KR20100051699A - Shield film for printed wiring board, and printed wiring board - Google Patents

Abstract

Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0 μm, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.

Description

Shield film for printed wiring board and printed wiring board {SHIELD FILM FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to shield films for printed wiring boards and printed wiring boards used in devices such as computers, communication devices, video cameras, and the like.

Conventionally, the shield film for printed wiring boards using a metal layer is known. For example, it is disclosed by following patent document 1. Patent document 1 is characterized in that a metal layer is laminated on at least one surface of a synthetic resin sheet base material, and the peel strength between the metal layer and the synthetic resin sheet is 5 N / cm or less, and the transfer metal can be easily transferred to an FPC or the like. Disclosed is a metal foil sheet for transfer with a conductive adhesive layer, characterized by laminating a conductive adhesive layer obtained by dispersing a metal powder and / or carbon powder in a resin composition on a thin film sheet and a metal layer surface of the metal foil sheet for transfer.

Japanese Patent Application Laid-Open No. 2006-297714

In recent years, devices for computers, communication devices, video cameras, and the like, for printed wiring boards that can withstand repeated bending and sliding even further from a large radius of curvature to a small radius of curvature (1.0 mm). Shield films and printed wiring boards are required.

However, Patent Document 1, although having some flexibility, is not considered for repeated bending and sliding from a large radius of curvature to a small radius of curvature (1.0 mm). Repeated bending and sliding from a radius of curvature to a small radius of curvature (1.0 mm) may cause breakage of the metal layer, which may result in deterioration of the electromagnetic shield characteristics.

It is therefore an object of the present invention to provide a shield film and a printed wiring board for a printed wiring board, in which breakage of the metal layer is unlikely to occur due to repeated bending and sliding from a large radius of curvature to a small radius of curvature (1.0 mm).

(1) The shield film for printed wiring boards of this invention is equipped with the 1st metal layer formed in one side of the insulating layer, and the arithmetic mean deviation (JIS B 0601 (1994)) of the surface of one side of the said insulating layer is 0.5-5.0 At the same time as the micrometer, the first metal layer is formed to have a corrugated structure along one surface of the insulating layer.

According to the above structure, since the metal layer is a corrugated structure with high bendability, it is possible to provide a shield film for a printed wiring board which is unlikely to break the metal layer due to repeated bending and sliding from a large radius of curvature to a small radius of curvature (1.0 mm). Can be. Therefore, the shield film for printed wiring boards with which electromagnetic wave shield characteristics are hard to reduce can be provided. In addition, when bonded to a printed wiring board and used, it protects a printed wiring board and can maintain an electromagnetic shield characteristic even if a printed wiring board is repeatedly bent and slid.

(2) In the shield film for printed wiring boards of said (1), it is preferable that the arithmetic mean deviation of the surface on the opposite side to the said insulating layer of a said 1st metal layer is 0.5-5.0 micrometers.

According to the said structure, the corrugated structure of a more preferable shape is formed, and the effect of said (1) can be exhibited more reliably.

(3) In the shielding film for printed wiring boards (1) or (2), the first metal layer is nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or one of these materials. It is preferable that it is a layer using any material of the alloy containing the above.

By the above structure, it is possible to set it as the metal layer with high electromagnetic shielding characteristic. In addition, when other metal layers made of different materials are formed on the surface of the metal layer, alloying becomes easy.

(4) In said shield film for printed wiring boards of said (1) or (2), it is preferable that the said 1st metal layer is a layer formed from the 1 or more types of scaly metal particles.

According to the above configuration, when a bonded wiring board is bonded to the printed wiring board at a predetermined temperature (for example, 150 ° C.) or more by a press, the gap is formed between the scaly metal particles, and an intermetallic bond is formed. Since a continuous metal layer can be formed, it is possible to set it as the conductive layer which is more flexible. Therefore, when used for the above-mentioned printed wiring board, the shielding film for printed wiring boards with which the metal layer is less likely to be destroyed with respect to the bending and sliding repeated from a large curvature radius to a small curvature radius (1.0 mm) can be provided.

(5) In the shielding film for printed wiring boards of said (1) or (2), it is preferable that the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said 1st metal layer.

The above structure can be easily adhered to a printed wiring board, and can be used as a layer having an electromagnetic shielding effect in addition to being used as an adhesive layer. In addition, in the shielding film for printed wiring boards of the above (4), the conductive adhesive layer is filled in the gaps between the scaly metal particles when pressed and bonded to the printed wiring board to improve the strength and flexibility of the metal layer. There is a number.

(6) Moreover, in the said shield film for printed wiring boards of said (1) or (2), the said 1st metal layer is a porous layer which has several holes, and a conductive adhesive is opposed to the said insulating layer of the said 1st metal layer. It is also good that a layer is formed.

According to the said structure, when press-bonding and using to a printed wiring board, a conductive adhesive layer is filled in the space | gap of a hole, and the strength and flexibility of a metal layer can be improved.

(7) In addition, in the said shielding film for printed wiring boards of said (1) or (2), it is nickel, copper, silver, tin, gold, palladium, aluminum, chromium, on the opposite side to the said insulating layer of the said 1st metal layer. A second metal layer using any of titanium, zinc and an alloy containing at least one of these materials is formed so that the first metal layer and the second metal layer may be made of different kinds of materials.

According to the said structure, the effect which corrodes a 1st metal layer with a 2nd metal layer can be acquired. Moreover, when using by bonding to a printed wiring board by predetermined pressure (for example, 150 degreeC) or more by a press, it can also form an intermetallic compound between a 1st metal layer and a 2nd metal layer. As a result, when it adhere | attaches a printed wiring board by predetermined | prescribed temperature (for example, 150 degreeC) or more by a press press, it can be set as the shield film for printed wiring boards which improved strength and flexibility.

(8) In the shield film for printed wiring boards of said (7), it is preferable that the said 2nd metal layer is a layer formed from the 1 or more types of scaly metal particles.

With the above configuration, when the adhesive is bonded to the printed wiring board at a predetermined temperature (for example, 150 ° C.) or more by a press, the gap is formed between the scaly metal particles constituting the second metal layer. At the same time, an intermetallic bond can also be formed to form an electrically continuous metal layer, which makes it possible to provide a more flexible conductive layer. Therefore, the shielding film for printed wiring boards with which the metal layer is hard to generate | occur | produce with respect to the bending | flexion and sliding repeated from big curvature radius to small curvature radius (1.0 mm) can be provided.

(9) In the shield film for printed wiring boards of said (8), it is preferable that the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said 2nd metal layer.

According to the said structure, it can be easily adhere | attached to a printed wiring board, and can be used also as a layer which has an electromagnetic shielding effect besides using as an adhesive bond layer. Moreover, when press-bonding and using a printed wiring board, a conductive adhesive layer is filled in the space | interval between scaly metal particles, and the strength and flexibility of a metal layer can be improved.

(10) Moreover, in the shield film for printed wiring boards of (7), the second metal layer is a porous layer having a plurality of holes, and a conductive adhesive layer is formed on the opposite side of the insulating layer of the second metal layer. It is good to be.

According to the above configuration, when press-bonded and bonded to the printed wiring board, part of the conductive adhesive layer is filled in the pores of the holes in the second metal layer, thereby improving the strength and flexibility of the second metal layer.

(11) In said shield film for printed wiring boards of said (1) or (2), it is preferable that the said 1st metal layer is a layer formed from the porous layer which has a some hole, or 1 or more types of scaly metal particles.

According to the above configuration, when the first metal layer is a porous layer having a plurality of holes when press-bonded to a printed wiring board and used, when the layer is formed of one or more scaly metal particles in the pores of the holes, A part of conductive adhesive layer is filled in the space | interval between scaly metal particles, and the intensity | strength and flexibility in a 1st metal layer can be improved.

