with this first metal layer 2 corresponding to the part at described ground slot place.
As illustrated in fig. 2, on the other hand, can be grounded by described first electromagnetic shielding film 4 is directly contacted to the bending of the direction of described the first metal layer 2 or depression and with this first metal layer 2.
Wherein, described ground slot can be many, can select the bar number of described ground slot, the width of ground slot, the position between each ground slot according to the occasion of using and the requirement of product, for example, for the mobile phone flexible circuit board, preferably the width of described ground slot is the 0.5-2 millimeter.More preferably, described ground slot is parallel to each other 2, and the distance between these two ground slots is the 15-20 millimeter.
Described first protective layer 3 comprises first welding portion 31 that is electrically connected that is used to realize described the first metal layer 2 formed circuit and is used to protect the first not oxidized welding resistance part 32 of described the first metal layer 2; in order more clearly to represent the utility model, the first welding resistance part 32 and first welding portion 31 are only shown in Figure 3.
The first welding resistance part 32 of described first protective layer 3 can be polyimide film (PI), PETG film (PET) and/or the composite membrane of the two; preferably, be the composite membrane of polyamides Asia (PI) film and PETG film (PET) according to the described first welding resistance part 32 of the present utility model.The thickness of described first protective layer 3 can be the 5-50 micron; the thickness that also is the described first welding resistance part 32 is the 5-50 micron; particularly; different according to the employed place of flexible circuit board with applied product; can be 12.5 microns, 18 microns, 25 microns, 50 microns; for example say; when described flexible circuit board is used for slide phone; the thickness of the described first welding resistance part 32 can be the 5-50 micron; under the preferable case, the thickness of the described first welding resistance part 32 (comprising adhesive) is 27.5 microns.
On the first metal layer 2 surfaces of the described first welding resistance part 32 attached to described flexible circuit board, for described the first metal layer 2 provides insulation protection.Described method of adhering to can be a whole bag of tricks, to be as the criterion on the surface with the stable the first metal layer 2 attached to described flexible circuit board of the described first welding resistance part 32.For example, the directly described the first metal layer 2 of pressing and the first welding resistance part 32, perhaps by applying adhesive on a surface of the described the first metal layer 2 and/or the first welding resistance part 32, so that the described first welding resistance part 32 is adhered on the surface of described the first metal layer 2.For the situation of above-mentioned use adhesive, described adhesive can be a sensitized material, also can be glue.Preferably, described adhesive is heat sensitive adhesive and/or photosensitive adhesive, like this can the described the first metal layer 2 and/or the first welding resistance part 32 will with applying adhesive on the surface of described the first metal layer 2 contact portions after, use hot pressing or use the energy line irradiation to solidify described adhesive and realizes the strong bonded of the two.
Described first protective layer 3 can make by the method that comprises the steps: the material that cover to form the first welding resistance part 32 at the first metal layer 2 on corresponding to the position of the first welding resistance part 32; form the first welding resistance part 32; cover the anti-plate adhesive tape in the position corresponding then, afterwards by electroplating nickel dam and the gold layer that forms described first welding portion 31 with ground slot.
Described first electromagnetic shielding film 4 can be by pressing with silver foil attached on described first protective layer 3, also can use adhesive with silver foil attached on described first protective layer 3, perhaps by on described first protective layer 3, using silver slurry coating.For the situation of above-mentioned use adhesive, described adhesive can be a sensitized material, also can be glue.Preferably; described adhesive is heat sensitive adhesive and/or photosensitive adhesive; like this can described first protective layer 3 and/or first electromagnetic shielding film 4 will with applying adhesive on the surface of described first protective layer, 3 contact portions after, use hot pressing or use the energy line irradiation to solidify described adhesive and realizes the strong bonded of the two.The thickness of described first electromagnetic shielding film 4 can be the 10-35 micron.
Normally, select that pliability is good for use, the material of insulation is as the base material 1 of flexible circuit board.The base material 1 that is adopted can be one or more in polyimides (PI), acrylic acid, polyethers nitrile, polyether sulphur, PEN, PETG (PET), poly-para Toluic Acid's ethyl ester, aramid fiber ester, polyvinyl chloride and their compound.Under the preferable case, described base material 1 is that polyimides (PI) film, poly terephthalic acid acetic acid esters (PET) film constitute, and this kind material thermal resistance height, dimensional stability are good.The thickness of described base material 1 is the 10-25 micron, and more preferably, the thickness of described base material 1 is 18 microns.