(12) In another aspect, the shielding film for printed wiring boards of the present invention includes the first metal layer formed on one side of the insulating layer and the second metal layer formed on the opposite side of the insulating layer of the first metal layer. The first metal layer and the second metal layer are different from each other while being a layer using any of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and alloys including at least one of these materials. It may be made of a material.

According to the said structure, the effect which corrodes a 1st metal layer with a 2nd metal layer can be acquired. Moreover, when using by bonding to a printed wiring board by predetermined pressure (for example, 150 degreeC) or more by a press, it can also form an intermetallic compound between a 1st metal layer and a 2nd metal layer. As a result, when it adhere | attaches a printed wiring board by predetermined | prescribed temperature (for example, 150 degreeC) or more by pressure press, it can be set as the shield film for printed wiring boards which the strength improved. Therefore, the shielding film for printed wiring boards with which the metal layer is hard to generate | occur | produce with respect to the bending | flexion and sliding repeated from big curvature radius to small curvature radius (1.0 mm) can be provided.

(13) In the shield film for printed wiring boards of the above (12), the second metal layer is preferably a layer formed of at least one scaly metal particle.

With the above configuration, when the adhesive is bonded to the printed wiring board at a predetermined temperature (for example, 150 ° C.) or more by a press, the gap is formed between the scaly metal particles constituting the second metal layer. At the same time, an intermetallic bond can also be formed to form an electrically continuous metal layer, which makes it possible to provide a more flexible conductive layer. Therefore, the shielding film for printed wiring boards with which the metal layer is hard to generate | occur | produce with respect to the bending | flexion and sliding repeated from big curvature radius to small curvature radius (1.0 mm) can be provided.

(14) In the shield film for printed wiring boards of said (13), it is preferable that the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said 2nd metal layer.

By the said structure, it can adhere easily to a printed wiring board. Moreover, when press-bonding and using a printed wiring board, a conductive adhesive layer is filled in the space | interval between scaly metal particles, and the strength and flexibility of a metal layer can be improved.

(15) In addition, in the shielding film for a printed wiring board according to (12), the second metal layer is a porous layer having a plurality of holes, and a conductive adhesive layer is formed on the opposite side to the insulating layer of the second metal layer. Also good.

According to the above configuration, when press-bonded and bonded to the printed wiring board, a part of the conductive adhesive layer is filled in the pores of the holes in the second metal layer, thereby improving the strength and flexibility of the second metal layer. .

(16) In the shielding film for printed wiring boards (14) or (15), the first metal layer is preferably a porous layer having a plurality of holes or a layer formed of one or more scaly metal particles.

In the above configuration, when the first metal layer is a porous layer having a plurality of holes when pressed and bonded to a printed wiring board, the layer is formed of one or more scaly metal particles in the pores of the holes. In the gap between the scaly metal particles, a portion of which the conductive adhesive layer is filled through the second metal layer is present, so that the strength and flexibility of the first metal layer can be improved.

(17) In still another aspect, the shielding film for printed wiring boards of the present invention may be a layer having a metal layer formed on one side of the insulating layer and formed of one or more scaly metal particles.

According to the above configuration, when the adhesive is bonded and used by a pressure press at a predetermined temperature (for example, 150 ° C.) or more, a gap is formed between the scaly metal particles, and an intermetallic bond is also generated and is electrically continuous. Since a metal layer can be formed, it is possible to set it as the conductive layer rich in flexibility. Therefore, the shielding film for printed wiring boards with which the metal layer is hard to generate | occur | produce with respect to the bending | flexion and sliding repeated from big curvature radius to small curvature radius (1.0 mm) can be provided.

(18) In the shielding film for printed wiring boards of said (17), it is preferable that the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said metal layer.

By the said structure, it can adhere easily to a printed wiring board. Moreover, when press-bonding and using a printed wiring board, a conductive adhesive layer is filled in the space | interval between scaly metal particles, and the strength and flexibility of a metal layer can be improved.

(19) In still another aspect, the shielding film for a printed wiring board of the present invention is a porous layer having a metal layer formed on one side of the insulating layer and having a plurality of holes in the metal layer, and conductive on the opposite side of the insulating layer of the metal layer. It is also good that the adhesive layer is formed.

According to the above configuration, when press-bonded and bonded to a printed wiring board, a part of the conductive adhesive layer is filled in the pores of the holes in the metal layer, thereby improving the strength and flexibility of the metal layer. Therefore, the shielding film for printed wiring boards with which the metal layer is hard to generate | occur | produce with respect to the bending | flexion and sliding repeated from big curvature radius to small curvature radius (1.0 mm) can be provided.

(20) In the shielding film for printed wiring boards (1), (2), (12) to (15), and (17) to (19), the lower limit of the radius of curvature is repeated for bending and sliding. You may use as a shield film of the.

(21) The printed wiring board of the present invention comprises a conductive adhesive in which the shield film for a printed wiring board according to (1) or (2) is applied to the first metal thin film layer on at least one surface of a substrate including one or more printed circuits. It is attached through intervention.

(22) The printed wiring board of the present invention is attached to at least one surface of a substrate including one or more printed circuits through the conductive adhesive coated with the shield film for printed wiring board described in (5) on the first metal thin film layer. At the same time, a part of the conductive adhesive layer is filled in the gap between the scaly metal particles.

(23) The printed wiring board of this invention is attached to at least one surface of the board | substrate containing one or more layers of printed circuit boards through the said conductive adhesive agent with which the shield film for printed wiring boards of said (6) was apply | coated to the said 1st metal thin film layer. At the same time, a part of the conductive adhesive layer is filled in the pores of the holes.

(24) In the printed wiring board of the present invention, the shield film for printed wiring boards described in (1), (2), and (12) is applied to the second metal thin film layer on at least one surface of a substrate including one or more printed circuits. A material of forming the first metal thin film layer and the material of forming the second metal thin film layer between the first metal thin film layer and the second metal thin film layer at the same time as being attached through the conductive adhesive. It has a liver compound layer.

(25) In the printed wiring board of the present invention, the shield film for printed wiring boards described in (1), (2), and (13) is applied to the second metal thin film layer on at least one side of a substrate including one or more printed circuits. At the same time, the second metal thin film layer is an intermetallic bonding layer of one or more types of scaly metal particles.

(26) In the printed wiring board of the present invention, the shield film for printed wiring boards described in (1), (2) and (14) is applied to the second metal thin film layer on at least one surface of a substrate including one or more printed circuits. A portion of the conductive adhesive layer is filled in the gaps of the scaly metal particles at the same time as being attached through the conductive adhesive.

(27) In the printed wiring board of the present invention, the shield film for printed wiring boards described in (1), (2), and (15) is applied to the second metal thin film layer on at least one surface of a substrate including one or more printed circuits. At the same time, a portion of the conductive adhesive layer is filled in the pores of the holes while being attached through the conductive adhesive.

(28) The printed wiring board of the present invention is attached to at least one surface of a substrate including one or more layers of printed circuit boards through the conductive adhesive coated with the shield film for printed wiring board described in (11) on the second metal thin film layer. At the same time, a part of the conductive adhesive layer is filled in the gaps of the scaly metal particles or the pores of the holes in the first metal thin film layer.

(29) The printed wiring board of this invention is attached to at least one surface of the board | substrate containing one or more layers of printed circuit boards through the said conductive adhesive agent with which the shield film for printed wiring boards of said (16) was apply | coated to the said 2nd metal thin film layer. At the same time, a part of the conductive adhesive layer is filled in the gaps of the scaly metal particles or the pores of the holes in the first metal thin film layer.

(30) In the printed wiring board of the present invention, the shielding film for a printed wiring board according to (17) is attached to at least one surface of a substrate including one or more printed circuits through a conductive adhesive applied to the metal thin film layer, The metal thin film layer is an intermetallic bonding layer of one or more scaly shaped metal particles.

(31) In the printed wiring board of the present invention, the shielding film for a printed wiring board according to (18) is attached to at least one surface of a substrate including one or more printed circuits through a conductive adhesive applied to the metal thin film layer, Part of the conductive adhesive layer is filled in the gap between the scaly metal particles.

(32) In the printed wiring board of the present invention, the shielding film for a printed wiring board according to (19) is attached to at least one surface of a substrate including one or more printed circuits through a conductive adhesive applied to the metal thin film layer. Part of the conductive adhesive layer is filled in the voids of the holes.

According to the structure of said (21)-(32), the printed wiring board which has the effect of each of the shield film for printed wiring boards of said (1)-(19) can be provided. In particular, the printed wiring board which is physically protected can be provided while the electromagnetic shielding characteristic is not reduced even when the bending and sliding repeated from the large radius of curvature to the small radius of curvature (1.0 mm) are repeated.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic cross section of the shield film for printed wiring boards which concerns on 1st Embodiment of this invention.
It is a schematic cross section of the shield film for printed wiring boards which concerns on 2nd Embodiment of this invention.
It is a schematic cross section of the shield film for printed wiring boards which concerns on 3rd Embodiment of this invention.
It is a schematic diagram of the scaly metal particle group which forms the metal layer of the shield film for printed wiring boards shown in FIG.
It is a schematic cross section of the shield film for printed wiring boards which concerns on 4th Embodiment of this invention.
It is a schematic cross section which showed the process of the manufacturing method of the printed wiring board which concerns on 5th Embodiment of this invention sequentially.
It is a shield film body for printed wiring boards of 5th Embodiment.
It is a schematic cross section of the printed wiring board which concerns on 6th Embodiment of this invention.
It is a schematic cross section of the printed wiring board which concerns on 7th Embodiment of this invention.
It is a schematic cross section of the printed wiring board which concerns on 8th Embodiment of this invention.
It is a schematic cross section of the printed wiring board which concerns on 9th Embodiment of this invention.
It is a figure which shows the test method of a bending resistance test.
It is a SEM photograph of the shield film for printed wiring boards concerning Example 1 of this invention, (b) is a schematic diagram which shows the imaging direction of the SEM photograph of (a).

<First Embodiment>

The shield film for printed wiring boards which concerns on 1st Embodiment of this invention is demonstrated. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic cross section of the shield film for printed wiring boards which concerns on 1st Embodiment of this invention.

The shield film 10 for printed wiring boards shown in FIG. 1 has the metal layer 2 of the structure corrugated on one side (the arithmetic mean deviation of surface (JIS B 0601 (1994)) 0.5-5.0 micrometers) of the insulating layer 1 Will be prepared.

The insulating layer 1 consists of a cover film or the coating layer of insulating resin. The cover film is made of engineering plastics. For example, polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, polyphenylene sulfide (PPS), polyethylene, Phthalate (PEN) etc. are mentioned. When heat resistance is not requested | required, a cheap polyester film is preferable, and when flame retardance is required, a polyphenylene sulfide film and a polyimide film is preferable when heat resistance is further required. In the case of insulated resin, what is necessary is just resin which has insulation, and a thermosetting resin or an ultraviolet curable resin etc. are mentioned, for example. As a thermosetting resin, a phenol resin, an acrylic resin, an epoxy resin, a melamine resin, a silicone resin, an acrylic modified silicone resin, etc. are mentioned, for example. As ultraviolet curable resin, an epoxy acrylate resin, polyester acrylate resin, such a methacrylate modified product, etc. are mentioned, for example. Moreover, as hardening form, what kind of things, such as thermosetting, ultraviolet curing, electron beam hardening, may be sufficient, and what is necessary is just to harden | cure.

As a method of adjusting the surface deviation of the insulating layer 1, a sandblasting method for roughening the surface itself of the insulating layer 1 with particles such as sand, and a synthetic resin in which fine particles are dispersed and mixed on the surface of the insulating layer 1 are used. Chemical mat method for coating and applying irregularities, Dough mixing method for mixing the fine particles in advance and curing the resin material itself before curing to form the insulating layer 1, Etching method using a chemical agent such as an acidic agent or an alkaline agent, Plasma etching Law and the like.

The arithmetic mean deviation of the insulating layer and the opposite surface of the metal layer 2 is 0.5-5.0 micrometers, and the corrugated structure of the desired shape is formed. Examples of the metal material for forming the metal layer 2 include nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, alloys containing one or more of these materials, and the like. The appropriate electromagnetic wave shield characteristics and repeated bending and sliding resistance may be appropriately selected. However, the thickness may be about 0.1 µm to 8 µm. Examples of the method for forming the metal layer 2 include an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam vapor deposition method, a vacuum vapor deposition method, a CVD method, a metal organic material, and the like.

In addition, although not shown in figure, the release layer and the separate film may be formed in the outer side of the insulating layer 1 sequentially. Moreover, the adhesive bond layer may be formed in the outer side of the metal layer 2. By these, after adhering to a printed wiring board through an adhesive bond layer, it is possible to bond the shielding film 10 for printed wiring boards, heating and pressurizing with a press, and after this joining, peeling a separator film together with a mold release layer. The printed wiring board of a shield part can be obtained.

Here, as the adhesive layer, thermoplastic resins such as polystyrene-based, vinyl acetate-based, polyester-based, polyethylene-based, polypropylene-based, polyamide-based, rubber-based, acrylic-based, phenol-based, epoxy-based, urethane-based, melamine-based, alkyd-based, etc. Thermosetting resin may be used. In the case where heat resistance is not particularly required, a polyester-based thermoplastic resin that is not restricted by storage conditions or the like is preferable. When heat resistance or more excellent flexibility is required, a highly reliable epoxy-based thermosetting resin after the shield layer is formed. Is preferred. In addition, it is needless to say that any of them is preferable to have a small amount of exudation (resin flow) during hot press.

Moreover, it is preferable that an adhesive bond layer is comprised from the said resin containing a conductive filler. It is because it can use also as a layer which has an electromagnetic shielding effect besides using as an adhesive bond layer. As the conductive filler, a silver coat copper filler in which silver plating is applied to carbon, silver, copper, nickel, solder, arami and copper powder, a filler in which metal plating is performed on a resin ball, glass beads, or a mixture of such fillers can be used. Silver is expensive, copper lacks the reliability of heat resistance, Army lacks the reliability of moisture resistance, and furthermore, solder is difficult to obtain sufficient conductivity. Preference is given to using fillers or nickel.

Although the compounding ratio of an electrically conductive filler to adhesive resin depends also on the shape of a filler etc., in the case of silver coat copper filler, it is preferable to set it as 10-400 weight part with respect to 100 weight part of adhesive resin, More preferably, it is 20 It is good to set it as -150 weight part. When it exceeds 400 weight part, adhesiveness to a ground circuit (copper foil) falls, and flexibility, such as a printed wiring board, worsens. Moreover, if it is less than 10 weight part, electroconductivity will fall remarkably. Moreover, in the case of a nickel filler, it is preferable to set it as 40-400 weight part with respect to 100 weight part of adhesive resin, More preferably, it is good to set it as 100-350 weight part. When it exceeds 400 weight part, adhesiveness to a ground circuit (copper foil) will fall and flexibility, such as a shield FPC, will worsen. Moreover, if it is less than 40 weight part, electroconductivity will fall remarkably. The shape of the metal filler may be spherical, needle-like, fibrous, flake-like or dendritic. Moreover, it is preferable that the said conductive filler is a low melting metal.

According to this embodiment, since the metal layer 2 is a corrugated structure with high bendability, it is hard to destroy the metal layer 2 with respect to the bending and sliding repeated from a large radius of curvature to a small radius of curvature (1.0 mm). The shield film 10 for wiring boards can be provided. Therefore, the shield film for printed wiring boards with which electromagnetic wave shield characteristics are hard to reduce can be provided. Moreover, when it adheres to a printed wiring board and uses, it can protect a printed wiring board, and can maintain an electromagnetic shield characteristic even if a printed wiring board is repeatedly bent and slid.