Described the first metal layer 2 is used for forming line map on described base material 1.Described the first metal layer 2 is selected Copper Foil usually for use, and described Copper Foil can be along pressing copper (RA) or cathode copper (ED), and wherein, the thickness of described Copper Foil as the first metal layer 2 can be the 9-70 micron, is preferably the 12-70 micron.Particularly, different according to the employed place of flexible circuit board with applied product, the Copper Foil that is purchased is generally 12 microns, 18 microns, 35 microns or 70 microns specifications, for example say, when described flexible circuit board is used for slide phone, consider the flexural property as slide phone, inventor of the present utility model finds that the flexible circuit board of the thin more acquisition of Copper Foil can have better flexural property simultaneously, and therefore the thickness of described Copper Foil is preferably 12 microns.Described the first metal layer 2 can be attached on the described base material 1 with the whole bag of tricks, for example can also can use methods such as adhesive or curing agent to realize the first metal layer 2 adhering on described base material 1 by the described the first metal layer 2 of lamination on described base material 1.
As a kind of preferred implementation; described film body layer also comprises second protective layer 7; a surface of this second protective layer 7 can contact with another surface of described base material 1; have under the situation of second metal level 6 at described film body layer, described second protective layer 7 also can contact with described second metal level 6 on covering described base material 1.
Particularly; according to the employed occasion of flexible circuit board; described film body layer can also comprise and also comprises second metal level 6; this second metal level 6 is between the described base material 1 and second protective layer 7, and two surfaces of promptly described second metal level 6 contact with another surface of described base material 1 and a surface of described second protective layer 7 respectively.Described second metal level 6 is selected Copper Foil usually for use, described Copper Foil can be along pressing copper (RA) or cathode copper (ED), wherein, copper thickness can be preferably the 12-70 micron, particularly, different with applied product according to the employed place of flexible circuit board, the thickness of described second metal level 6 can be 12 microns, 18 microns, 35 microns or 70 microns.In the reality, the material of described second metal level 6 and thickness can be identical or different with the material and the thickness of described the first metal layer 2 respectively.
Described second protective layer 7 can include the second welding portion (not shown) and the second welding resistance part (not shown) simultaneously, perhaps only includes the second welding resistance part.Promptly, described second welding resistance part can be polyimide film (PI), PETG film (PET) and/or the composite membrane of the two, preferably, the composite membrane that partly is polyimides (PI) film and PETG film (PET) according to described second welding resistance of the present utility model.The thickness of described second protective layer 7 can be the 5-50 micron; the thickness that also is described second welding resistance part can be the 5-50 micron; particularly; different according to the employed place of flexible circuit board with applied product; the thickness of described second welding resistance part can be 12.5 microns, 18 microns, 25 microns, 50 microns; under the preferable case, the thickness of described second welding resistance part (comprising adhesive) is 27.5 microns (identical with claim 8).In the reality, the material and the thickness of described second welding resistance part can be identical or different with the material and the thickness of the first welding resistance part 32 respectively.
Described second welding portion can be by being coated on described second metal level 6 such as methods such as plating.Preferably, because the good welding performance of nickel gold copper-base alloy, and the surface is not easy oxidizedly, and described second welding portion is the nickel gold, and thickness is the 0.5-9 micron.More preferably, described nickel gold is the alloy-layer of nickel and gold.More preferably, carry out after earlier being plated in nickel dam on described second metal level 6 gold-platedly again, wherein, the thickness of described nickel dam is the 0.5-9 micron, and the thickness of described gold layer is the 0.03-0.1 micron, can protect second metal level 6 better.In the reality, the material of described second welding portion and thickness can be identical or different with the material and the thickness of first welding portion 31 respectively.
In the above-described embodiment, described film body layer can also comprise second electromagnetic shielding film 8, and the thickness of described second electromagnetic shielding film 8 can be the 15-35 micron.The structure of described second metal level 6, second protective layer 7 and second electromagnetic shielding film 8 and the relation of the position between them can be identical with the structure and the relation of the position between them of the first metal layer 2, first protective layer 3 and the first battery ripple screened film 4, also can be different.For example, the described second battery ripple screened film 8 can directly contact with second metal level 6, also can contact with second protective layer 7 by second metal level 6, and second protective layer 7 contacts with the second battery ripple screened film 8.The structure of preferred described second metal level 6 of the utility model, second protective layer 7 and second electromagnetic shielding film 8 and the relation of the position between them can and the structure and the relation of the position between them of the first metal layer 2, first protective layer 3 and the first battery ripple screened film 4 identical respectively.