<2nd embodiment>

Next, the shield film for printed wiring boards which concerns on 2nd Embodiment of this invention is demonstrated. It is a schematic cross section of the shield film for printed wiring boards which concerns on 2nd Embodiment of this invention. In addition, code | symbols 11 and 12 may be issued to the same part as code | symbol 1 and 2 of 1st Embodiment sequentially, and the description may be abbreviate | omitted.

The shielding film 20 for printed wiring boards which concerns on this embodiment is equipped with the metal layer 13 (2nd metal layer) of the structure corrugated on the surface opposite the insulating layer 11 of the metal layer 12 (1st metal layer). There exists a difference from 1st Embodiment.

The metal layer 13 is any of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and alloys including one or more of these materials, and is formed of a material different from the metal layer 12, but the metal The material and thickness may be appropriately selected in response to the required electromagnetic shield characteristics and repeated bending and sliding resistance. In addition, the thickness may be about 0.1 μm to 8 μm. As the method for forming the metal layer 13, there are an electroplating method, an electroless plating method, a sputtering method, an electron beam vapor deposition method, a vacuum vapor deposition method, a CVD method, a metal organic material, and the like. Moreover, the arithmetic mean deviation of the insulating layer of the metal layer 13 and the opposite surface is 0.5-5.0 micrometers, and the corrugated structure of the desired shape is formed. Here, as one modified example, when the metal layer 13 is made of a metal material having a relatively high degree of flexibility such as tin, the outer surface may not have a corrugated structure.

In addition, although not shown in figure, the release layer and the separate film may be formed in the outer side of the insulating layer 11 sequentially. Moreover, the adhesive bond layer like 1st Embodiment may be formed in the outer side of the metal layer 13. By these, after adhering to a printed wiring board through an adhesive bond layer, it is possible to join the shielding film 20 for printed wiring boards, heating and pressurizing with a press, and after this joining, peeling a separator film together with a mold release layer. The printed wiring board of a shield part can be obtained.

According to this embodiment, the same effects as in the first embodiment can be obtained. Moreover, the effect which corrosion-proof the metal layer 12 by the metal layer 13 can be acquired. Moreover, when using by adhering to a printed wiring board by predetermined pressure (for example, 150 degreeC) or more by using a press, you may form an intermetallic compound between the metal layer 12 and the metal layer 13. As a result, the strength is improved when the printed wiring board is bonded to the printed wiring board by a pressing press at a predetermined temperature or more, so that the metal layer is more destroyed against bending and sliding repeated from a large radius of curvature to a small radius of curvature (1.0 mm). It can provide the shield film for printed wiring boards which is hard to occur.

Third Embodiment

Next, the shield film for printed wiring boards which concerns on 3rd Embodiment of this invention is demonstrated. It is a schematic cross section of the shield film for printed wiring boards which concerns on 3rd Embodiment of this invention.

The shield film 30 for printed wiring boards shown in FIG. 3 is provided with the metal layer 22 formed by depositing 1 or more types of scaly metal particles in the substantially flat surface of the insulating layer 21. As shown in FIG.

The metal layer 22 is formed by depositing a large number of scaly metal particles as shown in the schematic diagram of FIG. Although the average particle diameter of this scaly metal particle is 1 micrometer-100 micrometers, and thickness is 0.1 micrometer-8 micrometers, the thing with thickness exceeding 8 micrometers becomes the thickness of the metal layer 22 too much, and obtains the film of the target thickness. As it becomes impossible, it is not desirable. As the material of the scaly metal particles, nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and alloys containing at least one of these materials may be used. At least one material is appropriately selected in response to the characteristics and repeated bending and sliding resistance. In addition, in the metal layer on which the scaly metal particles are deposited, a gap is formed between the scaly metal particles by heating under a predetermined temperature or more, and an intermetallic bond is formed to form an electrically continuous layer. It is possible. In addition, the metal layer 22 at this time is 0.1 micrometer-8 micrometers thick, when the shield film containing the said metal layer 22 was adhere | attached to a printed wiring board by predetermined pressure (for example, 150 degreeC) or more. It is preset to the same thickness as.

Moreover, although not shown in figure, the release layer and the separate film may be formed in the outer side of the insulating layer 21 sequentially. Moreover, the adhesive bond layer like 1st Embodiment may be formed in the outer side of the metal layer 22. FIG. By these, after adhering to a printed wiring board through an adhesive bond layer, it is possible to bond the shielding film 30 for printed wiring boards, heating and pressurizing with a press, and after this joining, peeling a separator film together with a mold release layer. The printed wiring board of a shield part can be obtained. At this time, in particular, part of the adhesive layer is filled in the gap formed between the scaly metal particles by heating and pressing, and the strength and flexibility of the metal layer can be improved.

According to this embodiment, when a bonded wiring board is bonded to a printed wiring board at a predetermined temperature (for example, 150 ° C.) or more by a press, the gap is formed between the scaly metal particles, and at the same time, an intermetallic bond is generated. Since an electrically continuous metal layer can be formed, it is possible to set it as the conductive layer rich in flexibility. Therefore, when used for the above-mentioned printed wiring board, the shielding film for printed wiring boards with which the metal layer is less likely to be destroyed with respect to the bending and sliding which repeats from a large curvature radius to a small curvature radius (1.0 mm) can be provided.

&Lt; Fourth Embodiment &

Next, the shield film for printed wiring boards which concerns on 4th Embodiment of this invention is demonstrated. It is a schematic cross section of the shield film for printed wiring boards which concerns on 4th Embodiment of this invention.

In the shielding film 40 for printed wiring boards which concerns on this embodiment, the metal layer 32 (1st metal layer) and the metal layer 33 (2nd metal layer) are provided in order on the substantially flat surface of the insulating layer 31 in order. .

The metal layer 33 is any of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and alloys including one or more of these materials, and is formed of a material different from the metal layer 32, The metal material and thickness may be appropriately selected in response to the required electromagnetic shield characteristics and repeated bending and sliding resistance. In addition, the thickness of the metal layers 32 and 33 may be about 0.1 micrometer-about 8 micrometers. The metal layers 32 and 33 may be formed by electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum evaporation, CVD or metal organic.

Moreover, although not shown in figure, the release layer and the separate film may be formed in the outer side of the insulating layer 31 sequentially. Moreover, the adhesive bond layer like 1st Embodiment may be provided in the outer side of the metal layer 32. As shown in FIG. By these, after adhering to a printed wiring board through an adhesive bond layer, it is possible to bond the shielding film 40 for printed wiring boards, heating and pressurizing with a press, and after this joining, peeling a separator film together with a mold release layer. The printed wiring board of a shield part can be obtained.

According to this embodiment, the effect which corrosion-proof the metal layer 32 with the metal layer 33 can be acquired. In addition, when bonded to a printed wiring board by a pressing press at a predetermined temperature (for example, 150 ° C.) or more, an intermetallic compound (not shown) can be formed between the metal layer 32 and the metal layer 33. It may be. As a result, the strength is improved when the printed wiring board is bonded to the printed wiring board by a pressing press at a temperature higher than the predetermined temperature, so that the metal layer is more destroyed against bending and sliding repeated from a large radius of curvature to a small radius of curvature (1.0 mm). It can provide the shield film for printed wiring boards which is hard to occur.

&Lt; Embodiment 5 >

Next, the printed wiring which concerns on 5th Embodiment of this invention is demonstrated. It is a schematic cross section which sequentially shows the process of the manufacturing method of the printed wiring board which concerns on 5th Embodiment of this invention. It is a shield film body for printed wiring boards of 5th Embodiment. In addition, code | symbols 41, 42, and 50 may be issued to the same part as code | symbol 1, 2, 10 of 1st Embodiment sequentially, and the description may be abbreviate | omitted.

As for the printed wiring board 100 which concerns on this embodiment, as shown in FIG.6 (c), the shield film 50 for printed wiring boards and the base film 46 like the 1st Embodiment are made of the adhesive bond layer 47. As shown in FIG. To be bonded. The base film 46 includes a base film 43, a printed circuit 44 (signal circuit 44a and a ground circuit 44b) formed on the base film 43, and at least a portion (non-insulating portion) 44c. Except for this, the insulating film 45 formed on the printed circuit 44 is provided.

The base film 43 and the insulation film 45 are all made of engineering plastics. For example, resin, such as a polypropylene, crosslinked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, polyphenylene sulfide (PPS), is mentioned. When heat resistance is not requested | required, a cheap polyester film is preferable, and when flame retardance is required, a polyphenylene sulfide film and a polyimide film is preferable when heat resistance is further required.

Here, the bonding of the base film 43 and the printed circuit 44 may be bonded by an adhesive, or may be bonded like a so-called adhesive-free copper clad laminate that does not use an adhesive. Moreover, the insulating film 45 may be made to adhere | attach a flexible insulating film using an adhesive agent, and may be formed by a series of methods, such as coating, drying, exposure, image development, and heat processing of the photosensitive insulating resin. Further, the base film 46 is a single-sided printed wiring board having a printed circuit only on one side of the base film, a double-sided printed wiring board having a printed circuit on both sides of the base film, and a multilayer in which a plurality of such printed wiring boards are stacked. Adopted a flexible printed circuit board, a flexible board (registered trademark) having a multilayer component mounting portion and a cable portion, a flexible rigid substrate having a member constituting the multilayer portion, or a TAB tape for a tape carrier package. Can be carried out.

The adhesive layer 47 is an adhesive resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber or acrylic resin, phenol, epoxy, urethane or melamine. It is comprised by thermosetting resins, such as an alky type and an alkyd type. Moreover, you may use the electrically conductive adhesive which mixed electroconductive fillers, such as a metal and carbon, with these adhesive resins, and made it electroconductive. The anisotropic conductive layer can also be formed by reducing the amount of the conductive filler. In the case where heat resistance is not particularly required, a polyester-based thermoplastic resin that is not restricted by storage conditions or the like is preferable. When heat resistance or more excellent flexibility is required, a highly reliable epoxy-based thermosetting resin after the shield layer is formed. Is preferred. In addition, it is needless to say that any one of them is preferable to have a small amount of oozing (resin flow) during heating and pressing.

As the conductive filler, a silver coat copper filler in which silver plating is applied to carbon, silver, copper, nickel, solder, arami and copper powder, a filler in which metal plating is applied to a resin ball or glass bead, or a mixture of such fillers can be used. Silver is expensive, copper lacks the reliability of heat resistance, Army lacks the reliability of moisture resistance, and furthermore, solder is difficult to obtain sufficient conductivity, so it has relatively excellent conductivity and is more reliable silver coat copper. Preference is given to using fillers or nickel.

Although the compounding ratio of conductive fillers, such as a metal filler, to adhesive resin depends also on the shape of a filler, etc., In the case of a silver coat copper filler, it is preferable to set it as 10-400 weight part with respect to 100 weight part of adhesive resins, Furthermore, Preferably it is 20 to 150 parts by weight. When it exceeds 400 weight part, the adhesiveness to the ground circuit (copper foil) 44b falls and the flexibility of the printed wiring board 100 will worsen. Moreover, if it is less than 10 weight part, electroconductivity will fall remarkably. Moreover, in the case of a nickel filler, it is preferable to set it as 40-400 weight part with respect to 100 weight part of adhesive resin, More preferably, it is good to set it as 100-350 weight part. When it exceeds 400 weight part, the adhesiveness to the ground circuit (copper foil) 44b falls and the flexibility of the printed wiring board 100 will worsen. Moreover, if it is less than 40 weight part, electroconductivity will fall remarkably. The shape of electroconductive fillers, such as a metal filler, may be any of spherical form, needle shape, a fibrous form, a flake form, and a resin form.

As mentioned above, when the adhesive layer 47 mixes conductive fillers, such as a metal filler, it becomes thick by these fillers, and is about 20 +/- 5micrometer. Moreover, when electroconductive filler is not mixed, it is 1 micrometer-10 micrometers. For this reason, the total thickness of the shield layer (metal layer 42 and adhesive bond layer 47) can be made thin, and it is possible to set it as the thin printed wiring board 100. FIG.

Next, the shield film body used for manufacture of the printed wiring board which concerns on 5th Embodiment of this invention is demonstrated using FIG. The shield film body of FIG. 7 is sequentially on the surface opposite to the metal film 42 of the shielding film 50 for printed wiring boards and the insulating layer 41 in the shield film 50 for printed wiring boards like 1st Embodiment. It has the release layer 48b, the separator film 48a, and the above-mentioned adhesive bond layer 47 formed in the surface on the opposite side to the metal layer 42 insulating layer 41 formed in the above. In the case where the adhesive layer 47 is a conductive adhesive layer, a shield layer is formed together with the metal layer 42.

Engineering plastics such as the base film 43, the insulating film 45, and the insulating layer 41 are used for the separator film 48a, but an inexpensive polyester film is preferable because it is removed during the manufacturing process.

If the release layer 48b has peelability with respect to the insulating layer 41, it will not specifically limit, For example, PET film etc. which coated silicone can be used.

Next, the manufacturing method of the printed wiring board which concerns on 5th Embodiment of this invention is demonstrated. First, the shield film body of FIG. 7 mentioned above is placed on the base film 46, and it pressurizes, heating by the press machines 49 (49a, 49b). A part of the adhesive layer 47 made soft by heating flows to the insulating removal part 45a by an arrow like an arrow (refer FIG. 6 (a)).

Thus, after a part of adhesive bond layer 47 fully adhere | attaches with the non-insulation part 44c and the insulation film 45 of the grand circuit 44b, the formed printed wiring board 10 is taken out from the press 49, and the printed wiring board The separated film 48a of the shield film 50 for peeling is peeled together with the release layer 48b (refer FIG. 6 (b)), and the printed wiring board 100 can be obtained (refer FIG. 6 (c)).

According to this embodiment, the effect of the shield film for printed wiring boards of 1st Embodiment can be exhibited. In particular, the printed wiring board 100 which is physically protected can also be provided with respect to bending and sliding repeated from a large radius of curvature to a small radius of curvature (1.0 mm) without reducing the electromagnetic shielding characteristics.

Sixth Embodiment

Next, the printed wiring which concerns on 6th Embodiment of this invention is demonstrated. It is a schematic cross section of the printed wiring board which concerns on 6th Embodiment of this invention. In addition, code | symbols 51, 52, 53, and 50 may be sequentially attached to the same parts as 11, 12, 13, and 20 of 2nd Embodiment, and the description may be abbreviate | omitted. In addition, the code | symbol 54-58 may be issued sequentially and the description may be abbreviate | omitted to the part similar to code | symbol 43-47 of 5th Embodiment.

The printed wiring board 101 according to the present embodiment differs from the fifth embodiment in that the printed wiring board shield film 60 as in the second embodiment is provided in place of the shield film 50 for the printed wiring board. In addition, the printed wiring board 101 can be manufactured by the manufacturing method similar to 5th Embodiment.

According to this embodiment, the same effect as the printed wiring board of 5th Embodiment can be exhibited. Moreover, as a modification, the printed wiring board which bonded the shield film for printed wiring boards of 3rd or 4th embodiment like the present embodiment instead of the shield film 60 for printed wiring boards may be sufficient.

Seventh Embodiment

Next, the printed wiring which concerns on 7th Embodiment of this invention is demonstrated. It is a schematic cross section of the printed wiring board which concerns on 7th Embodiment of this invention. In addition, parts 61a, 62a, 70a (61b, 62b, 70b) may be sequentially attached to the same part as 21, 22, 30 of 3rd Embodiment, and the description may be abbreviate | omitted. In addition, code | symbols 64-67 may be issued sequentially to the same part as code | symbol 44-47 of 5th Embodiment, and the description may be abbreviate | omitted.