According to flexible circuit board of the present utility model, the number of described film body layer can be for a plurality of, and preferably, the number of described film body layer can be 1-4.
Flexible circuit board according to prior art shown in Figure 3, can find, also there is first welding portion 31 between the contact of described first electromagnetic wave screen film 4 and described the first metal layer 2, because described first welding portion 31 adopts more crisp material usually, nickel gold etc. for example, therefore, strength is not easy to disperse when flexible circuit board is stressed, produce concentrating of stress easily at some position, and then make flexible circuit board when flexing, hold fracture, reduced the flexion capabilities of flexible circuit board.
Flexible circuit board according to prior art shown in Figure 4; first protective layer 3 that has insulation between described first electromagnetic shielding film 4 and the described the first metal layer 2; therefore described first electromagnetic shielding film 4 can't be connected and ground connection with described the first metal layer 2; therefore; though avoided concentrating the flexion capabilities that influences flexible circuit board owing to hard material directly contacts the stress that causes; but because this flexible circuit board does not have ground connection, the weak effect of shielding.
According to flexible circuit board of the present utility model, first electromagnetic shielding film 4 directly is connected with the first metal layer 2 contacts, described first electromagnetic shielding film 4 is grounded by direct contact the first metal layer 2 on the one hand, can obtain to shield preferably the interference from outside signals ability.On the other hand, though first electromagnetic shielding film 4, the first metal layer 2 also are the direct connections of harder objuct matter, but there is not the first more crisp welding portion 31 between them, like this when flexible circuit board is subjected to external force, as twisting resistance, bending power, some the part stress on flexible circuit board that can avoid causing owing to the uneven distribution of stress on more crisp material is concentrated the fracture that takes place, and then influences the flexion capabilities of this flexible circuit board.Therefore, can have shield effectiveness and the ability that tolerates flexing preferably simultaneously according to flexible circuit board of the present utility model.Be applied to electronic product according to flexible circuit board of the present utility model, in the time of particularly in the slide phone, have screen display, sound and mobile phone signal preferably, and the radiation of complete machine reduces, simultaneously, the chance probability that bears strength zone (being generally slipper) appearance fracture reduces, and has to tolerate flexion capabilities preferably, and then improved the quality of entire product, prolonged useful life.Simultaneously, because higher as the costs such as nickel gold of weld layer, the flexible circuit board that the utility model provides does not need at the ground connection place to have reduced the use of nickel gold by nickel gold ground connection, has reduced cost.
Specifically describe the flexible circuit board that the utility model provides below by embodiment.
As shown in Figure 2 flexible circuit board of preparation, wherein said the first metal layer 2 is for available from the two-sided Copper Foil of NFX-2ABEPFE (18T) of Mitsui (Cu/PI/Cu (thickness be respectively 12 microns/PI:18 micron/12 microns).The described first welding resistance part 32 carries adhesive layer, is the FDO0515HL (PI:12.5 micron, ADH:15 micron) available from the platform rainbow, and the described first welding resistance part 32 is passed through this adhesive layer attached on the described the first metal layer 2.Described first electromagnetic shielding film 4 is the SF-PC5000 silver foil (22 microns) available from three favours.Have two ground slots parallel to each other on first protective layer 3, the distance between the ground slot is 15 millimeters, and the width of every ground slot is 0.5 millimeter.The formation method of described first welding portion 31 is included in and covers the N0380 anti-plate adhesive tape that reaches available from great richness on two parallel ground slots of described first protective layer 3; electronickelling and electrogilding form described first welding portion 31 successively then; wherein; the thickness of gold layer is 0.03 micron, and the thickness of nickel dam is 0.5 micron.After removing the anti-plate adhesive tape described first welding portion 31 is linked to each other with first electromagnetic shielding film 4 by welding.Direction bending towards described the first metal layer 2 directly contacts with the first metal layer 2 this first electromagnetic shielding film 4 at described ground slot place.Obtain the flexible circuit board that the utility model provides.