As for the printed wiring board 102 which concerns on this embodiment, (1) Through the adhesive bond layers 67 and 68, the shield film 70a, 70b for printed wiring boards similar to 3rd Embodiment is carried out on both surfaces of the base film 66. (2) Grand circuit 64b provided with insulation removal part 65a and insulation removal part 63a in the insulation film 65 and base film 63 side above and below the grand circuit 64b, respectively. The adhesive layers 67 and 68 and the ground circuit 64b are connected to the non-insulating portions 64c on the upper and lower surfaces of the upper and lower surfaces of the upper and lower surfaces). In addition, the same material as the adhesive layer 67 is used for the adhesive bond layer 68. In addition, the printed wiring board 102 can be manufactured using the manufacturing method similar to 5th Embodiment.

According to this embodiment, the printed wiring board 102 which can exhibit the same effect as the printed wiring board 100 of 5th Embodiment on both surfaces of the base film 66 can be provided.

In addition, as a modification, instead of the shielding films 70a and 70b for printed wiring boards, the printed wiring boards to which the shielding films for printed wiring boards of the first, second or fourth embodiment are bonded may be bonded as in the present embodiment. Moreover, you may use combining the shield films for printed wiring boards of 1st-4th embodiment suitably.

<8th embodiment>

Next, the printed wiring which concerns on 8th Embodiment of this invention is demonstrated. It is a schematic cross section of the printed wiring board which concerns on 8th Embodiment of this invention. In addition, parts 71a, 72a, 73a, 80a (71b, 72b, 73b, 80b) may be sequentially assigned to the same parts as 31, 32, 33, 40 of the fourth embodiment, and the description thereof may be omitted. In addition, the parts similar to 45-47 of 5th Embodiment may attach the code | symbol 76-78 sequentially, and abbreviate | omits the description.

As for the printed wiring board 103 which concerns on this embodiment, (1) Through the adhesive bond layers 78 and 79, the shield film 80a, 80b for printed wiring boards similar to 4th Embodiment is carried out on both surfaces of the base film 77. (2) The insulation removal part 76a and the insulation removal part 74a are provided in the insulation film 76 and the base film 74 side above and below the grand circuit 75b, respectively. A through hole 75d is formed in the grand circuit 75b to communicate the insulation removing portion 76a with the insulation removing portion 74a, and the adhesive layers 78 and 79 are positioned within the through hole 75d. The point of contact with 가 is different from the fifth embodiment. In addition, the same material as the adhesive layer 78 is used for the adhesive layer 79. In addition, the printed wiring board 103 can be manufactured using the manufacturing method similar to 5th Embodiment.

According to this embodiment, the printed wiring board 103 which can exhibit the same effect as the printed wiring board of 5th Embodiment in the both surfaces of the base film 77 can be provided.

Moreover, as a modification, instead of the shielding films 70a and 70b for printed wiring boards, the printed wiring boards which respectively bonded the shielding films for printed wiring boards of 1st, 2nd, or 4th embodiment like each other may be sufficient. Moreover, you may use combining the shield films for printed wiring boards of 1st-4th embodiment suitably.

<Ninth Embodiment>

Next, the printed wiring which concerns on 9th Embodiment of this invention is demonstrated. It is a schematic cross section of the printed wiring board which concerns on 8th Embodiment of this invention. In addition, 81, 82, 90 may be issued sequentially, and the description may be abbreviate | omitted to the same part as 1, 2, 10 of 1st Embodiment. In addition, the code | symbols 83-87 may be issued sequentially, and the description may be abbreviate | omitted to the part similar to code | symbol 43-47 of 5th Embodiment.

The printed wiring board 104 which concerns on this embodiment coat | covers the shielding film 90 for printed wiring boards through the adhesive bond layer 87 on one surface of the base film 86, and has the rectangular-shaped grand member 93 at the edge part. To prepare.

The ground member 93 is provided with an adhesive resin layer 92 on one surface of a rectangular metal foil 91 having a width W. As shown in FIG. Although the ground W of the grand member 93 is larger, the ground impedance becomes smaller, but is preferably selected from the viewpoint of handling and economical efficiency. In this example, the width W1 of the width W is exposed, and the width W2 is bonded to the adhesive layer 87. The exposed portion of the width W1 can be reliably grounded by connecting to an adjacent grand portion using a suitable conductive member. In addition, the width W2 may be made smaller if the adhesion is securely performed. In addition, although the length of the ground member 93 was matched with the width | variety of the shield film 90 and the base film 86 in this example, in order to be easy to process, it may be shorter or longer than it, and is connected to the conductive adhesive layer 92 It is good to be able to connect to the part which becomes, and the grand part of the exposed vicinity.

Similarly, the shape of the grand member 93 is not limited to the rectangular shape, but a part thereof may be connected to the adhesive layer 87, and another part may be a shape that can be connected to a neighboring grand part.

The position of excretion is not necessarily limited to the end of the printed wiring board 104, but may be a position 93a other than the end shown by an imaginary line in Fig. 11A. In this case, however, the ground member 93a is exposed from the shield film 90 to the side portion so as to be connectable to the adjacent ground portion. The exposure lengths L1 and L2 on both sides may be a length that can be connected to a grand part in the vicinity of a frame or the like of the device, and the exposed part may be only at one end. The gland portion is connected to the surface of the metal layer 82 by bead fixing or soldering.

The material of the metal foil 91 of the grand member 93 is preferably copper foil in terms of conductivity, flexibility, economical efficiency, etc., but is not limited thereto. Moreover, although electroconductive resin is also possible instead of metal foil, metal foil is preferable at the point of electroconductivity.

As the adhesive resin layer 92, thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, acryl, phenol, epoxy, urethane, Thermosetting resins such as melamine-based, polyimide-based, alkyd-based, and the like are preferably used to provide good adhesion to the metal foil, the adhesive resin layer, or the insulating film 85 of the base film 86 constituting the grand member 93. Do. In addition, when the gland member 93 arranges it in a position other than an end part and covers it with a shield layer (it is a metal layer 82, but also includes an adhesive bond layer 87 when the adhesive bond layer 87 is a conductive adhesive bond layer), You may comprise only metal foil or a metal wire.

As described above, the shield layer of the shield film 90 (the metal layer 82, but also includes the adhesive layer 87 when the adhesive layer 87 is a conductive adhesive layer) is grounded by the gland member 93. Therefore, it is not necessary to provide a wide grand line as part of the printed circuit, and the wiring density of the signal line can be increased accordingly. In addition, it is easy to reduce the ground impedance of the gland member 93 compared to the ground impedance of the gland line of the conventional printed wiring board, thus increasing the electromagnetic shielding effect of the shield layer.

In addition, a ground member is connected to a printed wiring board connected with a shield layer (which is a metal layer 82, but also includes an adhesive layer 87 in the case where the adhesive layer 87 is a conductive adhesive layer) in which a wide gland wire is provided as in the prior art. Naturally provided also is included in the present invention. In this case, since the effects of the substrate ground by the wide gland and the frame ground by the gland member are added, the electromagnetic shielding effect is more excellent and more stable.

The tip of the base film 86 exposes only the width t1, and the printed circuit 84 exposes it. In this example, the ground member 93 is bonded so that only one end of the width direction is separated from the end of the insulating film 85 by the width t2. Insulation resistance is ensured.

In addition, the gland member can be made into various forms other than the form shown in FIG. For example, the gland member is a metal foil made of copper, silver, aluminum, or the like, and the metal foil exposed by a plurality of conductive bumps protruding from one surface of the metal foil through the cover film and connected to the shield layer is exposed to the gland portion in the vicinity thereof. It may be in the form of being connected.

In addition, the gland member is a metal plate made of copper, silver, aluminum, or the like, in which a plurality of projections are formed on one surface, and the metal plate exposed by the projections connected to the shield layer through the cover film is also connected to the grand portion in the vicinity thereof. Can be considered

In addition, the gland member is a metal foil made of copper, silver, aluminum, or the like, and a metal foil exposed by a plurality of metal fillers protruding from one side of the metal foil penetrates through the cover film and is connected to the adhesive layer and the metal layer of the shield layer. It may also be considered to be connected to the grand portion.

The window may be formed at a predetermined position of the shield film by removing the cover film using an excimer laser, and one end of the gland member as a conductor may be connected through a conductive adhesive in which the conductive filler is mixed in the window. The other end of the grand member is connected to a nearby grand section. Alternatively, a nearby grand portion may be directly connected to this window portion without intervening the grand member.

In addition, as a modification, instead of the shield film 90 for printed wiring boards, you may make it the printed wiring board which respectively bonded the shield films for printed wiring boards of 2nd-4th embodiment like this embodiment.

Example

(Example 1)

First, the shielding film for printed wiring boards of the same shape as the shielding film 10 for printed wiring boards shown in FIG. 1 was produced (for Example, see Example 1 of Table 1 below). The SEM photograph of the shield film for printed wiring boards produced at this time is shown to FIG. 13 (a). Moreover, the schematic diagram which shows the imaging direction of the SEM photograph of FIG. 13 (a) is shown to FIG. 13 (b). After producing a shield film for a printed wiring board having such a corrugated metal layer, the shielded film for a printed wiring board is bonded to the printed wiring board while being heated and pressurized by a press using an adhesive, and then printed on the shielded printed wiring board (10 mm in width and length 170). mm). Here, the insulating layer of the shield film for printed wiring boards of this Example was made into the polyimide resin layer whose thickness is 12.5 micrometers. 17 micrometers of epoxy resins were used for the adhesive bond layer. The printed wiring board thus produced was used as a sample of Example 1.

(Example 2)

Next, the shielding film for printed wiring boards of the same shape as the shielding film 10 for printed wiring boards shown in FIG. 1 was produced (for details of a metal layer, see Example 2 of following Table 1). Then, the shielding film for printed wiring boards was bonded to the printed wiring board by heating and pressurizing it with a press through an adhesive agent, and the printed wiring board (width 10mm, length 170mm) of the shield part was produced. In addition, the same thing as Example 1 was used for the insulating layer and the adhesive agent.

The printed wiring board thus produced was used as a sample of Example 2.

(Example 3)

Subsequently, the shielding film for printed wiring boards of the same shape as the shielding film 10 for wiring boards shown in FIG. 1 was produced (for Example, see Example 3 of Table 1 below). Then, the shielding film for printed wiring boards was bonded to the printed wiring board by heating and pressurizing it with a press through an adhesive agent, and the printed wiring board (width 10mm, length 170mm) of the shield part was produced. In addition, the same thing as Example 1 was used for the insulating layer and the adhesive agent. The printed wiring board thus produced was used as a sample of Example 3.

(Comparative Example 1)

Instead of the two-layer metal layer in Example 1, the shield film for printed wiring boards in which the one-layer silver thin film layer which is 0.1 micrometer was formed was produced. Then, the shielding film for printed wiring boards was bonded to the printed wiring board by heating and pressurizing it with a press through an adhesive agent, and the printed wiring board (width 10mm, length 170mm) of the shield part was produced. In addition, the same thing as Example 1 was used for the insulating layer and the adhesive agent. The printed wiring board thus produced was used as a sample of Comparative Example 1.

(Comparative Example 2)

Instead of the two-layer metal layer in Example 1, the shield film for printed wiring boards in which the silver paste layer of 20 micrometers in thickness was formed was produced. Thereafter, the shield film for printed wiring boards was bonded to the printed wiring board by heating and pressing with a press through an adhesive, thereby producing a printed wiring board (10 mm in width and 170 mm in length) of the shield portion. In addition, the same thing as Example 1 was used for the insulating layer and the adhesive agent. The printed wiring board thus produced was used as a sample of Comparative Example 2.

[Flexibility Test]

According to the IPC standard, as shown in FIG. 12, the printed wiring board 111 of the shield portion between the fixed plate 121 and the sliding plate 122 (any one of the above-described Examples 1 and Comparative Examples 1 and 2). For printed wiring boards, which were bent in a U-shape with a curvature of 1.0 mm, and the sliding plate 122 was slid up and down at a test atmosphere of 23 ° C at a stroke of 30 mm and a sliding speed of 100 times / min. It was verified whether the resistance of the metal layer in the shield film (maintaining the electron shielding property) and the printed wiring board could be protected. In the printed circuits of the printed wiring boards in the samples of Example 1 and Comparative Examples 1 and 2, the number of lines was 6, and the line width was 0.12 mm and the space width was 0.1 mm. Moreover, it was verified by measuring the electricity supply amount in the metal layer or the printed circuit of each sample about whether the tolerance (holding of electronic shielding property) of a metal layer in a shield film for printed wiring boards, and whether a printed wiring board can be protected. The verification results are shown in Table 1 below.

From Table 1, it turns out that the sample of Examples 1-3 is resistant to a metal layer, and can protect a printed wiring board. On the other hand, about the comparative example 1, although it can protect a printed wiring board, it turned out that it does not hold | maintain the electron shielding property in a silver thin film layer (the amount of electricity supply is falling). Moreover, about the comparative example 2, although the electromagnetic shielding property in the silver paste layer can be maintained, it turned out that the printed wiring board cannot be protected (it is disconnected).

In addition, this invention can change a design in the range which does not deviate from a claim, and is not limited to the said embodiment or Example. For example, in the said embodiment, although the metal layer showed the case of two layers, three or more metal layers may be sufficient as it.

Moreover, you may use the porous (porous) thing which has two or more holes or voids for each metal layer in the said embodiment. In the case of a porous metal layer having a plurality of holes, the diameter of the hole is 0.1 µm to 10 µm, and in the case of a porous metal layer having a plurality of pores, the size of the voids is 0.1 µm to 10 µm and the porosity is 1 to 50%. If the porosity is less than 1%, it is almost impossible to have the effect described later. If the porosity exceeds 50%, the conductivity will be considerably reduced. In addition, the metal layer at this time is previously adjusted to the thickness of 0.1 micrometer-8 micrometers, when the shield film containing the said metal layer is adhere | attached on a printed wiring board by predetermined pressure (for example, 150 degreeC) or more. It is. Moreover, even if it uses in several metal layers, when it adheres to a printed wiring board by predetermined | prescribed temperature (for example, 150 degreeC) or more like a 2nd or 4th embodiment and uses it by a press press, it uses the metal layer 12 and a metal layer. You may form an intermetallic compound with (13). As a result, when press-bonded and bonded to the printed wiring board, a part of the conductive adhesive layer is filled in the pores of the holes in the metal layer, thereby improving the strength and flexibility of the metal layer. Therefore, the shielding film for printed wiring boards and the printed wiring board with which this film is hard to produce | generate more easily with respect to the bending | flexion and sliding which repeat from a large curvature radius to a small curvature radius (1.0 mm) can be provided.

Moreover, you may use the shield film for printed wiring boards which combined each layer of each embodiment of the shield film for printed wiring boards suitably. In addition, in the shielding film for printed wiring boards of each embodiment, only the thing which provided the metal layer in the one surface side of an insulating layer is shown, What is provided in both surfaces of an insulating layer may be sufficient.

Moreover, although the shield film for printed wiring boards of this invention can be used for FPC, COF (tip-on-free), RF (flexible printed board), a multilayer flexible board, a rigid board | substrate, etc., it is not necessarily limited to these.