Comparative Examples 1
Prepare flexible circuit board according to embodiment 1 described method, different is, does not cover the anti-plate adhesive tape before forming first welding portion 31 on the first welding resistance part 32, obtains reference flexible circuit board as shown in Figure 3.
Comparative Examples 2
Prepare flexible circuit board according to embodiment 1 described method; different is, does not have ground slot on first protective layer 3, and promptly the first metal layer 2 directly contacts with first protective layer 3; first protective layer 3 directly contacts with first electromagnetic shielding film 4, obtains reference flexible circuit board as shown in Figure 4.
Prepare flexible circuit board according to embodiment 1 described method, different is that the thickness of described first electromagnetic shielding film 4 is 10 microns.
Prepare flexible circuit board according to embodiment 1 described method, different is, described first electromagnetic shielding film 4 by available from three and SW-LAB-A silver slurry form, thickness is 35 microns.
Prepare flexible circuit board according to embodiment 1 described method; different is; the method for preparing first protective layer 3 and first electromagnetic shielding film 4 according to embodiment 1 respectively on another Copper Foil in available from the two-sided Copper Foil of NFX-2ABEPFE (18T) of Mitsui (i.e. second metal level 6) forms second protective layer 7 and the second battery ripple screened film 8, obtains flexible circuit board shown in Figure 1.
Embodiment 5-8
The flexible circuit board that the foregoing description 1-4 is made is that 32.5mm, the tortuous load are that 400 grams, tortuous angle are 75 degree with crooked process radius R=1.5mm, test stroke respectively, and upward the bending number of times result of test flexible circuit board is as shown in table 1 to place simulation buckling test machine (Shenzhen China friendship is created the anti-testing machine of destroying or force to yield of RS-6300H of great Instr Ltd.).
Comparative Examples 3-4
Test the bending number of times of the flexible circuit board that is obtained by Comparative Examples 1-2 according to the method for embodiment 5-8, the result is as shown in table 1.
Embodiment 9-12
The flexible circuit board that the foregoing description 1-4 is made is used action radio frequency testing instrument CMU200 to carry out SAR value and is tested after being assembled into complete machine (HD1U330LCAM model mobile phone).
Comparative Examples 5-6
The flexible circuit board that is obtained by Comparative Examples 1-2 according to the test of the method for embodiment 9-12 is used action radio frequency testing instrument CMU200 to carry out SAR value and is tested after being assembled into HD1U330LCAM model hand, and the result is as shown in table 1.
Table 1
| The flexible circuit board source | The flexing number of times | SAR value (6 minutes) |
| |
182000 times | 1.5w/kg |
| Comparative Examples 1 | 85300 times | 1.5w/kg |
| Comparative Examples 2 | 175000 times | 2.3w/ |
| Embodiment | ||
| 2 | 89960 times | 1.3w/ |
| Embodiment | ||
| 3 | 123000 times | 2.0w/ |
| Embodiment | ||
| 4 | 45500 times | 1.5w/kg |
By the data of last table 1 as can be seen, the flexible circuit board that provides according to the utility model can satisfy the requirement of flexing number of times and shield effectiveness simultaneously, that is to say, compared with prior art, can have anti-preferably flexion capabilities and shielding properties preferably simultaneously according to flexible circuit board of the present utility model, have better quality, and the utility model reduce the usable floor area of weld layer, save material, reduced cost.
Claims (10)
1, a kind of flexible circuit board; this flexible circuit board comprises at least one film body layer; described film body layer is included in the first metal layer, first protective layer and first electromagnetic shielding film that is arranged in order on the face of base material; it is characterized in that the part of described first electromagnetic shielding film directly contacts with the part of described the first metal layer.
2, flexible circuit board according to claim 1; it is characterized in that; this flexible circuit board comprises also that on first protective layer at least one runs through the ground slot of this first protective layer, and described first electromagnetic shielding film directly contacts with described the first metal layer at this ground slot place.
3, flexible circuit board according to claim 2 is characterized in that, described first electromagnetic shielding film extends to this first metal layer to described the first metal layer corresponding to the part of described ground slot and directly contacts.
4, flexible circuit board according to claim 2 is characterized in that, described first electromagnetic shielding film directly contacts towards the bending of described the first metal layer direction or depression and with described the first metal layer at described ground slot place.
5, according to any described flexible circuit board among the claim 2-4, it is characterized in that the width of described ground slot is the 0.5-2 millimeter.