1, 11, 21, 31, 41, 61a, 71a, 71b, 81 insulation layer
2, 12, 13, 22, 32, 33, 42, 62a, 62b, 82 metal layer
Shield film for 10, 20, 30, 40, 50, 60, 70a, 70b, 80a, 80b, 90 printed wiring board
43, 63, 74 base film
44, 84 printed circuit
44a signal circuit
44b, 64b, 75b grand circuit
44c, 64c non-insulated
45, 65, 76, 85 insulation film
45a, 63a, 65a, 74a, 76a insulation removal
46, 66, 77, 86 base film
47, 67, 68, 78, 79, 87 adhesive layer
48a separate film
48b release layer
49 press
75d through hole
91 metal foil
92 adhesive resin layer
93, 93a grand member
78a, 93a position
100, 101, 102, 103, 104, 111 printed wiring board
121 fixing plate
122 sliding plate

Claims (32)

The first metal layer is provided with a first metal layer formed on one side of the insulating layer and the arithmetic mean deviation (JIS B 0601 (1994)) of the surface of one side of the insulating layer is 0.5 to 5.0 탆 and the first metal layer is the insulating layer. Shield film for a printed wiring board, characterized in that it is formed so as to have a corrugated structure along the surface of one side.
The arithmetic mean deviation of the surface opposite to the said insulating layer of the said 1st metal layer is 0.5-5.0 micrometers, The shield film for printed wiring boards of Claim 1 characterized by the above-mentioned.
3. The method of claim 1 or 2, wherein the first metal layer is a layer using any of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and alloys including one or more of these materials. The shield film for printed wiring boards characterized by the above-mentioned.
The shield film for a printed wiring board according to claim 1 or 2, wherein the first metal layer is a layer formed of at least one scaly metal particle.
A shielding film for printed wiring board according to claim 1 or 2, wherein a conductive adhesive layer is formed on the opposite side of said insulating layer of said first metal layer.
The printed wiring board according to claim 1 or 2, wherein the first metal layer is a porous layer having a plurality of holes, and a conductive adhesive layer is formed on the opposite side of the insulating layer of the first metal layer. Shield film.
3. An alloy according to claim 1 or 2 comprising nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc and one or more of these materials opposite the insulating layer of the first metal layer. The 2nd metal layer using any material is formed, The said 1st metal layer and the said 2nd metal layer consist of a different kind of material, The shield film for printed wiring boards characterized by the above-mentioned.
The shield film for a printed wiring board according to claim 7, wherein said second metal layer is a layer formed of at least one scaly metal particle.
10. The shield film for a printed wiring board according to claim 8, wherein a conductive adhesive layer is formed on the opposite side of the insulating layer of the second metal layer.
The shield film for a printed wiring board according to claim 7, wherein the second metal layer is a porous layer having a plurality of holes, and a conductive adhesive layer is formed on the opposite side of the insulating layer of the second metal layer.
The shield film for a printed wiring board according to claim 1 or 2, wherein the first metal layer is a porous layer having a plurality of holes or a layer formed of one or more kinds of scaly metal particles.
A first metal layer formed on one side of the insulating layer and a second metal layer formed on the opposite side of the insulating layer of the first metal layer, wherein the first metal layer and the second metal layer are nickel, copper, silver, A shield film for a printed wiring board, characterized in that it is a layer made of tin, gold, palladium, aluminum, chromium, titanium, zinc and an alloy containing at least one of these materials, and is made of different kinds of materials.
The shield film for a printed wiring board according to claim 12, wherein the second metal layer is a layer formed of at least one scaly metal particle.
The shielding film for printed wiring boards of Claim 13 in which the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said 2nd metal layer.
The shield film for a printed wiring board according to claim 12, wherein the second metal layer is a porous layer having a plurality of holes, and a conductive adhesive layer is formed on the opposite side of the insulating layer of the second metal layer.
The shield film for a printed wiring board according to claim 14 or 15, wherein the first metal layer is a porous layer having a plurality of holes or a layer formed of one or more kinds of scaly metal particles.
A shield film for a printed wiring board having a metal layer formed on one side of an insulating layer, wherein said metal layer is a layer formed of at least one scaly metal particle.
18. The shield film for a printed wiring board according to claim 17, wherein a conductive adhesive layer is formed on the opposite side of said insulating layer of said metal layer.
The shield film for printed wiring boards provided with the metal layer formed in one side of the insulating layer, The said metal layer is a porous layer which has a some hole, and the conductive adhesive layer is formed in the opposite side to the said insulating layer of the said metal layer.
The bending / sliding action according to any one of claims 1, 2, 12 to 15, and 17 to 19, wherein the lower limit of the radius of curvature is repeated up to 1.0 mm. Shield film for printed wiring board to assume.
The shielding film for printed wiring boards of Claim 1 or 2 is attached to at least one surface of the board | substrate containing one or more layers of printed circuits through the conductive adhesive apply | coated to the said 1st metal layer, The printed wiring board characterized by the above-mentioned. .
The shield film for a printed wiring board of Claim 5 is attached to at least one surface of the board | substrate containing more than one layer through the said conductive adhesive agent apply | coated to the said 1st metal layer, and a part of said conductive adhesive layer Is filled in the gap of the said scaly-shaped metal particle, The printed wiring board characterized by the above-mentioned.
The shield film for a printed wiring board of Claim 6 is attached to at least one surface of the board | substrate containing more than one layer through the said conductive adhesive agent apply | coated to the said 1st metal layer, and a part of said conductive adhesive layer Is filled in the cavity of the said hole, The printed wiring board characterized by the above-mentioned.
The shielding film for printed wiring boards of any one of Claims 1, 2, or 12 is made to pass through the conductive adhesive apply | coated to the said 2nd metal layer on at least one surface of the board | substrate containing one or more layers of printed circuits. At the same time, an intermetallic compound layer of a material for forming the first metal layer and a material for forming the second metal layer is provided between the first metal layer and the second metal layer. Printed wiring board.
The shielding film for printed wiring boards of any one of Claims 1, 2, or 13 is made to pass through the electrically conductive adhesive agent apply | coated to the said 2nd metal layer on at least one surface of the board | substrate containing one or more layers of printed circuits. At the same time as the attachment, the second metal layer is an intermetallic bonding layer of one or more scaly metal particles.
The shield film for printed wiring boards as described in any one of Claims 1, 2, or 14 intervenes the said electrically conductive adhesive agent apply | coated to the said 2nd metal layer on at least one surface of the board | substrate containing one or more layers of printed circuits. And a part of the conductive adhesive layer is filled in the gaps of the scaly metal particles.
The shielding film for printed wiring boards of any one of Claims 1, 2, or 15 intervenes the said electrically conductive adhesive agent apply | coated to the said 2nd metal layer on at least one surface of the board | substrate containing one or more layers of printed circuits. And a part of said conductive adhesive layer is filled in the space | gap of the said hole, and is attached.
The shield film for a printed wiring board of Claim 11 is attached to at least one surface of the board | substrate containing one or more layers of printed circuit boards via the said conductive adhesive agent apply | coated to the said 2nd metal layer, and a part of said conductive adhesive layer Is filled in the space | gap of the said scaly metal particle or the space | gap of the said hole in a said 1st metal layer, The printed wiring board characterized by the above-mentioned.
The shield film for printed wiring boards of Claim 16 is attached to at least one surface of the board | substrate containing more than one layer through the said conductive adhesive agent apply | coated to the said 2nd metal layer, and a part of said conductive adhesive layer Is filled in the space | gap of the said scaly metal particle or the space | gap of the said hole in a said 1st metal layer, The printed wiring board characterized by the above-mentioned.
The shield film for printed wiring boards of Claim 17 is attached to at least one surface of the board | substrate containing one or more layers of printed circuits through the conductive adhesive apply | coated to the said metal layer, and the said metal layer has the shape of one or more scaly pieces. It is an intermetallic bonding layer of metal particle, The printed wiring board characterized by the above-mentioned.
The shield film for printed wiring boards of Claim 18 is attached to at least one surface of the board | substrate containing one or more layers of printed circuit boards through the conductive adhesive apply | coated to the said metal layer, and a part of the said conductive adhesive layer cuts off the said scales The printed wiring board is filled in the space | gap of the metal particle of a shape.
A shield film for a printed wiring board according to claim 19 is attached to at least one side of a substrate including one or more printed circuits through a conductive adhesive applied to the metal layer, and a part of the conductive adhesive layer is formed of the hole. A printed wiring board filled with voids.

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