According to any described flexible circuit board among the claim 2-4, it is characterized in that 6, described ground slot is parallel to each other two, and the distance between these two ground slots is the 15-20 millimeter.
7, flexible circuit board according to claim 1 is characterized in that, described film body layer also comprises second protective layer, and a surface of this second protective layer contacts with another surface of described base material.
8, flexible circuit board according to claim 7; it is characterized in that; described film body layer also comprises second electromagnetic shielding film; this second electromagnetic shielding film contacts with another surface of described second protective layer; the thickness of described second protective layer is the 5-50 micron, and the thickness of described second electromagnetic shielding film is the 15-35 micron.
9, flexible circuit board according to claim 1 is characterized in that, the thickness of described the first metal layer is the 9-70 micron, and the thickness of described first protective layer is the 5-50 micron, and the thickness of described first electromagnetic shielding film is the 10-35 micron.
10, flexible circuit board according to claim 1 is characterized in that, the number of described film body layer is a plurality of.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201252067U CN201282594Y (en) | 2008-07-03 | 2008-07-03 | Flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201252067U CN201282594Y (en) | 2008-07-03 | 2008-07-03 | Flexible circuit board |
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| CN201282594Y true CN201282594Y (en) | 2009-07-29 |
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| CNU2008201252067U Expired - Lifetime CN201282594Y (en) | 2008-07-03 | 2008-07-03 | Flexible circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131340A (en) * | 2010-01-12 | 2011-07-20 | 住友电工印刷电路株式会社 | Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same |
| CN102404930A (en) * | 2011-11-10 | 2012-04-04 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN107101152A (en) * | 2016-02-22 | 2017-08-29 | 法雷奥照明公司 | With the light emitting module for motor vehicles connected over the ground |
| CN112074075A (en) * | 2015-10-06 | 2020-12-11 | Lg伊诺特有限公司 | Flexible circuit board |
| WO2022040968A1 (en) * | 2020-08-26 | 2022-03-03 | 京东方科技集团股份有限公司 | Electromagnetic shielding film, flexible circuit board, and display device |
-
2008
- 2008-07-03 CN CNU2008201252067U patent/CN201282594Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131340A (en) * | 2010-01-12 | 2011-07-20 | 住友电工印刷电路株式会社 | Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same |
| CN102131340B (en) * | 2010-01-12 | 2016-03-16 | 住友电工印刷电路株式会社 | The manufacture method of flexible printed wiring board, flexible printed wiring board, there is the electronic equipment of flexible printed wiring board |
| CN102404930A (en) * | 2011-11-10 | 2012-04-04 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN102404930B (en) * | 2011-11-10 | 2015-06-03 | 广东步步高电子工业有限公司 | Improved structure of multilayered flexible printed circuit board (PCB) |
| CN112074075A (en) * | 2015-10-06 | 2020-12-11 | Lg伊诺特有限公司 | Flexible circuit board |
| CN112074075B (en) * | 2015-10-06 | 2023-06-09 | Lg伊诺特有限公司 | Flexible circuit board |
| CN107101152A (en) * | 2016-02-22 | 2017-08-29 | 法雷奥照明公司 | With the light emitting module for motor vehicles connected over the ground |
| CN107101152B (en) * | 2016-02-22 | 2021-12-07 | 法雷奥照明公司 | Light module for a motor vehicle with ground connection |
| WO2022040968A1 (en) * | 2020-08-26 | 2022-03-03 | 京东方科技集团股份有限公司 | Electromagnetic shielding film, flexible circuit board, and display device |
| CN114731775A (en) * | 2020-08-26 | 2022-07-08 | 京东方科技集团股份有限公司 | Electromagnetic shielding film, flexible circuit board and display device |
| US11765873B2 (en) | 2020-08-26 | 2023-09-19 | Boe Technology Group Co., Ltd. | Electromagnetic shielding film, flexible circuit board and display device |
| CN114731775B (en) * | 2020-08-26 | 2024-01-09 | 京东方科技集团股份有限公司 | Electromagnetic shielding film, flexible circuit board and display device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract record no.: 2011440020248 Denomination of utility model: Manufacture method of soft circuit board Granted publication date: 20090729 License type: Exclusive License Record date: 20110623 |
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| CX01 | Expiry of patent term |
Granted publication date: 20090729 |